AT91SAM7X512 - Atmel Corporation

ARM-based Flash MCU
SAM7X512 / SAM7X256 / SAM7X128
SUMMARY DATASHEET
Description
The Atmel SAM7X512/256/128 is a highly-integrated Flash microcontroller based on
the 32-bit ARM® RISC processor. It features 512/256/128 Kbytes of high-speed Flash
and 128/64/32 Kbytes of SRAM, a large set of peripherals, including an 802.3 Ethernet
MAC, and a CAN controller. A complete set of system functions minimizes the number
of external components.
The embedded Flash memory can be programmed in-system via the JTAG-ICE
interface or via a parallel interface on a production programmer prior to mounting. Builtin lock bits and a security bit protect the firmware from accidental overwrite and
preserve its confidentiality.
The SAM7X512/256/128 system controller includes a reset controller capable of
managing the power-on sequence of the microcontroller and the complete system.
Correct device operation can be monitored by a built-in brownout detector and a
watchdog running off an integrated RC oscillator.
By combining the ARM7TDMI® processor with on-chip Flash and SRAM, and a wide
range of peripheral functions, including USART, SPI, CAN controller, Ethernet MAC,
Timer Counter, RTT and analog-to-digital converters on a monolithic chip, the
SAM7X512/256/128 is a powerful device that provides a flexible, cost-effective solution
to many embedded control applications requiring communication over Ethernet, wired
CAN and ZigBee® wireless networks.
This is a summary document.
The complete document is
available on the Atmel website
at www.atmel.com.
6120IS–ATARM–14-Nov-13
Features
 Incorporates the ARM7TDMI ARM Thumb® Processor

High-performance 32-bit RISC Architecture
High-density 16-bit Instruction Set
 Leader in MIPS/Watt
 EmbeddedICE™ In-circuit Emulation, Debug Communication Channel Support

 Internal High-speed Flash

512 Kbytes (SAM7X512) Organized in Two Banks of 1024 Pages of
256 Bytes (Dual Plane)
 256 Kbytes (SAM7X256) Organized in 1024 Pages of 256 Bytes (Single Plane)
 128 Kbytes (SAM7X128) Organized in 512 Pages of 256 Bytes (Single Plane)
 Single Cycle Access at Up to 30 MHz in Worst Case Conditions
 Prefetch Buffer Optimizing Thumb Instruction Execution at Maximum Speed
 Page Programming Time: 6 ms, Including Page Auto-erase,
Full Erase Time: 15 ms
 10,000 Write Cycles, 10-year Data Retention Capability,
Sector Lock Capabilities, Flash Security Bit
 Fast Flash Programming Interface for High Volume Production
 Internal High-speed SRAM, Single-cycle Access at Maximum Speed

128 Kbytes (SAM7X512)
64 Kbytes (SAM7X256)
 32 Kbytes (SAM7X128)

 Memory Controller (MC)

Embedded Flash Controller, Abort Status and Misalignment Detection
 Reset Controller (RSTC)


Based on Power-on Reset Cells and Low-power Factory-calibrated Brownout Detector
Provides External Reset Signal Shaping and Reset Source Status
 Clock Generator (CKGR)

Low-power RC Oscillator, 3 to 20 MHz On-chip Oscillator and one PLL
 Power Management Controller (PMC)


Power Optimization Capabilities, Including Slow Clock Mode (Down to 500 Hz) and Idle Mode
Four Programmable External Clock Signals
 Advanced Interrupt Controller (AIC)


Individually Maskable, Eight-level Priority, Vectored Interrupt Sources
Two External Interrupt Sources and One Fast Interrupt Source, Spurious Interrupt Protected
 Debug Unit (DBGU)


2-wire UART and Support for Debug Communication Channel interrupt, Programmable ICE Access Prevention
Mode for General Purpose 2-wire UART Serial Communication
 Periodic Interval Timer (PIT)

20-bit Programmable Counter plus 12-bit Interval Counter
 Windowed Watchdog (WDT)

12-bit key-protected Programmable Counter
Provides Reset or Interrupt Signals to the System
 Counter May Be Stopped While the Processor is in Debug State or in Idle Mode

 Real-time Timer (RTT)


32-bit Free-running Counter with Alarm
Runs Off the Internal RC Oscillator
 Two Parallel Input/Output Controllers (PIO)


Sixty-two Programmable I/O Lines Multiplexed with up to Two Peripheral I/Os
Input Change Interrupt Capability on Each I/O Line
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6120IS–ATARM–14-Nov-13
2

Individually Programmable Open-drain, Pull-up Resistor and Synchronous Output
 Thirteen Peripheral DMA Controller (PDC) Channels
 One USB 2.0 Full Speed (12 Mbits per second) Device Port

On-chip Transceiver, 1352-byte Configurable Integrated FIFOs
 One Ethernet MAC 10/100 base-T


Media Independent Interface (MII) or Reduced Media Independent Interface (RMII)
Integrated 28-byte FIFOs and Dedicated DMA Channels for Transmit and Receive
 One Part 2.0A and Part 2.0B Compliant CAN Controller

Eight Fully-programmable Message Object Mailboxes, 16-bit Time Stamp Counter
 One Synchronous Serial Controller (SSC)

Independent Clock and Frame Sync Signals for Each Receiver and Transmitter
I²S Analog Interface Support, Time Division Multiplex Support
 High-speed Continuous Data Stream Capabilities with 32-bit Data Transfer

 Two Universal Synchronous/Asynchronous Receiver Transmitters (USART)
Individual Baud Rate Generator, IrDA® Infrared Modulation/Demodulation
 Support for ISO7816 T0/T1 Smart Card, Hardware Handshaking, RS485 Support
 Full Modem Line Support on USART1

 Two Master/Slave Serial Peripheral Interfaces (SPI)

8- to 16-bit Programmable Data Length, Four External Peripheral Chip Selects
 One Three-channel 16-bit Timer/Counter (TC)


Three External Clock Inputs, Two Multi-purpose I/O Pins per Channel
Double PWM Generation, Capture/Waveform Mode, Up/Down Capability
 One Four-channel 16-bit Power Width Modulation Controller (PWMC)
 One Two-wire Interface (TWI)

Master Mode Support Only, All Two-wire Atmel EEPROMs and I2C Compatible Devices Supported
 One 8-channel 10-bit Analog-to-Digital Converter, Four Channels Multiplexed with Digital I/Os
 SAM-BA® Boot Assistance


Default Boot program
Interface with SAM-BA Graphic User Interface
 IEEE® 1149.1 JTAG Boundary Scan on All Digital Pins
 5V-tolerant I/Os, Including Four High-current Drive I/O lines, Up to 16 mA Each
 Power Supplies

Embedded 1.8V Regulator, Drawing up to 100 mA for the Core and External Components
3.3V VDDIO I/O Lines Power Supply, Independent 3.3V VDDFLASH Flash Power Supply
 1.8V VDDCORE Core Power Supply with Brownout Detector

