Material Composition Specification SOD-123FL Case Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.34 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Component Material active device doped Si bond wire gold leadframe Cu alloy w/ silver plating encapsulation plating EMC tin alloy Material (%wt) (mg) 0.47% 0.039 0.01% 45.6% 53.12% 0.8% 0.001 3.802 4.429 Substance CAS No. Substance (%wt) (mg) (ppm) Si 7440-21-3 0.43% 0.036 4,318 Au 7440-57-5 0.04% 0.003 360 Au 7440-57-5 0.01% 0.001 120 Cu 7440-50-8 44.38% 3.7 443,789 Fe 7439-89-6 1.08% 0.09 10,795 Ag 7440-22-4 0.14% 0.012 1,439 SiO2 14808-60-7 38.38% 3.2 383,817 epoxy resin 29690-82-2 6.6% 0.55 65,969 phenol resin 9003-35-4 6.6% 0.55 65,969 Sb2O3 1309-64-4 0.42% 0.035 4,198 Br 7726-95-6 1.13% 0.094 11,275 Sn 7440-31-5 0.78% 0.065 7,796 Bi 7440-69-9 0.02% 0.0013 156 0.066 Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R1 (3-June 2011) w w w. c e n t r a l s e m i . c o m