ERmet ZDHD Application Note www.erni.com Application Katalog D 074518 Note Ausgabe 3, 03/05 02/14 www.erni.com Edition 2 1 www.erni.com Application Note 02/14 Edition 2 ERmet ZDHD – Application Note High-Speed Connector Sytem for Datarate up to 25 Gbit/s ERNI’s new ZDHD connector is a high speed, differential board to backplane connector. It is a higher density extension of our standard ERmet ZD product line. The ZDHD has an optimized footprint for improved electrical performance and is designed for data rates up to 25 Gbits/s. ERNI’s ZD HD will be available in a 6-pair version. Future additions to the product line will include a 2- and 4-pair version. Features • • • • • • • • • • • 14 rows per inch by 6 differential pairs per row 84 differential pairs per inch L-shield for each differential pair Impedance 100 Ohm, 85 Ohm on request Datarate up to 25 Gbit/s Superior crosstalk behavior Connector is skew compensated to 3 ps Pitch 1,8 mm between rows Pitch 3,6 mm between diff. pair within a row Downsized pressfit technology 0.46 mm dia. hole Robust alignment guides on male side walls Technical Features • Operating temperature: -55/125 °C • Mechanical operation: >250 mating cycles • Insertion and withdrawal force: 0,7 N/pin (Signal) Material • • Housing materaial: LCP Contact material: Base material: Cu alloy Mating area: PdNi + Au Termination area: Sn • Dual beam female contact design Application Note 02/14 Edition 2 www.erni.com 3 ERmet ZDHD – Application Note Vertical Male Connectors 6 Pair Dimensional Drawings 3 6,35 12 27,2 25,7 X 1,8 23,4 Leiterplattenoberfläche Tochterkarte Top surface of daughter card 9 8 7 6 5 4 3 2 1 4,35 1,95 14 13 12 11 10 1,8 1,3 3,6 a b GND a/b c d GND c/d e f GND e/f g h GND g/h i j GND i/j k l GND k/l a b GND a/b c d GND c/d e f GND e/f g h GND g/h i j GND i/j k l GND k/l 1,8 0,55 23,4 25,3 Leiterplattenoberfläche Tochterkarte Top surface of daughter card Lochbild für Leiterplatte (Bestückungsplan) Board hole pattern (Component mounting side) 13 x 1,8 = (23,4) 1,8 1,8 1) GND d/e GND f/g GND h/i GND j/k GND l ±0.05 Durchmesser des metallisierten Loches Ø 0.46 ±0.05 Diameter of finished plated- through hole 1,9 GND a a b GND b/c c d GND d/e e f GND f/g g h GND h/i i j GND j/k k l GND l a b c d e f g h i j k l 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Ø 0.55 ±0.02 Bohrungsdurchmesser des Loches Ø 0.55 ±0.02 Diameter of drilled hole Schichtaufbau im metallisierten Loch siehe Zeichnung 384191 Metal plating of plated-through hole see drawing 384191 18 x 1,2 = (21,6) GND b/c 1) Ø 0.46 1,2 GND a Ø 0,05 alle Löcher all holes ground 4Application Note 02/14 Edition 2 www.erni.com ERmet ZDHD – Application Note Right Angle Female Connectors 6 Pair Dimensional Drawings 23,4 1,8 l k GND k/l l k GND i/j j i GND g/h h g GND e/f f e GND c/d d c GND a/b b a j i GND g/h GND e/f GND c/d f e d c b a 1,8 4,15 1,3 GND a/b h g 25,5 GND i/j 3,6 GND k/l 0,65 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Leiterplattenoberfläche Top surface of daughter card 1,6 10,8 34,75 25,18 21,35 25,5 Lochbild für Leiterplatte (Bestückungsseite) Board hole pattern (Component mounting side) 13 x 1,8 = (23.4) Ø 0,05 alle Löcher all holes 1) GND l l k GND j/k