 Fully Static Operation: Up to 55 MHz at 1.65V and 85°C Worst Case Conditions
 Available in 100-lead LQFP Green and 100-ball TFBGA Green Packages
SAM7X Series [SUMMARY DATASHEET]
6120IS–ATARM–14-Nov-13
3
1.
Configuration Summary of the SAM7X512/256/128
The SAM7X512, SAM7X256 and SAM7X128 differ only in memory sizes. Table 1-1 summarizes the configurations of the
three devices.
Table 1-1.
Device
SAM7X512
SAM7X256
SAM7X128
Configuration Summary
Flash
512 Kbytes
256 Kbytes
128 Kbytes
Flash Organization
Dual-plane
Single-plane
Single-plane
SRAM
128 Kbytes
64 Kbytes
32 Kbytes
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6120IS–ATARM–14-Nov-13
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SAM7X512/256/128 Block Diagram
SAM7X512/256/128 Block Diagram
TDI
TDO
TMS
TCK
ICE
JTAG
SCAN
ARM7TDMI
Processor
JTAGSEL
1.8 V
Voltage
Regulator
System Controller
TST
FIQ
DRXD
DTXD
VDDIO
Memory Controller
DBGU
VDDIN
GND
VDDOUT
VDDCORE
AIC
IRQ0-IRQ1
PIO
PDC
SRAM
Embedded
Flash
Controllers
Address
Decoder
Abort
Status
Misalignment
Detection
128/64/32 Kbytes
PDC
PCK0-PCK3
PLLRC
PLL
XIN
XOUT
OSC
Flash
VDDCORE
Peripheral Bridge
BOD
POR
ERASE
512/256/128
Kbytes
PMC
RCOSC
VDDCORE
VDDFLASH
VDDFLASH
Reset
Controller
Peripheral DMA
Controller
ROM
13 Channels
Fast Flash
Programming
Interface
NRST
PGMRDY
PGMNVALID
PGMNOE
PGMCK
PGMM0-PGMM3
PGMD0-PGMD15
PGMNCMD
PGMEN0-PGMEN1
PIT
APB
SAM-BA
WDT
RTT
PIOB
PIO
PIOA
DMA
FIFO
Ethernet MAC 10/100
PDC
USART0
PDC
PDC
USB Device
USART1
PDC
PWMC
PDC
PDC
SPI0
SSC
PDC
PDC
PDC
Timer Counter
SPI1
TC0
PDC
PDC
TC1
TC2
ADC
ETXCK-ERXCK-EREFCK
ETXEN-ETXER
ECRS-ECOL, ECRSDV
ERXER-ERXDV
ERX0-ERX3
ETX0-ETX3
EMDC
EMDIO
EF100
VDDFLASH
FIFO
Transceiver
RXD0
TXD0
SCK0
RTS0
CTS0
RXD1
TXD1
SCK1
RTS1
CTS1
DCD1
DSR1
DTR1
RI1
SPI0_NPCS0
SPI0_NPCS1
SPI0_NPCS2
SPI0_NPCS3
SPI0_MISO
SPI0_MOSI
SPI0_SPCK
SPI1_NPCS0
SPI1_NPCS1
SPI1_NPCS2
SPI1_NPCS3
SPI1_MISO
SPI1_MOSI
SPI1_SPCK
ADTRG
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
PIO
Figure 2-1.
PIO
2.
TWI
CAN
DDM
DDP
PWM0
PWM1
PWM2
PWM3
TF
TK
TD
RD
RK
RF
TCLK0
TCLK1
TCLK2
TIOA0
TIOB0
TIOA1
TIOB1
TIOA2
TIOB2
TWD
TWCK
CANRX
CANTX
ADVREF
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6120IS–ATARM–14-Nov-13
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3.
Signal Description
Table 3-1.
Signal Name
Signal Description List
Function
Type
Active
Level
Comments
Power
VDDIN
VDDOUT
VDDFLASH
VDDIO
VDDCORE
VDDPLL
GND
XIN
XOUT
PLLRC
PCK0 - PCK3
TCK
TDI
TDO
TMS
JTAGSEL
ERASE
Voltage Regulator and ADC Power
Power
Supply Input
Voltage Regulator Output
Power
Flash and USB Power Supply
Power
I/O Lines Power Supply
Power
Core Power Supply
Power
PLL
Power
Ground
Ground
Clocks, Oscillators and PLLs
Main Oscillator Input
Input
Main Oscillator Output
Output
PLL Filter
Input
Programmable Clock Output
Output
ICE and JTAG
Test Clock
Input
Test Data In
Input
Test Data Out
Output
Test Mode Select
Input
JTAG Selection
Input
Flash Memory
Flash and NVM Configuration Bits Erase
Input
Command
Reset/Test
NRST
Microcontroller Reset
TST
Test Mode Select
3V to 3.6V
1.85V
3V to 3.6V
3V to 3.6V
1.65V to 1.95V
1.65V to 1.95V
No pull-up resistor
No pull-up resistor
No pull-up resistor
Pull-down resistor(1)
High
I/O
Low
Input
High
Pull-down resistor(1)
Pull-up resistor, Open Drain
Output
Pull-down resistor(1)
Debug Unit
DRXD
DTXD
Debug Receive Data
Debug Transmit Data
IRQ0 - IRQ1
FIQ
External Interrupt Inputs
Fast Interrupt Input
PA0 - PA30
PB0 - PB30
Parallel IO Controller A
Parallel IO Controller B
DDM
DDP
USB Device Port Data USB Device Port Data +
SCK0 - SCK1
TXD0 - TXD1
RXD0 - RXD1
RTS0 - RTS1
CTS0 - CTS1
DCD1
Serial Clock
Transmit Data
Receive Data
Request To Send
Clear To Send
Data Carrier Detect
Input
Output
AIC
Input
Input
PIO
I/O
I/O
USB Device Port
Analog
Analog
USART
I/O
I/O
Input
Output
Input
Input
Pulled-up input at reset
Pulled-up input at reset
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6120IS–ATARM–14-Nov-13
6
Table 3-1.
Signal Description List (Continued)
Signal Name
DTR1
DSR1
RI1
TD
RD
TK
RK
TF
RF
TCLK0 - TCLK2
TIOA0 - TIOA2
TIOB0 - TIOB2
PWM0 - PWM3
SPIx_MISO
SPIx_MOSI
SPIx_SPCK
SPIx_NPCS0
SPIx_NPCS1-NPCS3
TWD
TWCK
AD0-AD3
AD4-AD7
ADTRG
ADVREF
PGMEN0-PGMEN1
PGMM0-PGMM3
PGMD0-PGMD15
PGMRDY
PGMNVALID
PGMNOE
PGMCK
PGMNCMD
CANRX
CANTX
EREFCK
ETXCK
ERXCK
ETXEN
ETX0 - ETX3
Function
Data Terminal Ready
Data Set Ready
Ring Indicator
Type
Output
Input
Input
Synchronous Serial Controller
Transmit Data
Output
Receive Data
Input
Transmit Clock
I/O
Receive Clock
I/O
Transmit Frame Sync
I/O
Receive Frame Sync
I/O
Timer/Counter
External Clock Inputs
Input
I/O Line A
I/O
I/O Line B
I/O
PWM Controller
PWM Channels
Output
Serial Peripheral Interface - SPIx
Master In Slave Out
I/O
Master Out Slave In
I/O
SPI Serial Clock
I/O
