MTN4N65J3

Spec. No. : C797J3
Issued Date : 2011.09.14
Revised Date : 2013.12.26
Page No. : 1/11
CYStech Electronics Corp.
N-Channel Enhancement Mode Power MOSFET
BVDSS : 650V
RDS(ON) : 3.0Ω(typ.)
MTN4N65J3
ID : 4A
Features
• Low On Resistance
• Simple Drive Requirement
• Low Gate Charge
• Fast Switching Characteristic
• Pb-free lead plating and halogen-free package
Applications
• Open Framed Power Supply
• Adapter
• STB
Symbol
Outline
MTN4N65J3
TO-252(DPAK)
G
G：Gate
D S
D：Drain S：Source
Ordering Information
Device
MTN4N65J3-0-T3-G
Package
TO-252
(Pb-free lead plating and halogen-free package)
Shipping
2500 pcs / Tape & Reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T3 : 2500 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
MTN4N65J3
CYStek Product Specification
Spec. No. : C797J3
Issued Date : 2011.09.14
Revised Date : 2013.12.26
Page No. : 2/11
CYStech Electronics Corp.
Absolute Maximum Ratings (TC=25°C)
Parameter
Symbol
Limits
Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Continuous Drain Current @TC=100°C
Pulsed Drain Current @ VGS=10V
(Note 1)
Single Pulse Avalanche Energy
(Note 2)
Avalanche Current
(Note 1)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
Maximum Temperature for Soldering @ Lead at 0.125 in(0.318mm)
from case for 10 seconds
Total Power Dissipation (TA=25℃)
Total Power Dissipation (TC=25℃)
Linear Derating Factor
Operating Junction and Storage Temperature
VDS
VGS
ID
ID
IDM
EAS
IAR
EAR
dv/dt
650
±30
4
2.4
16
69
4
4.8
4.5
V
V
A
A
A
mJ
A
mJ
V/ns
TL
300
°C
1.14
48
0.38
-55~+150
W
W
W/°C
°C
PD
Tj, Tstg
Note : 1.Repetitive rating; pulse width limited by maximum junction temperature.
2. IAS=4A, VDD=50V, L=8mH, RG=25Ω, starting TJ=+25℃.
3. ISD≤4A, dI/dt≤100A/μs, VDD≤BVDSS, starting TJ=+25℃.
Thermal Data
Parameter
Thermal Resistance, Junction-to-case, max
Thermal Resistance, Junction-to-ambient, max
MTN4N65J3
Symbol
Rth,j-c
Rth,j-a
Value
2.6
110
Unit
°C/W
°C/W
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C797J3
Issued Date : 2011.09.14
Revised Date : 2013.12.26
Page No. : 3/11
Characteristics (TC=25°C, unless otherwise specified)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
650
2.0
-
0.6
2.3
3.0
4.0
±100
1
10
3.5
V
V/°C
V
S
nA
μA
μA
Ω
VGS=0, ID=250μA, Tj=25℃
Reference to 25°C, ID=250μA
VDS = VGS, ID=250μA
VDS =15V, ID=2A
VGS=±30
VDS =650V, VGS =0
VDS =520V, VGS =0, TC=125°C
VGS =10V, ID=2A
11
2.6
4.6
15
33
30
37
568
51
9.6
-
280
2
1.5
4
16
-
Static
BVDSS
∆BVDSS/∆Tj
VGS(th)
*GFS
IGSS
IDSS
*RDS(ON)
Dynamic
*Qg
*Qgs
*Qgd
*td(ON)
*tr
*td(OFF)
*tf
Ciss
Coss
Crss
Source-Drain Diode
*VSD
*IS
*ISM
*trr
*Qrr
-
nC
ID=4A, VDD=520V, VGS=10V
ns
VDD=325V, ID=4A, VGS=10V,
RG=25Ω
pF
VGS=0V, VDS=25V, f=1MHz
V
IS=4A, VGS=0V
A
ns
μC
VGS=0, IF=4A, dI/dt=100A/μs
*Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%
Recommended soldering footprint
MTN4N65J3
CYStek Product Specification
Spec. No. : C797J3
Issued Date : 2011.09.14
Revised Date : 2013.12.26
Page No. : 4/11
CYStech Electronics Corp.
Typical Characteristics
Static Drain-Source On-resistance vs Ambient Temperature
Typical Output Characteristics
7
15V
10V
9V
7V
6V
Drain Current - ID(A)
6
5
4
Static Drain-Source On-state
Resistance-RDS(on) (Ω)
7
5.5V
3
5V
2
6
5
4
3
ID=2A,
VGS=10V
2
1
VGS=4.5V
0
0
10
20
30
40
Drain-Source Voltage -VDS(V)
50
1
-100
60
150
4
6
VGS=10V
Ta=25°C
VDS=10V
Drain Current-I D(on) (A)
3.5
4
3
2.5
2
1.5
1
0.5
0
2
0.1
1
0
10
5
10
15
Gate-Source Voltage-VGS(V)
Drain Current-ID(A)
100
20
Reverse Drain Current-I DR (A)
Ta=25°C
15
10
5
ID=2A
20
Body Diode Forward Voltage Variation with Source
Current and Temperature
Static Drain-Source On-State Resistance vs Gate-Source
Voltage
Static Drain-Source On-State
Resistance-R DS(ON)(Ω)
0
50
100
Ambient Temperature-Ta(°C)
Drain Current vs Gate-Source Voltage
Static Drain-Source On-State resistance vs Drain Current
Static Drain-Source On-State ResistanceRDS(on) (Ω)
-50
VGS=0V
10
Ta=150°C
1
Ta=25°C
0.1
0
0
MTN4N65J3
2
4
6
8
Gate-Source Voltage-VGS(V)
10
12
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Source Drain Voltage -VSD(V)
CYStek Product Specification
Spec. No. : C797J3
Issued Date : 2011.09.14
Revised Date : 2013.12.26
Page No. : 5/11
CYStech Electronics Corp.
