A623308A Series 8K X 8 BIT CMOS SRAM Document Title 8K X 8 BIT CMOS SRAM Revision History History Issue Date Remark 0.0 Initial issue November 9, 2004 Preliminary 1.0 Remove non-Pb-free package type July 3, 2006 Final Rev. No. Final version release (July, 2006, Version 1.0) AMIC Technology, Corp. A623308A Series 8K X 8 BIT CMOS SRAM Preliminary Features Power Supply Range: 4.5V to 5.5V Access times: 70 ns A623308A-S series: Operating: Standby: A623308A-SI/SU series: Operating: Standby: Extended operating temperature range: 0°C to 70°C for S series, -25°C to 85°C for -SI series, -40°C to 85°C for -SU series. Full static operation, no clock or refreshing required All inputs and outputs are directly TTL-compatible Common I/O using three-state output Data retention voltage: 2.0V (min.) Available in 28-pin, DIP/SOP and TSOP Pb-Free package only All Pb-free (Lead-free) products are RoHS compliant 35mA (max.) 10µA (max.) 35mA (max.) 15µA (max.) General Description Minimum standby power is drawn by this device when CE is at a high level, independent of the other input levels. Data retention is guaranteed at a power supply voltage as low as 2.0V. The A623308A is a low operating current 65,536-bit static random access memory organized as 8,192 words by 8 bits and operates on a voltage from 4.5V to 5.5V. Inputs and three-state outputs are TTL compatible and allow for direct interfacing with common system bus structures. Pin Configurations 1 28 VCC 2 27 WE A7 3 26 NC A6 4 25 A8 A5 5 24 A9 A4 6 23 A11 A3 7 22 OE A2 8 21 A10 A1 9 20 CE A0 10 19 I/O7 I/O0 11 18 I/O6 I/O1 12 17 I/O5 I/O2 13 16 I/O4 GND 14 15 I/O3 (July, 2006, Version 1.0) A623308A(M) NC A12 OE A11 A9 A8 NC WE VCC NC A12 A7 A6 A5 A4 A3 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 ~ ~ TSOP A623308AV ~ DIP / SOP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 VSS I/O2 I/O1 I/O0 A0 A1 A2 AMIC Technology, Corp. A623308A Series Block Diagram VCC A0 GND A10 ROW 128 X 512 DECODER MEMORY ARRAY INPUT DATA CIRCUIT COLUMN I/O A11 A12 I/O0 I/O7 CE CONTROL CIRCUIT OE WE Pin Description-TSOP Pin Descriptions – DIP / SOP Pin No. Symbol No Connection 5, 8 NC No Connection A0 - A12 Address Input 2-4, 9-17, 28 A0 - A12 Address Input 11-13, 15-19 I/O0 - I/O7 Data Input/Output 18-20, 22-26 I/O0 - I/O7 Data Input/Output 20 CE Chip Enable 27 CE Chip Enable 22 OE Output Enable 1 OE Output Enable 27 WE Write Enable 6 WE Write Enable 28 VCC Power Supply 7 VCC Power Supply 14 GND Ground 21 GND Ground Pin No. Symbol 1, 26 NC 2-10, 21, 23-25 (July, 2006, Version 1.0) Description 2 Description AMIC Technology, Corp. A623308A Series Recommended DC Operating Conditions (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C) Symbol Parameter Min. Typ. Max. Unit 4.5 5.0 5.5 V 0 0 0 V VCC Supply Voltage GND Ground VIH Input High Voltage 2.2 - VCC + 0.5 V VIL Input Low Voltage -0.5 0 +0.8 V Absolute Maximum Ratings* *Comments VCC to GND . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V Operating Temperature, Topr …………………………… ………………………….. 0°C to +70°C or -40°C to +85°C Storage Temperature, Tstg . . . . . . . . -55°C to +125°C Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . . 