Eon Silicon Solution Inc. 6F-2, No.30, Tai-Yuan Street, Chu-Pei, Hsin-Chu, Taiwan TEL:886-3-5525686 FAX:886-3-5525696 PRODUCT CHANGE NOTICE PCN No.: PCN09040101 Issued Date: 2009/04/01 Dear Customers, We appreciate your interest and support in Eon’s flash products. We continue to do our best to serve you and look forward to extending our cooperation and long term relationship. EN29LV320B is our new product with the advanced Flash technology. It will replace EN29LV320A for mass production in the near future. The migration note is attached. The new device shall bring satisfactions and benefits to both of us. If you have any questions or comments, please feel free to contact our channel sales. Effective date: Apr. 15, 2009 Sincerely yours, William Chen ________________ Deputy Product Manager Eon Silicon Solution Inc. Eon Silicon Solution Inc. Migration Note Eon Flash EN29LV320A to EN29LV320B This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 1 Rev. A, Issue Date: 2009/ 04/07 ©2005 Eon Silicon Solution Inc. www.ession.com Eon Silicon Solution Inc. 1. INTRODUCTION The application note introduces how to implement a system design from Eon EN29LV320A Flash to EN29LV320B Flash. 2. GENERAL FUNCTION COMPARISON TABLE: The following table is major features of these two devices. Features EN29LV320A EN29LV320B voltage range 2.7 ~ 3.6 2.7 ~ 3.6 Pin to Pin Yes Yes Access time 70ns and 90ns 70ns Sector 32Kword x 63 sectors + 4Kword 32Kword x 63 sectors + 4Kword Architecture x 8 boot sectors at Top or Bottom x 8 boot sectors at Top or Bottom CFI Yes Yes Erase Yes Yes Suspend/Resume Hardware Protection for Yes Yes Top/Bottom Sector OTP sector None None Minimum endurance cycle Package 100K 100K 48-pin 12mm x 20mm TSOP 48 ball 6mm x 8mm TFBGA This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 48-pin 12mm x 20mm TSOP 48 ball 6mm x 8mm TFBGA 2 Rev. A, Issue Date: 2009/ 04/07 ©2005 Eon Silicon Solution Inc. www.ession.com Eon Silicon Solution Inc. 3. HARDWARE CONSIDERATIONS ICC comparison Current EN29LV320A Typ Read ICC1 EN29LV320B Unit Max Typ Max 9 16 9 16 mA Write ICC2 20 30 20 30 mA Standby ICC3 1 5.0 1 5.0 A 4. SOFTWARE CONSIDERATIONS There is no difference in Manufacturer ID, Device ID and Autoselect function for EN29LV320A and EN29LV320B. Manufacturer, Device Identification and Autoselect Information This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 3 Rev. A, Issue Date: 2009/ 04/07 ©2005 Eon Silicon Solution Inc. www.ession.com Eon Silicon Solution Inc. 5. PERFORMANCE DIFFERENCES 5.1 Power-on and Reset Timings EN29LV320A EN29LV320B Parameter Description tVCS Vcc Setup Time RESET# Pulse Width (During Embedded Algorithms) RESET# Pulse Width (NOT During Embedded Algorithms) Reset# High Time Before Read RY/BY# Recovery Time ( to CE#, OE# go low) RY/BY# Recovery Time ( to WE# go low) Reset# Pin Low (During Embedded Algorithms) to Read or Write Reset# Pin Low (NOT During Embedded Algorithms) to Read or Write tRP1 tRP2 tRH tRB1 tRB2 tREADY1 tREADY2 50µs 50µs None* 10µs 500ns 500ns 50ns 50ns None* 0ns None* 50ns 20µs 20µs 500ns 500ns 5.2 ERASE AND PROGRAM PERFORMANCE The erase time is improved greatly in EN29LV320B. This is the major different between EN29LV320A and EN29LV320B. EN29LV320A EN29LV320B Typ Max Typ Max Sector Erase Time 0.5 10 0.1 2 Sec Chip Erase Time 70 None* 8 70 Sec Byte Programming Time 8 300 8 200 µS Accelerated Program Time 7 200 7 200 µS 8 300 8 200 µS Byte 35 100 33.6 100.8 Sec Word 17 50 16.8 50.4 Sec Parameter Byte/Word Word Programming Time Chip Programming Time Unit Note* : There is no description in datasheet. This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 4 Rev. A, Issue Date: 2009/ 04/07 ©2005 Eon Silicon Solution Inc. www.ession.com Eon Silicon Solution Inc. Revisions List Revision No Description Date A 2009/4/7 Initial Release This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 5 Rev. A, Issue Date: 2009/ 04/07 ©2005 Eon Silicon Solution Inc. www.ession.com