Series UP3 Series for TO- 66 Outline Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS UP3 Series for TO-66 Outline Natural Conv. (°C/W): 13.6 Forced Air (°C/W): 3.9 Mounting Envelope: 1.50" x 1.38" x .44" DESCRIPTION OF CURVES A. B. C. D. E. • • • Thermal Resistance Case to Sink is 0.6-0.7 °C/W w/Joint Compound. Derate 0.8 °C/watt for unplated part in natural convection only. Derate 0.8 °C/watt for Insulube® part in natural convection only. N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss. Ordering Information Unplated UP3-T066-U CTS IERC PART NO. Comm'l. Black Mil. Black Anodize Anodize UP3-T066-CB UP3-T066-B Semiconductor Accommodated T0-66 Hole patt. ref. no. Max. Weight (Grams) 14 10.5 HOLE PATTERNS 14. Hole pattern no. 138 accommodates T0-66s. Available in UP3 series heat dissipators only. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872 Rev. 03-01-03