0.7W Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied and exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Characteristics (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C, VCC = 5.0V ± 10%, GND = 0V) Symbol Parameter A623308A-70S A623308A-70SI/SU Min. Max. Min. Max. Unit Conditions ⏐ILI⏐ Input Leakage Current - 1 - 1 µA VIN = GND to VCC ⏐ILO⏐ Output Leakage Current - 1 - 1 µA CE = VIH VI/O = GND to VCC Active Power Supply Current - 5 - 5 mA CE = VIL, II/O = 0mA ICC ICC1 Dynamic Operating Current - 35 - 35 mA Min. Cycle, Duty = 100% CE = VIL, II/O = 0mA ICC2 Dynamic Operating Current - 5 - 5 mA CE = VIL, VIH = VCC VIL = 0V, f = 1 MHz II/O = 0 mA - 0.5 - 0.5 mA CE = VIH - 10 - 15 µA CE ≥ VCC - 0.2V VIN ≥ 0V ISB Supply Current Standby Power ISB1 VOL Output Low Voltage - 0.4 - 0.4 V IOL = 2.1 mA VOH Output High Voltage 2.4 - 2.4 - V IOH = -1.0 mA (July, 2006, Version 1.0) 3 AMIC Technology, Corp. A623308A Series Truth Table Mode I/O Operation Supply Current CE OE WE Standby H X X High Z ISB, ISB1 Output Disable L H H High Z ICC, ICC1, ICC2 Read L L H DOUT ICC, ICC1, ICC2 Write L X L DIN ICC, ICC1, ICC2 Note: X: H or L Capacitance (TA = 25°C, f = 1.0 MHz) Symbol Parameter Min. Max. Unit Conditions CIN* Input Capacitance - 6 pF VIN = 0V CI/O* Input/Output Capacitance - 8 pF VI/O = 0V * These parameters are sampled and not 100% tested. (July, 2006, Version 1.0) 4 AMIC Technology, Corp. A623308A Series AC Characteristics (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C, VCC = 5.0V ± 10%) Symbol A623308A-70S/SI/SU Parameter Unit Min. Max. 70 - ns Read Cycle tRC Read Cycle Time tAA Address Access Time - 70 ns tACE Chip Enable Access Time - 70 ns tOE Output Enable to Output Valid - 35 ns tCLZ Chip Enable to Output in Low Z 10 - ns tOLZ Output Enable to Output in Low Z 5 - ns tCHZ Chip Disable to Output in High Z - 25 ns tOHZ Output Disable to Output in High Z - 25 ns tOH Output Hold from Address Change 10 - ns tWC Write Cycle Time 70 - ns tCW Chip Enable to End of Write 60 - ns tAS Address Set up Time 0 - ns tAW Address Valid to End of Write 60 - ns tWP Write Pulse Width 50 - ns tWR Write Recovery Time 0 - ns tWHZ Write to Output in High Z - 25 ns tDW Data to Write Time Overlap 30 - ns tDH Data Hold from Write Time 0 - ns tOW Output Active from End of Write 5 - ns Write Cycle Notes: tCHZ, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels. (July, 2006, Version 1.0) 5 AMIC Technology, Corp. A623308A Series Timing Waveforms Read Cycle 1 (1) tRC Address tAA OE tOE tOH tOLZ5 CE tOHZ5 tACE tCHZ5 tCLZ5 DOUT Read Cycle 2 (1, 2, 4) tRC Address tAA tOH tOH DOUT (July, 2006, Version 1.0) 6 AMIC Technology, Corp. A623308A Series Timing Waveforms (continued) Read Cycle 3 (1, 3, 4) CE tACE tCLZ 5 tCHZ 5 DOUT Notes: 1. 2. 3. 4. 5. WE is high for Read Cycle. Device is continuously enabled, CE = VIL. Address valid prior to or coincident with CE transition low. OE = VIL. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested. Write Cycle 1 (6) (Write Enable Controlled) tWC Address tAW tWR 3 tCW 5 CE (4) tAS1 tWP 2 WE tDW tDH DIN tWHZ 7 tOW 7 DOUT (July, 2006, Version 1.0) 7 AMIC Technology, Corp. A623308A Series Timing Waveforms (continued) Write Cycle 2 (6) (Chip Enable Controlled) tWC Address tWR3 tAW tCW5 CE tAS1 (4) tWP2 WE tDW tDH DIN tWHZ7 DOUT tAS is measured from the address valid to the beginning of Write. A Write occurs during the overlap (tWP) of a low CE and a low WE . tWR is measured form the earliest of CE or WE going high to the end of the Write cycle. If the CE low transition occurs simultaneously with the WE low transition or after the WE transition, outputs remain in a high impedance state. 5. tCW is measured from the later of CE going low to the end of Write. 6. OE level is high or low. 7. Transition is measured ±500mV from steady. This parameter is sampled and not 100% tested. Notes: 1. 2. 3. 