IMAGINATION. CREATION. INNOVATION. AVX RF/Microwave Short Form RF Microwave Products Application Guide APPLICATIONS PRODUCTS System Frequency High Directivity Couplers (0402, 0603) Couplers (0603, 0805) 3dB Couplers KNA Filter Low Pass Filter 0805 Low Pass Filter 0603 EMI Miniature Filter Inductors (0603,0805) LGA Inductors 0402 Ultra Tight Tolerance RF Capacitors (Accu-P®) SQ CS,CA,CB Capacitors U Dielectric Capacitors HQ CC/CE Capacitors HQ L Capacitors Single Layer Capacitors (SLC) Bordered Single Layer Capacitors Multi-Padded Single Layer Capacitors Maxi Single Layer Capacitors GZ Capacitors GZ StackCap MOS/MIS Capacitors Filters - Passive Micro Components Inductors - Passive Micro Components Resistors - Passive Micro Components Capacitors - Passive Micro Components Attenuators Bluetooth Module RB06 Bluetooth Module RB04 Voltage Controlled Crystal Oscillators Antenna Switch Module CMOS Clock Oscillators Crystal Units SMD MHz Resonators RF Shield Lock Connector 8069 MOBO™ Standard I/O with RF Co-ax Pogo Pin I/O with RF Co-ax Medical (MRI) Public Safety Radio Marine Radio Power Amplifiers Up to 300MHz ISM Radios WLAN (802.XX) Gigabit Ethernet/Optical Power Amplifiers Basestation Amplifiers 300-3000MHz Space & Military WLAN (802.XX) Gigabit Ethernet/Optical Power Amplifiers Basestation Amplifiers 3-30GHz Space & Military Gigabit Ethernet/Optical Power Amplifiers 30GHz+ RF Microwave Short Form Table of Contents Couplers, Filters, Inductors, Capacitors High Directivity Couplers (0402, 0603). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Directional Couplers (0603, 0805) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3dB Couplers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 EMI Filter – KNA Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Low Pass Filter 0805. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Low Pass Filter 0603. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 EMI Miniature Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Inductors (0603, 0805) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 LGA Inductors (0402) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Ultra Tight Tolerance RF Capacitors (Accu-P®). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 SQCS, SQCA & SQCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 U Dielectric . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 HQCC & HQCE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 HQLC & HQLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Single Layer Capacitors (SLC) – GH Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Bordered Single Layer Capacitors – GB Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Multi-Padded Single Layer Capacitors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Maxi/Maxi+ Single Layer Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 GZ Surface Mount SLC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 GZ StackCap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 PMC (Passive Micro Components) Resistors, Capacitors & Inductors Discrete, Array or RCL Filters MOS/MIS Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 RCLs/Filters – Passive Micro Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Inductors – Passive Micro Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Resistors – Passive Micro Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Capacitors – Passive Micro Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Resistors Material Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Capacitor Material Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Modules & Timing Devices Chip Attenuators ATC1A Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Bluetooth Module – RB06 Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Bluetooth Module – RB04 Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Voltage Controlled Crystal Oscillators VC-TCXO-208C / KT18B, VC-TCXO-214C / KT21 Series. