ERmet zeroXT Application Note Version 4.0 www.erni.com Katalog D 074518 11/09 Ausgabe 3, 03/05 Version www.erni.com 4.0 1 www.erni.com 11/09 Version 4.0 ERmet zeroXT Application Note Version 4.0 Greneral Technical Features For modern high speed backplane designs with data transimission rates up to 10 Gbit/s ERNI has developed the new ERmet zeroXT Connector System with 100Ω matched differential impedance for enhanced signal integrity. The new connector system is specifically designed to meet the challenging electrical performance needs required by next generation designs utilizing low voltage differential signaling. The ERmet zeroXT now offers an innovative shielding design and SMT termination to provide very low cross-talk, low skew and improved trace routing. Additional features and benefits are a reliable female contact design, different mating levels and a rugged housing. Economical and easy trace routing is achieved by the optimized grid design with in-line design for signal and ground pins. This allows wide traces for long runs without ever having two differential pairs to negotiate via holes. ERmet zeroXT is compatible in pin density and layout to the ERmet ZD. • Design: Wafers with individually fully shielded pairs of contacts. • Contacts: Signal: Low noise, dual beam female and male contacts with SMT termination. Ground: Female and male shield blades with combined SMT and THR (Thru Hole Reflow) termination pins. • Wafer pitch: 2.5 mm from wafer to wafer. • Pitch between signal pins: 1.5 mm between pairs (within wafer). • Pitch between pairs: 4.5 mm (within wafer). • Ground arrangement: In line with signals at termination and sur rounding shield. • Multiline Crosstalk: <1% at 100 ps rise time, 250 mV swing. • Differential Impedance: 100 Ω • Propagation Delay: A Pin 92 ps B Pin 103 ps C Pin 115 ps D Pin 125 ps E Pin 143 ps F Pin 156 ps G Pin 174 ps H Pin 188 ps • Power Modules: Closed entry, vertical female backplane modules with stamped blades. • Alignment Features: Improved pre-alignment guide and polarizing features, 2 rigid blades for all modules. • Weight: Female connector: 25 g Male connector: 8g Material and plating features • Plasitic parts are made of LCP, Vectra E130i. • Plating 0.8/1.2 µm (30/50 µ“) Au subjacent 1 - 2 µm (40 - 80 µ“) Ni for mating area. Au thickness depends from mating cycles. Plating with PdNi and Au-flash possible. • Plating 6µm dull finish Sn (240 µ“) subjacent 1 - 2 µm (40 - 80 µ“) Ni for temination area. • Contact parts are made of CuSn 6. Part numbers Male connectors: 204406 Female connectors: 204405 11/09 Version 4.0 www.erni.com 3 ERmet zeroXT Application Note Version 4.0 Dimensional Drawings Male connector 2 11,2 13,1 Connector with pick and place cap All dimensions in mm 4 11/09 Version 4.0 www.erni.com ERmet zeroXT Application Note Version 4.0 Dimensional Drawings Female connector All dimensions in mm 11/09 Version 4.0 www.erni.com 5 ERmet zeroXT Application Note Version 4.0 Layouts Backplane Layout for Signal Vias backdrilled ERmet 2 mm 5+2 ERmet zeroXT ERmet 2 mm 8+2 Daughtercard Layout for Signal Vias backdrilled All dimensions in mm 6 11/09 Version 4.0 www.erni.com ERmet zeroXT Application Note Version 4.0 Heat trap We recommend the heat trap design for the ground vias to improve soldering behavior. Annular ring depends from board manufacterer. 0,2 0,35 min. 0,6 Stencil We recommend a stencil thickness of 6 mil/150 µm. Backplane stencil for Signal Vias backdrilled All dimensions in mm 11/09 Version 4.0 www.erni.com 7 ERmet zeroXT Application Note Version 4.0 Stencil Daughtercard stencil for Signal Vias backdrilled The hole filling depends on the angle of the squeegee and the solder paste. Due to the particle size, we recommend a minimum solder paste of type 3. 8 11/09 Version 4.0 www.erni.com ERmet zeroXT Application Note Version 4.0 Optional Paste Printing Process The DEK ProFlow System such a closed printing system can be used, when space for a solder paste depot is restricted. With this system the solder paste filling of the vias can be improved. Process description Transfer head on contact height. PCB moved to printing position. Transfer head moved to printing height. Transfer head moved over the stencil. Solder paste is induced into a rolling action. Paste printing is finished. Transfer head moved back to contact height. 