ERmet ZD-Appl note

ERmet ZD
Application Note Version 1.1
Technical Features
The ERmet ZD is specifically designed for high speed differential signaling in telecom applications at data rates of up to 5
Gbit/s. This robust, high performance, modular connector system is also designed to be used in conjunction with the 2mm
hard metric (IEC 61076-4-101) family of connectors.
The connector meets the electrical performance requirements
of high speed, low voltage differential signaling. The ERmet ZD
connector family is available in pressfit versions. The backplane
module is a male pin header that has three mating levels.
The robust mechanical design and excellent signal integrity are
a result of the internal differential shielding scheme and the “L”
shaped male shield blades. The inherently rigid male shields
stand higher than the signal pins and surround each pair. An
improved guidance feature completes the rugged mechanical
design.
Optimized grid design to improve the RF characteristics.
Easy and economical trace routing achieved by in line-design
of signal and ground pins.
• Modules: 2 pair, 3 pair and 4 pair versions available.
• Design: Wafers with individually fully shielded pairs of contacts.
• Contacts: Low noise, dual beam, leaf contacts with one
ground blade for every pair of signals.
• Wafer pitch: 2.5mm from wafer to wafer.
• Pitch between signal pins: 1.5mm between pairs (within wafer).
• Pitch between pairs: 4.5mm (within wafer).
• Ground arrangement: In line with signals at termination and surrounding shield.
• Multiline Crosstalk: <3% at 100ps rise time, 250mV swing.
• Insertion loss: <1dB up to 3GHz.
• Differential Impedance: 100Ω
• Propagation Delay: A Pin
97 ±10ps
B Pin
107 ±10ps
C Pin
125 ±10ps
D Pin
134 ±10ps
E Pin
157 ±10ps
F Pin
166 ±10ps
G Pin
187 ±10ps
H Pin
199 ±10ps
• Power Modules: Closed entry, vertical female backplane modules with stamped blades.
• Alignment Features: Improved pre-alignment guide and polarizing features, 4 rigid blades for all modules.
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01/05
Edition 1
Printed in Germany · Subject to modification without prior notice.
General
Dimensional Drawings
Vertical Male Connectors 4 pair / 10 wafer
-0,1
0,1
23,4
Date Code
0,05
6,35
Id.-Nr.
XXXXXX
0,2
)
3 -0,1
13,4
XXXXXXX
ERNI
Löcher ø 0.6
( 1,7
EE-Zone für durchkontaktierte
±0.05
compliant zone for through hole
2
0,1
A
B
C
D
1
F
4,5
1,5
1,7
a
b
ab
c
d
cd
e
f
ef
g
h
gh
E
2,5
9x2.5= 22,5
24,95
0,75
-0,1
Part Numbers
Configuration
Pin Version
Type 4 (4 pairs) / 10 wafers
D
973031
Type 4 (4 pairs) / 10 wafers
B
973061
All dimensions in mm
2
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01/05
Edition 1
Part Number
Datum plane depth
3
0,2
4
3,7
5
0,2
6
( 3 -0,1 )
7
0,2
8
5,3
0,1
3,8
5,7
10 9
Bezugsebene Tiefe
Kontaktversionen, Messerkontakte
Contact Selection Options, Male Contacts
±0.05
2,5
ø 0.6
Vertical Male Connectors 3 pair / 10 wafer
18,9 -0,1
Date/Code
13,4
0,05
XXXXXXX
ERNI
0,1
±0.05
3
2
1
5,3
B
C
D
E
F
1,7
0,2
( 3 -0,1 )
3,8
A
1,5
4,5
a
b
ab
c
d
cd
e
f
ef
0,2
4
3,7
5
0,2
6
2,5
7
0,1
8
0,1
Kontaktversionen, Messerkontakte
Contact Selection Options, Male Contacts
5,7
10 9
6,35
1,7
compliant zone for through hole
ø 0.6
3 -0,1
±0.05
0,2
Löcher ø 0.6
Datum plane depth
XXXXXX
EE-Zone für durchkontaktierte
Bezugsebene Tiefe
Ident-Nr.