4. (July, 2006, Version 1.0) 8 AMIC Technology, Corp. A623308A Series AC Test Conditions Input Pulse Levels 0V, 3V Input Rise And Fall Time 5 ns Input and Output Timing Reference Levels 1.5V Output Load See Figure 1 and 2 TTL TTL CL CL 5pF 30pF * Including scope and jig. * Including scope and jig. Figure 1. Output Load Figure 2. Output Load for tCLZ1, tCLZ2, tOHZ, tOLZ, tCHZ1, tCHZ2, tWHZ, and tOW Data Retention Characteristics (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C) Symbol Parameter Min. Max. Unit Conditions VDR VCC for Data Retention 2.0 5.5 V CE ≥ VCC - 0.2V ICCDR Data Retention Current - 3 µA VCC = 2.0V, CE ≥ VCC - 0.2V VIN ≥ 0V tCDR Chip Disable to Data Retention Time 0 - ns tRC - ns See Retention Waveform tR Operation Recovery Time (July, 2006, Version 1.0) 9 AMIC Technology, Corp. A623308A Series Low VCC Data Retention Waveform DATA RETENTION MODE VCC 4.5V 4.5V tCDR tR VDR ≥ 2.0V VIH VIH CE CE ≥ VDR - 0.2V Ordering Information Operating Current Max. (mA) Standby Current Max. (µA) A623308A-70SF 35 10 28L Pb-Free DIP A623308AM-70SF 35 10 28L Pb-Free SOP A623308AV-70SF 35 10 28L Pb-Free TSOP (Forward) A623308A-70SIF 35 15 28L Pb-Free DIP 35 15 28L Pb-Free SOP A623308AV-70SIF 35 15 28L Pb-Free TSOP (Forward) A623308A-70SUF 35 15 28L Pb-Free DIP A623308AM-70SUF 35 15 28L Pb-Free SOP A623308AV-70SUF 35 15 28L Pb-Free TSOP (Forward) Part No. A623308AM-70SIF (July, 2006, Version 1.0) Access Time (ns) 70 10 Package AMIC Technology, Corp. A623308A Series Package Information P-DIP 28L Outline Dimensions unit: inches/mm D 28 E1 15 1 14 E A1 A2 Base Plane Seating Plane L A C S B B1 α e1 Dimensions in inches eA Dimensions in mm Symbol Min Nom Max Min Nom Max A - - 0.210 - - 5.33 A1 0.010 - - 0.25 - - A2 0.150 0.155 0.160 3.81 3.94 4.06 B 0.016 0.018 0.022 0.41 0.46 0.56 B1 0.058 0.060 0.064 1.47 1.52 1.63 C D 0.008 - 0.010 1.460 0.014 1.470 0.20 - 0.25 37.08 0.36 37.34 E 0.590 0.600 0.610 14.99 15.24 15.49 E1 0.540 0.545 0.550 13.72 13.84 13.97 e1 0.090 0.100 0.110 2.29 2.54 2.79 L 0.120 0.130 0.140 3.05 3.30 3.56 α 0° - 15° 0° - 15° eA 0.630 0.650 0.670 16.00 16.51 17.02 S - - 0.090 - - 2.29 Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E1 does not include resin fins. 3. Dimension S includes end flash. (July, 2006, Version 1.0) 11 AMIC Technology, Corp. A623308A Series Package Information SOP (W.B.) 28L Outline Dimensions unit: inches/mm H 15 E 28 θ L 1 B Detail F 14 L1 A1 e S D y A A2 c D Seating Plane y See Detail F Dimensions in inches Symbol Dimensions in mm Min Nom Max Min Nom Max A - - 0.112 - - 2.85 A1 0.004 - - 0.10 - 2.62 A2 0.093 0.098 0.103 2.36 2.49 B 0.014 0.016 0.020 0.36 0.41 0.51 C 0.008 0.010 0.012 0.20 0.25 0.30 18.49 D - 0.713 0.728 - 18.11 E 0.326 0.331 0.336 8.28 8.41 8.53 e 0.044 0.050 0.056 1.12 1.27 1.42 H 0.453 0.465 0.477 11.51 11.81 12.12 L 0.028 0.036 0.044 0.71 0.91 1.12 L1 0.059 0.067 0.075 1.50 1.70 1.91 S - - 0.047 - - 1.19 y - - 0.004 - - 0.10 θ 0° - 8° 0° - 8° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. (July, 2006, Version 1.0) 12 AMIC Technology, Corp. A623308A Series Package Information TSOP 28L TYPE I (8 X 13.4mm) Outline Dimensions unit: inches/mm D1 Detail "A" 28 A1 E c A A2 1 e θ 14 L 15 D D Detail "A" y S Dimensions in inches Symbol A b Dimensions in mm Min Nom Max Min Nom Max - - 0.049 - - 1.25 A1 0.002 - - 0.05 - - A2 0.037 0.039 0.041 0.95 1.00 1.05 b 0.007 0.009 0.011 0.17 0.22 0.27 c 0.005 - 0.008 0.12 - 0.21 E 0.311 0.315 0.319 7.90 8.00 8.10 L 0.012 0.020 0.028 0.30 0.50 0.70 D 0.520 0.528 0.536 13.20 13.40 13.60 D1 0.461 0.465 0.469 11.70 11.80 11.90 e 0.022 BSC S 0.55 BSC 0.017 TYP 0.425 TYP y - - 0.004 - - 0.10 θ 0° - 5° 0° - 5° Notes: 1. The maximum value of dimension D1 includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. (July, 2006, Version 1.0) 13 AMIC Technology, Corp.