ECMF04-4HSM10 Common mode filter with ESD protection for high speed serial interface Datasheet - production data Features • Very large differential bandwidth to comply with HDMI Full HD, MIPI, USB2.0, USB3.0, Display Port and other high speed serial interfaces • Provides -20 dB attenuation at 700 MHz in LTE bands • High common mode attenuation:- 25 dB between 800 MHz - 900 MHz • Very low PCB space consumption • Thin package: 0.55 mm max. µQFN-10L 2.60 x 1.35 mm • Lead-free package • High reduction of parasitic elements through integration. Figure 1. Pin configuration (top view) Complies with the following standards: • IEC 61000-4-2 level 4: – ±15 kV (air discharge) – ±8 kV (contact discharge) D1+ 1 10 D1+ Applications • Mobile phones D1- 2 5 D19 • Notebook, laptop • Portable devices • PND GND 3 8 GND D2+ 4 7 D2+ D2- 5 6 D2- Description August 2014 This is information on a product in full production. This device is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like HDMI Full HD, MIPI, Display Port and other high speed serial interfaces.The device has a very large differential bandwidth to comply with these standards. The device can protect and filter 2 differential lanes. DocID024844 Rev 2 1/13 www.st.com Characteristics 1 ECMF04-4HSM10 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Unit 8 16 kV 100 mA -40 to +85 °C 125 °C - 55 to +150 °C IEC 61000-4-2 Contact discharge (connector side) Air discharge (connector side) VPP Peak pulse voltage IDC Maximum DC current Top Operating temperature range Tj Value Maximum junction temperature Tstg Storage temperature range Figure 2. Electrical characteristics (definitions) I Symbol VBR IRM VRM IR Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Breakdown current = = = = VBR VRM IRM IR V Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Test conditions VBR IR = 1 mA IRM VRM = 3 V per line RDC DC serial resistance Min. Typ. Max. 6 V 100 Pin number Description Pin number Description 1 D1+ to connector 6 D2- to IC 2 D1- to connector 7 D2+ to IC 3 GND 8 GND 4 D2+ to connector 9 D1- to IC 5 D2- to connector 10 D1+ to IC DocID024844 Rev 2 nA Ω 5 Table 3. Pin description 2/13 Unit ECMF04-4HSM10 Characteristics Figure 3. Differential attenuation versus frequency (Z0 diff = 100 Ω) SDD21 (dB) 0 -1 -2 -3 -4 F (Hz) -5 10M 30M 100M 300M F/Hz 1G 3G Lane #2 Lane #1 Figure 4. Common mode attenuation versus frequency (Z0 com = 50 Ω) 0 SCC21 (dB) -5 -10 -15 -20 -25 -30 -35 F (Hz) -40 10M 30M 100M Lane #1 DocID024844 Rev 2 300M 1G 3G Lane #2 3/13 13 Characteristics ECMF04-4HSM10 Figure 5. Differential (ZDD21) and common mode (ZCC21) impedance versus frequency ZDD21 1E4 ZCC21 (Ω) 1E3 1E2 1E1 F (Hz) 1E7 1E8 1E9 6E9 Figure 6. ESD response to IEC61000-4-2 (+8 kV contact discharge) 20 V/div 1 2 3 4 VPP: ESD peak voltage VCL :clamping voltage @ 30 ns VCL :clamping voltage @ 60 ns VCL :clamping voltage @ 100 ns 1 70.5 V 2 26.4 V 3 18.9 V 4 11.9 V 20 ns/div 4/13 DocID024844 Rev 2 ECMF04-4HSM10 Characteristics Figure 7. ESD response to IEC61000-4-2 (-8 kV contact discharge) 20 V/div 2 -15.3 V 3 -9.3 V 4 -4.3 V 1 -74.6 V 1 2 3 4 VPP: ESD peak voltage VCL :clamping voltage @ 30 ns VCL :clamping voltage @ 60 ns VCL :clamping voltage @ 100 ns 20 ns/div Figure 8. USB2.0 480 Mbps eye diagram without device Figure 