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Antenna Switch Module LM/LX Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 CMOS Clock Oscillator – MFO-208F Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Crystal Units CX-3225SB (CX-101F), CX-2520SB, CX5032SB (CX-96F). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SMD Resonators PBRC-MR Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Resonator Cross-Reference Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Connectors RF Shield Lock Connector 8069 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 MOBOTM Standard I/O with RF Co-ax . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Pogo Pin I/O with RF Co-ax . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 1 High Directivity Couplers (0402, 0603) • • • • • High Directivity Low Parasitics 4 Terminal 3 Watts Continuous Low Profile HOW TO ORDER CP 0603 X **** X Style Directional Coupler Size 0402 0603 Type Frequency MHz Sub Type L TR Termination Packaging Code Code TR = Tape and Reel L = LGA Sn90, Pb10 N = LGA Sn100 Directional Couplers (0603, 0805) • • • • • 50 ohm Impedance Lead Free 800 MHz to 6 GHz 3 Watts Continuous Low Profile HOW TO ORDER CP 0603 X **** X W TR Style Directional Coupler Size 0603 0805 Type Frequency MHz Sub Type Termination Code W = Sn90, Pb10 S = Sn100 Packaging Code TR = Tape and Reel 3dB Couplers • • • • • 0805 Size 10 Watts Continuous 4 Terminal Low Insertion Loss High Isolation HOW TO ORDER 2 DB 0805 A **** A W TR Style Size Type Frequency MHz Sub Type Termination Code W = Sn90, Pb10 S = Sn100 Packaging Code TR = Tape and Reel EMI Filter – KNA Series • Distributed constant type LC Filter • Prevents Ringing caused by Circuit Impedance • Suitable for High Speed Digital Circuits and Video Signal Lines • Stable Noise Attenuation over Wide Frequency Ranges • Small, Low Profile SMT Package HOW TO ORDER KNA 21 400 W 3 Series Size EIA = 0805 EIAJ = 2012 Frequency 400 = 400MHz *Frequency at Attenuation typical 3dB, max 6dB Taping Direction W = Standard Quantity per Reel 3 = 3000 pieces Low Pass Filter 0805 • • • • • 50 ohm Impedance 3 Watts Continuous Low Profile 800 MHz to 3.5 GHz 4 Terminal HOW TO ORDER LP 0805A 0902 AW TR Style Low Pass Size 0805 Frequency MHz Termination Nickel/Solder (Sn/Pb) Packaging Code TR = Tape and Reel Low Pass Filter 0603 • • • • • 50 ohm Impedance 3 Watts Continuous Low Profile Lead Free Low Parasitics HOW TO ORDER LP 0603 A XXXX A N TR Style Size 0603 Type Frequency MHz Sub Type Termination LGA Ni/Lead Free Solder Tape & Reel 3 EMI Miniature Filters • • • • • World’s smallest filters 73mm diameter Available in screw-in and solder-in style Superior insertion loss up to 10GHz Available in “L”, “C”, or “T” circuit Rugged discoidal capacitor design HOW TO ORDER ZXS 2 C 3 – 1 0 3 Basic Style ZX5 ZYS ZZS SXD SYD SZD Circuit 1 = Feed Thru 2 = L-Section 4 = T-Section Voltage A = 100 VDC B = 200 VDC C = 50 VDC Lead 3 = Special Reliability Code – = Standard R = R-Level B = Class “B” S = Class “S” 3-Digit Capacitor Code (In pF) Inductors (0603, 0805) • • • • • Tight