SPI Peripheral Chip Select 0
I/O
SPI Peripheral Chip Select 1 to 3
Output
Two-wire Interface
Two-wire Serial Data
I/O
Two-wire Serial Clock
I/O
Analog-to-Digital Converter
Analog Inputs
Analog
Analog Inputs
Analog
ADC Trigger
Input
ADC Reference
Analog
Fast Flash Programming Interface
Programming Enabling
Input
Programming Mode
Input
Programming Data
I/O
Programming Ready
Output
Data Direction
Output
Programming Read
Input
Programming Clock
Input
Programming Command
Input
CAN Controller
CAN Input
Input
CAN Output
Output
Ethernet MAC 10/100
Reference Clock
Input
Transmit Clock
Input
Receive Clock
Input
Transmit Enable
Output
Transmit Data
Output
Active
Level
Comments
Low
Low
Digital pulled-up inputs at reset
Analog Inputs
High
Low
Low
Low
RMII only
MII only
MII only
ETX0 - ETX1 only in RMII
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Table 3-1.
Signal Name
ETXER
ERXDV
ECRSDV
ERX0 - ERX3
ERXER
ECRS
ECOL
EMDC
EMDIO
EF100
Note:
Signal Description List (Continued)
Function
Transmit Coding Error
Receive Data Valid
Carrier Sense and Data Valid
Receive Data
Receive Error
Carrier Sense
Collision Detected
Management Data Clock
Management Data Input/Output
Force 100 Mbits/sec.
Type
Output
Input
Input
Input
Input
Input
Input
Output
I/O
Output
Active
Level
Comments
MII only
MII only
RMII only
ERX0 - ERX1 only in RMII
MII only
MII only
High
RMII only
1. Refer to Section 6. ”I/O Lines Considerations”.
SAM7X Series [SUMMARY DATASHEET]
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8
4.
Package
The SAM7X512/256/128 is available in 100-lead LQFP Green and 100-ball TFBGA RoHS-compliant packages.
4.1
100-lead LQFP Package Outline
Figure 4-1 shows the orientation of the 100-lead LQFP package. A detailed mechanical description is given in the
Mechanical Characteristics section.
Figure 4-1.
100-lead LQFP Package Outline (Top View)
75
51
76
50
100
26
1
4.2
25
100-lead LQFP Pinout
Table 4-1.
Pinout in 100-lead LQFP Package
1
ADVREF
26
PA18/PGMD6
2
GND
27
PB9
3
AD4
28
PB8
4
AD5
29
PB14
5
AD6
30
PB13
6
AD7
31
PB6
7
VDDOUT
32
GND
8
VDDIN
33
VDDIO
9
PB27/AD0
34
PB5
10
PB28/AD1
35
PB15
11
PB29/AD2
36
PB17
12
PB30/AD3
37
VDDCORE
13
PA8/PGMM0
38
PB7
14
PA9/PGMM1
39
PB12
15
VDDCORE
40
PB0
16
GND
41
PB1
17
VDDIO
42
PB2
18
PA10/PGMM2
43
PB3
19
PA11/PGMM3
44
PB10
20
PA12/PGMD0
45
PB11
21
PA13/PGMD1
46
PA19/PGMD7
22
PA14/PGMD2
47
PA20/PGMD8
23
PA15/PGMD3
48
VDDIO
24
PA16/PGMD4
49
PA21/PGMD9
25
PA17/PGMD5
50
PA22/PGMD10
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
TDI
GND
PB16
PB4
PA23/PGMD11
PA24/PGMD12
NRST
TST
PA25/PGMD13
PA26/PGMD14
VDDIO
VDDCORE
PB18
PB19
PB20
PB21
PB22
GND
PB23
PB24
PB25
PB26
PA27/PGMD15
PA28
PA29
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
TDO
JTAGSEL
TMS
TCK
PA30
PA0/PGMEN0
PA1/PGMEN1
GND
VDDIO
PA3
PA2
VDDCORE
PA4/PGMNCMD
PA5/PGMRDY
PA6/PGMNOE
PA7/PGMNVALID
ERASE
DDM
DDP
VDDFLASH
GND
XIN/PGMCK
XOUT
PLLRC
VDDPLL
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6120IS–ATARM–14-Nov-13
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4.3
100-ball TFBGA Package Outline
Figure 4-2 shows the orientation of the 100-ball TFBGA package. A detailed mechanical description is given in the
Mechanical Characteristics section of the full datasheet.
Figure 4-2.
100-ball TFBGA Package Outline (Top View)
TOP VIE
10
9
8
7
6
5
4
3
2
1
BALL A1
4.4
A
B
C
D
E
F
G
H
J
K
100-ball TFBGA Pinout
Pinout in 100-ball TFBGA Package
Pin
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
C1
C2
C3
C4
C5
Signal Name
PA22/PGMD10
PA21/PGMD9
PA20/PGMD8
PB1
PB7
PB5
PB8
PB9
PA18/PGMD6
VDDIO
TDI
PA19/PGMD7
PB11
PB2
PB12
PB15
PB14
PA14/PGMD2
PA16/PGMD4
PA17/PGMD5
PB16
PB4
PB10
PB3
PB0
Pin
C6
C7
C8
C9
C10
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
E1
E2
E3
E4
E5
E6
E7
E8
E9
E10
Signal Name
PB17
PB13
PA13/PGMD1
PA12/PGMD0
PA15/PGMD3
PA23/PGMD11
PA24/PGMD12
NRST
TST
PB19
PB6
PA10/PGMM2
VDDIO
PB27/AD0
PA11/PGMM3
PA25/PGMD13
PA26/PGMD14
PB18
PB20
TMS
GND
VDDIO
PB28/AD1
VDDIO
GND
Pin
F1
F2
F3
F4
F5
F6
F7
F8
F9
F10
G1
G2
G3
G4
G5
G6
G7
G8
G9
G10
H1
H2
H3
H4
H5
Signal Name
PB21
PB23
PB25
PB26
TCK
PA6/PGMNOE
ERASE
VDDCORE
GND
VDDIN
PB22
PB24
PA27/PGMD15
TDO
PA2
PA5/PGMRDY
VDDCORE
GND
PB30/AD3
VDDOUT
VDDCORE
PA28
JTAGSEL
PA3
PA4/PGMNCMD
Pin
H6
H7
H8
H9
H10
J1
J2
J3
J4
J5
J6
J7
J8
J9
J10
K1
K2
K3
K4
K5
K6
K7
K8
K9
K10
Signal Name
PA7/PGMNVALID
PA9/PGMM1
PA8/PGMM0
PB29/AD2
PLLRC
PA29
PA30
PA0/PGMEN0
PA1/PGMEN1
VDDFLASH
GND
XIN/PGMCK
XOUT
GND
VDDPLL
VDDCORE
VDDCORE
DDP
DDM
GND
AD7
AD6
AD5
AD4
ADVREF
SAM7X Series [SUMMARY DATASHEET]
6120IS–ATARM–14-Nov-13
10
5.
Power Considerations
5.1
Power Supplies
The SAM7X512/256/128 has six types of power supply pins and integrates a voltage regulator, allowing the device to be
supplied with only one voltage. The six power supply pin types are:

