ERmet zeroXT-Appl note4.0

ERmet zeroXT
Application Note Version 4.0
www.erni.com
Katalog D 074518
11/09
Ausgabe 3, 03/05
Version
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4.0
1
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11/09
Version 4.0
ERmet zeroXT
Application Note Version 4.0
Greneral
Technical Features
For modern high speed backplane designs with data transimission rates
up to 10 Gbit/s ERNI has developed the new ERmet zeroXT Connector
System with 100Ω matched differential impedance for enhanced signal
integrity. The new connector system is specifically designed to meet the
challenging electrical performance needs required by next generation
designs utilizing low voltage differential signaling. The ERmet zeroXT now
offers an innovative shielding design and SMT termination to provide very
low cross-talk, low skew and improved trace routing. Additional features
and benefits are a reliable female contact design, different mating levels
and a rugged housing. Economical and easy trace routing is achieved by
the optimized grid design with in-line design for signal and ground pins.
This allows wide traces for long runs without ever having two differential
pairs to negotiate via holes. ERmet zeroXT is compatible in pin density
and layout to the ERmet ZD.
• Design: Wafers with individually fully shielded pairs of contacts.
• Contacts:
Signal: Low noise, dual beam female and male
contacts with SMT termination.
Ground: Female and male shield blades with combined SMT and
THR (Thru Hole Reflow) termination pins.
• Wafer pitch: 2.5 mm from wafer to wafer.
• Pitch between signal pins: 1.5 mm between pairs (within wafer).
• Pitch between pairs: 4.5 mm (within wafer).
• Ground arrangement: In line with signals at termination and sur
rounding shield.
• Multiline Crosstalk: <1% at 100 ps rise time, 250 mV swing.
• Differential Impedance: 100 Ω
• Propagation Delay: A Pin
92 ps
B Pin
103 ps
C Pin
115 ps
D Pin
125 ps
E Pin
143 ps
F Pin
156 ps
G Pin
174 ps
H Pin
188 ps
• Power Modules: Closed entry, vertical female backplane modules with stamped blades.
• Alignment Features: Improved pre-alignment guide and polarizing features, 2 rigid blades for all modules.
• Weight: Female connector: 25 g
Male connector:
8g
Material and plating features
• Plasitic parts are made of LCP, Vectra E130i.
• Plating 0.8/1.2 µm (30/50 µ“) Au subjacent 1 - 2 µm
(40 - 80 µ“) Ni for mating area. Au thickness depends from
mating cycles. Plating with PdNi and Au-flash possible.
• Plating 6µm dull finish Sn (240 µ“) subjacent 1 - 2 µm
(40 - 80 µ“) Ni for temination area.
• Contact parts are made of CuSn 6.
Part numbers
Male connectors: 204406
Female connectors: 204405
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Version 4.0
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ERmet zeroXT
Application Note Version 4.0
Dimensional Drawings
Male connector
2
11,2
13,1
Connector with pick and place cap
All dimensions in mm
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ERmet zeroXT
Application Note Version 4.0
Dimensional Drawings
Female connector
All dimensions in mm
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Version 4.0
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ERmet zeroXT
Application Note Version 4.0
Layouts
Backplane Layout for Signal Vias backdrilled
ERmet 2 mm 5+2
ERmet zeroXT
ERmet 2 mm 8+2
Daughtercard Layout for Signal Vias backdrilled
All dimensions in mm
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Version 4.0
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ERmet zeroXT
Application Note Version 4.0
Heat trap
We recommend the heat trap design for the ground vias to improve soldering behavior.
Annular ring depends from board manufacterer.
0,2
0,35 min.
0,6
Stencil
We recommend a stencil thickness of 6 mil/150 µm.
Backplane stencil for Signal Vias backdrilled
All dimensions in mm
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Version 4.0
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ERmet zeroXT
Application Note Version 4.0
Stencil
Daughtercard stencil for Signal Vias backdrilled
The hole filling depends on the angle of the squeegee and the solder paste.
Due to the particle size, we recommend a minimum solder paste of type 3.
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Version 4.0
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ERmet zeroXT
Application Note Version 4.0
Optional Paste Printing Process
The DEK ProFlow System such a closed printing system can be used, when space for a solder paste depot is
restricted. With this system the solder paste filling of the vias can be improved.
Process description
Transfer head on contact height.
PCB moved to printing position.
Transfer head moved to printing height.
Transfer head moved over the stencil. Solder paste is induced into a rolling
action.
Paste printing is finished.
Transfer head moved back to contact height.
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Version 4.0
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ERmet zeroXT
Application Note Version 4.0
Vapor Phase Soldering Process
Defaults from ERNI for the soldering process:
Galden 200 for leaded solder paste (depends from the solder paste).