j i GND h/i h g GND f/g f e GND d/e d c GND b/c b a GND a 9 8 7 6 5 4 3 2 1 Schichtaufbau im metallisierten Loch siehe Zeichnung 384191 1,5 3,6 18 x 1,2 = (21,6) Metal plating of plated-through hole see drawing 384191 1,8 14 13 12 11 10 1) Ø 0.46 ± 0.05 Durchmesser des metallisierten Loches Ø 0.46 ± 0.05 Diameter of finished plated-through hole Ø 0.55 ± 0.02 Bohrdurchmesser des Loches Ø 0.55 ± 0.02 Diameter of drilled hole GND l l k GND j/k j i GND h/i h g GND f/g f e GND d/e d c GND b/c b a GND a 4,5 1,2 3,6 19,2 1,8 ground Application Note 02/14 Edition 2 www.erni.com 5 ERmet ZDHD – Application Note Vertical Male Connectors 4 Pair Dimensional Drawings 3 6,35 12 20 18,5 X 1,8 23,4 Leiterplattenoberfläche Tochterkarte Top surface of daughter card 9 8 7 6 5 4 3 2 1 1,8 4,35 1,95 14 13 12 11 10 1,3 3,6 a b GND a/b c d GND c/d e f GND e/f g h GND g/h a b GND a/b c d GND c/d e f GND e/f g h GND g/h 1,8 23,4 25,3 0,55 Leiterplattenoberfläche Tochterkarte Top surface of daughter card Lochbild für Leiterplatte (Bestückungsplan) Board hole pattern (Component mounting side) 13 x 1,8 = (23,4) Ø 0,05 1,8 1,8 GND d/e GND f/g GND h 1,9 a b c d e f g h 14 13 12 11 10 9 8 7 6 5 4 3 2 1 ±0.05 Durchmesser des matallisierten Loches Ø 0.46 ±0.05 Diameter of finished plated-through hole Ø 0.55 ±0.02 Bohrungsdurchmesser des Loches Ø 0.55 ±0.02 Diameter of drilled hole Schichtaufbau im metallisierten Loch siehe Zeichnung 384191 12 x 1,2 = (21,6) GND b/c GND a a b GND b/c c d GND d/e e f GND f/g g h GND h 1) Ø 0.46 Metal plating of plated-through hole see drawing 384191 1,2 GND a alle Löcher all holes 1) ground 6Application Note 02/14 Edition 2 www.erni.com ERmet ZDHD – Application Note Right Angle Female Connectors 4 Pair Dimensional Drawings 23,4 GND e/f GND c/d GND g/h h g GND e/f f e GND c/d d c GND a/b b a f e d c b a 1,8 4,15 1,3 GND a/b h g 18,3 GND g/h 0,65 3,6 1,8 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Leiterplattenoberfläche Top surface of daughter card 1,6 10,8 27,55 25,18 14,15 18,3 Lochbild für Leiterplatte (Bestückungsseite) Board hole pattern (Component mounting side) 13 x 1,8 = (23,4) Ø 0,05 alle Löcher all holes 1) GND h h g GND f/g f e GND d/e d c GND b/c b a GND a 9 8 7 6 5 4 3 2 1 Ø 0.55 ± 0.02 Bohrdurchmesser des Loches Ø 0.55 ± 0.02 Diameter of drilled hole 1,5 3,6 12 x 1,2 = (14,4) Metal plating of plated-through hole see drawing 384191 1,8 14 13 12 11 10 1) Ø 0.46 ± 0.05 Durchmesser des metallisierten Loches Ø 0.46 ± 0.05 Diameter of finished plated-through hole Schichtaufbau im metallisierten Loch siehe Zeichnung 384191 GND h h g GND f/g f e GND d/e d c GND b/c b a GND a 4,5 1,2 3,6 13,2 1,8 ground Application Note 02/14 Edition 2 www.erni.com 7 ERmet ZDHD – Application Note Vertical Male Connectors 2 Pair Dimensional Drawings 3 6,35 12 14,4 12,9 X 1,8 23,4 Leiterplattenoberfläche Tochterkarte Top surface of daughter card 8 7 6 5 4 3 2 1 3,6 a b GND a/b c d GND c/d a b GND a/b c d GND c/d 1,3 1,8 1,95 9 4,35 14 13 12 11 10 1,8 23,4 25,3 0,55 Leiterplattenoberfläche Tochterkarte Top surface of daughter card Lochbild für Leiterplatte (Bestückungsplan) Board hole pattern (Component mounting side) 13 x 1,8 = (23,4) Ø 0,05 1,8 1,9 GND a a b GND b/c