Tolerance Hi-Q High Self Resonance High RF Power Capability Low DC Resistance HOW TO ORDER 4 L 0805 4R7 Product Inductor Size 0603 0805 Inductance Expressed in nH (2 significant digits + number of zeros) for values <10nH, letter R denotes decimal point. Example: 22nH = 220 4.7nH = 4R7 D Tolerance for L ≤ 4.7nH, L ≥ 10nH, B = ±0.1nH G = ±2% C = ±0.2nH J = ±5% D = ±0.5nH 4.7nH<L<10nH, C = ±0.2nH D = ±0.5nH E Specification Code E = Accu-L® 0805 technology G = Accu-L® 0603 technology W TR Termination Code Packaging W = Nickel/ Code solder coated TR = Tape and Reel (Sn63, Pb37) (3,000/reel) LGA Inductors (0402) • • • • • Inherent Low Profile Low Parasitics Tight Tolerance Better Heat Dissipation Low Profile HOW TO ORDER L 0402 XXX X H L TR Inductor Size 0402 0603 Inductance (nH) Tolerance A = ±0.05nH B = ±0.1nH C = ±0.2nH D = ±0.5nH Series F = ±1% G = ±2% J = ±5% LGA Termination Tape & Reel Ultra Tight Tolerance RF Capacitors (Accu-P®) • • • • • Tight Tolerance No secondary resonances Repeatable lot to lot 0201-1210 size Low ESR HOW TO ORDER 0805 5 J 120 G Size 0201 0402 0603 0805 1210 Voltage 1 = 100V 5 = 50V 3 = 25V Y = 16V Z = 10V Temperature Coefficient (1) J = 0±30ppm/°C (-55°C to +125°C) K = 0±60ppm/°C (-55°C to +125°C) Capacitance Capacitance expressed in pF. (2 significant digits + number of zeros) for values <10pF, letter R denotes decimal point. Example: 68pF = 680 8.2pF = 8R2 Tolerance for C≤2.0pF* P = ±0.02pF Q = ±0.03pF A = ±0.05pF B = ±0.1pF C = ±0.25pF for C≤3.0pF Q, A, B, C for C≤5.6pF A, B, C for 5.6pF<C<10pF B, C, D for C≥10pF F = ±1% G = ±2% J = ±5% (1) TC’s shown are per EIA/IEC Specifications. B Specification Code B = Accu-P® technology W TR Termination Packaging Code Code W = Nickel/ TR = Tape and Reel Solder Coated Accu-P® 0201 & 0402 Sn90, Pb10 T = Nickel/High Temperature Solder Coated Accu-P® 0603, 0805, 1210 Sn96, Ag4 S = Nickel/Lead Free Solder Coated Accu-P® 0402 Sn100 * Tolerances as tight as ±0.01pF are available. Please consult the factory. 5 SQCS, SQCA & SQCB • • • • • High Self Resonance WVDC to 500 VDC Low ESR Hi-Rel versions available Lead Free available HOW TO ORDER SQ CB 7 M AVX Style SQ Case Size Voltage Code Temperature Coefficient Code CS = 0603 CA = 0605 CB = 1210 5 = 50V 1 = 100V E = 150V 2 = 200V V = 250V 9 = 300V 7 = 500V M = +90±20ppm/°C A = 0±30ppm/°C C = 15% (“J” Termination only) 100 J A 1 ME Capacitance Capacitance Tolerance Code Failure Rate Code Termination Style Code Packaging Code A = Not Applicable 1 = Pd/Ag 7 = Ag/Ni/Au J = Nickel Barrier Sn/Pb (60/40) T = 100% Tin ME = 7" Reel RE = 13" Reel WE = Waffle Pack 3A = SQCS 13" 6A = SQCS Waffle Pack 1A = SQCS 7" EIA Capacitance Code in pF. First two digits = significant figures or “R” for decimal place. Third digit = number of zeros or after “R” significant figures. A = ±.05 pF B = ±.1 pF C = ±.25 pF D = ±.5 pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% N = ±30% U Dielectric • • • • • Low ESR High Q Low Cost High Self Resonance 0402-1210 sizes HOW TO ORDER 0805 1 U 100 J A T 2 A Case Size 0402 0603 0805 1210 Voltage Code 3 = 25V 5 = 50V 1 = 100V 2 = 200V Dielectric = Ultra Low ESR Capacitance EIA Capacitance Code in pF. First two digits = significant figures or “R” for decimal place. Third digit = number of zeros or after “R” significant figures. Capacitance Tolerance Code B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% Failure Rate Code A = Not Applicable Termination T = Plated Ni and Tin Packaging Code 2 = 7" Reel 4 = 13" Reel 9 = Bulk