Crystal Clock Oscillators 32SMO (+1.8V, +2.5V, +3.0V or +3.3V FIXED MODELS) XTAL 32SMO #3 Operating Conditions #2 1.0±0.2 Absolute Max. Ratings 1.0 1.2 #1 1.0 #2 1.0 0.75 VCXO Frequency stability (over all conditions) 3.2±0.2 0.75 PIN 1 2 3 4 #4 TCXO #3 CONNECTION OPEN or “H” “ L” GND OUTPUT Z VDD Z : high impedance C to +125゜ C -55゜ VDD +1.8V +2.5V +3.3V Rise and fall times "0" Level "1" Level Load Disable delay time Enable delay time Start-up time SSB phase noise (at VDD = +3.3V & 133.000 MHz) RMS jitter (12 kHz to 20.000 MHz band) Aging Reflow condition +2.5V, +3.0V or +3.3V DC ±5% VIH : 70% VDD min. VIL : 30% VDD max.*2 -0.3V to +4.0V DC Storage temperature (-40゜ C to +85゜ C) 1.1 1.9 OCXO OUTPUT WAVEFORM C to +70゜ C (Standard) -20゜ C to +85゜ C (W = Option) -40゜ C to +105゜ C (WW = Option) 1.500 MHz to 80.000 MHz -40゜ C to +125゜ C (WWW = Option) 1.500 MHz to 80.000 MHz -40゜ +1.8V, +2.5V, +3.0V or +3.3V DC ±5% Symmetry Output 0.01μF ～ 0.1μF 2.3 Supply voltage (VDD) Stand-by control voltage (Pin#1) Supply voltage Stand-by current*2 1.3 ● WIDE FREQUENCY RANGE ● CMOS OUTPUT ● PACKAGE SIZE 3.2x2.5 mm Operating temperature Input current (max. mA) (Pin#1 = Open or VIH) No load SOLDERING PATTERN CMOS Specifications 32SMO*1 1.500 MHz to 135.000 MHz 133.000 MHz to 170.000 MHz 32SMO(A) : ±100 ppm over -20゜ C to +70゜ C 32SMO(B) : ±50 ppm over -20゜ C to +70゜ C 32SMO(C) : ±30 ppm over -20゜ C to +70゜ C 32SMO(D) : ±25 ppm over -20゜ C to +70゜ C 32SMO(E) : ±20 ppm over -20゜ C to +70゜ C C to +85゜ C 32SMO(AW) : ±100 ppm over -40゜ C to +85゜ C 32SMO(BW) : ±50 ppm over -40゜ C to +85゜ C 32SMO(CW) : ±30 ppm over -40゜ C to +85゜ C 32SMO(DW) : ±25 ppm over -40゜ 0.025gm (wt.) 2.5±0.2 CLK OSC Actual size 3.2x2.5 mm STANDARD SMD CLOCK OSCILLATORS 3.2x2.5 mm Item General part number Frequency range #1 1.5 to 170 MHz STANDARD SPECIFICATIONS 32SMO #4 Wide Freq. SPXO 1.0M+ 1.5 2.0 2.4 10M+ 2.0 2.3 3.5 40M+ 5.0 6.0 7.0 Frequency 75M+ 85M+ 7.0 7.5 8.0 8.5 9.0 10.5 101M+ 10 12 15 135M+ n.a. 25.5 29.5 10 μA max. (Pin#1 = VIL) … -40゜ C to +85゜ C 20 μA max. (Pin#1 = VIL) … -40゜ C to +105゜ C / +125゜ C 45% to 55% at 1/2 VDD level 6 ns max. 3 ns max. (10% VDD to 90% VDD level) (10% VDD to 90% VDD level) VOL : 10% VDD max. VOH : 90% VDD min. 15 pF max. (CMOS) 200 ns max. 10 ms max. 10 ms max. -135 dBc / Hz, Typical at 1 kHz offset -158 dBc / Hz, Typical at 1 MHz offset 500 fs max. (80 fs, Typical at 133.000 MHz) ±5 ppm max. at +25゜ C ±3゜ C for first year +250゜ C ±10゜ C for 10 seconds +170゜ C ±10゜ C for 1 to 2 minutes (preheating) PACKAGE DATA Terminal plating RoHS 72 Metal Ceramic Seam Tungsten (metalized) Gold / Nickel (surface) / (under) Compliant (Pb-free) L ∅ 1.5 + 0 -0 .1 1.75±0.1 4.0±0.1 32SMO 2.0±0.1 D Lid Base Sealing Terminal Package C Item TAPE SPECIFICATIONS M B J TEST CIRCUIT A MCF ( * 1 ) F inal par t number to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng tem pe rat ure and f requency. e. g. 32S M O( 1.8VD ) 24.000MH z ( * 2 ) I nt er nal c r ys tal os c i l l ati on to be hal ted ( Pi n#1 = V IL ) F A B C D F J L M Reel Dia. Qty/Reel 3.5 2.8 8.0 3.5 4.0 1.0 0.25 1.4 180 1000pcs 2000pcs