VDDIN pin. It powers the voltage regulator and the ADC; voltage ranges from 3.0V to 3.6V, 3.3V nominal. In order
to decrease current consumption, if the voltage regulator and the ADC are not used, VDDIN, ADVREF, AD4, AD5,
AD6 and AD7 should be connected to GND. In this case, VDDOUT should be left unconnected.

VDDOUT pin. It is the output of the 1.8V voltage regulator.

VDDIO pin. It powers the I/O lines; voltage ranges from 3.0V to 3.6V, 3.3V nominal.

VDDFLASH pin. It powers the USB transceivers and a part of the Flash and is required for the Flash to operate
correctly; voltage ranges from 3.0V to 3.6V, 3.3V nominal.

VDDCORE pins. They power the logic of the device; voltage ranges from 1.65V to 1.95V, 1.8V typical. It can be
connected to the VDDOUT pin with decoupling capacitor. VDDCORE is required for the device, including its
embedded Flash, to operate correctly.

VDDPLL pin. It powers the oscillator and the PLL. It can be connected directly to the VDDOUT pin.
No separate ground pins are provided for the different power supplies. Only GND pins are provided and should be
connected as shortly as possible to the system ground plane.
5.2
Power Consumption
The SAM7X512/256/128 has a static current of less than 60 μA on VDDCORE at 25°C, including the RC oscillator, the
voltage regulator and the power-on reset when the brownout detector is deactivated. Activating the brownout detector
adds 28 μA static current.
The dynamic power consumption on VDDCORE is less than 90 mA at full speed when running out of the Flash. Under
the same conditions, the power consumption on VDDFLASH does not exceed 10 mA.
5.3
Voltage Regulator
The SAM7X512/256/128 embeds a voltage regulator that is managed by the System Controller.
In Normal Mode, the voltage regulator consumes less than 100 μA static current and draws 100 mA of output current.
The voltage regulator also has a Low-power Mode. In this mode, it consumes less than 25 μA static current and draws 1
mA of output current.
Adequate output supply decoupling is mandatory for VDDOUT to reduce ripple and avoid oscillations. The best way to
achieve this is to use two capacitors in parallel: one external 470 pF (or 1 nF) NPO capacitor should be connected
between VDDOUT and GND as close to the chip as possible. One external 2.2 μF (or 3.3 μF) X7R capacitor should be
connected between VDDOUT and GND.
Adequate input supply decoupling is mandatory for VDDIN in order to improve startup stability and reduce source voltage
drop. The input decoupling capacitor should be placed close to the chip. For example, two capacitors can be used in
parallel: 100 nF NPO and 4.7 μF X7R.
5.4
Typical Powering Schematics
The SAM7X512/256/128 supports a 3.3V single supply mode. The internal regulator input connected to the 3.3V source
and its output feeds VDDCORE and the VDDPLL. Figure 5-1 shows the power schematics to be used for USB buspowered systems.
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Figure 5-1.
3.3V System Single Power Supply Schematic
VDDFLASH
Power Source
ranges
from 4.5V USB
to 18V
DC/DC Con erter
VDDIO
VDDIN
Voltage
Regulator
3.3V
VDDOUT
VDDCORE
VDDPLL
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6.
I/O Lines Considerations
6.1
JTAG Port Pins
TMS, TDI and TCK are schmitt trigger inputs and are not 5-V tolerant. TMS, TDI and TCK do not integrate a pull-up
resistor.
TDO is an output, driven at up to VDDIO, and has no pull-up resistor.
The JTAGSEL pin is used to select the JTAG boundary scan when asserted at a high level. The JTAGSEL pin integrates
a permanent pull-down resistor of about 15 kΩ to GND.
To eliminate any risk of spuriously entering the JTAG boundary scan mode due to noise on JTAGSEL, it should be tied
externally to GND if boundary scan is not used, or pulled down with an external low-value resistor (such as 1 kΩ) .
6.2
Test Pin
The TST pin is used for manufacturing test or fast programming mode of the SAM7X512/256/128 when asserted high.
The TST pin integrates a permanent pull-down resistor of about 15 kΩ to GND.
To eliminate any risk of entering the test mode due to noise on the TST pin, it should be tied to GND if the FFPI is not
used, or pulled down with an external low-value resistor (such as 1 kΩ)
To enter fast programming mode, the TST pin and the PA0 and PA1 pins should be tied high and PA2 tied to low.
Driving the TST pin at a high level while PA0 or PA1 is driven at 0 leads to unpredictable results.
6.3
Reset Pin
The NRST pin is bidirectional with an open drain output buffer. It is handled by the on-chip reset controller and can be
driven low to provide a reset signal to the external components or asserted low externally to reset the microcontroller.
There is no constraint on the length of the reset pulse, and the reset controller can guarantee a minimum pulse length.
This allows connection of a simple push-button on the NRST pin as system user reset, and the use of the signal NRST to
reset all the components of the system.
The NRST pin integrates a permanent pull-up resistor to VDDIO.
6.4
ERASE Pin
The ERASE pin is used to re-initialize the Flash content and some of its NVM bits. It integrates a permanent pull-down
resistor of about 15 kΩ to GND.
To eliminate any risk of erasing the Flash due to noise on the ERASE pin, it shoul be tied externally to GND, which
prevents erasing the Flash from the applicatiion, or pulled down with an external low-value resistor (such as 1 kΩ) .
This pin is debounced by the RC oscillator to improve the glitch tolerance. When the pin is tied to high during less than
100 ms, ERASE pin is not taken into account. The pin must be tied high during more than 220 ms to perform the reinitialization of the Flash.
6.5
PIO Controller Lines
All the I/O lines, PA0 to PA30 and PB0 to PB30, are 5V-tolerant and all integrate a programmable pull-up resistor.
Programming of this pull-up resistor is performed independently for each I/O line through the PIO controllers.
5V-tolerant means that the I/O lines can drive voltage level according to VDDIO, but can be driven with a voltage of up to
5.5V. However, driving an I/O line with a voltage over VDDIO while the programmable pull-up resistor is enabled will
create a current path through the pull-up resistor from the I/O line to VDDIO. Care should be taken, in particular at reset,
as all the I/O lines default to input with pull-up resistor enabled at reset.
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6.6
I/O Lines Current Drawing
The PIO lines PA0 to PA3 are high-drive current capable. Each of these I/O lines can drive up to 16 mA permanently.
The remaining I/O lines can draw only 8 mA.
However, the total current drawn by all the I/O lines cannot exceed 200 mA.
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7.
Processor and Architecture
7.1
ARM7TDMI Processor

RISC processor based on ARMv4T Von Neumann architecture



7.2
Two instruction sets

ARM high-performance 32-bit instruction set

Thumb high code density 16-bit instruction set
Three-stage pipeline architecture

Instruction Fetch (F)

Instruction Decode (D)

Execute (E)
Debug and Test Features



7.3
Runs at up to 55 MHz, providing 0.9 MIPS/MHz
Integrated embedded in-circuit emulator

Two watchpoint units

Test access port accessible through a JTAG protocol

Debug communication channel
Debug Unit

Two-pin UART

Debug communication channel interrupt handling

Chip ID Register
IEEE1149.1 JTAG Boundary-scan on all digital pins
Memory Controller

Programmable Bus Arbiter





Handles requests from the ARM7TDMI, the Ethernet MAC and the Peripheral DMA Controller
Address decoder provides selection signals for

Three internal 1 Mbyte memory areas

One 256 Mbyte embedded peripheral area
Abort Status Registers

Source, Type and all parameters of the access leading to an abort are saved

Facilitates debug by detection of bad pointers
Misalignment Detector

Alignment checking of all data accesses

Abort generation in case of misalignment
Remap Command

Remaps the SRAM in place of the embedded non-volatile memory

Allows handling of dynamic exception vectors
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
7.4
Embedded Flash Controller

