CYStech Electronics Corp.

Spec. No. : C211M3
Issued Date : 2013.07.18
Revised Date :2014.12.31
Page No. : 1/6
CYStech Electronics Corp.
1A Snubber Damping Rectifier
QJM3
Features
• High current capability
• Smoothly soft reverse recovery time (trr)
• Low profile surface mounted package in order to minimize board space
• Pb-free lead plating and halogen-free package
Symbol
Outline
SOT-89
QJM3
A K N
A：Anode K：Cathode
N：Not Connected
Ordering Information
Device
QJM3-0-T2-G
Package
SOT-89
(Pb-free lead plating and halogen-free package)
Shipping
1000 pcs / Tape & Reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T2 :1000 pcs/tape & reel, 7” reel
Product rank, zero for no rank products
Product name
QJM3
CYStek Product Specification
Spec. No. : C211M3
Issued Date : 2013.07.18
Revised Date :2014.12.31
Page No. : 2/6
CYStech Electronics Corp.
Absolute Maximum Ratings (TA=25℃, unless otherwise noted)
Parameters
Repetitive peak reverse voltage
RMS voltage
Continuous reverse voltage
Conditions
Single phase half wave,
60Hz @TJ=25°C
Single phase half wave,
60Hz @TJ=25°C
8.3ms single half sine-wave
superimposed on rated load
(JEDEC method)
Forward rectified current
Repetitive Peak Forward Current
Forward surge current
Power Dissipation
Symbol
VRRM
VRMS
VR
Value
600
420
600
Units
V
V
V
IF(AV)
1
A
IFRM
1.57
A
IFSM
10
A
0.6
1
2
3
-55~+150
-55~+150
PD
(Note 1)
(Note 2)
Maximum reverse recovery time
Storage temperature range
Operating junction temperature range
IF=0.5A, IR=1.0A, RR=0.25A
trr
Tstg
Tj
W
μs
°C
°C
Thermal Data
Parameter
Thermal Resistance, Junction-to-ambient, max
Thermal Resistance, Junction-to-ambient, max
Thermal Resistance, Junction-to-ambient, max
Thermal Resistance, Junction-to-case, max
Symbol
(Note 1 )
Value
208
125
62.5
40
Rth,j-a
(Note 2 )
Rth,j-c
Unit
°C/W
Note: *1 When mounted on FR-4 PCB with area measuring 10×10×1 mm
*2 When mounted on ceramic with area measuring 40×40×1 mm
Characteristics (TA=25°C, unless otherwise noted)
Characteristic
Symbol
VR
Forward Voltage
Reverse Leakage Current
Junction Capacitance
QJM3
VF 1
VF 2
IR
IR
CJ
Condition
IR=100μA
IF=100mA
IF=500mA
VR=540V
VR=540V, TA=125°C
VR=1V, f=1MHz
Min.
Typ
Max.
Unit
600
-
-
V
-
6
0.95
1.2
100
10
-
V
nA
μA
pF
CYStek Product Specification
Spec. No. : C211M3
Issued Date : 2013.07.18
Revised Date :2014.12.31
Page No. : 3/6
CYStech Electronics Corp.
Typical Characteristics
Power Derating Curves
Forward Current vs Forward Voltage
10000
Instantaneous Forward Current---IF(mA)
Power Dissipation---PD(W)
2.5
See Note 2 on page 1
2
1000
1.5
See Note 1 on page 1
1
0.5
0
Pulse width=300μs,
1% Duty cycle
125℃
100
75°C
25°C
0℃
10
-40°C
1
0
50
100
150
200
0
0.5
1
1.5
2
2.5
3
Forward Voltage---VF(V)
Ambient Temperature ---Ta(℃ )
Junction Capacitance vs Reverse Voltage
Reverse Leakage Current vs Reverse Voltage
10
10000
Junction Capacitance---C J(pF)
Reverse Leakage Current---I R (nA)
Tj=125℃
1000
100
Tj=75℃
10
1
Tj=25℃
0.1
Tj=0°C
0.01
Tj=25℃, f=1.0MHz
Tj=-40°C
1
0.001
0
100
200
300
400
500
600
Reverse Voltage---VR (V)
0.1
1
10
100
Reverse Voltage---VR (V)
Recommended soldering footprint
QJM3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C211M3
Issued Date : 2013.07.18
Revised Date :
Page No. : 4/6
Reel Dimension
Carrier Tape Dimension
QJM3, QJCTM3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C211M3
Issued Date : 2013.07.18
Revised Date :
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
QJM3, QJCTM3
CYStek Product Specification
Spec. No. : C211M3
Issued Date : 2013.07.18
Revised Date :
Page No. : 6/6
CYStech Electronics Corp.
SOT-89 Dimension
Marking:
A
2
1
3
Product
Code
H
C
D
B
Year code:
0→2010,
1→2011,
2→2012,
…etc.
□□
□□
month code: 1~9,
A,B,C
E
I
F
G
3-Lead SOT-89 Plastic
Surface Mounted Package
CYStek Package Code: M3
Style: Pin 1. Anode 2. Cathode 3. Not Connected
*: Typical
Inches
Min.
Max.
0.1732 0.1811
0.1551 0.1673
0.0591 0.0663
0.0906 0.1024
0.0126 0.0205
DIM
A
B
C
D
E
Millimeters
Min.
Max.
4.40
4.60
3.94
4.25
1.50
1.70
2.30
2.60
0.32
0.52
DIM
F
G
H
I
Inches
Min.
Max.
0.0579 0.0602
0.1165 0.1197
0.0551 0.0630
0.0138 0.0173
Millimeters
Min.
Max.
1.47
1.53
2.96
3.04
1.40
1.60
0.35
0.44
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
QJM3, QJCTM3
CYStek Product Specification