MP23AB02B MEMS audio sensor high-performance analog bottom-port microphone Datasheet - production data Description The MP23AB02B is a compact, low-power microphone built with a low-profile sensing element. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors. The MP23AB02B has an acoustic overload point of 125 dBSPL with a 64 dB signal-to-noise ratio. RHLGA metal cap 3-lead 3.35 x 2.5 x 0.98 mm The MP23AB02B is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C. Features Single supply voltage operation Low power consumption Omnidirectional sensitivity High signal-to-noise ratio High bandwidth Package compliant with reflow soldering Table 1. Device summary Order code Temperature range (C) Package Packing MP23AB02B -40 to +85 (3.35 x 2.5 x 0.98) mm Tray MP23AB02BTR -40 to +85 (3.35 x 2.5 x 0.98) mm Tape and reel September 2014 This is information on a product in full production. DocID026104 Rev 3 1/12 www.st.com Pin description 1 MP23AB02B Pin description Figure 1. Pin connections 2 1 3 Table 2. Pin description 2/12 Pin n° Pin name Function 1 Out Analog output 2 Vdd Power supply 3 GND Ground DocID026104 Rev 3 MP23AB02B Acoustic and electrical specifications 2 Acoustic and electrical specifications 2.1 Acoustic and electrical characteristics The values listed in the table below are specified for Vdd = 1.8 V, Tamb = 25 °C unless otherwise specified. Table 3. Acoustic and electrical characteristics Symbol Parameter Test condition Vdd Supply voltage Idd Current consumption mean value = 2 V So Sensitivity 1 kHz (0 dB = 1 V/Pa) SNR Signal-to-noise ratio A-weighted, 1 kHz (0 dB = 1 V/Pa) Top Operating temperature range Min. Typ.(1) Max. Unit 1.6 1.8 3.6 V 150 220 μA -38 -35 dBV/PA -41 64 dBA -40 +85 °C 1. Typical specifications are not guaranteed Table 4. Distortion specifications at 1 kHz Parameter Test condition Value Distortion 94 < 0.5% Distortion 120 < 2% Distortion 124 = 10% Figure 2. Frequency response DocID026104 Rev 3 3/12 12 Absolute maximum ratings 3 MP23AB02B Absolute maximum ratings Stresses above those listed as “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 5. Absolute maximum ratings Symbol Ratings Vdd Supply voltage TSTG Storage temperature range Maximum value Unit -0.5 to 4 V -40 to +125 °C This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part. This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part. 4/12 DocID026104 Rev 3 MP23AB02B 4 Application recommendations Application recommendations Figure 3. MP23AB02B electrical connections and external component values Vdd R2 - Vref C2 C3 R1 Pin.2 MP23AB02B Pin.1 (Vout ) C1 + Pin.3 Typical values: C1 > 1µF C2 ~ 1000pF C3 = 1µF (Ground) R Vref Ext. gain = (R1+R2) / R1 GAMS1103141450SG DocID026104 Rev 3 5/12 12 Package mechanical data 5 MP23AB02B Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 6/12 DocID026104 Rev 3 MP23AB02B Figure 4. RHLGA metal cap 3-lead 3.35 mm x 2.5 mm x 0.98 mm package outline DocID026104 Rev 3 7/12 Package mechanical data 8419346_A Package mechanical data MP23AB02B Table 6. RHLGA metal cap 3-lead (3.35 x 2.5 x 0.98 mm9 package dimensions Dimensions (mm) Reference 8/12 Min. Typ. Max. A1 0.880 0.980 1.080 A2 0.200 0.250 0.300 D1 3.250 3.350 3.450 D2 0.495 0.595 0.695 D3 2.770 2.920 3.070 R1 0.275 0.325 0.375 R2 0.28 R3 0.25 E1 2.400 2.500 2.600 E2 1.150 1.250 1.350 E3 1.920 2.070 2.220 L1 1.480 1.520 1.560 L2 1.180 1.220 1.260 N1 0.885 0.925 0.965 N2 0.570 0.610 0.650 T1 0.860 0.900 0.940 T2 0.640 0.680 0.720 G1 0.900 0.950 1.000 G2 1.400 1.550 1.600 G3 0.100 0.150 0.200 P1 1.425 1.475 1.525 P2 1.000 1.050 1.100 d 0.150 K 0.050 DocID026104 Rev 3 MP23AB02B Package mechanical data Figure 5. RHLGA tape and reel (dimensions are in mm.) *$066* DocID026104 Rev 3 9/12 12 Soldering information 6 MP23AB02B Soldering information Figure 6. Recommended soldering profile limits tp TP CRITICAL ZONE RAMP-UP TL to T P TL TEMPERATURE TSMAX tL TSMIN ts PREHEAT RAMP-DOWN T25°C to PEAK 30 60 90 120 150 180 TIME 210 240 270 300 330 360 390 AM045166v1 Table 7. Recommended soldering profile limits Description Average ramp rate Parameter Pb free TL to TP 3 °C/sec max TSMIN TSMAX tS 150 °C 200 °C 60 sec to 120 sec Preheat Minimum temperature Maximum temperature Time (TSMIN to TSMAX) Ramp-up rate TSMAX to TL Time maintained above liquidus temperature Liquidus temperature tL TL 60 sec to 150 sec 217 °C Peak temperature TP 260 °C max Time within 5 °C of actual peak temperature 10/12 20 sec to 40 sec Ramp-down rate 6 °C/sec max Time 25 °C (t = 25 °C) to peak temperature 8 minutes max DocID026104 Rev 3 MP23AB02B 7 Revision history Revision history . Table 8. Document revision history Date Revision Changes 21-Mar-2014 1 Initial release. 16-Jun-2014 2 Updated Figure 5 on page 9. 22-Sep-2014 3 Updated acoustic overload point in Description. DocID026104 Rev 3 11/12 12 MP23AB02B IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2014 STMicroelectronics – All rights reserved 12/12 DocID026104 Rev 3