Embedded Flash interface, up to three programmable wait states

Prefetch buffer, buffering and anticipating the 16-bit requests, reducing the required wait states

Key-protected program, erase and lock/unlock sequencer

Single command for erasing, programming and locking operations

Interrupt generation in case of forbidden operation
Peripheral DMA Controller

Handles data transfer between peripherals and memories

Thirteen channels



Two for each USART

Two for the Debug Unit

Two for the Serial Synchronous Controller

Two for each Serial Peripheral Interface

One for the Analog-to-digital Converter
Low bus arbitration overhead

One Master Clock cycle needed for a transfer from memory to peripheral

Two Master Clock cycles needed for a transfer from peripheral to memory
Next Pointer management for reducing interrupt latency requirements
 Peripheral DMA Controller (PDC) priority is as follows (from the highest priority to the lowest):
Receive
DBGU
Receive
USART0
Receive
USART1
Receive
SSC
Receive
ADC
Receive
SPI0
Receive
SPI1
Transmit
DBGU
Transmit
USART0
Transmit
USART
Transmit
SSC
Transmit
SPI0
Transmit
SPI1
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8.
Memories
8.1
SAM7X512


512 Kbytes of dual-plane Flash Memory

2 contiguous banks of 1024 pages of 256 bytes

Fast access time, 30 MHz single-cycle access in Worst Case conditions

Page programming time: 6 ms, including page auto-erase

Page programming without auto-erase: 3 ms

Full chip erase time: 15 ms

10,000 write cycles, 10-year data retention capability

32 lock bits, protecting 32 sectors of 64 pages

Protection Mode to secure contents of the Flash
128 Kbytes of Fast SRAM

8.2
SAM7X256


256 Kbytes of Flash Memory

1024 pages of 256 bytes

Fast access time, 30 MHz single-cycle access in Worst Case conditions

Page programming time: 6 ms, including page auto-erase

Page programming without auto-erase: 3 ms

Full chip erase time: 15 ms

10,000 write cycles, 10-year data retention capability

16 lock bits, each protecting 16 sectors of 64 pages

Protection Mode to secure contents of the Flash
64 Kbytes of Fast SRAM

8.3
Single-cycle access at full speed
Single-cycle access at full speed
SAM7X128


128 Kbytes of Flash Memory

512 pages of 256 bytes

Fast access time, 30 MHz single-cycle access in Worst Case conditions

Page programming time: 6 ms, including page auto-erase

Page programming without auto-erase: 3 ms

Full chip erase time: 15 ms

10,000 write cycles, 10-year data retention capability

8 lock bits, each protecting 8 sectors of 64 pages

Protection Mode to secure contents of the Flash
32 Kbytes of Fast SRAM

Single-cycle access at full speed
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Figure 8-1.
SAM7X512/256/128 Memory Mapping
Internal Memory Mapping
0x0000 0000
Note:
(1) Can be ROM, Flash or SRAM
depending on GPNVM2 and REMAP
Boot Memory (1)
Flash before Remap
SRAM after Remap
1 MBytes
Internal Flash
1 MBytes
Internal SRAM
1 MBytes
Internal ROM
1 MBytes
0x000F FFF
0x0010 0000
0x001F FFF
0x0020 0000
0x002F FFF
0x0030 0000
Address Memory Space
0x0000 0000
0x003F FFF
0x0040 0000
Internal Memories
256 MBytes
Reserved
252 MBytes
0x0FFF FFFF
0x0FFF FFFF
System Controller Mapping
0x1000 0000
0xFFFF F000
AIC
512 Bytes/128 registers
DBGU
512 Bytes/128 registers
PIOA
512 Bytes/128 registers
PIOB
512 Bytes/128 registers
0xFFFF F1FF
0xFFFF F200
Peripheral Mapping
0xF000 0000
Reserved
Undefined
(Abort)
14 x 256 MBytes
3,584 MBytes
0xFFF9 FFFF
0xFFFA 0000
0xFFFA 3FFF
0xFFFA 4000
0xFFFA FFFF
0xFFFB 0000
TC0, TC1, TC2
16 Kbytes
0xFFFF F3FF
0xFFFF F400
Reserved
UDP
16 Kbytes
0xFFFB 3FFF
0xFFFB 4000
0xFFFF F5FF
0xFFFF F600
Reserved
0xFFFB 7FFF
0xFFFB 8000
0xFFFB BFFF
0xFFFB C000
0xEFFF FFFF
0xFFFB FFFF
0xFFFC 0000
0xF000 0000
0xFFFC 3FFF
0xFFFC 4000
Internal Peripherals
0xFFFF FFFF
256 MBytes
TWI
16 Kbytes
Reserved
Reserved
USART0
16 Kbytes
USART1
16 Kbytes
0xFFFC 7FFF
0xFFFC 8000
Reserved
0xFFFC BFFF
0xFFFC C000
PWMC
16 Kbytes
CAN
16 Kbytes
SSC
16 Kbytes
ADC
16 Kbytes
0xFFFC FFFF
0xFFFD 0000
0xFFFD 3FFF
0xFFFD 4000
0xFFFD 7FFF
0xFFFD 8000
0xFFFD BFFF
0xFFFD C000
0xFFFD FFFF
0xFFFE 0000
0xFFFE 3FFF
0xFFFE 4000
0xFFFE 7FFF
0xFFFE 8000
0xFFFF F7FF
0xFFFF F800
0xFFFF FBFF
0xFFFF FC00
0xFFFF FCFF
0xFFFF FD00
0xFFFF FD0F
0xFFFF FD4F
EMAC
16 Kbytes
SPI0
16 Kbytes
SPI1
16 Kbytes
Reserved
0xFFFF FFFF
256 Bytes/64 registers
RSTC
16 Bytes/4 registers
Reserved
0xFFFF FD20
0xFFFF FC2F
0xFFFF FD30
0xFFFF FC3F
0xFFFF FD40
RTT
16 Bytes/4 registers
PIT
16 Bytes/4 registers
WDT
16 Bytes/4 registers
Reserved
0xFFFF FD60
0xFFFF FC6F
0xFFFF FD70
0xFFFF FEFF
0xFFFF FF00
VREG
4 Bytes/1 register
Reserved
MC
0xFFFF EFFF
0xFFFF F000
PMC
256 Bytes/64 registers
SYSC
0xFFFF FFFF
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8.4
Memory Mapping
8.4.1
Internal SRAM

The SAM7X512 embeds a high-speed 128-Kbyte SRAM bank.

The SAM7X256 embeds a high-speed 64-Kbyte SRAM bank.

The SAM7X128 embeds a high-speed 32-Kbyte SRAM bank.
After reset and until the Remap Command is performed, the SRAM is only accessible at address 0x0020 0000. After
Remap, the SRAM also becomes available at address 0x0.
8.4.2
Internal ROM
The SAM7X512/256/128 embeds an Internal ROM. At any time, the ROM is mapped at address 0x30 0000. The ROM
contains the FFPI and the SAM-BA program.
8.4.3
Internal Flash

The SAM7X512 features two banks (dual plane) of 256 Kbytes of Flash.

The SAM7X256 features one bank (single plane) of 256 Kbytes of Flash.

