DM(R)、NDI(R)、DL(R)-V SPECIFICATION FILE No. REV. Page : E-V-AD05 : B : 1 / 4 1.Style: This specification describes "DUAL IN-LINE PACKAGE SWITCHES" mainly used as signal switch of electric devices with the general requirements of mechanical and electrical characteristics. 1.1 Operating Temperature Range : -20℃ ~ +85℃ 1.2 Storage Temperature Range : -40℃ ~ +85℃ 2. Current Range : 2.1 Non-Switching : 100mA, 50V DC 2.2 Switching : 25mA , 24V DC 3. Type of Actuation: Actuated by sliding 4. Test Sequence : ELECTRIC PERFORMANCE ITEM DESCRIPTION 1 2 3 4 MECHANICAL PERFORMANCE 5 6 TEST CONDITIONS Visual By visual examination check without Examination any out pressure & testing. Contact Resistance To be measured between the two terminals associated with each switch pole. Measurements shall be made with a 1kHz shall current contact resistance meter. Insulation 500V DC, 1 minute ± 5 sec. Resistance 500V AC (50Hz or 60 Hz) shall be Dielectric applied between all the adjacent withstandterminals and between the terminal ing Voltage and the frame for 1 minute. Capacitance 1 MHz ± 10 kHz Applied in the direction of operation. ON→OFF Operation OFF→ON Force REQUIREMENTS There shall be no defects that affect the serviceability of the product. 50mΩ max. (initial) 100MΩ min. There shall be no breakdown or flashover. 5 pF max. 1000gf max （9.8N max） DM(R)、NDI(R)、DL(R)-V SPECIFICATION 7 Stop Strength FILE No. REV. Page A static load of 1 kgf is applied in the operating direction and pulling direction operated for a period of 15 seconds. : E-V-AD05 : B : 2 / 4 There shall be no sign of damage mechanically. MECHANICAL PERFORMANCE 1.Soldering Temperature : PROD SERIES TEMP TIME THROUGH HOLE TYPE NDI(R)-V 260℃±5℃ 5±1 sec. Soldering SMT TYPE Heat As shown in item 2~6 8 SEE PAGE 4/4 DM(R)、DL(R)-V Resistance 2.Duration of Solder Immersion: 5±1 sec. 3.Frequency of Soldering Process: 2 times max. (PCB is 1.6mm in thickness.) Shall be vibrated in accordance with Method 201A of MIL-STD-202F Frequency: 10-55-10 Hz 1 min/cycle. As shown in item 2~6 9 Vibration Direction: 3 vertical directions including the direction of operation. Test Time: 2 hours each direction. Shall be shocked in accordance with Method 213B condition A of MIL-STD-202F Shock Acceleration: 50G. As shown in item 2~6 10 Action Time : 11 ± 1 m sec. Testing Direction: 6 sides. Test cycle : 3 times in each direction THROUGH HOLE TYPE Soldering Temperature:245±3℃ Lead-Free solder：M705E JIS Z 3282 Class No anti-soldering and the A coverage of dipping into 11 Solderability (Tin 96.5%，Silver 3%，Copper 0.5%) solder must more than Flux: 5-10 seconds. 75% was requested. Duration of solder Immersion: 3±0.5 sec. SMT TYPE SEE PAGE 4/4 DURABILITY DM(R)、NDI(R)、DL(R)-V SPECIFICATION Measurements shall be made following the test set forth below: 25 mA, 24V DC resistive load Operation 12 Rate of Operation: 15~20 cycles/ Life minute Cycle of Operation: 2000 cycles. Resistance 13 Low Temperature WEATHER-PROOF FILE No. REV. Page Resistance 14 High Temperature : E-V-AD05 : B : 3 / 4 1.As show in item 3,4 2.Contact Resistance: 100mΩ max. (final-after test) Following the test set forth below the sample shall be left in normal temperature and humidity conditions for an hour before As shown in item 2~6 measurements are made : 1.Temperature : -40℃±3℃ 2.Time: 96 hours Following the test set forth below the sample shall be left in normal temperature and 1.As shown in item 3~6 humidity conditions for an hour before 2.Contact Resistance: measurements are made : 100mΩ max. 1.Temperature : 85℃±2℃ 2.Time: 96 hours Following the test set forth below the 1.As shown in item 4,6 sample shall be left in normal temperature 2.Contact Resistance: and humidity conditions for an hour 100mΩ max. Resistance before measurements are made : 3.Insulation Resistance: 15 Humidity Temperature : 85℃±2℃ 10MΩ min. Relative Humidity :90~95% Time: 96 hours DM(R)、NDI(R)、DL(R)-V SPECIFICATION FILE No. REV. Page : E-V-AD05 : B : 4 / 4 5. SOLDERING CONDITIONS: ■ Condition for Soldering –DM(R)、DL(R) –V Series MAX 260° 255° 230° 150° Room Temperature 120~150sec 5~10sec 60sec TIME(sec) ■ The condition mentioned above is the temperature on the Cu foil of the P.C.B surface. There are cases where board’s temperature greatly differs from switch’s surface temperature depending on board’s material, size, thickness, etc. Care, therefore, should be used not to allow switch’s surface temperature to exceed 260℃. ■ Manual Soldering Soldering Temperature Max.350℃ Continuous Soldering Time Max. 5 seconds ■ Precautions in Handling 1. Care should be exercised so that flux from the upper part of the printed circuit board does not adhere to the switch. 2. Don’t clean the switch body except with top tape sealed type, which can only spray of cleaning method from top of s/w. 3. Please make sure that there is no flux rose over the surface of the PCB