Application Note - Eon Silicon Solution Inc.

Eon Silicon Solution Inc.
Application Note
EON EN25Q32A
vs
MXIC
KH25L3205D
Specification Comparison
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
1
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
1. INTRODUCTION
The application note introduces how to implement a system design from MXIC
KH25L3205D Flash to Eon EN25Q32A Flash.
2. GENERAL FUNCTION COMPARISON TABLE:
2.1 The following table highlights the major features of these two devices.
Features
EN25Q32A
2.7 ~ 3.6
KH25L3205D
2.7 ~ 3.6
8-pins SOP 200mil
8 contact VDFN
8-pins DIP
8-pins SOP 200mil
8-land WSON (6mmx5mm)
8-pins DIP
SPI frequency
100MHz (standard mode)
80MHz @ dual & quad mode
86MHz (standard mode)
50MHz @ dual mode
Secured Silicon
Sector Region
512 Byte
512 bit
Uniform
1024 sectors of 4K byte
64 block of 64K byte
Mode 0 / Mode 3
Uniform
1024 sectors of 4K byte
64 block of 64K byte
Mode 0 / Mode 3
Minimum
Endurance Cycle
100K
100K
Package
8-pins SOP 150mil
8-pins SOP 200mil
8 contact VDFN
8-pins DIP
8-pins SOP 200mil
16-pins SOP 300mil
8-land WSON (6mmx5mm)
8-pins DIP
Voltage Range
Pin to Pin
Compatible
(standard SPI
mode)
Sector
Architecture
SPI mode
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
2
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
3. HARDWARE CONSIDERATIONS
3.1 ICC comparison
EN25Q32A
KH25L3205D
Max
25 @ 50/86MHz
mA
Page Program (PP) ICC4
Max
25 @ 100MHz
20 @ 80MHz
28
20
mA
Sector Erase (SE) ICC6
25
20
mA
Standby ICC1
20
20
μA
Current
Read ICC3
Unit
3.2 Pin Configuration (8-pin package)
Pin number
Pin1
Pin2
Pin3
Pin4
Pin5
Pin6
Pin7
Pin8
EN25Q32A
CS#
DO (DQ1)
WP# (DQ2)
VSS
DI (DQ0)
CLK
NC (DQ3)
VCC
KH25L3205D
CS#
SO / SIO1
WP# / ACC
GND
SI / SIO0
SCLK
HOLD#
VCC
Note:
1. Eon EN25Q32A Flash can support the general standard / dual / quad SPI mode (Need specific SPI
controller), but don’t support the acceleration (ACC) pin and HOLD# pin functions.
2. For the general standard / dual SPI mode, Eon EN25Q32A Flash is the same as MXIC KH25L3205D
Flash if customer don’t use the accelerated (ACC) pin and HOLD# pin functions.
3. MXIC KH25L3205D don’t support the quad SPI mode.
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
3
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
4. SOFTWARE CONSIDERATIONS
4.1 Manufacturer, Memory Type & Device Identification (M7~M0: manufacture ID,
D15~ID0: memory type, ID7~ID0: memory density) comparison.
For EN25Q32A
For KH25L3205D
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
4
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
4.2. Instruction Set Comparison
4.2.1 Different Block Protection Area
EN25Q32A:
KH25L3205D:
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
5
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
4.2.2 Different RDSR bit definition
EN25Q32A:
KH25L3205D:
Bit 5 is used for BP3 (level of protected block).
Bit 6 is used for continuously program mode status.
4.2.3 Security Register Definition
EN25Q32A: No support.
KH25L3205D:Support.
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
6
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
4.2.4 CP (Continuously Program mdoe) command
EN25Q32A: No support.
KH25L3205D:Support. (ADh)
4.2.5 RES (Read electronic ID) command
EN25Q32A: No support.
KH25L3205D:Support. (ABh)
4.2.6 REMS2 (Read ID for 2x I/O mode) command
EN25Q32A: No support.
KH25L3205D:Support. (EFh)
4.2.7 Enter Secured OTP command
EN25Q32A: Support. (3Ah)
KH25L3205D:Support. (B1h)
4.2.8 Exit Secured OTP command
EN25Q32A: Support. (04h)
KH25L3205D:Support. (C1h)
4.2.9 Secured OTP Addresses
EN25Q32A:
KH25L3205D:
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
7
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
4.2.10 RDSCUR (Read Security register) command
EN25Q32A: No support.
KH25L3205D:Support. (2Bh)
4.2.11 WRSCUR (Write Security register) command
EN25Q32A: No support.
KH25L3205D:Support. (2Fh)
4.2.12 ESRY (Enable SO to output RY/BY#) command
EN25Q32A: No support.
KH25L3205D:Support. (70h)
4.2.13 DSRY (Disable SO to output RY/BY#) command
EN25Q32A: No support.
KH25L3205D:Support. (80h)
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
8
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
5. PERFORMANCE DIFFERENCES
5.1 ERASE AND PROGRAM PERFORMANCE
The erasing and programming performance comparison.
EN25Q32A
Parameter
KH25L3205D
Unit
Typ
Max
Typ
Max
Block Erase Time
0.5
2
0.7
2
sec
Sector Erase Time
0.09
0.3
0.09
0.15
sec
25
50
25
50
sec
1.3
5
1.4
5
ms
Chip (Bulk) Erase Time
Page Programming Time
5.2 KEY AC PARAMETER PERFORMANCE
EN25Q32A
KH25L3205D
tCH (serial clock high time)
Min @ 4ns
Min @ 7ns
tCL (serial clock low time)
Min @ 4ns
Min @ 7ns
tCLCH(serial clock rise time)
Min @ 0.1V / ns
Min @ 0.1V / ns
tCLCL(serial clock fall time)
Min @ 0.1V / ns
Min @ 0.1V / ns
[email protected] 5ns
Min @ 5ns
Parameter
tCHSH(CS# active setup / hold time)
tSHSL(CS# high time)
Min, read @15ns
Program/Erase @50ns
Min @ 100ns
tDSU(Data in setup time)
Min @ 2ns
Min @ 2ns
tDH(Data in hold time)
Min @ 5ns
Min @ 5ns
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
9
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
Revisions List
Revision No Description
Date
A
2010/01/11
Initial Release
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
10
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com