2,5
9x2.5= 22,5
24,95
0,75
-0,1
Part Numbers
Configuration
Pin Version
Part Number
Type 3 (3 pairs) / 10 wafers
D
973027
Type 3 (3 pairs) / 10 wafers
B
973062
All dimensions in mm
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01/05
Edition 1
Vertical Male Connectors 2 pair / 10 wafer
Date/Code
15,4 -0,1
0,2
1,7
±0.05
compliant zone for through hole
±0.05
2
1
0,1
3,8
A
B
C
0,2
1,7
2,5
9x2.5= 22,5
24,95
D
E
F
( 3 -0,1 )
4,5
a
b
ab
c
d
cd
0,75
-0,1
Part Numbers
Configuration
Pin Version
Type 2 (2 pairs) / 10 wafers
D
973056
Type 2 (2 pairs) / 10 wafers
B
973063
All dimensions in mm
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01/05
Edition 1
Part Number
Datum plane depth
3
Bezugsebene Tiefe
4
0,2
5
3,7
6
0,2
7
5,3
8
1,5
10 9
0,1
Kontaktversionen, Messerkontakte
Contact Selection Options, Male Contacts
5,7
ø 0.6
6,35
XXXXXX
Löcher ø 0.6
3 -0,1
0,1
13,4
0,05
XXXXXXX
ERNI
EE-Zone für durchkontaktierte
2,5
Ident-Nr.
Right Angle Female Connectors 4 pair / 10 wafer
9x2.5= 22,5
0,75
2,5
1,5
f
e
19,4
h
g
4,5
d
c
b
a
10
1
EE-Zone für durchkontaktierte
Löcher ø 0.6
±0.05
compliant zone for through hole
ø 0.6
2,4
-0,1
gh
h
g
ef
f
e
cd
d
c
ab
b
a
973032
XXXXXXX
21,4 -0,1
Date Code
1
10,8 -0,2
1,5
ERNI
1
1,5
0,1
0,1
24,95
15,7
27,9
1,8
±0.05
0,1
Position
Id.-Nr.
Part Numbers
Configuration
Part Number
Type 4 (4 pairs) / 10 wafers
973032
All dimensions in mm
5
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01/05
Edition 1
Right Angle Female Connectors 3 pair / 10 wafer
9x2.5= 22,5
0,75
2,5
4,5
d
c
14,9
1,5
f
e
b
a
10
1
EE-Zone für durchkontaktierte
Löcher ø 0.6
±0.05
compliant zone for through hole
ø 0.6
ef
f
e
cd
d
c
ab
b
a
XXXXXXX
ERNI
973028
16,9 -0,1
Firmensignet
Ident-Nr.
1
10,8 -0,2
1,5
1,5
0,1
0,1
2,4
-0,1
1
24,95
11,2
0,1
23,3
1,8
±0.05
Position
Date Code
Part Numbers
Configuration
Part Number
Type 3 (3 pairs) / 10 wafers
973028
All dimensions in mm
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01/05
Edition 1
Right Angle Female Connectors 2 pair / 10 wafer
9x2,5= 22,5
0,75
4,5
d
c
b
a
10
11,35
1,5
2,5
1
8,56
1,8
0,1
-0,1
0,1
18,9
0,1
cd
d
c
ab
b
a
1
XXXXXXX
ERNI
973046
10,8 -0,2
1,5
1,5
2,4
Position
Id.-Nr.
Firmensignet
13,35 -0,1
1
24,95
Date Code
EE-Zone für durchkontaktierte
Löcher ø0.6 ±0.05
compliant zone for through hole
ø0.6 ±0.05
Part Numbers
Configuration
Part Number
Type 2 (2 pairs) / 10 wafers
973046
All dimensions in mm
7
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01/05
Edition 1
Layouts
Backplane Layout 4 Pair
Additional GND-holes for improved RF-characteristics in pair a-b
Slot 1
Slot 2
2
2
a
b
c
d
e
f
z
a
b
c
d
e
f
g
h
i
2
z
ERmet 2 mm 8+2
2
ERmet 2 mm 5+2
25
b
c
ab
d
e
cd
f
ef
g
h
a
gh
1
ab
b
c
d cd
e
f
ef
g
h
3
3
25
a
gh
1
(23 mil)
0,7 Drill (27.5 mil)
finished hole = 0.6 mm ±0.05
1,5
ERmet ZD
2,5
ERmet ZD
0,65 (25 mil)
0,25 (10 mil)
22,5
16,5
10
2
3
1
2
3
0,15
(12 mil) 0,3
10
1
ERmet 2mm 5+2
ERmet 2 mm 5+2
z
a
b
c
d
e
f
z
a
b
c
d
e
f
1,15 (45 mil)
2
depends from manufacturer and size of the Backplane
25,4
2
Backplane Layout 3 Pair