11/09 Version 4.0 www.erni.com 9 ERmet zeroXT Application Note Version 4.0 Vapor Phase Soldering Process Defaults from ERNI for the soldering process: Galden 200 for leaded solder paste (depends from the solder paste). Galden 230 for lead-free solder paste (SnAg 3.8 Cu 0.8) Pin in Paste / SMT soldering - cross section Signal Pin / SMT Solder paste Shielding Pin / Pin in Paste Vapour Phase temperature profile (Standard profile) for leaded solder paste (in this case with Galden 215) 10 11/09 Version 4.0 www.erni.com ERmet zeroXT Application Note Version 4.0 Vapor Phase Soldering Process Convection Reflow solder process for male connectors possible - Temperature profile with a PCB thickness of 6 mm Ton/lead solder paste Zedec 20A Convection Reflow solder process for female connectors with HELLER oven Lead-free solder paste Zedec 20B Peaks are caused from problems of the thermal couplers Red = Under the receptacle Green = Top of connector Blue = Board surface Speed = 0.5 m/min 11/09 Version 4.0 www.erni.com 11 ERmet zeroXT Application Note Version 4.0 Measurement Results Test boards Test board material: FR4 Trace length: 110 mm Trace width: 0.2 mm/8 mil Measurement is done with Anritsu MP1763 B Bit Pattern generator and Agilent 86100 A TDR with a PRBS 2 exp 7 –1 signal. Impedance profiles Row e-f Row g-h 12 11/09 Version 4.0 www.erni.com ERmet zeroXT Application Note Version 4.0 Measurement Results Crosstalk Crosstalk in intrinsic zeroXT: 0.15% @ tr ~50 ps Crosstalk in intrinsic zeroXT: 0.08% @ tr ~100 ps Eye diagrams for row g-h 10 Gbit/s - Max. eye opening 77% 11/09 Version 4.0 www.erni.com 13 ERmet zeroXT Application Note Version 4.0 Measurement Results 13.5 Gbit/s - Max. eye opening 60% Measurement results backplane with daughtercards 14 11/09 Version 4.0 www.erni.com ERmet zeroXT Application Note Version 4.0 Measurement Results The following eye diagrams are done with the XILINX Virtex-II Pro X FPGA semiconductors 29’’ FR4 and 2 ERmet zeroXT - with pre-emphasis, with crosstalk 29’’ FR4 and 2 ERmet zeroXT - with pre-emphasis, without crosstalk 11/09 Version 4.0 www.erni.com 15 ERmet zeroXT Application Note Version 4.0 Repair Tools Depending on the equipment, we recommend preheating the entire assembly group to 70-80°C, to reduce the local heat stress during the repair process. When using a local repair station, the solder energy has to be applied predominantly to the bottom of the pcb. Examples for commercially rework systems available at the market: ERSA - IR 550 MARTIN - Expert-07.6 FINETECH - FINEPLACER CRS 10 VJ ELECTRONICS - Summit 2200 or Summit 1100 16 11/09 Version 4.0 www.erni.com ERmet zeroXT Application Note Version 4.0 Repair Tools ZEVAC Onyx 29 11/09 Version 4.0 www.erni.com 17 ERmet zeroXT Application Note Version 4.0 Repair Tools 18 11/09 Version 4.0 www.erni.com ERmet zeroXT Application Note Version 4.0 Guiding System Layouts Guiding pin kit with base plate Guiding pin kit without base plate Guide bush kit Layout of daughtercard Backplanelayout Backplanelayout 4,3 0,03 15,4 5,5 0,1 14 7 0,1 10,5 0,2 10,5 component side 0,05 8,5 2,5 +0,05 0,2 backplane 0,05 0,03 3 -0,2 4,3 Backplane daughtercard daughtercard 3,1 0,03 Ordering Information Backplane versions Description Guiding pin kit Guiding pin kit Guiding pin kit Guiding pin kit without base plate without base plate with base plate with base plate PCB Thickness 2.5 – 6.0mm 6.0 – 8.0mm 2.5 – 6.0mm 6.0 – 8.0mm Part Number 144370 144371 144131 144132 PCB Thickness min. 1.5mm min. 3mm Part Number 144127 144128 Daughtercard versions Description Guide bush kit Guide bush kit 11/09 Version 4.0 www.erni.com 19 ERmet zeroXT Application Note Version 4.0 Notes 20 11/09 Version 4.0 www.erni.com Member www.erni.com Katalog D 074518 11/09 Ausgabe 3, 03/05 Version www.erni.com 4.01 21 ERNI Electronics GmbH & Co. KG Seestrasse 9 73099 Adelberg/Germany Tel +49 7166 50-0 Fax +49 7166 50-282 [email protected] Europe ERNI Electronics, Inc. 2201 Westwood Ave Richmond, VA 23230/USA Tel +1 804 228-4100 Fax +1 804 228-4099 [email protected] North America ERNI Asia Holding Pte Ltd. Blk 4008 Ang Mo Kio Avenue 10 #04-01/02 Techplace I Singapore 569625 Tel +65 6 555 5885 Fax +65 6 555 5995 [email protected] Asia South America Australia Africa Japan Canada Mexico New Zealand www.erni.com © ERNI Electronics GmbH & Co.KG 2009 • Printed in Germany. A policy of continuous improvement is followed and the right to alter any published data without notice is reserved. ERNI ®, MicroStac ®, MicroSpeed ®, MiniBridge ®, MaxiBridge ®, ERmet ®, ERmet ZD ®, ERbic ® and ERNIPRESS ® are trademarks (registered or applied for in various countries) of ERNI Electronics GmbH & Co. KG. 22 Katalog D 074518 11/09 Ausgabe 3, 03/05 Version www.erni.com 4.0