RENESAS HVM14

HVM14
Silicon Epitaxial Planar PIN Diode for High Frequency
Attenuator
REJ03G0112-0400Z
(Previous: ADE-208-082C)
Rev.4.00
Oct.08.2003
Features
• Low forward resistance. (rf = 7.0 Ω max)
• Low capacitance. (C = 0.25 pF typ)
• MPAK package is suitable for high density surface mounting and high speed assembly.
Ordering Information
Type No.
Laser Mark
Package Code
HVM14
H5
MPAK
Pin Arrangement
3
2
1
(Top View)
Rev.4.00, Oct.08.2003, page 1 of 4
1. NC
2. Anode
3. Cathode
HVM14
Absolute Maximum Ratings
(Ta = 25°C)
Item
Symbol
Value
Unit
Reverse voltage
VR
50
V
Forward current
IF
50
mA
Power dissipation
Pd
100
mW
Junction temperature
Tj
125
°C
Storage temperature
Tstg
–55 to +125
°C
Electrical Characteristics
(Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Forward voltage
VF
—
—
1.0
V
IF = 50 mA
Reverse current
IR
—
—
100
nA
VR = 50 V
Capacitance
C
—
0.25
—
pF
VR = 50 V, f = 1 MHz
rf
—
—
7.0
Ω
IF = 10 mA, f = 100 MHz
—
200
—
—
V
C = 200 pF, Both forward and reverse
direction 1 pulse.
Forward resistance
1
ESD-Capability *
Note:
1. Failure criterion; IR ≥ 200 nA at VR = 50 V
Rev.4.00, Oct. 08.2003, page 2 of 4
HVM14
Main Characteristic
10–8
10–1
Reverse current IR (A)
Forward current IF (A)
10–3
10–5
10–7
–9
10–9
10–10
10–11
10
10–11
0
0.2
0.4
0.6
0.8
1.0
10–12
0
10
20
30
40
50
Forward voltage VF (V)
Reverse voltage VR (V)
Fig.1 Forward current vs. Forward voltage
Fig.2 Reverse current vs. Reverse voltage
104
f = 100MHz
f = 1MHz
Forward resistance rf (Ω)
Capacitance C (pF)
10
1.0
0.1
1.0
10
100
103
102
10
1.0 –5
10
10–4
10–3
10–2
Reverse voltage VR (V)
Forward current IF (A)
Fig.3 Capacitance vs. Reverse voltage
Fig.4 Forward resistance vs. Forward current
Rev.4.00, Oct. 08.2003, page 3 of 4
HVM14
Package Dimensions
As of January, 2003
1.9 ± 0.2
2.8
+ 0.2
– 0.6
+ 0.2
1.1 – 0.1
0.3
2.8 +– 0.1
0 – 0.1
(0.3)
(0.95) (0.95)
+ 0.10
0.16 – 0.06
(0.65)
1.5 ± 0.15
0.10
3–0.4 +– 0.05
(0.65)
Unit: mm
Package Code
JEDEC
JEITA
Mass (reference value)
Rev.4.00, Oct. 08.2003, page 4 of 4
MPAK(D)
—
Conforms
0.011 g
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