Multilayer Organic (MLOTM) 0603 WLAN/BT Diplexer MLOTM TECHNOLOGY APPLICATIONS The 0603 diplexer is a best in class low profile multilayer organic passive device that is based on AVX’s patented multilayer organic high density interconnect technology. The MLO™ diplexer uses high dielectric constant and low loss materials to realize high Q passive printed elements such as inductors, and capacitors in a multilayer stack up. The MLO™ diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN, GSM, and BT. These diplexers are less than 0.5mm in height and are ideally suited for band switching for dual band systems. All diplexers are expansion matched to printed circuit boards thereby resulting in improved reliability vs. ceramic and Si components. Multiband applications including WiFi, WiMax, GPS, and cellular bands A 03 2450 T TR Design Size Inherent Low Profile Excellent Solderability Low Parasitics High Heat Dissipation Bottom View Bottom View Frequency (MHz) Finish 7 = Au T = NiSn Packaging Tape & Reel 2 3 0.88±0.20 (0.035±0.008) 0.04±0.04 (0.002±0.002) 0.06±0.10 1.28±0.20 0.46±0.10 (0.050±0.008)(0.018±0.004) (0.002±0.004) 0.25±0.10 (0.010±0.004) 0.61±0.05 0.95±0.05 (0.024±0.002) (0.037±0.002) QUALITY INSPECTION 0.51±0.05 (0.020±0.002) Finished parts are 100% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -40ºC to +85ºC TERMINATION Finishes available in Ni Au, Ni Sn and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual. 0.20±0.10 (0.008±0.004) Side View Side View 0.64±0.05 0.23±0.10 (0.009±0.004) (0.025±0.002) 0.20±0.10 0.30±0.10 (0.012±0.004) (0.008±0.004) 1 Type • • • • COMPONENT DIMENSIONS AND FUNCTIONS HOW TO ORDER DP LAND GRID ARRAY ADVANTAGES 6 5 0.15±0.02 (0.006±0.001) 4 1.65±0.20 2.12±0.20 (0.065±0.008) (0.083±0.008) Terminal No. 1 2 3 4 5 6 0.45±0.10 (0.018±0.004) 0.55±0.10 (0.022±0.004) 0.44±0.10 0.45±0.10 (0.017±0.004) (0.018±0.004) Unit: mm (inches) Unit: mm (inches) Terminal Name High Frequency Port GND Low Frequency Port GND Common GND PART NUMBER: DP03A2450TTR Electrical Characteristics @ 25ºC ORIENTATION IN TAPE POWER CAPACITY No. Parameter Freq. (MHz) 1 2400-2496 Insertion Loss 2 4900-5950 3 500-2700 Attenuation 4 10300-11900 6 4800-4992 7 Attenuation 4900-5950 8 7200-7500 9 500-2700 Isolation 10 5150-5950 11 VSWR 2400-2500 12 VSWR 4900-5950 13 VSWR 2400-2500 14 VSWR 4900-5950 4.5W Maximum Mechanical Characteristics @ 25ºC Top View 1 6 1 6 1 6 2 5 2 5 2 5 3 4 3 4 3 4 Size [mm(inches)] Height [mm(inches)] Volume (mm^3) Port Low High High High Low Low Low Low-High Low-High Ant Ant Low High Specification 0.40 max 0.85 max 25 min 8 min 25 min 25 min 25 min 25 min 22 min 2.0 max 2.0 max 2.0 max 2.0 max Typ. value 0.35 0.80 30 10 28 27 30 30 25 1.5 1.3 1.5 1.3 Unit dB dB dB dB dB dB dB dB dB - 1.65 x 0.88 (0.065 x 0.035) 0.42 (0.017) 0.77 1 Multilayer Organic (MLOTM) 0603 WLAN/BT Diplexer S PARAMETER MEASUREMENTS LOW BAND PORT ATTENUATION Low Band Attenuation Frequency (GHz) 4.800 5.000 7.200 7.500 9.600 10.00 Attenuation (dB) 36.441 44.044 32.638 38.299 24.064 26.152 LOW BAND INSERTION LOSS 2 HIGH BAND ATTENUATION High Band Attenuation Frequency (GHz) 2.400 2.500 10.30 12.00 Attenuation (dB) 36.829 39.116 10.573 35.929 HIGH BAND INSERTION LOSS Low Band Insertion Loss High Band Insertion Loss Frequency (GHz) 2.400 2.500 Frequency (GHz) 5.150 5.950 Insertion Loss (dB) 0.338 0.374 Insertion Loss (dB) 0.760 0.651 Multilayer Organic (MLOTM) 0603 WLAN/BT Diplexer S PARAMETER MEASUREMENTS COMMON PORT RETURN LOSS ISOLATION Common Return Loss Frequency (GHz) 2.400 2.500 5.150 5.950 Return Loss (dB) 22.592 21.127 20.578 19.279 Isolation VSWR 1.160 1.193 1.206 1.244 LOW BAND RETURN LOSS Low Band Return Loss Frequency (GHz) 2.400 2.500 Return Loss (dB) 25.568 23.775 VSWR 1.111 1.138 Frequency (GHz) 2.400 2.500 5.150 5.950 Attenuation (dB) 38.031 41.305 32.861 27.052 HIGH BAND RETURN LOSS High Band Return Loss Frequency (GHz) 5.150 5.950 Return Loss (dB) 18.278 19.376 VSWR 1.278 1.241 3 Multilayer Organic (MLOTM) 0805 WLAN/BT Diplexer AUTOMATED SMT ASSEMBLY Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLOTM devices onto the PCB. The following section describes the guidelines for automated SMT assembly of MLOTM RF devices which are typically Land Grid Array (LGA) packages or side termination SMT pacages. Control of solder and solder paste volume is critical for surface mount assembly of MLOTM RF devices onto the PCB. SMT REFLOW PROFILE may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below. Common IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLOTM devices onto the PCB. In all cases, a temperature gradient of 3°C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time tp Tp Critical Zone TL to Tp Ramp-up Temperature TL tL Ts max Ts min Ramp-down ts Preheat 25 t 25ºC to Peak Time Figure A. Typical Lead Free Profile and Parameters Profile Parameter Ramp-up rate (Tsmax to Tp Preheat temperature (Ts min to Ts max) Preheat time (ts) Time above TL, 217ºC (tL) Peak temperature (Tp) Time within 5ºC of peak temperature (tp) Ramp-down rate Time 25ºC to peak temperature 4 Pb free, Convection, IR/Convection 3ºC/second max. 150ºC to 200ºC 60 – 180 seconds 60 – 120 seconds 260°C 10 – 20 seconds 4ºC/second max. 6 minutes max.