Special Code A = Standard 6 HQCC & HQCE • • • • • 600 to 4,000 VDC High Current capable Low ESR Non-Magnetic Versions Leaded versions available HOW TO ORDER HQCC AVX Style HQCC HQCE A A Voltage Temperature 600V = C Coefficient 1000V = A C0G = A 1500V = S 2000V = G 2500V = W 3000V = H 4000V = J 271 J A Capacitance Code (2 significant digits + no. of zeros) Examples: 4.7 pF = 4R7 10 pF = 100 100 pF = 101 1,000 pF = 102 Capacitance Tolerance C = ±0.25pF (<13pF) D = ±0.50pF (<25pF) F = ±1% (25pF) G = ±2% (13pF) J = ±5% K = ±10% M = ±20% T 1 A Packaging Test Termination 1 = 7" Reel Level 1 = Pd/Ag 3 = 13" Reel A = Standard T = Plated 9 = Bulk Ni and Sn (RoHS Compliant) J = 5% Min Pb Special Code A = Standard HQLC & HQLE • • • • • 600 to 4,000 VDC High Current capable Low ESR Non-Magnetic Versions Leaded versions available HOW TO ORDER HQLC A A 271 J A A AVX Style HQLC HQLE Voltage 600V = C 1000V = A 1500V = S 2000V = G 2500V = W 3000V = H 4000V = J Temperature Coefficient C0G = A Capacitance Code (2 significant digits + no. of zeros) Examples: 4.7 pF = 4R7 10 pF = 100 100 pF = 101 1,000 pF = 102 Capacitance Tolerance C = ±0.25pF (<13pF) D = ±0.50pF (<25pF) F = ±1% (25pF) G = ±2% (13pF) J = ±5% K = ±10% M = ±20% Test Level A = Standard Lead Style A = Axial Ribbon M = Microstrip 7 Single Layer Capacitors (SLC) – GH Series • • • • • Dielectrics - NPO thru X7R High Q Voltage Ratings to 200 VDC High Wirebond Strength Decoupling/Bypass Applications HOW TO ORDER GH Type Code GH = No Borders 35 5 A 6R8 K A 6N Case Code Working Voltage Code 5 = 50WVDC 1 = 1000WVDC Dielectric Code A = NP0 4 = TC 7 = TC Y = TC C = X7R Capacitance Value EIA Cap Code in pF Capacitance Tolerance <10pF A = ±0.05pF (Special order) B = ±0.1pF C = ±0.25pF D = ±0.5pF >10pF J = ±5% K = ±10% M = ±20% Termination Code A = Au (100 µ-in min) over Ti/W (1000 Å nom) also available N = Ti/W-Ni-Au Packaging Code 6N = Antistatic Waffle Pack First two digits = significant figures or “R” for decimal place. Third digit = number of zeros or after “R” significant figures. Bordered Single Layer Capacitors – GB Series • • • • • Minimizes Epoxy Shorting Enhances Vision Recognition Excellent Wirebonding Multiple Dielectrics including Maxi & Maxi+ Decoupling/Bypass Applications HOW TO ORDER GB 35 5 A 6R8 K A 6N Type Code GB = With Borders Case Code Working Voltage Code 5 = 50WVDC 1 = 1000WVDC Dielectric Code A = NP0 4 = TC 7 = TC Y = TC C = X7R Capacitance Value EIA Cap Code in pF Capacitance Tolerance <10pF A = ±0.05pF (Special order) B = ±0.1pF C = ±0.25pF D = ±0.5pF >10pF J = ±5% K = ±10% M = ±20% Termination Code A = Au (100 µ-in min) over Ti/W (1000 Å nom) also available N = Ti/W-Ni-Au Packaging Code 6N = Antistatic Waffle Pack 8 First two digits = significant figures or “R” for decimal place. Third digit = number of zeros or after “R” significant figures. Multi-Padded Single Layer Capacitors • • • • • Maximizes Board Space Efficiency Reduces Part Handling Excellent Wirebonding Multiple Dielectrics including Maxi/Maxi+ Custom Configurations Available HOW TO ORDER GH B 5 5 8 102 P Type Code Array Code B=2 C=3 D=4 E=5 F=6 Size Code 2 = .020" W Y = .025" W 3 = .030" W 4 = .040" W 5 = .050" W S = Special Working Voltage Code 5 = 50VDC Dielectric Code A = NP0 C = X7R Z = X7S 8 = Maxi 9 = Maxi+ Cap Code EIA Cap Code in pF Cap Tolerance P = +100% -0% Z = +80% -20% Dual-Caps M = ±20% available A 6N Termination Packaging Code Code A = Au 6N = Antistatic (100 µ-in min) Waffle Pack over Ti/W (1000 Å nom) also available N = Ti/W-Ni-Au Maxi/Maxi+ Single Layer Capacitors • • • • • 20K & 30K Dielectric Constants Industry Leading Volumetric Efficiency X7R Temperature Characteristics Excellent for RF Bypass Applications High Bond Strength HOW TO ORDER GH 02 5 8 102 M Type Code GH = No Borders GB = With Borders Case Size 01 02 03 04 05 06 Working Voltage Code 5 = 50 VDC Dielectric Code 8 = Maxi (k = 20,000) 9 = Maxi+ (k = 30,000) Capacitance Value EIA Cap Code in pF Capacitance Tolerance K = ±10% M = ±20% Z = +80% -20% A 6N Termination Packaging Code Code A = Au 6N = Antistatic (100 µ-in min) Waffle Pack over Ti/W (1000 Å nom) also available N = Ti/W-Ni-Au 9 GZ Surface Mount SLC • • • • Performance thru 40 GHz Surface Mount Configuration 6 Standard Footprints - 0415 thru 0805 Compatible with All Standard Soldering Processes • Custom Designs Available HOW TO ORDER GZ 0402 5 800 Z N W Style Mounting Footprint Voltage Rating 5 = 50V Capacitance EIA Cap Code in pF Capacitance Tolerance Z = +80%, 20% Termination (Sputtered) TiW-Ni-Au Packaging Code Waffle Pack GZ StackCap • • • • • DC Blocking to 40 GHz High Temp SLC/MLC Joint 0415, 0402 & 0602 Footprints No Solder Embrittlement Issues Custom Designs Available HOW TO ORDER GZ 0402 Z D 104 M 800 Z N Style Mounting Footprint Voltage Rating Z = 10V Y = 16V 3 = 25V MLC Dielectric X7R = C X5R = D MLC Capacitance EIA Cap Code in pF MLC Tolerance M = ±20% SLC Capacitance EIA Cap Code in pF SLC Tolerance Z= +80% -20% SLC Termination Ti/W-Ni-Au 10 T or W Packaging Code T = Tape & 7" Reel W = Waffle Pack PMC (PASSIVE MICRO COMPONENTS) RESISTORS, CAPACITORS & INDUCTORS DISCRETE, ARRAY OR RCL FILTERS Typical R, C, L Materials & Designs Offered Passive Material Minimum Chip Size (mm) Range Trimmable Tolerance NOTE value dependent Performance NOTE TCR, in ppm/ºC I/O Type NOTE: Maximum chip size 5x5mm Resistors TaN SiCr 0.5x0.5 0.5x0.5 0.47-1M Ohm Yes 0.05% 47R-20M Ohm Yes 0.05% SiON Capacitors SiO2 BCB 0.25x0.25 0.25x0.25 0.5x0.5 1-500pF 1-500pF 1-50pF Yes No ≥ 0.5%; ≥ 0.5%; or ≥ 0.05pF or ≥ 0.05pF Yes ≥ 0.5%; or ≥ 0.05pF X7R Inductor Cu 0.5x0.5 1.0x0.5 2.2pF-400nF 0.5-20nH No 5% No 5% TCR TCR K 5.8 K4 K 2.7 K 1000 -100 to ±25; Q ≤ 80 TCC 60 TCC 30 TCC 42 -150 ±250 BGA (Ball Grid Array), LGA (Land Grid Array), and gold or aluminum wire bond MOS/MIS Capacitors • GHz operation • Ultra stable capacitance through time and with temperature • Custom specification welcome, arrays or binary • Size down to 10x10 mils • SiO2 and SiON Dielectrics HOW TO ORDER MS 20 3 S 100 M Series Code MS = MOS MI = MIS Case Size Square Size in mils 10, 20, 30, 40 OS = Special Order Please supply design Working Voltage 2 = 2V 4 = 4V Z = 10V 3 = 25V 5 = 50V 1 = 100V Dielectric Code S = SiO2 For MOS Style ONLY N = Si0N For MIS Style ONLY Capacitance EIA Capacitance Code in pF First two digits = significant figures or R for decimal place Third digit = number of zeros or after “R” significant figures Capacitance Tolerance F = ±1% (MOS only) J = ±5% (MOS only) K = ±10% M = ±20% 3893 W Termination Packaging Code W = Antistatic 1st position Waffle Pack top layer T = Tested, 2nd position Whole Wafer top bonding layer D = Tested. 