Additional GND-holes for improved RF-characteristics in pair a-b
Slot 1
Slot 2
2
2
a
b
c
d
e
f
z
a
b
c
d
e
f
2
z
ERmet 2 mm 5+2
2
ERmet 2 mm 5+2
25
b
c
ab
d
cd
e
f
ef
a
1
b
ab
c
d
e
cd
f
3
3
25
a
ef
1
(23 mil)
0,7 Drill (27.5 mil)
finished hole = 0.6 mm ±0.05
0,25 (10 mil)
1,5
ERmet ZD
2,5
ERmet ZD
0,65 (25 mil)
22,5
12
10
3
1
2
0,15
3
2
1
(12 mil) 0,3
10
ERmet 2mm 5+2
ERmet 2 mm 5+2
z
a
b
c
d
e
f
z
a
b
c
d
e
f
1,15 (45 mil)
2
depends from manufacturer and size of the Backplane
20,32
2
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01/05
Edition 1
All dimensions in mm
Backplane Layout 2 Pair
Additional GND-holes for improved RF-characteristics in pair a-b
Slot 1
Slot 2
2
2
a
b
c
d
e
f
z
a
b
c
d
e
f
2
z
ERmet 2 mm 5+2
2
ERmet 2 mm 5+2
25
b
c
ab
d
a
cd
1
b
ab
c
d
3
3
25
a
cd
1
(23 mil)
ERmet ZD
2,5
0,15
0,3 (12 mil)
ERmet ZD
0,7 Drill (27.5 mil)
finished hole = 0.6 mm ±0.05
0,25 (10 mil)
1,5
0,65 (25 mil)
22,5
7,5
10
3
3
10
1
2
2
1
ERmet 2mm 5+2
ERmet 2 mm 5+2
z
a
b
c
d
e
f
z
a
b
c
d
e
f
1,15 (45 mil)
2
depends from manufacturer and size of the Backplane
15,24
2
Daughtercard Layout 4 Pair
22,5
2,5
3
3
ERmet 2mm 5+2
ERmet ZD
ERmet 2mm 8+2
1
10
1
a
b
b
ab
c
c
d
d
e
cd
f
e
g
f
h
10
c
16,5
2
d
e
z/f
ef
2
10,5
b
a
1,75
4,5
1,5
a
1,5
1
25
1,5
Additional GND-holes for
improved RF-characteristics in pair a-b
z/i
g
2
h
gh
0,3 (12 mil)
1,05 (41 mil)
depends from manufacturer and board size
(6 mil) 0,15
0,5
(20 mil)
0,7 Drill (27.5 mil)
0,25
finished hole = 0.6 mm ± 0.05
(23 mil)
(10 mil)
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01/05
Edition 1
Daughtercard Layout 3 Pair
22,5
2,5
3
3
ERmet 2mm 5+2
ERmet ZD
25
ERmet 2mm 8+2
1
10
1
b
a
a
b
b
ab
c
c
d
d
e
cd
f
e
g
f
h
12
10
c
d
10,5
4,5
1,5
a
1,5
1
1,5
Additional GND-holes for improved RF-characteristics in pair a-b
z/f
ef
2
1,75
2
e
z/i
2
1,05 (41 mil)
0,3 (12 mil)
depends from manufacturer and board size
(6 mil)
0,5
0,15
(20 mil)
0,7 Drill (27.5 mil)
finished hole = 0.6 mm ± 0.05
(23 mil)
0,25
(10 mil)
Daughtercard Layout 2 Pair
22,5
2,5
3
3
ERmet 2mm 5+2
ERmet ZD
ERmet 2mm 8+2
1
10
1
7,5
b
10
c
d
a
a
b
b
ab
c
c
d
d
e
cd
f
10,5
4,5
1,5
a
1,5
1
e
g
z/f
h
2
z/i
0,3 (12 mil)
2
(6 mil)
1,05 (41 mil)
0,15
depends from manufacturer and board size
0,5
(20 mil)
0,7 Drill (27.5 mil)
finished hole = 0.6 mm ± 0.05
(23 mil)
0,25
(10 mil)
All dimensions in mm
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01/05
Edition 1
1,75
1,5
25
2
Additional GND-holes for improved RF-characteristics in pair a-b
Plated Through-Holes for Pressfit Terminals
All ERmet ZD, ERmet 5+2, ERmet 8+2 and ERmet Power
Module pressfit terminals share the same plated through-hole
requirements. These pressfit terminals have been used
successfully with reflowed tin-lead, plated tin-lead, immersion
tin, organic coatings over bare copper and immersion gold
hole plating regimes. The hole recommendations and press in
force information shown in this catalog are for reflowed tinlead and plated tin-lead. Additional test data for other hole
plating regimes are available through customer service.