c d GND d a b c d Schichtaufbau im metallisierten Loch siehe Zeichnung 384191 Metal plating of plated-through hole see drawing 384191 1,2 GND d ±0.05 Durchmesser des metallisierten Loches ±0.05 Diameter of finished plated- through hole Ø 0.55 ±0.02 Bohrungsdurchmesser des Loches Ø 0.55 ±0.02 Diameter of drilled hole Ø 0.46 6 x 1,2 = (7,2) GND b/c 1) Ø 0.46 1) 1,8 GND a alle Löcher all holes 14 13 12 11 10 9 8 7 6 5 4 3 2 1 ground 8Application Note 02/14 Edition 2 www.erni.com ERmet ZDHD – Application Note Right Angle Female Connectors 2 Pair Dimensional Drawings 23,4 3,6 b a 12,7 GND c/d d c GND a/b b a 1,8 GND a/b d c 1,3 GND c/d 0,65 4,15 1,8 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Leiterplattenoberfläche Top surface of daughter card 25,18 10,8 20,35 1,6 8,55 12,7 Lochbild für Leiterplatte (Bestückungsseite) Board hole pattern (Component mounting side) 13 x 1,8 = (23,4) Ø 0,05 alle Löcher all holes Ø 1) 1) Ø 0.46 ± 0.05 Durchmesser des metallisierten Loches Ø 0.46 ± 0.05 Diameter of finished plated-through hole 9 8 7 6 5 4 3 2 1 Schichtaufbau im metallisierten Loch siehe Zeichnung 384191 1,5 Metal plating of plated-through hole see drawing 384191 1,8 14 13 12 11 10 3,6 GND d d c GND b/c b a GND a 6 x 1,2 = (7,2) Ø 0.55 ± 0.02 Bohrdurchmesser des Loches Ø 0.55 ± 0.02 Diameter of drilled hole GND d d c GND b/c b a GND a 4,5 3,6 6 1,2 1,8 ground Application Note 02/14 Edition 2 www.erni.com 9 ERmet ZDHD – Application Note Mating Conditions 1 1 Allowed misalignment tolerances longitudinal and transverse axes ±1 mm 2° 2° Allowed angular inclination tolerances, longitudinal ±2°, transverse ±2° Wipe length max. 1.5 mm 14 12.5 10Application Note 02/14 Edition 2 www.erni.com ERmet ZDHD – Application Note Mating Conditions ERmet ZDHD 6-14, mated 27,2 21,35 22,2 37,75 5 Daughtercard Backplane 13,8 ERmet ZDHD 4-14, mated 30,55 5 20 14,15 15 Backplane Daughtercard 13,8 ERmet ZDHD 2-14, mated Backplane 5 14,4 8,55 9,4 23,35 Daughtercard 13,8 Application Note 02/14 Edition 2 www.erni.com 11 ERmet ZDHD – Application Note High-Speed Connector Sytem for Datarate up to 25 Gbit/s Ordering Information Configuration Part Number Vertical Male Connector 6 Pair 384787* Right Angle Female Connector 6 Pair 384786* Vertical Male Connector 4 Pair 444798* Right Angle Female Connector 4 Pair 444797* Vertical Male Connector 2 Pair on request Right Angle Female Connector 2 Pair on request * Only for sample ordering. Simulations 25 Gbit/s transmission behavior of a backplane system, with a dauhtercard trace length of 25 mm and a backplane trace length of 200 mm. Boardmaterial: Dielectric loss = 0,009 without Equalizing 12Application Note with 6-Tab FFE Equalizing 02/14 Edition 2 www.erni.com ERmet ZDHD – Application Note Layout Backplane Layout 6 Pair Slot 1 Slot 2 30 23,4 1,2 1,9 GND a a b GND b/c c d GND d/e e f GND f/g g h GND h/i i j GND j/k k l GND l 1,9 0,3 (12 mil) 0,15 (6 mil) 1,8 1 23,4 ERmet ZDHD ERmet ZDHD B 14 2 min. 1 A ERmet ZDHD ERmet ZDHD GND a a b GND b/c c d GND d/e e f GND f/g g h GND h/i i j GND j/k k l GND l 14 1,2 Ø 0,55 Drill (21.65 mil) finished hole = (18.11 mil) Ø 0,65 (25.6 mil) Daughtercard assembly side 1,8 Ø 0,46 ± 0,05 depends from manufacturer