3rd position Diced Wafer bottom bonding layer on Tape 4th position bottom layer 1=Al, 2=Cr, 3=Au, 4=Ni, 5=Pd, 6=Ta, 7=TaN, 8=TiW, 9=TiWNi OSOS=Special Order Please Supply Design RCLs/Filters – Passive Micro Components • Trimmable capacitors and resistors for superior performance • Bring us your analog RCL designs • BGA, LGA, wire bondable terminations • Silicon, glass or quartz substrates • RF blocking, DC bias filters HOW TO ORDER N 2 2 2 Integrated Number of Number of Number of Passive Resistors Capacitors Inductors Thin Film 0-9 0-9 0-9 a = 10 a = 10 a = 10 b = 11 b = 11 b = 11 c = 12 c = 12 c = 12 etc. etc. etc. 12 5 B Rated Voltage 2 = 2V 4 = 4V Z = 10V 3 = 25V 5 = 50V Wafer Substrate A = Glass B = Silicon C = Quartz S = Special 2 A C E G Resistor Capacitor Inductor Failure Special Material Material Material Rate Features 1 = SiCr A = NP0 C = Copper A = AI wire pad A = Standard 2 = TaN C = X7R X = NA G = Medical E = Eutectic X = NA X = NA F = Fiducial G = Au wire pad H = High Temp Solder U = Lead Free 1 2A Termination Type 1 = BGA 2 = Flip Clip 3 = Wire Bond 4 = LGA “Land Grid Array” Packaging 2A = 7" Reel 6A = Waffle Pack T = Tested, whole wafer D = Tested, diced wafer on tape Inductors – Passive Micro Components • • • • • Up to 40nH or Q of 80 Low profile multiturn designs BGA, LGA, wire bondable terminations Glass substrates for improved performance Thick precision plated copper layers HOW TO ORDER N X X 2 L B Integrated Number of Number of Number of Rated Passive Resistors Capacitors Inductors Voltage Thin Film X = NA X = NA 0-9 L = Current a = 10 and Frequency b = 11 Dependent c = 12 etc. X X C Wafer Resistor Capacitor Inductor Substrate Material Material Material A = Glass X = NA X = NA C = Copper B = Silicon C = Quartz S = Special E G Failure Special Rate Features A = AI wire pad A = Standard G = Medical E = Eutectic F = Fiducial G = Au wire pad H = High Temp Solder U = Lead Free 1 2A Termination Type 1 = BGA 2 = Flip Clip 3 = Wire Bond 4 = LGA “Land Grid Array” Packaging 2A = 7" Reel 6A = Waffle Pack T = Tested, whole wafer D = Tested, diced wafer on tape 1 2A Termination Type 1 = BGA 2 = Flip Clip 3 = Wire Bond 4 = LGA “Land Grid Array” Packaging 2A = 7" Reel 6A = Waffle Pack T = Tested, whole wafer D = Tested, diced wafer on tape Resistors – Passive Micro Components • High Ohmic SiCr and TaN materials • Laser trimmable designs, matched arrays and networks • BGA, LGA, wire bondable terminations • Silicon, glass or quartz substrates • High voltage designs up to 1000 volts HOW TO ORDER N 2 X X R Integrated Number of Number of Number of Rated Passive Resistors Capacitors Inductors Voltage Thin Film 0-9 X = NA X = NA R = Power a = 10 Dependent b = 11 c = 12 etc. B Wafer Substrate A = Glass B = Silicon C = Quartz S = Special 2 X X E G Resistor Capacitor Inductor Failure Special Material Material Material Rate Features 1 = SiCr X = NA X = NA A = AI wire pad A = Standard 2 = TaN G = Medical E = Eutectic F = Fiducial G = Au wire pad H = High Temp Solder U = Lead Free 13 Capacitors – Passive Micro Components • Precision tolerances, 0.5% capacitance, 0.05% tracking available • NP0 materials suitable for GHz applications • BGA, LGA, wire bondable terminations • Complex matched arrays and networks welcome • Silicon, glass or quartz substrates • Stability, ±30, 42, or 60 ppm/ºC HOW TO ORDER N X 2 X Z Integrated Number of Number of Number of Passive Resistors Capacitors Inductors Thin Film X = NA 0-9 X = NA a = 10 b = 11 c = 12 etc. B Rated Voltage 2 = 2V 4 = 4V Z = 10V 3 = 25V 5 = 50V 1 = 100V X A X E G Wafer Resistor Capacitor Inductor Failure Special Substrate Material Material Material Rate Features A = Glass X = NA A = NP0 X = NA A = AI wire pad A = Standard B = Silicon C = X7R G = Medical E = Eutectic C = Quartz F = Fiducial S = Special G = Au wire pad H = High Temp Solder U = Lead Free 1 2A Termination Type 