Future Technology Devices International Ltd. Technical Note TN_108 VINCULUM Chipset Feature Comparison Document Reference No.: FT_000140 Version 1.1 Issue Date: 2010-02-26 This technical note compares the features of VNC1L and VNC2 devices. Future Technology Devices International Limited (FTDI) Unit1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH United Kingdom Tel.: +44 (0) 141 429 2777 Fax: + 44 (0) 141 429 2758 E-Mail (Support): [email protected] Web: http://www.ftdichip.com Copyright © 2010 Future Technology Devices International Limited Document Reference No.: FT_000140 FTDI Chipset Feature Comparison Technical Note TN_108 Version 1.1 Clearance No.: FTDI# 144 1 Introduction............................................................................................ 2 2 Chipset summary .................................................................................. 3 3 2.1 VNC1L ................................................................................................................... 3 2.2 VII – Second generation device .......................................................................... 3 Chipset comparison tables ................................................................... 4 3.1 VNC1L vs VII ........................................................................................................ 4 4 Contact Information............................................................................... 6 5 Appendix A– Definitions ....................................................................... 7 6 5.1 Terms description ............................................................................................... 7 5.2 Links to datasheets ............................................................................................. 7 Appendix B - Revision History ............................................................. 8 Revision Record Sheet ................................................................................ 9 Copyright © 2010 Future Technology Devices International Limited 1 Document Reference No.: FT_000140 FTDI Chipset Feature Comparison Technical Note TN_108 Version 1.1 Clearance No.: FTDI# 144 1 Introduction VII is the next generation device in the Vinculum family. The VNC2 device will build on the successes of the original VNC1L device. Copyright © 2010 Future Technology Devices International Limited 2 Document Reference No.: FT_000140 FTDI Chipset Feature Comparison Technical Note TN_108 Version 1.1 Clearance No.: FTDI# 144 2 Chipset summary 2.1 VNC1L VNC1L is a single chip embedded USB host controller IC device. The entire USB protocol is handled on the chip. The device supports two independent USB 2.0 Low-speed/Full-speed USB host ports with integrated pullup and pull-down resistors. The device supports USB suspend and resume with 3V3 interface. 2.2 VNC2 – Second generation device VNC2 expands on the abilities of the VNC1L devices with more memory and a faster processor. It also has a debug port and is supported with a suite of software development tools available to customers to create their own firmware. Copyright © 2010 Future Technology Devices International Limited 3 Document Reference No.: FT_000140 FTDI Chipset Feature Comparison Technical Note TN_108 Version 1.1 Clearance No.: FTDI# 144 3 Chipset comparison tables 3.1 VNC1L vs VNC2 The following table highlights and compares the features of VNC1L and VNC2 devices. FEATURE VNC1L VNC2 Package 48 pin LQFP 64 pin LQFP (Also aiming at 32 pin and 48 pin cut down versions) Temperature -40 to +85C -40 to +85C VCC 3V3 3V3 VCCIO 5V tolerant 3V3 5V tolerant 3V3 CLK source 12MHz (external) 12MHz (external) CPU 8-bit Harvard architecture 16-bit Harvard architecture USB ports 2 2 UART port 1 1 SPI slave port 1 2 SPI master port 0 1 FIFO monitor port option 1 1 Debug port 0 1 Precompiled firmware YES YES Tools for creating own firmware NO YES DATA RAM 4k x 8 (4kbytes) 4k x 32 (16kbytes) E-FLASH 64k x 8 (64kbytes) 128k x16 (256kByte) Speed Full / low Full / low Transfer modes Bulk / Interrupt Bulk, interrupt, isochronous MECHANICAL ELECTRICAL INTERFACING FIRMWARE MEMORY USB MODES CONFIGURATION PORTS Copyright © 2010 Future Technology Devices International Limited 4 Document Reference No.: FT_000140 FTDI Chipset Feature Comparison Technical Note TN_108 Version 1.1 Clearance No.: FTDI# 144 UART YES YES USB YES (after initial programming) YES SPI NO YES FIFO NO YES DEBUG PORT N/A YES Copyright © 2010 Future Technology Devices International Limited 5 Document Reference No.: FT_000140 FTDI Chipset Feature Comparison Technical Note TN_108 Version 1.1 Clearance No.: FTDI# 144 4 Contact Information Head Office – Glasgow, UK Future Technology Devices International Limited Unit 1, 2 Seaward Place, Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 E-mail (Sales) [email protected] E-mail (Support) [email protected] E-mail (General Enquiries) [email protected] Web Site URL http://www.ftdichip.com Web Shop URL http://www.ftdichip.com Branch Office – Taipei, Taiwan Future Technology Devices International Limited (Taiwan) 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan , R.O.C. Tel: +886 (0) 2 8797 1330 Fax: +886 (0) 2 8751 9737 E-mail (Sales) [email protected] E-mail (Support) [email protected] E-mail (General Enquiries) [email protected] Web Site URL http://www.ftdichip.com Branch Office – Hillsboro, Oregon, USA Future Technology Devices International Limited (USA) 7235 NW Evergreen Parkway, Suite 600 Hillsboro, OR 97123-5803 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-Mail (Sales) [email protected] E-Mail (Support) [email protected] Web Site URL http://www.ftdichip.com Branch Office – Shanghai, China Future Technology Devices International Limited (China) Room 408, 317 Xianxia Road, ChangNing District, ShangHai, China Tel: +86 (21) 62351596 Fax: +86(21) 62351595 E-Mail (Sales): [email protected] E-Mail (Support): [email protected] E-Mail (General Enquiries): [email protected] Web Site URL: http://www.ftdichip.com Distributor and Sales Representatives Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales representative(s) in your country. Vinculum is part of Future Technology Devices International Ltd. Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure of this product. Your statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH United Kingdom. Scotland Registered Number: SC136640 Copyright © 2010 Future Technology Devices International Limited 6 Document Reference No.: FT_000140 FTDI Chipset Feature Comparison Technical Note TN_108 Version 1.1 Clearance No.: FTDI# 144 5 Appendix A– Definitions 5.1 Terms description Terms Description UART Universal Asynchronous Receiver Transmitter FIFO FT245 style asynchronous FIFO interface SPI Serial Peripheral Interface USB Universal Serial BUS 5.2 Links to datasheets Chipset Web link to datasheet VNC1L http://www.vinculum.com/documents/datasheets/DS_VNC1L_V201(FT_000030).pdf Copyright © 2010 Future Technology Devices International Limited 7 Document Reference No.: FT_000140 FTDI Chipset Feature Comparison Technical Note TN_108 Version 1.1 Clearance No.: FTDI# 144 6 Appendix B - Revision History Revision History th Version draft Initial draft 13 March, 2009 Version 1.0 Initial rev1.0 21 May, 2009 Version 1.1 Released to the Web 26 Feb, 2010 st th Copyright © 2010 Future Technology Devices International Limited 8