The SAM7X128 features one bank (single plane) of 128 Kbytes of Flash.
At any time, the Flash is mapped to address 0x0010 0000. It is also accessible at address 0x0 after the reset, if GPNVM
bit 2 is set and before the Remap Command.
A general purpose NVM (GPNVM) bit is used to boot either on the ROM (default) or from the Flash.
This GPNVM bit can be cleared or set respectively through the commands “Clear General-purpose NVM Bit” and “Set
General-purpose NVM Bit” of the EFC User Interface.
Setting the GPNVM Bit 2 selects the boot from the Flash. Asserting ERASE clears the GPNVM Bit 2 and thus selects the
boot from the ROM by default.
Figure 8-2.
Internal Memory Mapping with GPNVM Bit 2 = 0 (default)
x
0x000F FFFF
ROM Before Remap
SRAM After Remap
1 M Bytes
x
Internal FLASH
1 M Bytes
Internal SRAM
1 M Bytes
Internal ROM
1 M Bytes
0x001F FFFF
x
256M Bytes
0x002F FFFF
x
0x003F FFFF
0x0040 0000
Undefined Areas
Abort
252 M Bytes
0x0FFF FFFF
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Figure 8-3.
Internal Memory Mapping with GPNVM Bit 2 = 1
x
0x000F FFFF
Flash Before Remap
SRAM After Remap
1 M Bytes
x
Internal FLASH
1 M Bytes
Internal SRAM
1 M Bytes
Internal ROM
1 M Bytes
0x001F FFFF
x
256M Bytes
0x002F FFFF
0x0030 0000
0x003F FFFF
0x0040 0000
Undefined Areas
Abort
252 M Bytes
0x0FFF FFFF
8.5
Embedded Flash
8.5.1
Flash Overview

The Flash of the SAM7X512 is organized in two banks (dual plane) of 1024 pages of 256 bytes. The 524,288 bytes
are organized in 32-bit words.

The Flash of the SAM7X256 is organized in 1024 pages of 256 bytes (single plane). It reads as 65,536 32-bit
words.

The Flash of the SAM7X128 is organized in 512 pages of 256 bytes (single plane). It reads as 32,768 32-bit words.
The Flash contains a 256-byte write buffer, accessible through a 32-bit interface.
The Flash benefits from the integration of a power reset cell and from the brownout detector. This prevents code
corruption during power supply changes, even in the worst conditions.
When Flash is not used (read or write access), it is automatically placed into standby mode.
8.5.2
Embedded Flash Controller
The Embedded Flash Controller (EFC) manages accesses performed by the masters of the system. It enables reading
the Flash and writing the write buffer. It also contains a User Interface, mapped within the Memory Controller on the APB.
The User Interface allows:

programming of the access parameters of the Flash (number of wait states, timings, etc.)

starting commands such as full erase, page erase, page program, NVM bit set, NVM bit clear, etc.

getting the end status of the last command

getting error status

programming interrupts on the end of the last commands or on errors
The Embedded Flash Controller also provides a dual 32-bit Prefetch Buffer that optimizes 16-bit access to the Flash.
This is particularly efficient when the processor is running in Thumb mode.
Two EFCs are embedded in the SAM7X512 to control each bank of 256 KBytes. Dual-plane organization allows
concurrent read and program functionality. Read from one memory plane may be performed even while program or
erase functions are being executed in the other memory plane.
One EFC is embedded in the SAM7X256/128 to control the single plane of 256/128 KBytes.
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8.5.3
8.5.3.1
Lock Regions
SAM7X512
Two Embedded Flash Controllers each manage 16 lock bits to protect 16 regions of the flash against inadvertent flash
erasing or programming commands. The SAM7X512 contains 32 lock regions and each lock region contains 64 pages of
256 bytes. Each lock region has a size of 16 Kbytes.
If a locked-region’s erase or program command occurs, the command is aborted and the EFC trigs an interrupt.
The 32 NVM bits are software programmable through both of the EFC User Interfaces. The command “Set Lock Bit”
enables the protection. The command “Clear Lock Bit” unlocks the lock region.
Asserting the ERASE pin clears the lock bits, thus unlocking the entire Flash.
8.5.3.2
SAM7X256
The Embedded Flash Controller manages 16 lock bits to protect 16 regions of the flash against inadvertent flash erasing
or programming commands. The SAM7X256 contains 16 lock regions and each lock region contains 64 pages of 256
bytes. Each lock region has a size of 16 Kbytes.
If a locked-region’s erase or program command occurs, the command is aborted and the EFC trigs an interrupt.
The 16 NVM bits are software programmable through the EFC User Interface. The command “Set Lock Bit” enables the
protection. The command “Clear Lock Bit” unlocks the lock region.
Asserting the ERASE pin clears the lock bits, thus unlocking the entire Flash.
8.5.3.3
SAM7X128
The Embedded Flash Controller manages 8 lock bits to protect 8 regions of the flash against inadvertent flash erasing or
programming commands. The SAM7X128 contains 8 lock regions and each lock region contains 64 pages of 256 bytes.
Each lock region has a size of 16 Kbytes.
If a locked-region’s erase or program command occurs, the command is aborted and the EFC trigs an interrupt.
The 8 NVM bits are software programmable through the EFC User Interface. The command “Set Lock Bit” enables the
protection. The command “Clear Lock Bit” unlocks the lock region.
Asserting the ERASE pin clears the lock bits, thus unlocking the entire Flash.
8.5.4
Security Bit Feature
The SAM7X512/256/128 features a security bit, based on a specific NVM-Bit. When the security is enabled, any access
to the Flash, either through the ICE interface or through the Fast Flash Programming Interface, is forbidden. This ensures
the confidentiality of the code programmed in the Flash.
This security bit can only be enabled, through the Command “Set Security Bit” of the EFC User Interface. Disabling the
security bit can only be achieved by asserting the ERASE pin at 1, and after a full flash erase is performed. When the
security bit is deactivated, all accesses to the flash are permitted.
It is important to note that the assertion of the ERASE pin should always be longer than 220 ms.
As the ERASE pin integrates a permanent pull-down, it can be left unconnected during normal operation. However, it is
safer to connect it directly to GND for the final application.
8.5.5
Non-volatile Brownout Detector Control
Two general purpose NVM (GPNVM) bits are used for controlling the brownout detector (BOD), so that even after a
power loss, the brownout detector operations remain in their state.
These two GPNVM bits can be cleared or set respectively through the commands “Clear General-purpose NVM Bit” and
“Set General-purpose NVM Bit” of the EFC User Interface.

GPNVM Bit 0 is used as a brownout detector enable bit. Setting the GPNVM Bit 0 enables the BOD, clearing it
disables the BOD. Asserting ERASE clears the GPNVM Bit 0 and thus disables the brownout detector by default.
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
8.5.6
The GPNVM Bit 1 is used as a brownout reset enable signal for the reset controller. Setting the GPNVM Bit 1
enables the brownout reset when a brownout is detected, Clearing the GPNVM Bit 1 disables the brownout reset.
Asserting ERASE disables the brownout reset by default.
Calibration Bits
Eight NVM bits are used to calibrate the brownout detector and the voltage regulator. These bits are factory configured
and cannot be changed by the user. The ERASE pin has no effect on the calibration bits.
8.6
Fast Flash Programming Interface
The Fast Flash Programming Interface allows programming the device through either a serial JTAG interface or through
a multiplexed fully-handshaked parallel port. It allows gang-programming with market-standard industrial programmers.
The FFPI supports read, page program, page erase, full erase, lock, unlock and protect commands.
The Fast Flash Programming Interface is enabled and the Fast Programming Mode is entered when the TST pin and the
PA0 and PA1 pins are all tied high.
8.7
SAM-BA Boot Assistant
The SAM-BA Boot Assistant is a default Boot Program that provides an easy way to program in-situ the on-chip Flash
memory.
The SAM-BA Boot Assistant supports serial communication via the DBGU or the USB Device Port.