0,7
Durchmesser des
metallisierten Loches
Diameter of finished
plated-through hole
0,6
0,02
Bohrungsdurchmesser
des Loches
Diameter of drilled hole
0,05
min. 0,05
Restringbreite
Restring width
max. 15 µm
Sn
min. 25 µm Cu
Antipad Size
Y
F
E
X
D
,2
R0
B
2,5
A
C
1,5
Drawing shows one differential track pair
A = trackwidth
D = plated hole
X x Y = antipad size
B = space between tracks
E = drill hole
C = space
F = pad diameter
The table below shows two examples for the antipad size
No. of Track-Pairs
Pad-Diameter F
Antipad Size X x Y
Space C
Trackwidth A
Space between Tracks B
2
1.0mm
1.3 x 2.8mm
0.075mm*
0.15mm
0.15mm
1
1.0mm
1.4 x 2.9mm
0.1mm*
0.25mm
0.4mm
* overlapping is necessary because of impedance control
Note:
To improve the high speed characteristics, remove all pads on unconnected layers!
Smaller padsizes also improves the electrical characteristics!
Antipad size as large as possible also improves the electrical characteristics!
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01/05
Edition 1
Impedance Profiles
Measured from the daughtercard side, with Agilent 86100A TDR. Rise time is typically 35ps.
Row a-b
Row c-d
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Edition 1
Row e-f
Row g-h
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01/05
Edition 1
Stubbing Effect
Top connection
Bottom connection
The bottom connection is to prefer, because it don’t cause so much reflection.
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01/05
Edition 1
Measurement Setup for Eye Diagrams
The rise time of the bit pattern generator is 40ps. We use a PBRS 2 exp 7-1 signal.
Board Materials
For the testboards we used the materials Rogers 4350 and Standard FR4
Material Parameters
FR4
Rogers 4350
Permitivity
Dielectric loss
Frequency
4 - 4.5
0.02
1MHz
3.5
0.004
up to 10GHz
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01/05
Edition 1
Board Constructions
Edge coupled stripline
The traces are designed for 100Ω differential impedance. Copper layer thickness is 35µm for stripline and 18µm for microstrip.
The trace width and spacing is for:
Layer 1
0.25 / 0.20mm
Layer 3
0.25 / 0.27mm
Layer 5
0.15 / 0.15mm
Layer 13
0.20 / 0.17mm
Layer 16
0.25 / 0.20mm
The SMA connectors were applied in SMD technology. The Daughtercards thickness is between 2.5 and 3mm. They had the same layer structure
without the blind layers.
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01/05
Edition 1
Eye Diagrams
Without ERmet ZD Connectors for Different Materials
Data rate: 5Gbit/s
Trace length: 380mm / 15inch
Layer: 13
FR4
Max. eye opening: 46%
Rogers
Max. eye opening: 66%
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01/05
Edition 1
With ERmet ZD Connectors
Data rate: 3.125Gbit/s
Trace length: 600mm / 24inch
Layer: 13
Antipadsize: 3.5 x 1.7mm
FR4
Max. eye opening: 46%
Rogers
Max. eye opening: 65%
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01/05
Edition 1
With ERmet ZD Connectors
Data rate: 5Gbit/s
Trace length: 600mm / 24inch
Layer: 13
Antipadsize: 3.0 x 1.3mm
FR4
Max. eye opening: 13%
Rogers
Max. eye opening: 49%
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01/05
Edition 1
With ERmet ZD Connectors “Stubbing Effect”
Data rate: 5Gbit/s
Trace length: 190mm / 7.5inch
Material: Rogers
Antipadsize: 3.5 x 1.7mm
Layer 13
Max. eye opening: 67%
Layer 5
Max. eye opening: 52%
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01/05
Edition 1
With Different Antipadsizes
Data rate: 5Gbit/s
Trace length: 190mm / 7.5inch
Layer: 13
Antipadsize: 3.0 x 1.3mm
Max. eye opening: 57%
Antipadsize: 3.5 x 1.7mm
Max. eye opening: 63%
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01/05
Edition 1
Measurements ERmet ZD Backdrilled
Board Constructions
Edge coupled stripline
The traces are designed for 100Ω differential impedance. Copper layer thickness is 35µm for stripline and 18µm for microstrip.
The trace width and spacing is for:
Layer 1
0.25 / 0.20mm
Layer 3
0.25 / 0.27mm
Layer 5
0.15 / 0.15mm
Layer 13
0.20 / 0.17mm
Layer 16
0.25 / 0.20mm
The SMA connectors were applied in SMD technology. The Daughtercards thickness is between 2.5 and 3mm. Backplane and daughtercard has
the same layer structure without the blind layers.
The via sleeves were backdrilled to a length A of 2.5mm at the backplane, and 2mm on the daughtercard.