Galden 230 for lead-free solder paste (SnAg 3.8 Cu 0.8)
Pin in Paste / SMT soldering - cross section
Signal Pin /
SMT
Solder paste
Shielding Pin /
Pin in Paste
Vapour Phase temperature profile (Standard profile) for leaded solder paste (in this case with Galden 215)
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ERmet zeroXT
Application Note Version 4.0
Vapor Phase Soldering Process
Convection Reflow solder process for male connectors possible - Temperature profile with a PCB thickness of 6 mm
Ton/lead solder paste Zedec 20A
Convection Reflow solder process for female connectors with HELLER oven
Lead-free solder paste Zedec 20B
Peaks are caused from
problems of the thermal
couplers
Red = Under the receptacle
Green = Top of connector
Blue = Board surface
Speed = 0.5 m/min
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ERmet zeroXT
Application Note Version 4.0
Measurement Results
Test boards
Test board material: FR4
Trace length: 110 mm
Trace width: 0.2 mm/8 mil
Measurement is done with Anritsu MP1763 B Bit Pattern generator and Agilent 86100 A TDR with a PRBS 2 exp 7 –1 signal.
Impedance profiles
Row e-f
Row g-h
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ERmet zeroXT
Application Note Version 4.0
Measurement Results
Crosstalk
Crosstalk in intrinsic zeroXT: 0.15% @ tr ~50 ps
Crosstalk in intrinsic zeroXT: 0.08% @ tr ~100 ps
Eye diagrams for row g-h
10 Gbit/s - Max. eye opening 77%
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ERmet zeroXT
Application Note Version 4.0
Measurement Results
13.5 Gbit/s - Max. eye opening 60%
Measurement results backplane with daughtercards
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Version 4.0
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ERmet zeroXT
Application Note Version 4.0
Measurement Results
The following eye diagrams are done with the XILINX Virtex-II Pro X FPGA semiconductors
29’’ FR4 and 2 ERmet zeroXT - with pre-emphasis, with crosstalk
29’’ FR4 and 2 ERmet zeroXT - with pre-emphasis, without crosstalk
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ERmet zeroXT
Application Note Version 4.0
Repair Tools
Depending on the equipment, we recommend preheating the entire assembly group to 70-80°C, to reduce the local heat stress
during the repair process. When using a local repair station, the solder energy has to be applied predominantly to the bottom of
the pcb.
Examples for commercially rework systems available at the market:
ERSA - IR 550
MARTIN - Expert-07.6
FINETECH - FINEPLACER CRS 10
VJ ELECTRONICS - Summit 2200 or Summit 1100
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ERmet zeroXT
Application Note Version 4.0
Repair Tools
ZEVAC Onyx 29
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ERmet zeroXT
Application Note Version 4.0
Repair Tools
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Version 4.0
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ERmet zeroXT
Application Note Version 4.0
Guiding System
Layouts
Guiding pin kit with base plate
Guiding pin kit without base plate
Guide bush kit
Layout of daughtercard
Backplanelayout
Backplanelayout
4,3
0,03
15,4
5,5
0,1
14
7
0,1
10,5
0,2
10,5
component side
0,05
8,5
2,5
+0,05
0,2
backplane
0,05
0,03
3 -0,2
4,3
Backplane
daughtercard
daughtercard
3,1
0,03
Ordering Information
Backplane versions
Description
Guiding pin kit
Guiding pin kit
Guiding pin kit
Guiding pin kit
without base plate
without base plate
with base plate
with base plate
PCB Thickness
2.5 – 6.0mm
6.0 – 8.0mm
2.5 – 6.0mm
6.0 – 8.0mm
Part Number
144370
144371
144131
144132
PCB Thickness
min. 1.5mm
min. 3mm
Part Number
144127
144128
Daughtercard versions
Description
Guide bush kit
Guide bush kit
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ERmet zeroXT
Application Note Version 4.0
Notes
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Version 4.0
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Member
www.erni.com
Katalog D 074518
11/09
Ausgabe 3, 03/05
Version
www.erni.com
4.01
21
ERNI Electronics GmbH & Co. KG
Seestrasse 9
73099 Adelberg/Germany
Tel +49 7166 50-0
Fax +49 7166 50-282
info@erni.de
Europe
ERNI Electronics, Inc.
2201 Westwood Ave
Richmond, VA 23230/USA
Tel +1 804 228-4100
Fax +1 804 228-4099
info.usa@erni.com
North America
ERNI Asia Holding Pte Ltd.
Blk 4008 Ang Mo Kio Avenue 10
#04-01/02 Techplace I
Singapore 569625
Tel +65 6 555 5885
Fax +65 6 555 5995
info@erni-asia.com
Asia
South America
Australia
Africa Japan
Canada
Mexico
New Zealand
www.erni.com
© ERNI Electronics GmbH & Co.KG 2009 • Printed in Germany. A policy of continuous improvement is followed and the right to alter any published data without notice is reserved.
ERNI ®, MicroStac ®, MicroSpeed ®, MiniBridge ®, MaxiBridge ®, ERmet ®, ERmet ZD ®, ERbic ® and ERNIPRESS ® are trademarks (registered or applied for in various countries) of
ERNI Electronics GmbH & Co. KG.
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Katalog D 074518
11/09
Ausgabe 3, 03/05
Version
www.erni.com
4.0