Technical Data Sheet

LBP01
LED bypass protection
Datasheet − production data
Features
■
Bidirectional device: LBP01-0810B
■
Unidirectional device: LBP01-0803SC5
■
RoHS compliant
Benefits
■
Keep LED strings on in case of LED open
mode failure
■
Reduced maintenance cost
■
Increase lifetime of the lighting system
SOT23-5L
LBP01-0803SC5
SMB
(DO-214AA)
LBP01-0810B
Figure 1.
Functional diagrams
Complies with the following standards:
■
IEC61000-4-2 level 4
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
■
IEC 61000-4-5
– ±1kV / 24 A
Control
circuit
LBP01-0810B
Control
circuit
Applications
This device shunts failed LEDs in applications
where LED strings can not be turned-off for safety
reason due to a LED failure. Main applications
are:
■
Automotive headlights
■
Traffic lights
■
Aircraft runaway lights
■
Emergency lighting systems
■
Display panel backlighting
■
Street lighting
1
3
4
5
2
LBP01-0803SC5
Description
The LBP01 series are bypass switches to be
connected in parallel with 1 or 2 LEDs. In case of
LED failure, this allows the current to flow through
the other LEDs.
It also provides an overvoltage protection against
surges defined in IEC 61000-4-2 and
IEC 61000-4-5
Their robust dice also protect LEDs against surge.
These devices are compatible with LEDs up to
1 A.
LBP01 are packaged either in SMB or SOT23-5L
March 2012
This is information on a product in full production.
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8
Characteristics
LBP01
1
Characteristics
Table 1.
Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
IEC 61000-4-2 contact discharge
Unit
30
kV
24
A
0.35
A
1
A
VPP
Peak pulse voltage
IPP
Repetitive peak pulse current (8/20µs)
IF
On-state DC current
Tj
Operating junction temperature range
-55 to 150
°C
Storage temperature range
-65 to 150
°C
260
°C
SOT23-5L
Tstg
TL
Table 2.
SMB
Maximum lead temperature for soldering during 10 s
Electrical characteristics (Tamb = 25 °C)
Symbol
IRM
Test conditions
Min.
8
IH
Von
Ion = 1 A
mA
2
V
SMB
1.3
V
SMB
1.5
V
300
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V
200
Ion = 0.35 A
1. Measured between pin 1, 3, 4, or 5 and pin 2
15
SMB
SOT23-5L
On recommended pad layout with copper area of 1 cm2
nA
200
Ion = 0.35 A (1)
Unit
100
SOT23-5L
dV/dt
Rth(j-a)
Typ. Max.
VRM = 3 V
VBO
2/8
Value
V/µs
SOT23-5L
140
°C/W
SMB
100
°C/W
LBP01
Ordering information scheme
Figure 3.
Thermal resistance, junction to
ambient, versus copper area under
each lead (SMB)
Figure 2.
200
Rth(j-a)(°C/W)
Thermal resistance, junction to
ambient, versus copper area under
each lead (SOT23-5L)
Rth(j-a)(°C/W)
240
220
180
200
160
180
140
160
120
140
120
100
SCu(mm2)
SCu(mm2)
100
80
0
20
40
60
80
100
120
140
160
180
200
0
2
Ordering information scheme
Figure 4.
Ordering information scheme
LBP
20
40
01
60
-
80 100 120 140 160 180 200
vv
ii
p
LED bypass protection
Version
Breakdown voltage
Forward DC current
Delivery mode
SC5 = SOT23-5L
B = SMB
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Package information
3
LBP01
Package information
●
Epoxy meets UL94, V0
●
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 3.
SMB dimensions
Dimensions
Ref.
Millimeters
E1
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
L
0.75
1.50
0.030
0.059
D
E
A1
A2
C
L
Figure 5.
b
Footprint, dimensions in mm Figure 6.
(inches)
1.62
2.60
(0.064) (0.102)
Marking(1)
1.62
(0.064)
2.18
(0.086)
x x x
z y ww
ECOPACK compliance
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
5.84
(0.23)
1. Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product
marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this
purpose.
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LBP01
Package information
Table 4.
SOT23-5L dimensions
Dimensions
Ref.
Millimeters
Min. Typ. Max.
c
A1
q
L
H
A
E
Inches
Min.
Typ.
Max.
A
0.90
1.45 0.035
0.057
A1
0
0.10
0.004
A2
0.90
1.30 0.035
0.051
b
0.35
0.50 0.014
0.020
c
0.09
0.20 0.004
0.008
D
2.80
3.05
0.11
0.118
E
1.50
1.75 0.059
0.069
0
e
D
b
e
e
A2
Figure 7.
0.95
0.037
H
2.60
3.00 0.102
0.118
L
0.10
0.60 0.004
0.024
M
0°
Footprint, dimensions in mm Figure 8.
(inches)
10°
0°
10°
Marking
0.60
(0.024)
1.20
(0.047)
0.95
(0.037)
1.10
(0.043)
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2.30
3.50
(0.138) (0.091)
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Recommendations on PCB assembly
LBP01
4
Recommendations on PCB assembly
4.1
PCB design
1.
To control the solder paste amount, the closed via is recommended instead of open
vias.
2.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Figure 9.
4.2
Printed circuit board layout
Reflow profile
Figure 10. ST ECOPACK® recommended soldering reflow profile for PCB mounting
240-245 °C
Temperature (°C)
250
-2 °C/s to
-3 °C/s
-6 °C/s max
2 - 3 °C/s
60 sec
(90 max)
200
150
100
0.9 °C/s
50
Time (s)
0
Note:
6/8
30
60
90
120
150
180
210
240
270
300
Minimize air convection currents in the reflow oven to avoid component movement.
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LBP01
5
Ordering information
Ordering information
Table 5.
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
LBP01-0803SC5
XT08
SOT23-5L
16 mg
3000
Tape and reel
SMB
0.11 g
2500
Tape and reel
LBP01-0810B
(1)
L08
1. The marking can be rotated by 90° to differentiate assembly location.
6
Revision history
Table 6.
Document revision history
Date
Revision
20-Mar-2012
1
Changes
Initial release.
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LBP01
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