9. USB2.0 480 Mbps eye diagram with device Thru ECMF04-4HSM10 DocID024844 Rev 2 5/13 13 Characteristics ECMF04-4HSM10 Figure 10. USB3.0 5 Gbps eye diagram without device Thru Figure 11. USB3.0 5 Gbps eye diagram with device ECMF04-4HSM10 250 mV/c 250 mV/c 33.4 ps/c 33.4 ps/c Figure 12. HDMI 3.35 Gbps eye diagram without device Figure 13. HDMI 3.35 Gbps eye diagram with device Thru ECMF04-4HSM10 6/13 DocID024844 Rev 2 ECMF04-4HSM10 Characteristics Figure 14. TDR 130 Z (ohm) 120 Before compensation HDMI template 110 100 After compensation 90 80 time (ns) 70 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 DocID024844 Rev 2 1.6 1.8 2.0 2.2 2.4 7/13 13 Application information 2 ECMF04-4HSM10 Application information Figure 15. HDMI schematic ECMF04 D0 D1 HDMI ASIC HEAC- HPD UTILITY Clock HEAC+ HDMI connector ECMF04 D2 HDP_IC SDA SDA_IC SCL GND SCL_IC GND CEC_IC CEC VDD_CEC VDD_IC VDD_5V 5V_OUT VDD_CFC_IC FAULT HDMI2C1-6C1 More application information available in following AN: 8/13 • Application Note AN4356: "Antenna desense on handheld equipment" • Application Note AN4511: "Common Mode filters" • Application Note AN4540: "MHL link filtering and protection" DocID024844 Rev 2 ECMF04-4HSM10 PCB layout recommendations Figure 16. PCB layout recommendations Host 170 µm Connector Differential lanes (Z0 = 100 W) 5000 µm Pad layout 350 µm 170 µm 3 PCB layout recommendations 150 µm 350 µm Differential lanes (Z0 = 100 W) 330 µm Figure 17. PCB stack dimensions 40 µm 105 µm εr = 4.28 DocID024844 Rev 2 9/13 13 Package information 4 ECMF04-4HSM10 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 18. µQFN-10L dimension definitions Top view D Idex area E Side view A1 A Bottom view e b 1 5 10 6 PIN # 1 ID L Table 4. µQFN-10L dimension values Dimensions Ref. A Millimeters Min. Typ. Max. Min. Typ. Max. 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.00 0.0008 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 2.55 2.60 2.65 0.1 0.102 0.104 E 1.30 1.35 1.40 0.051 0.053 0.055 0.60 0.016 e L 10/13 Inches 0.50 0.40 0.50 0.020 DocID024844 Rev 2 0.020 0.024 ECMF04-4HSM10 Package information Figure 19. Footprint Figure 20. Marking 0.20 0.70 KK 1.75 0.50 Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 21. Tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 3.5 2.8 1.75 0.20 8.0 Note: 1.55 4.0 0.65 All dimensions are typical values in mm User direction of unreeling DocID024844 Rev 2 11/13 13 Ordering information 5 ECMF04-4HSM10 Ordering information Figure 22. Ordering information scheme ECMF 04 - 4 HS M10 Function Common mode filter with ESD protection Number of lines 04 = 4 filtered lines Number of ESD protected lines 4 lines with ESD protection Version HS = High speed Package M10 = µQFN-10L Table 5. Ordering information Order code Marking(1) Package Weight Base qty Delivery mode ECMF04-4HSM10 KK µQFN-10L 5.00 mg 3000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location 6 Revision history Table 6. Document revision history 12/13 Date Revision Changes 03-Oct-2013 1 Initial release. 25-Aug-2014 2 Added Figure 5: Differential (ZDD21) and common mode (ZCC21) impedance versus frequency. DocID024844 Rev 2 ECMF04-4HSM10 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2014 STMicroelectronics – All rights reserved DocID024844 Rev 2 13/13 13