1 = BGA 2 = Flip Clip 3 = Wire Bond 4 = LGA “Land Grid Array” Packaging 2A = 7" Reel 6A = Waffle Pack T = Tested, whole wafer D = Tested, diced wafer on tape Y AXIS: TCR (PPM/ºC) Resistors Material Selection 400 300 200 100 0 -100 -200 -300 -400 SiCr Sheet resistivity 300-1300 Ohms/square R values 47 to 20M Ohms TCR ± 250ppm TCR ± 25ppm TaN 0 250 500 750 1000 1250 1500 Sheet resistivity 20-100 Ohms/square R values 0.5 to 1M Ohms TCR – 100 to -150ppm X AXIS: R SQUARED (OHMS) Capacitor Material Details Material pF / mm2 Typical Stability Rated Voltage BDV (V/µm) DF Voltage Stability Frequency Range 14 X7R SiON SiO2 8000 @ 5V, up to 25000 @ 3V* 55 35 -55 to +125 ±15% ±60 ppm/ºC ±30 ppm/ºC 3-5 ≤ 100 ≤ 100 100 600 1000 ≤ 8% ≤ 0.1% ≤ 0.1% Less 1.25% per volt from 0 to 5 volts Independent Independent ≤ 10 GHz ≤ 40 GHz ≤ 40 GHz *Based on dielectric thickness of 0.25µm @ 3V, and 0.5µm @5V BCB 25 ±42 ppm/ºC ≤ 25 300 ≤ 0.1% Independent ≤ 75 GHz MODULES & TIMING DEVICES Chip Attenuators ATC1A Series • • • • • Attenuation: 1 ~ 10dB 50 ohm Impedance Reduction in Mounting and Process Costs Saves PCB Space RoHS Compliant HOW TO ORDER ATC 1A 2 C H Series Size 1A = 1.0x1.0mm Attenuation (1 digit numbering) 1 = 1dB 6 = 6dB 2 = 2dB 7 = 7dB 3 = 3dB 8 = 8dB 4 = 4dB 9 = 9dB 5 = 5dB A = 10dB Attenuation Tolerance C = ±0.3dB D = ±0.5dB Packaging H = Taping Paper 10,000pcs/reel Available in Asia from KED (Kyocera Electronic Devices) *2mm pitch taping Bluetooth Module – RB06 Series • • • • • Best Solution for CDMA cell phones Miniature Size – 5.0 x 4.0 x 1.4mm Improved Reception Sensitivity Low Power Consumption Wide Operating Temperature Range -30 to +75ºC HOW TO ORDER Available in Asia from KED All part numbers are customer specific. (Kyocera Electronic Devices) Bluetooth Module – RB04 Series • Bluetooth Host Control Interface • Chip Set: Bluecore3-ROM CSP • Improved High Sensitivity – -80dBm (typ.) Low Current Consumption – 35mA (typ.) • Ultra Miniature Size – 5.0 x 4.0 x 1.4mm • Wide Operating Temperature Range – -40 ~ +85ºC Power Class 2, RoHS Compliant HOW TO ORDER All part numbers are customer specific. Available in Asia from KED (Kyocera Electronic Devices) 16 Voltage Controlled Crystal Oscillators VC-TCXO-208C / KT18B, VC-TCXO-214C / KT21 Series • Designed for use in Cellular Phones and Automotive Applications • SMT Ceramic Package for Auto Pick-and-Place • Reflow Soldering Compatible • Low Power Consumption Available in Asia from KED • Lead Free (Kyocera Electronic Devices) HOW TO ORDER KT18 D C V 30 Series KT18 KT21 Frequency Stability K = ±5ppm E = ±2.5ppm D = ±2.0ppm Lower Operating Temperature C = -30ºC E = -20ºC G = -10ºC Upper Operating Temperature W = 85ºC V = 80ºC U = 75ºC Supply Voltage 28 = 2.8V 30 = 3.0V Option Code 19.680M T Frequency (MHz) Packaging Tape & Reel KT18 = 4000pcs/Reel KT21 = 2000pcs/Reel 12,600 16,800 19,800 13,000 19,200 26,000 14,400 19,440 38,400 19,680 Antenna Switch Module LM/LX Series • • • • • Supports multiple Bands – GSM/DCS/PCS Dual / Triple / Quad Bands Small Size / Low Profile Low Current Consumption Includes ESD Protection HOW TO ORDER LX Series LM = Dual LM = Triple LX = Quad Q 6 Circuit Q = Quad T = Triple D = Dual Type 1 5 6 15 SX Height 15 = 1.5mm max 18 = 1.8mm max E Custom Specification Available in Asia from KED ESD Protection (Kyocera Electronic Devices) CMOS Clock Oscillator – MFO-208F Series • • • • • • “H” type Designed Ceramic SMT Package Reflow Solder Compatible High Reliability Seam Welding Tri-sate Function CMOS Output ±15 PPM / -40 ~ +85ºC available Available in Asia from KED (Kyocera Electronic Devices) HOW TO ORDER KT5032N 26000 D C W 28 T AA Series Output Frequency Frequency Tolerance B = ±1.0x10-6 C = ±1.5x10-6 D = ±2.0x10-6 Lower Operating Temperature C = -30ºC E = -20ºC G = -10ºC Upper Operating Temperature W = +85ºC V = +80ºC U = +75ºC Supply Voltage 28 = 2.8V 30 = 3.0V Voltage Control Range TCXO = T VCTCXO = Customer Spec Option Code 17 Crystal Units CX-3225SB (CX-101F), CX-2520SB, CX5032SB (CX-96F) • For Audio and Visual Office Equipment and Mobile Communications • Reference Frequency for Telecommunication Systems • Small and Low Profile Ceramic Package • Lead Free Product • Reflow Solder Compatible Available in Asia from KED (Kyocera Electronic Devices) CX-2520SB CX-3225SB CX-5032SB 2.5 x 2.0mm 26-60 kHz 3.2 x 2.5mm 12-54 kHz 5.0 x 3.2mm 9.8-120 MHz SMD Resonators PBRC-MR Series • • • • • SMT Package – 4.5 x 2.0 mm Frequency Range – 2.00 ~ 20.00 MHz Initial Frequency Tolerance – 0.3%, 0.5% or 0.7% Automotive Grade Available RoHS Compliant Available in Asia from KED (Kyocera Electronic Devices) HOW TO ORDER PBRC 15 H R 10 Y 0AB Series PBRC: Consumer Frequency (MHz) Type H&M Packing Bulk (Null) R = Reel Frequency Tolerance at 25ºC 10 = ±0.1% 20 = ±0.2% 30 = ±0.3% 40 = ±0.4% 50 = ±0.5% 70 = ±0.7% Operating Temperature X = -40/85ºC Y = -40/125ºC Z = -40/150ºC Unique Code Resonator Cross-Reference Table AVX MURATA Part Number Range Part Number Range PBRC-GR (AR) 3.58-20.00 CSAC_MGCM 1.80-13.00 PBRC-HR (BR) 3.58-20.00 CSTCC_MG 2.00-10.00 PBRV-HR-Y 3.58-20.00 CSTCC_MG_A 2.00-10.00 PBRC-LR 4.00-20.00 PBRC-MR 4.00-20.00 CSTCR_MG 4.00-7.99 PBRV-MR-Y 4.00-20.00 CSTCR_MG_A 4.00-7.99 SSR-B 20.00-60.00 SSR-D 20.00-60.00 CSTCW_MX 20.00-70.00 TDK Panasonic Part Number Range Part Number Range CCR_MX7 16.93-50.00 EFOP 2.00-13.00 CCR_MXC7 16.93-50.00 EFOS 2.00-13.00 All information in this cross reference guide, should be checked by the customer for suitability of our products for their applications. AVX shall have no liability for the accuracy of the information contained within this cross reference. 18 CONNECTORS Connectors – 8069 Series & 0.5mm/0.4mm Pitch Board to Board • • • • • Designed for RF Shielding 1.8mm and 3.0mm heights available Applicable to 0.2mm shield case thickness Two locking point secure holding feature Easy Shield Case removal HOW TO ORDER 04 8069 Tape & Reel Series Number 000 X00 800 Variation Code Plating Code MOBO™ Standard I/O with RF Co-ax • • • • • Combination signal and RF format SMT receptacle and cabled plug 10k mating cycles Vertical SMT cradle connector Robust, keyed connector system HOW TO ORDER 10 9157 015 000 001 10 = Plug 20 = Socket Series Number of Positions Coax Option Termination Pogo Pin I/O with RF Co-ax • • • • • Compression RF contact design Integrated into Pogo-Pin connector body Custom capabilities Robust/Industrial design 30,000 mating cycles HOW TO ORDER 58 9151 012 000 001 00 = Standard 58 = Special Series Number of Positions Not Assigned Variation Code 20 If you have any questions about our RF/Microwave products, please e-mail us at [email protected] For the very latest innovations in RF/Microwave products from AVX, visit us on the web at: www.avxrf.com Contact: NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all safety measures are indicated or that other measures may not be required. Specifications are typical and may not apply to all applications. © AVX Corporation A KYOCERA GROUP COMPANY http://www.avx.com S-RFMSF10M1205-N