UltraThin Ceramic Capacitors UT Series The Ultrathin (UT) series of ceramic capacitors is a new product offering from AVX. The UT series was designed to meet the stringent thickness requirements of our customers. AVX developed a new termination process (FCT - Fine Copper Termination) that provides unbeatable flatness and repeatability. The series includes products < 0.35mm in height and is targeted for applications such as Smart cards, Memory modules, High Density SIM cards, Mobile phones, MP3 players, and embedded solutions. HOW TO ORDER UT 02 3 D 103 M A T 2 D Style Ultra Thin Case Size 0402 Rated Voltage 6 = 6.3V Z = 10V Y = 16V 3 = 25V 5 = 50V Temperature Characteristic D = X5R C = X7R Coded Cap (in pF) 2 Significant Digits + Number of Zeros Cap Tolerance ± 20% Termination Style Commercial Termination T = 100% Sn C = Cu G = Au Packaging 2 = 7" Reel 15,000 pcs 4 = 13" Reel 50,000 pcs Thickness D = 0.30mm max E = 0.25mm max F = 0.15mm max (only availabe in Cu Termination) RECOMMENDED SOLDER PAD DIMENSIONS (Sn Termination) L mm (inches) BL W 0.50 (0.020) L BL End View T Top View Side View 0.50 (0.020) TYPICAL Cu THICKNESS PART DIMENSIONS Thickness L 1.00 ± 0.10 (0.039±0.004) 1.00 ± 0.10 (0.039±0.004) 1.00 ± 0.10 (0.039±0.004) D E F 1.70 (0.067) TT TT 10.0 ± 4.00 0.40 ± 0.16 µM mil 0.60 (0.024) mm (inches) W 0.50 ± 0.10 (0.020 ± 0.004) 0.50 ± 0.10 (0.020 ± 0.004) 0.50 ± 0.10 (0.020 ± 0.004) T 0.25 ± 0.05 (0.010 ± 0.002) 0.20 ± 0.05 (0.008 ± 0.002) 0.125 ± 0.025 (0.005 ± 0.001) BL 0.27 ± 0.05 (0.0108 ± 0.002) 0.27 ± 0.05 (0.0108 ± 0.002) 0.27 ± 0.05 (0.0108 ± 0.002) CAP RANGE (THICKNESS CODE) X5R Cap (nF) 1 10 22 33 47 68 100 6.3V 10V D 16V Thickness Code E 25V 50V 6.3V 10V X7R F 16V 6.3V 10V Cap (nF) 1 10 6.3V Thickness Code D 10V 16V 25V F 6.3V 1 UltraThin Ceramic Capacitors UT Series Specifications and Test Methods – Cu Termination Parameter/Test Operating Temperature Range Capacitance Dissipation Factor Insulation Resistance 100 MΩ - μF Dielectric Strength No breakdown or visual defects Resistance to Flexure Stresses Load Life 2 Specification Limits -55ºC to +85ºC Within specified tolerance ≤ 3.0% for ≥ 25V DC rating ≤ 12.5% for ≤ 16V DC rating Appearance Capacitance Variation Dissipation Factor Insulation Resistance Appearance Capacitance Variation Dissipation Factor Insulation Resistance Dielectric Strength No defects ≤ ±12% Measuring Conditions Temperature Cycle Chamber Freq.: 1.0 kHz ± 10% Voltage: 1.0Vrms ± .2V Charge device with rated voltage for 120 ± 5 secs @ room temp/humidity Charge device with 300% of rated voltage for 1-5 seconds, with charge and discharge current limited to 50 mA (max) Deflection: 2mm Test Time: 30 seconds 1mm/sec Meets Initial Values (As Above) ≥ Initial Value x 0.3 90 mm No visual defects ≤ ±20% ≤ Initial Value x 2.0 (As Above) ≥ Initial Value x 0.3 (As Above) Meets Initial Values (As Above) Charge device with 1.5X rated voltage in test chamber set at 85ºC ± 2ºC for 1000 hours (+48, -0) Remove from test chamber and stabilize at room temperature for 24 ± 2 hours before measuring. UltraThin Ceramic Capacitors UT Series Specifications and Test Methods – Sn Termination Parameter/Test Operating Temperature Range Capacitance Dissipation Factor Specification Limits -55ºC to +85ºC Within specified tolerance ≤ 3.0% for ≥ 25V DC rating ≤ 12.5% for ≤ 16V DC rating Insulation Resistance 100 MΩ - μF Dielectric Strength No breakdown or visual defects Resistance to Flexure Stresses Appearance Capacitance Variation Dissipation Factor Insulation Resistance Solderability Resistance to Solder Heat Load Life Load Humidity Appearance Capacitance Variation Dissipation Factor Insulation Resistance Dielectric Strength Appearance Capacitance Variation Dissipation Factor Insulation Resistance Dielectric Strength Appearance Capacitance Variation Dissipation Factor Insulation Resistance Dielectric Strength No defects ≤ ±12% Measuring Conditions Temperature Cycle Chamber Freq.: 1.0 kHz ± 10% Voltage: 1.0Vrms ± 0.2V Charge device with rated voltage for 120 ± 5 secs @ room temp/humidity Charge device with 300% of rated voltage for 1-5 seconds, with charge and discharge current limited to 50 mA (max) Deflection: 2mm Test Time: 30 seconds 1mm/sec Meets Initial Values (As Above) ≥ Initial Value x 0.3 90 mm ≥ 95% of each terminal should be covered with fresh solder No defects, <25% leaching of either end terminal Dip device in eutectic solder at 245 ± 5ºC for 5.0 ± 0.5 seconds ≤ ±7.5% Meets Initial Values (As Above) Dip device in eutectic solder at 260ºC for 60 seconds. Store at room temperature for 24 ± 2 hours before measuring electrical properties. Meets Initial Values (As Above) Meets Initial Values (As Above) No visual defects ≤ ±12% ≤ Initial Value x 2.0 (As Above) ≥ Initial Value x 0.3 (As Above) Meets Initial Values (As Above) No visual defects ≤ ±12% Charge device with 1.5X rated voltage in test chamber set at 85ºC ± 2ºC for 1000 hours (+48, -0) Remove from test chamber and stabilize at room temperature for 24 ± 2 hours before measuring. Store in a test chamber set at 85ºC ± 2ºC/ 85% ± 5% relative humidity for 1000 hours (+48, -0) with rated voltage applied. ≤ Initial Value x 2.0 (As Above) ≥ Initial Value x 0.3 (As Above) Remove from chamber and stabilize at room temperature and humidity for 24 ± 2 hours before measuring. Meets Initial Values (As Above) 3