Typical Characteristics(Cont.)
Brekdown Voltage vs Ambient Temperature
Capacitance vs Reverse Voltage
1000
Drain-Source Breakdown Voltage
BVDSS(V)
850
Capacitance-(pF)
Ciss
100
Coss
10
Crss
800
750
700
650
ID=250μA,
VGS=0V
f=1MHz
1
0
5
10
15
20
25
Drain-to-Source Voltage-VDS (V)
600
-100
30
-50
50
100
150
200
Gate Charge Characteristics
Maximum Safe Operating Area
12
100
Operation in this area
is limited by RDS(ON)
VDS=130V
10μs
10
100μs
1ms
1
10ms
100ms
Single pulse
Tc=25°C
Tj=150°C
0.1
DC
Gate-Source Voltage---VGS(V)
Drain Current --- ID(A)
0
Ambient Temperature-Tj(°C)
10
VDS=325V
8
VDS=520V
6
4
2
ID=4A
0
0.01
1
10
100
Drain-Source Voltage -VDS(V)
1000
0
2
4
6
8
10
12
Total Gate Charge---Qg(nC)
Maximum Drain Current vs Case Temperature
5
Maximum Drain Current---I D(A)
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
25
50
75
100
125
150
175
Case Temperature---TC (°C)
MTN4N65J3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C797J3
Issued Date : 2011.09.14
Revised Date : 2013.12.26
Page No. : 6/11
Typical Characteristics(Cont.)
Transient Thermal Response Curves
10
ZθJC(t), Thermal Response
D=0.5
1
1.ZθJC(t)=2.6 °C/W max.
2.Duty Factor, D=t1/t2
3.TJM-TC=PDM*ZθJC(t)
0.2
0.1
0.05
0.1
0.02
0.01
Single Pulse
0.01
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
t1, Square Wave Pulse Duration(s)
MTN4N65J3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C797J3
Issued Date : 2011.09.14
Revised Date : 2013.12.26
Page No. : 7/11
Test Circuit and Waveforms
MTN4N65J3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C797J3
Issued Date : 2011.09.14
Revised Date : 2013.12.26
Page No. : 8/11
Test Circuit and Waveforms(Cont.)
MTN4N65J3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C797J3
Issued Date : 2011.09.14
Revised Date : 2013.12.26
Page No. : 9/11
Reel Dimension
Carrier Tape Dimension
MTN4N65J3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C797J3
Issued Date : 2011.09.14
Revised Date : 2013.12.26
Page No. : 10/11
Recommended wave soldering condition
Product
Peak Temperature
Soldering Time
Pb-free devices
260 +0/-5 °C
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Sn-Pb eutectic Assembly
Average ramp-up rate
3°C/second max.
(Tsmax to Tp)
Preheat
100°C
−Temperature Min(TS min)
−Temperature Max(TS max)
150°C
−Time(ts min to ts max)
60-120 seconds
Time maintained above:
−Temperature (TL)
183°C
− Time (tL)
60-150 seconds
Peak Temperature(TP)
240 +0/-5 °C
Time within 5°C of actual peak
10-30 seconds
temperature(tp)
Ramp down rate
6°C/second max.
6 minutes max.
Time 25 °C to peak temperature
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260 +0/-5 °C
20-40 seconds
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
MTN4N65J3
CYStek Product Specification
Spec. No. : C797J3
Issued Date : 2011.09.14
Revised Date : 2013.12.26
Page No. : 11/11
CYStech Electronics Corp.
TO-252 Dimension
Marking:
4
Device
Name
CYS
4N65
Date
Code
□□□□
1
3-Lead TO-252 Plastic Surface Mount Package
CYStek Package Code: J3
Inches
Min.
Max.
0.087
0.094
0.000
0.005
0.039
0.048
0.026
0.034
0.026
0.034
0.018
0.023
0.018
0.023
0.256
0.264
0.201
0.215
0.236
0.244
DIM
A
A1
B
b
b1
C
C1
D
D1
E
Millimeters
Min.
Max.
2.200
2.400
0.000
0.127
0.990
1.210
0.660
0.860
0.660
0.860
0.460
0.580
0.460
0.580
6.500
6.700
5.100
5.460
6.000
6.200
2
3
Style: Pin 1.Gate 2.Drain 3.Source
4.Drain
DIM
e
e1
H
K
L
L1
L2
L3
P
V
Inches
Min.
Max.
0.086
0.094
0.172
0.188
0.163 REF
0.190 REF
0.386
0.409
0.114 REF
0.055
0.067
0.024
0.039
0.026 REF
0.211 REF
Millimeters
Min.
Max.
2.186
2.386
4.372
4.772
4.140 REF
4.830 REF
9.800
10.400
2.900 REF
1.400
1.700
0.600
1.000
0.650 REF
5.350 REF
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead : Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTN4N65J3
CYStek Product Specification