BALF-SPI-01D3 50 Ω nominal input / conjugate match balun to SPIRIT1, with integrated harmonic filter Datasheet − production data Features • 50 Ω nominal input / conjugate match to SPIRIT1 • Low insertion loss • Low amplitude imbalance • Low phase imbalance • Small footprint Flip-Chip package 6 bumps Benefits Figure 1. Pin coordinates (top view) • Very low profile (< 670 µm) • High RF performance • RF BOM and area reduction $ 5;B3 *1' Applications % $17 5;B1 *1' 7; • 868 MHz and 915 MHz impedance matched balun filter • Optimized for SPIRIT1 sub GHz RFIC & Description Figure 2. Application schematic (top view) C0 The BALF-SPI-01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performances. 1.8 - 3.6 V MOSI 4 SCLK 17 SPIRIT1 16 VBAT 3 18 VREG 2 MISO 19 GPIO2 20 GPIO1 GPIO0 GPIO3 Digital interface C13 1 C12 SDN 15 L7 SMPS Ext1 14 SMPS Ext2 13 TX 12 L8 STMicroelectronics BALF-SPI-01D3 is an ultra miniature balun. The BALF-SPI-01D3 integrates matching network and harmonics filters. Matching impedance has been customized for the SPIRIT1 ST transceiver. C11 L0 6 7 8 9 1.8-3.6 V RFN RFP XOUT XIN CSn VBAT 5 RBIAS R0 CX 11 Antenna (50 Ω) 10 BALF-SPI -01D3 XTAL C9 C10 September 2015 This is information on a product in full production. DocID025035 Rev 4 1/12 www.st.com 12 Characteristics 1 BALF-SPI-01D3 Characteristics Table 1. Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min. PIN Typ. Max. Input power RFIN VESD TOP 20 ESD ratings human body model (JESD22-A114-C), all I/O one at a time while others connected to GND 2000 ESD ratings machine model, all I/O 200 Operating temperature (JESD22-A115-C), all I/O -40 dBm V +85 °C Table 2. Impedances (Tamb = 25 °C) Value Symbol Parameter Unit Min. ZRX Nominal differential RX balun impedance ZTX Nominal TX filter impedance ZANT Antenna impedance Typ. Max. match to SPIRIT1 Ω 50 Ω Table 3. RF performance (Tamb = 25 °C) Value Symbol F Parameter Test condition Frequency range (bandwidth) Unit Min. Typ. Max. 779 868 956 MHz S21RX-ANT Insertion loss in bandwidth without mismatch loss (RX balun) -1.7 -2 dB S21TX-ANT Insertion loss in bandwidth without mismatch loss (TX filter) -1.4 -2 dB S11ANT Input return loss in bandwidth (RX balun) -23 -15 dB S11ANT Input return loss in bandwidth (TX filter) -15 -12 dB 10 15 ° 0.35 0.8 dB φimb Output phase imbalance (RX balun) Aimb Output amplitude imbalance (RX balun) Att 2/12 Harmonic levels (TX filter) 5 Attenuation at 2fo -35 Attenuation at 3fo -40 DocID025035 Rev 4 dBm BALF-SPI-01D3 1.1 Characteristics RF measurement (Rx balun) Figure 3. Insertion loss (Tamb = 25 °C) 0.0 Figure 4. Return loss antenna (Tamb = 25 °C) (dB) -0 (dB) -0.5 -5 -1.0 -10 -1.5 -15 -2.0 -20 -2.5 F (MHz) F (MHz) -3.0 779 799 819 839 859 879 899 919 939 956 Figure 5. Phase imbalance (Tamb = 25 °C) 20 -25 779 799 819 839 859 879 899 919 939 956 Figure 6. Amplitude imbalance (Tamb = 25 °C) (dB) 1.0 (deg) 0.8 15 0.6 10 0.4 5 0.2 F (MHz) 0 779 F (MHz) 799 819 839 859 879 899 919 939 956 0.0 779 799 DocID025035 Rev 4 819 839 859 879 899 919 939 956 3/12 Characteristics 1.2 BALF-SPI-01D3 RF measurement (Tx filter) Figure 7. Transmission (Tamb = 25 °C) 0.0 Figure 8. Insertion loss (Tamb = 25 °C) (dB) -0 -10 -0.5 -20 -1.0 -30 -1.5 -40 -2.0 (dB) F (MHz) F (GHz) -50 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 Figure 9. Attenuation (Tamb = 25 °C) 0.0 -2.5 779 799 819 839 859 879 899 919 939 956 Figure 10. Return loss antenna (Tamb = 25 °C) (dBm) 0 (dB) 3f0 2f0 -10 -5 -20 -10 -30 -15 -40 F (GHz) -50 1.6 4/12 1.8 2.0 2.2 2.4 2.6 F (MHz) 2.8 -20 779 799 DocID025035 Rev 4 819 839 859 879 899 919 939 956 BALF-SPI-01D3 2 Application information Application information Figure 11. Application board EVB (4 layers) Figure 12. TX output measurements with BALF-SPI-01D3 at 868 MHz Measured output Power (dBm) 13 12 11 10 9 8 7 6 5 4 3 2 1 Requested Power (dBm) 0 0 1 2 3 4 5 6 DocID025035 Rev 4 7 8 9 10 11 12 13 5/12 Application information BALF-SPI-01D3 Figure 13. TX output power measurements over frequency with BALF-SPI-01D3 Measured output Power (dBm) 12 915 - 920 MHz 868 MHz 10 +10 dBm mode 8 6 4 2 0 0 dBm mode F (MHz) -2 800 820 840 860 880 900 920 940 960 Figure 14. Harmonic measurements at Pout = 10 dBm with BALF-SPI-01D3 Att (dB) H2 H3 H4 H5 H6 H7 H8 -30 -40 -50 -60 -70 -80 F (MHz) -90 0 6/12 1000 2000 3000 4000 5000 DocID025035 Rev 4 6000 7000 8000 9000 10000 BALF-SPI-01D3 3 Package information Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Flip-Chip package information Figure 15. Flip-Chip package outline (top and side view) 7RSYLHZ %RWWRPYLHZ VLGHYLHZ $ $ ( 'LDPE $ $ $ I' $ ' FFF & ' 3.1 & % % ' % % ' & & & & I' $ ( Table 4. Flip-Chip package mechanical data Parameter Description Min. Typ. Max. Unit 0.590 0.650 0.710 mm A Bump height + substrate thickness A1 Bump height 0.200 mm A2 Substrate thickness 0.400 mm b Bump diameter 0.210 0.250 0.290 mm D Y dimension of the die 1.950 2.000 1.950 mm D1 Y pitch 0.960 1.000 1.040 mm D2 Y pitch2 0.460 0.500 0.540 mm E X dimension of the die 1.350 1.400 1.450 mm E1 X pitch 0.790 0.820 0.850 mm fD1 Distance from bump to edge of die on Y axis 0.295 mm fD2 Distance from bump to edge of die on Y axis 0.195 mm ccc 0.05 DocID025035 Rev 4 mm 7/12 Package information BALF-SPI-01D3 Figure 16. Recommended balun land pattern 1325 µm 1590 µm 1290 µm 125 µm 1125 µm RX Ground clearance 130 microns TX/ANT Ground clearance 100 microns Copper pads Æ = 220 µm 8/12 DocID025035 Rev 4 BALF-SPI-01D3 Package information Figure 17. Footprint - 3 mils stencil -non solder mask defined Figure 18. Footprint - 3 mils stencil - solder mask defined &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG Figure 19. Footprint - 5 mils stencil -non solder mask defined Figure 20. Footprint - 5 mils stencil - solder mask defined &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG GHSHQGLQJRQSDVWHLWFDQJRGRZQWRP GHSHQGLQJRQSDVWHLWFDQJRGRZQWRP DocID025035 Rev 4 9/12 Package information BALF-SPI-01D3 Figure 21. Marking Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode x x z y ww Figure 22. Flip Chip tape and reel specifications 'RWLGHQWLI\LQJ3LQ $ORFDWLRQ [ [ ] \ ZZ [ [ ] \ ZZ [ [ ] \ ZZ $OOGLPHQVLRQVDUHW\SLFDOYDOXHVLQPP Note: 8VHUGLUHFWLRQRIXQUHHOLQJ More information is available in the STMicroelectronics Application note: AN2348 Flip-Chip: “Package description and recommendations for use” 10/12 DocID025035 Rev 4 BALF-SPI-01D3 4 Ordering information Ordering information Table 5. Ordering information 5 Order code Marking Weight Base Qty Delivery mode BALF-SPI-01D3 SJ 3.0 mg 5000 Tape and Reel Revision history Table 6. Document revision history Date Revision Changes 27-Aug-2013 1 Initial release 03-Oct-2013 2 Updated document title. Updated Table 1 with JESD22 references. 15-May-2015 3 Updated Figure 1 and Figure 15. Added Figure 19 and Figure 20. 18-Sep-2015 4 Updated Figure 15 and added Table 4. DocID025035 Rev 4 11/12 BALF-SPI-01D3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 12/12 DocID025035 Rev 4