and size of the Backplane Trace Routing 45° 1,1(43 mil) 60° 0,15 (6 mil) 0,15 ( 6 mil) Example 2 1,1 (43 mil) 0,15 (6 mil) 0,15 (6 mil) Example 1 (preferred from ERNI) 0,65 (25,5 mil) 2,6 (102 mil) 2,6 (102 mil) Layout proposal is shown for a different skew of 3 ps. Antipadsize depends from layout and board design, regarding signal trace covering. Application Note 02/14 Layout proposal is shown for a different skew of 0. Antipadsize depends from layout and board design, regarding signal trace covering. regarding the unsymetrical impedance situation in the antipad area, skew compensation should be done in shielding layer covered area. Edition 2 www.erni.com 13 ERmet ZDHD – Application Note Layout Daughtercard Layout 6 Pair 14 B 1,8 Ø 0,65 (25.6 mil) (6 mil) 0,15 (12 mil) 0,3 3,6 1,8 GND a a b GND b/c c d GND d/e e f GND f/g g h GND h/i i j GND j/k k l GND l C 23,4 1,2 GND a a b GND b/c c d GND d/e e f GND f/g g h GND h/i i j GND j/k k l GND l 1,2 1,5 1 depends from manufacturer and board size 23,4 Ø 0,55 Drill (21.65 mil) finished hole = Ø 0,46 mm ± 0,05 (18.11 mil) Trace Routing Example 2 45° 0,15 (6 mil) 2,6 (102 mil) 2,6 (102 mil) 0,65 (25,5 mil) Example 1 (preferred from ERNI) 1,1 (43 mil) 60° 0,15 (6mil) 1,1(43 mil) 0,15 (6 mil) 0,15 (6 mil) Layout proposal is shown for a different skew of 3 ps. Antipadsize depends from layout and board design, regarding signal trace covering. 14Application Note Layout proposal is shown for a different skew of 0. Antipadsize depends from layout and board design, regarding signal trace covering. regarding the unsymetrical impedance situation in the antipad area, skew compensation should be done in shielding layer covered area. 02/14 Edition 2 www.erni.com ERmet ZDHD – Application Note Press-in Informations Schichtaufbau im metallisierten Loch für EN-Kontakt Plated Through-Holes for Pressfit Terminals Metal plating of plated-through hole for EN-contact All pressfit terminals of the ERmet ZDHD modules share the same plated through-hole requirements. These pressfit terminals have been used successfully with reflowed tin-lead, plated tin-lead, immersion tin, organic coatings over bare copper and immersion gold hole plating regimes. The hole recommendations and press in force information shown in this catalog are for reflowed tin-lead and plated tin-lead. Additional test data for other hole plating regimes are available through customer service. Bohrungsdurchmesser des Loches Durchmesser des metallisierten Loches Diameter of finished plated-through hole 0,55 ±0,02 Diameter of drilled hole 0,46 ±0,05 min. 0,05 Restringbreite Restring width max. 10 µm Sn 1) min. 25 µm Cu 1) Ordering Information for Press-in Tools Werden andere Oberflächentechniken, wie z.B. NiAu, chem. Sn oder Cu blank eingesetzt, sind die angegebenen Maße für Bohrungsdurchmesser, Durchmesser des metallisierten Loches, Restringbreite und die Mindestschichtdicke von Cu einzuhalten. Ein mögliches Überschreiten der oberen Toleranz von Maß "Durchmesser des metallisierten Loches" wird durch eine entsprechende Cu-Schichtdicke vermieden. For other platings, such as NiAu, chem. Sn or blanc Cu the recommended dimensions have to be respected for the diameter of drilled