Application Note - Eon Silicon Solution Inc.

Eon Silicon Solution Inc.
Application Note
EON EN25F16
vs
MXIC
MX25L1605D
Specification Comparison
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
1
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
1. INTRODUCTION
The application note introduces how to implement a system design from MXIC
MX25L1605D Flash to Eon EN25F16 Flash.
2. GENERAL FUNCTION COMPARISON TABLE:
2.1 The following table highlights the major features of these two devices.
Features
EN25F16
2.7 ~ 3.6
8-pins SOP 150mil
8-pins SOP 200mil
8 contact VDFN
8-pins DIP
MX25L1605D
2.7 ~ 3.6
8-pins SOP 150mil
8-pins SOP 200mil
8-land WSON (6mmx5mm)
8-pins DIP
100MHz
86MHz
128 Byte
512 bit
Uniform
512 Sectors of 4 K byte
32 Blocks of 64 K byte
Mode 0 / Mode 3
Uniform
512 Sectors of 4 K byte
32 Blocks of 64 K byte
Mode 0 / Mode 3
Minimum
Endurance Cycle
100K
100K
Package
8-pins SOP 150mil
8-pins SOP 200mil
8 contact VDFN
8-pins DIP
8-pins SOP 150mil
8-pins SOP 200mil
16-pins SOP 300mil
8-land WSON (6mmx5mm)
8-land USON (4mmx4mm)
8-pins DIP
Voltage Range
Pin to Pin
Compatible
(standard SPI
mode)
SPI frequency
(standard mode)
Secured Silicon
Sector Region
Sector
Architecture
SPI mode
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
2
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
3. HARDWARE CONSIDERATIONS
3.1 ICC comparison
EN25F16
MX25L1605D
Read ICC3
Max ( @ 100MHz)
25
Max ( @ 86MHz)
25
Page Program (PP) ICC4
28
20
mA
Sector Erase (SE) ICC6
25
20
mA
Standby ICC1
20
20
μA
Current
Unit
mA
3.2 Pin Configuration (8-pin package)
Pin number
Pin1
Pin2
Pin3
Pin4
Pin5
Pin6
Pin7
Pin8
EN25F16
CS#
DO
WP#
VSS
DI
CLK
HOLD#
VCC
MX25L1605D
CS#
SO / SIO1
WP# / ACC
GND
SI / SIO0
SCLK
HOLD#
VCC
Note:
1. Eon EN25F16 Flash can support the general standard SPI mode but don’t support the acceleration
(ACC) pin function.
2. For the general standard SPI mode, Eon EN25F16 Flash is the same as MXIC MX25L1605D Flash if
customer don’t use the accelerated (ACC) pin function.
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
3
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
4. SOFTWARE CONSIDERATIONS
4.1 Manufacturer, Memory Type & Device Identification (M7~M0: manufacture ID,
D15~ID0: memory type, ID7~ID0: memory density) comparison.
For EN25F16
For MX25L1605D
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
4
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
4.2. Instruction Set Comparison
4.2.1 Different Block Protection Area
EN25F16:
MX25L1605D:
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
5
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
4.2.2 Different RDSR bit definition
EN25F16:
S5 and S6 are reserved.
MX25L1605D:
Bit 5 is used for BP3 (level of protected block).
Bit 6 is used for continuously program mode status.
4.2.3 Security Register Definition
EN25F16: No support.
MX25L1605D:Support.
4.2.4 2READ (2 x I/O) read commands
EN25F16: No support.
MX25L1605D:Support. (BBh)
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
6
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
4.2.5 CP (Continuously Program mdoe) command
EN25F16: No support.
MX25L1605D:Support. (ADh)
4.2.6 RES (Read electronic ID) command
EN25F16: No support.
MX25L1605D:Support. (ABh)
4.2.7 REMS2 (Read ID for 2x I/O mode) command
EN25F16: No support.
MX25L1605D:Support. (EFh)
4.2.8 Enter Secured OTP command
EN25F16: Support. (3Ah)
MX25L1605D:Support. (B1h)
4.2.9 Exit Secured OTP command
EN25F16: Support. (04h)
MX25L1605D:Support. (C1h)
4.2.10 Secured OTP Addresses
EN25F16:
MX25L1605D:
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
7
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
4.2.11 RDSCUR (Read Security register) command
EN25F16: No support.
MX25L1605D:Support. (2Bh)
4.2.12 WRSCUR (Write Security register) command
EN25F16: No support.
MX25L1605D:Support. (2Fh)
4.2.13 ESRY (Enable SO to output RY/BY#) command
EN25F16: No support.
MX25L1605D:Support. (70h)
4.2.14 DSRY (Disable SO to output RY/BY#) command
EN25F16: No support.
MX25L1605D:Support. (80h)
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
8
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
5. PERFORMANCE DIFFERENCES
5.1 ERASE AND PROGRAM PERFORMANCE
The erasing and programming performance comparison.
EN25F16
Parameter
MX25L1605D
Unit
Typ
Max
Typ
Max
Block Erase Time
0.4
2
0.7
2
sec
Sector Erase Time
0.09
0.3
0.06
0.3
sec
7
35
14
30
sec
1.3
5
1.4
5
ms
Chip (Bulk) Erase Time
Page Programming Time
5.2 KEY AC PARAMETER PERFORMANCE
EN25F16
MX25L1605D
tCH (serial clock high time)
Min @ 4ns
Min @ 5.5ns
tCL (serial clock low time)
Min @ 4ns
Min @ 5.5ns
tCLCH(serial clock rise time)
Min @ 0.1V / ns
Min @ 0.1V / ns
tCLCL(serial clock fall time)
Min @ 0.1V / ns
Min @ 0.1V / ns
[email protected] 5ns
Min @ 5ns
Min @ 100ns
Min @ 40ns
tDSU(Data in setup time)
Min @ 2ns
Min @ 2ns
tDH(Data in hold time)
Min @ 5ns
Min @ 5ns
Parameter
tCHSH(CS# active setup / hold time)
tSHSL(CS# high time)
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
9
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com
Eon Silicon Solution Inc.
Revisions List
Revision No Description
Date
A
2010/01/11
Initial Release
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
10
©2005 Eon Silicon Solution Inc.
Rev. A, Issue Date: 2010/ 01/11
www.eonssi.com