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01/05
Edition 1
Eye Diagrams
ERmet ZD Connector Backdrilled
Data rate: 3.125Gbit/s
Trace length: 1000mm / 40inch
Trace width: 0.25mm / 10mil
Layer: 3
Antipadsize: 3.5 x 1.7mm
FR4
Max. eye opening: 25%
Rogers
Max. eye opening: 53%
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01/05
Edition 1
ERmet ZD Connector Backdrilled
Data rate: 5Gbit/s
Trace length: 1000mm / 40inch
Trace width: 0.25mm / 10mil
Layer: 3
Antipadsize: 3.5 x 1.7mm
FR4
Max. eye opening: 14%
At 5Gbit eye is closed.
Rogers
Max. eye opening: 34%
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01/05
Edition 1
ERmet ZD Connector Backdrilled
Data rate: 3.125Gbit/s
Trace length: 600mm / 24inch
Trace width: 0.25mm / 10mil
Layer: 3
Antipadsize: 3.5 x 1.7mm
FR4
Max. eye opening: %
Rogers
Max. eye opening: %
25
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01/05
Edition 1
ERmet ZD Connector Backdrilled
Data rate: 5Gbit/s
Trace length: 600mm / 24inch
Trace width: 0.25mm / 10mil
Layer: 3
Antipadsize: 3.5 x 1.7mm
FR4
Max. eye opening: %
Rogers
Max. eye opening: %
26
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01/05
Edition 1
ERmet ZD Connector Backdrilled
Data rate: 7Gbit/s
Trace length: 600mm / 24inch
Trace width: 0.25mm / 10mil
Layer: 3
Antipadsize: 3.5 x 1.7mm
FR4
Max. eye opening: %
Rogers
Max. eye opening: %
27
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01/05
Edition 1
ERmet ZD Connector Backdrilled
Data rate: 5Gbit/s
Trace length: 380mm / 15inch
Trace width: 0.25mm / 10mil
Layer: 3
Antipadsize: 3.5 x 1.7mm
FR4
Max. eye opening: %
Rogers
Max. eye opening: %
28
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01/05
Edition 1
ERmet ZD Connector Backdrilled
Data rate: 5Gbit/s
Trace length: 190mm / 7.5inch
Trace width: 0.25mm / 10mil
Layer: 3
Antipadsize: 3.5 x 1.7mm
FR4
Max. eye opening: %
Rogers
Max. eye opening: %
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01/05
Edition 1
ERmet ZD Connector Backdrilled
Data rate: 10Gbit/s
Trace length: 190mm / 7.5inch
Trace width: 0.25mm / 10mil
Layer: 3
Antipadsize: 3.5 x 1.7mm
FR4
Max. eye opening: %
Rogers
Max. eye opening: %
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01/05
Edition 1
Influence of Skin Effect
Data rate: 5Gbit/s
Trace length: 1000mm / 40inch
Material: Rogers
Antipadsize: 3.5 x 1.7mm
Trace width: 0.15mm / 6mil
Max. eye opening: 19%
Trace width: 0.25mm / 10mil
Max. eye opening: 34%
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01/05
Edition 1
Influence of Skin Effect
Data rate: 7Gbit/s
Trace length: 1000mm / 40inch
Material: Rogers
Antipadsize: 3.5 x 1.7mm
Trace width: 0.15mm / 6mil
Max. eye opening: 4%
Trace width: 0.25mm / 10mil
Max. eye opening: 19%
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Edition 1
Spice Model
Single pair and multi pair spice models available. Also s-parameter and spectraquest models.
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01/05
Edition 1
Guiding System
Layouts
Alignment pin kit with base plate
Alignment pin kit without base plate
Alignment socket kit
Layout of daughtercard
Backplanelayout
Backplanelayout
4,3
0,03
15,4
daughtercard
5,5
0,1
14
7
0,1
10,5
0,2
10,5
component side
0,05
8,5
2,5
+0,05
0,2
backplane
0,05
0,03
3 -0,2
4,3
Backplane
daughtercard
3,1
0,03
Ordering Information
Backplane versions
Description
Alignment pin
Alignment pin
Alignment pin
Alignment pin
kit
kit
kit
kit
without base plate
without base plate
with base plate
with base plate
PCB Thickness
3.2 – 5 mm
6 – 8 mm
3.2 – 5 mm
6 – 8 mm
Part Number
144370
144371
144131
144132
PCB Thickness
min. 1.5 mm
min. 3 mm
Part Number
144127
144128
Daughtercard versions
Description
Alignment socket kit
Alignment socket kit
34
www.ERNI.com/contact/
01/05
Edition 1