Material Composition Specification TLM322S Case Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.0 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material Component Material Substance Substance CAS No. (%wt) (mg) (%wt) (mg) (ppm) active device doped Si 1.167% 0.07 Si 7440-21-3 1.167% 0.07 11,667 bond wire gold 0.5% 0.03 Au 7440-57-5 0.5% 0.03 5,000 Cu 7440-50-8 23.167% 1.39 231,667 Ni 7440-02-0 0.867% 0.052 8,667 Ag 7440-22-4 0.233% 0.014 2,333 Zn 7440-66-6 0.117% 0.007 1,167 Si 7440-31-5 0.117% 0.007 1,167 epoxy resin Proprietary 0.067% 0.004 667 Ag 7440-22-4 0.233% 0.014 2,333 silica (fused) 60676-86-0 66.583% 3.995 665,833 epoxy resin 29690-82-2 2.133% 0.128 21,333 phenol resin 9003-35-4 2.133% 0.128 21,333 carbon black 1333-86-4 0.217% 0.013 2,167 Sn 7440-31-5 2.467% 0.148 24,667 leadframe die attach encapsulation* plating Cu alloy silver epoxy EMC GREEN matte tin 24.5% 0.3% 71.066% 2.467% 1.47 0.018 4.264 0.148 *EMC GREEN molding compound is Halogen Free. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R0 (11-January 2012) w w w. c e n t r a l s e m i . c o m