hole, diameter of plated-through hole, rest ring width and min. thickness of Cu plating. To keep the max. tolerance for the "Diameter of finished plated-through hole" the according thickness of the Cu-plating has to be used. Configuration Part Number für Einpresszone ERmet ZDplus for press-fit zone ERmet ZDplus Upper Tool for Male Connectors 6 Pair 230158 Lower Tool for Male Connectors 6 Pair 230159 Upper Tool for Female Connectors 6 Pair 230160 Lower Tool for Female Connectors 6 Pair 230161 Application Note 02/14 Edition 2 www.erni.com 15 ERmet ZDHD – Application Note Recommended Method for Pre-seating the Connector on a PCB Procedure This chapter describes the recommended method for pre-seating ERmet ZDHD connectors onto a PCB. Daughtercard Connector 1. It is recommended to locate one corner pin into the corresponding plated hole. 2. Then roll the remaining pins of the back row into the board. 3. Finally roll the connector toward the front edge of the board and press down the connector to pre- seat the assembly. 2. Then roll the remaining pins of the back row into the board. 3. Finally roll the connector toward the remaining plated holes and press down the conenctor to pre- seat the assembly. Backplane Connector 1. It is recommended to locate one corner pin into the corresponding plated hole. Connector Removal The removal of ZDHD connectors doesn‘t require special tools. Clamp the ZDHD module with a fitting plier, pull straight up until the connector comes off the board. 16Application Note 02/14 Edition 2 www.erni.com ERmet ZDHD – Application Note Measurement Results Introduction In this abstract several results of ERNI ERmet ZDHD were presented, based on S-Parameter measurements with ZProbe. Measurement Equipment: Agilent ENA E5071C with Cascade Microtech ZProbes (GSGSG) Calibration and de-embedding were performed to isolate the connector. Frequency Range: Sweep points: IF Bandwidth: 300kHz...20GHz 3001 1kHz Device Under Test: ZDHD testboard V4 (21.12.2012) Application Note 02/14 Edition 2 www.erni.com 17 ERmet ZDHD – Application Note Measurement Results Return and Insertion Loss 18Application Note 02/14 Edition 2 www.erni.com Member www.erni.com Application Katalog D 074518 Note Ausgabe 02/14 3, 03/05 www.erni.com Edition 2 19 ERNI Electronics GmbH & Co. KG Seestrasse 9 73099 Adelberg, Germany Tel +49 7166 50-0 Fax +49 7166 50-282 [email protected] Europe ERNI Electronics, Inc. 2201 Westwood Ave Richmond, VA 23230 Tel +1 804 228-4100 Fax +1 804 228-4099 [email protected] North America Canada ERNI Asia Holding Pte Ltd. Blk 4008 Ang Mo Kio Avenue 10 #04-01/02 Techplace I Singapore 569625 Tel +65 6 555 5885 Fax +65 6 555 5995 [email protected] Asia New Zealand South America Australia Africa Japan Mexico www.erni.com © ERNI Electronics GmbH & Co. KG 2014 • Printed in Germany. A policy of continuous improvement is followed and the right to alter any published data without notice is reserved. ERNI®, MicroStac®, MicroSpeed®, MiniBridge®, MaxiBridge®, ERmet®, ERmet ZD®, ERbic® and ERNIPRESS® are trademarks (registered or applied for in various countries) of ERNI Electronics GmbH & Co. KG. 20 Katalog D 074518 Application Note Ausgabe 02/14 3, 03/05 www.erni.com Edition 2