Communication via the DBGU supports a wide range of crystals from 3 to 20 MHz via software auto-detection.

Communication via the USB Device Port is limited to an 18.432 MHz crystal.
The SAM-BA Boot provides an interface with SAM-BA Graphic User Interface (GUI).
The SAM-BA Boot is in ROM and is mapped at address 0x0 when the GPNVM Bit 2 is set to 0.
When GPNVM bit 2 is set to 1, the device boots from the Flash.
When GPNVM bit 2 is set to 0, the device boots from ROM (SAM-BA).
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9.
System Controller
The System Controller manages all vital blocks of the microcontroller: interrupts, clocks, power, time, debug and reset.
The System Controller peripherals are all mapped to the highest 4 Kbytes of address space, between addresses 0xFFFF
F000 and 0xFFFF FFFF.
Figure 9-1 on page 24 shows the System Controller Block Diagram.
Figure 8-1 on page 18 shows the mapping of the User Interface of the System Controller peripherals. Note that the
Memory Controller configuration user interface is also mapped within this address space.
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Figure 9-1.
System Controller Block Diagram
System Controller
Boundary Scan
TAP Controller
jtag_nreset
nirq
irq0-irq1
Advanced
Interrupt
Controller
fiq
periph_irq[2..19]
nfiq
proc_nreset
ARM7TDMI
PCK
int
debug
pit_irq
rtt_irq
wdt_irq
dbgu_irq
pmc_irq
rstc_irq
efc_irq
power_on_reset
force_ntrst
MCK
periph_nreset
dbgu_irq
Debug
Unit
force_ntrst
dbgu_txd
dbgu_rxd
security_bit
MCK
debug
periph_nreset
SLCK
power_on_reset
Periodic
Interval
Timer
pit_irq
Real-Time
Timer
rtt_irq
Watchdog
Timer
wdt_irq
flash_poe
cal
gpnvm[0]
flash_wrdis
BOD
power_on_reset
jtag_nreset
POR
flash_poe
efc_irq
bod_rst_en
MCK
Reset
Controller
periph_nreset
proc_nreset
rstc_irq
SLCK
XOUT
Voltage
Regulator
Mode
Controller
standby
Voltage
Regulator
cal
SLCK
MAINCK
Memory
Controller
proc_nreset
NRST
OSC
gpnvm[0..2]
wdt_fault
WDRPROC
gpnvm[1]
en
XIN
Embedded
Flash
cal
SLCK
debug
idle
proc_nreset
RCOSC
flash_wrdis
periph_clk[2..18]
Power
Management
Controller
UDPCK
pck[0-3]
periph_clk[11]
PCK
periph_nreset
UDPCK
USB Device
Port
periph_irq[11]
MCK
usb_suspend
PLLRC
PLL
PLLCK
pmc_irq
int
idle
periph_nreset
periph_clk[4..19]
usb_suspend
periph_nreset
periph_nreset
irq0-irq1
periph_clk[2-3]
dbgu_rxd
Embedded
Peripherals
periph_irq{2-3]
PIO
Controller
periph_irq[4..19]
fiq
dbgu_txd
in
PA0-PA30
PB0-PB30
out
enable
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9.1
9.1.1
Reset Controller

Based on one power-on reset cell and one brownout detector

Status of the last reset, either Power-up Reset, Software Reset, User Reset, Watchdog Reset, Brownout Reset

Controls the internal resets and the NRST pin output

Allows to shape a signal on the NRST line, guaranteeing that the length of the pulse meets any requirement.
Brownout Detector and Power-on Reset
The SAM7X512/256/128 embeds one brownout detection circuit and a power-on reset cell. The power-on reset is
supplied with and monitors VDDCORE.
Both signals are provided to the Flash to prevent any code corruption during power-up or power-down sequences or if
brownouts occur on the power supplies.
The power-on reset cell has a limited-accuracy threshold at around 1.5V. Its output remains low during power-up until
VDDCORE goes over this voltage level. This signal goes to the reset controller and allows a full re-initialization of the
device.
The brownout detector monitors the VDDCORE and VDDFLASH levels during operation by comparing them to a fixed
trigger level. It secures system operations in the most difficult environments and prevents code corruption in case of
brownout on the VDDCORE or VDDFLASH.
When the brownout detector is enabled and VDDCORE decreases to a value below the trigger level (Vbot18-, defined as
Vbot18 - hyst/2), the brownout output is immediately activated.
When VDDCORE increases above the trigger level (Vbot18+, defined as Vbot18 + hyst/2), the reset is released. The
brownout detector only detects a drop if the voltage on VDDCORE stays below the threshold voltage for longer than
about 1μs.
The VDDCORE threshold voltage has a hysteresis of about 50 mV, to ensure spike free brownout detection. The typical
value of the brownout detector threshold is 1.68V with an accuracy of ± 2% and is factory calibrated.
When the brownout detector is enabled and VDDFLASH decreases to a value below the trigger level (Vbot33-, defined
as Vbot33 - hyst/2), the brownout output is immediately activated.
When VDDFLASH increases above the trigger level (Vbot33+, defined as Vbot33 + hyst/2), the reset is released. The
brownout detector only detects a drop if the voltage on VDDCORE stays below the threshold voltage for longer than
about 1μs.
The VDDFLASH threshold voltage has a hysteresis of about 50 mV, to ensure spike free brownout detection. The typical
value of the brownout detector threshold is 2.80V with an accuracy of ± 3.5% and is factory calibrated.
The brownout detector is low-power, as it consumes less than 28 μA static current. However, it can be deactivated to
save its static current. In this case, it consumes less than 1μA. The deactivation is configured through the GPNVM bit 0 of
the Flash.
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9.2
Clock Generator
The Clock Generator embeds one low-power RC Oscillator, one Main Oscillator and one PLL with the following
characteristics:

RC Oscillator ranges between 22 KHz and 42 KHz

Main Oscillator frequency ranges between 3 and 20 MHz

Main Oscillator can be bypassed

PLL output ranges between 80 and 200 MHz
It provides SLCK, MAINCK and PLLCK.
Figure 9-2.
Clock Generator Block Diagram
Cloc Generator
XIN
Embedded
RC
Oscillator
Slow Cloc
SLCK
Main
Oscillator
Main Cloc
MAINCK
PLL and
Di ider
PLL Cloc
PLLCK
XOUT
PLLRC
Status
Control
Power
Management
Controller
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9.3
Power Management Controller
The Power Management Controller uses the Clock Generator outputs to provide:

the Processor Clock PCK

the Master Clock MCK

the USB Clock UDPCK

all the peripheral clocks, independently controllable

four programmable clock outputs
The Master Clock (MCK) is programmable from a few hundred Hz to the maximum operating frequency of the device.
The Processor Clock (PCK) switches off when entering processor idle mode, thus allowing reduced power consumption
while waiting for an interrupt.
Figure 9-3.
Power Management Controller Block Diagram
Processor
Cloc
Controller
Master Cloc Controller
SLCK
MAINCK
PLLCK
PCK
int
Idle Mode
Prescaler
/1 /2 /4 ... /64
MCK
Peripherals
Cloc Controller
periph cl 2..18
ON/OFF
Programmable Cloc Controller
SLCK
MAINCK
PLLCK
Prescaler
/1 /2 /4 ... /64
pc 0..3
USB Cloc Controller
ON/OFF
PLLCK
9.4
Di ider
/1 /2 /4
UDPCK
Advanced Interrupt Controller

Controls the interrupt lines (nIRQ and nFIQ) of an ARM Processor

Individually maskable and vectored interrupt sources



Source 0 is reserved for the Fast Interrupt Input (FIQ)

Source 1 is reserved for system peripherals (RTT, PIT, EFC, PMC, DBGU, etc.)

