EMIF02-SPK01C2 2 line IPAD™, EMI filter including ESD protection Datasheet - production data Applications Where EMI filtering in ESD sensitive equipment is required: Mobile phones and communication systems Computers and printers and MCU Boards Coated Flip-Chip package Description Features EMI symmetrical (I/O) low-pass filter High efficiency EMI filter (-33 dB @ 900 MHz) Very low PCB space consumption: 1.07 mm x 1.47 mm Very thin package: 0.695 mm The EMIF02-SPK01C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The Flip-Chip packaging means the package size is equal to the die size.This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV. Figure 1. Pin configuration (bump side) Coating resin on back side and lead free package 3 2 1 High efficiency in ESD suppression I2 A I1 High reliability offered by monolithic integration B GND High reduction of parasitic elements through integration and wafer level packaging. O2 C O1 Complies with the following standards: IEC 61000-4-2 level 4, on input pins: – 15 kV (air discharge) – 8 kV (contact discharge) Figure 2. Basic cell configuration Low-pass Filter IEC 61000-4-2 Level 1, on output pins: – 2 kV (air discharge) – 2 kV (contact discharge) Input Output Ri/o = 10 Ω Cline = 200 pF MIL STD 883G - Method 3015-7 Class 3 GND GND GND TM: IPAD is a trademark of STMicroelectronics May 2013 This is information on a product in full production. DocID13180 Rev 2 1/8 www.st.com Characteristics 1 EMIF02-SPK01C2 Characteristics Table 1. Absolute ratings (limiting values) Symbol Tj Parameter Maximum junction temperature Value Unit 125 °C Top Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to +150 °C Figure 3. Electrical characteristics (definitions) I Symbol VBR IRM VRM VCL RD IPP IR VF Cline = = = = = = = = = Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Breakdown current Forward voltage drop Line capacitance IPP VCL VBR IR IRM VRM IRM V VRM VBR VCL IR IPP Table 2. Electrical characteristics (Tamb = 25 °C) Symbol 2/8 Test conditions Min. Typ. 6 8 Max. Unit VBR IR = 1 mA IRM VRM = 3 V per line RI/O Tolerance ± 20% 10 Cline VR = 0 V 200 pF V 500 DocID13180 Rev 2 nA EMIF02-SPK01C2 Characteristics Figure 4. S21 (dB) attenuation measurement 0.00 Figure 5. Analog crosstalk measurement dB 0.00 dB --5.00 --10.00 --10.00 --20.00 --15.00 --20.00 --30.00 --25.00 --40.00 --30.00 --50.00 -35.00 F (Hz) -40.00 100.0k 1.0M 10.0M F (Hz) 100.0M --60.00 100.0k 1.0G Figure 6. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input Vin and one output Vout 1.0M 10.0M 100.0M 1.0G Figure 7. ESD response to IEC 61000-4-2 (- 15 kV air discharge) on one input Vin and one output Vout Figure 8. Line capacitance versus applied voltage C(pF) 250 F=1MHz Vosc=30mVRMS Tj=25°C 200 150 100 50 VR(V) 0 0 1 2 3 DocID13180 Rev 2 4 5 3/8 8 Characteristics EMIF02-SPK01C2 Figure 9. Aplac model IN1 Rbump Lbump Rspk Lspk Lbump Rbump GND OUT1 Lsub model = D1 model = D2 Rsub Rbump GND model = D3 Lbump model = D1 model = D2 Lgnd Cgnd IN2 Rgnd OUT2 Rbump Lbump Rspk Lspk Lbump Rbump Ground return EMIF02-SPK01C2 model Figure 10. Aplac parameters Model D1 Model D3 Model D2 aplacvar Ls 1nH CJO=Cdiode1 CJO=Cdiode3 CJO=Cdiode2 aplacvar Rs 150m BV=7 BV=7 BV=7 aplacvar Rspk 10 IBV=1u IBV=1u IBV=1u aplacvar Lspk 10p IKF=1000 IKF=1000 IKF=1000 aplacvar Cdiode1 234pF IS=10f IS=10f IS=10f aplacvar Cdiode2 3.5ppF ISR=100p ISR=100p ISR=100p aplacvar Cdiode3 1nF N=1 N=1 N=1 aplacvar Lbump 50pH M=0.3333 M=0.3333 M=0.3333 aplacvar Rbump 10m RS=0.7 RS=0.12 RS=0.3 aplacvar Rsub 0.5m VJ=0.6 VJ=0.6 VJ=0.6 aplacvar Lsub 10pH TT=50n TT=50n TT=50n aplacvar Rgnd 1m aplacvar Lgnd 50pH aplacvar Cgnd 0.15pF 4/8 DocID13180 Rev 2 EMIF02-SPK01C2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. Flip-Chip dimensions 500 µm ± 10 315 µm ± 50 695 µm ± 50 µm ± 15 1.47 m m ± 50 µm 250 µm ± 10 50 0 2 Package information 1.07 m m ± 50 µm Figure 12. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Figure 13. Footprint Copper pad Diameter : 250 µm recommended , 300 µm max E x x z y ww Solder stencil opening : 330µm Solder mask opening recommendation : 340 µm min for 300 µm copper pad diameter DocID13180 Rev 2 5/8 8 Package information EMIF02-SPK01C2 Figure 14. Flip-Chip tape and reel specification D otidentifying Pin A 1 location Ø 1.55 2.0 4.0 8.0 3.5 1.75 0.22 ST ST ST xxz yw w xxz yw w xxz yw w 4.0 0.73 All dimensions are typical values in mm 6/8 U ser direction ofunreeling DocID13180 Rev 2 EMIF02-SPK01C2 3 Ordering information Ordering information Figure 15. Ordering information scheme EMIF yy - xxx zz Cx EMI Filter Number of lines Information 3 letters = application 2 digits = version Package C = Coated Flip-Chip x = 2: Leadfree Pitch = 500 µm, Bump = 315 µm Table 3. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode EMIF02-SPK01C2 FX Flip Chip 2.3 mg 5000 Tape and reel 7” Revision history Table 4. Document revision history Date Revision Changes 26-Jan-2006 1 Initial release. 22-May-2013 2 Updated Figure 13. DocID13180 Rev 2 7/8 8 EMIF02-SPK01C2 EMIF02-SPK01C2 EMIF02-SPK01C2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT AUTHORIZED FOR USE IN WEAPONS. NOR ARE ST PRODUCTS DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 DocID13180 Rev 2