Other sources control the peripheral interrupts or external interrupts

Programmable edge-triggered or level-sensitive internal sources

Programmable positive/negative edge-triggered or high/low level-sensitive external sources
8-level Priority Controller

Drives the normal interrupt nIRQ of the processor

Handles priority of the interrupt sources

Higher priority interrupts can be served during service of lower priority interrupt
Vectoring

Optimizes interrupt service routine branch and execution

One 32-bit vector register per interrupt source

Interrupt vector register reads the corresponding current interrupt vector
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
Protect Mode

Fast Forcing





Comprises:

One two-pin UART

One Interface for the Debug Communication Channel (DCC) support

One set of Chip ID Registers

One Interface providing ICE Access Prevention
Two-pin UART

USART-compatible User Interface

Programmable Baud Rate Generator

Parity, Framing and Overrun Error

Automatic Echo, Local Loopback and Remote Loopback Channel Modes
Debug Communication Channel Support


9.8
9.9
Offers visibility of COMMRX and COMMTX signals from the ARM Processor
Chip ID Registers

Identification of the device revision, sizes of the embedded memories, set of peripherals

Chip ID is 0x275C 0A40 (MRL A) for SAM7X512

Chip ID is 0x275B 0940 (MRL A or B) for SAM7X256

Chip ID is 0x275B 0942 (MRL C) for SAM7X256

Chip ID is 0x275A 0740 (MRL A or B) for SAM7X128

Chip ID is 0x275A 0742 (MRL C) for SAM7X128
Periodic Interval Timer

9.7
Provides processor synchronization on events without triggering an interrupt
Debug Unit

9.6
Permits redirecting any interrupt source on the fast interrupt
General Interrupt Mask

9.5
Easy debugging by preventing automatic operations
20-bit programmable counter plus 12-bit interval counter
Watchdog Timer

12-bit key-protected Programmable Counter running on prescaled SLCK

Provides reset or interrupt signals to the system

Counter may be stopped while the processor is in debug state or in idle mode
Real-time Timer

32-bit free-running counter with alarm running on prescaled SLCK

Programmable 16-bit prescaler for SLCK accuracy compensation
PIO Controllers

Two PIO Controllers, each controlling 31 I/O lines

Fully programmable through set/clear registers

Multiplexing of two peripheral functions per I/O line

For each I/O line (whether assigned to a peripheral or used as general-purpose I/O)

Input change interrupt
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
9.10

Half a clock period glitch filter

Multi-drive option enables driving in open drain

Programmable pull-up on each I/O line

Pin data status register, supplies visibility of the level on the pin at any time
Synchronous output, provides Set and Clear of several I/O lines in a single write
Voltage Regulator Controller
The voltage regulator controller selects the power mode of the Voltage Regulator between normal mode (bit 0 is cleared)
or standby mode (bit 0 is set).
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10.
Peripherals
10.1
User Interface
The User Peripherals are mapped in the 256 Mbytes of address space between 0xF000 0000 and 0xFFFF EFFF. Each
peripheral is allocated 16 Kbytes of address space.
A complete memory map is provided in Figure 8-1 on page 18.
10.2
Peripheral Identifiers
The SAM7X512/256/128 embeds a wide range of peripherals. Table 10-1 defines the Peripheral Identifiers of the
SAM7X512/256/128. Unique peripheral identifiers are defined for both the Advanced Interrupt Controller and the Power
Management Controller.
Table 10-1.
Peripheral Identifiers
Peripheral ID
Peripheral Mnemonic
Peripheral Name
External
Interrupt
0
AIC
Advanced Interrupt Controller
FIQ
(1)
1
SYSC
System Controller
2
PIOA
Parallel I/O Controller A
3
PIOB
Parallel I/O Controller B
4
SPI0
Serial Peripheral Interface 0
5
SPI1
Serial Peripheral Interface 1
6
US0
USART 0
7
US1
USART 1
8
SSC
Synchronous Serial Controller
9
TWI
Two-wire Interface
10
PWMC
Pulse Width Modulation Controller
11
UDP
USB Device Port
12
TC0
Timer/Counter 0
13
TC1
Timer/Counter 1
14
TC2
Timer/Counter 2
15
CAN
CAN Controller
16
EMAC
Ethernet MAC
17
ADC
(1)
18 - 29
Reserved
30
AIC
Advanced Interrupt Controller
IRQ0
31
AIC
Advanced Interrupt Controller
IRQ1
Note:
1.
Analog-to Digital Converter
Setting SYSC and ADC bits in the clock set/clear registers of the PMC has no effect. The System Controller
and ADC are continuously clocked.
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10.3
Peripheral Multiplexing on PIO Lines
The SAM7X512/256/128 features two PIO controllers, PIOA and PIOB, that multiplex the I/O lines of the peripheral set.
Each PIO Controller controls 31 lines. Each line can be assigned to one of two peripheral functions, A or B. Some of
them can also be multiplexed with the analog inputs of the ADC Controller.
Table 10-2 on page 32 and Table 10-3 on page 33 defines how the I/O lines of the peripherals A, B or the analog inputs
are multiplexed on the PIO Controller A and PIO Controller B. The two columns “Function” and “Comments” have been
inserted for the user’s own comments; they may be used to track how pins are defined in an application.
Note that some peripheral functions that are output only, may be duplicated in the table.
At reset, all I/O lines are automatically configured as input with the programmable pull-up enabled, so that the device is
maintained in a static state as soon as a reset is detected.
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10.4
PIO Controller A Multiplexing
Table 10-2.
Multiplexing on PIO Controller A
PIO Controller A
Peripheral B
Application Usage
I/O Line
Peripheral A
Comments
PA0
RXD0
High-drive
PA1
TXD0
High-drive
PA2
SCK0
SPI1_NPCS1
High-drive
PA3
RTS0
SPI1_NPCS2
High-drive
PA4
CTS0
SPI1_NPCS3
PA5
RXD1
PA6
TXD1
PA7
SCK1
SPI0_NPCS1
PA8
RTS1
SPI0_NPCS2
PA9
CTS1
SPI0_NPCS3
PA10
TWD
PA11
TWCK
PA12
SPI_NPCS0
PA13
SPI0_NPCS1
PCK1
PA14
SPI0_NPCS2
IRQ1
PA15
SPI0_NPCS3
TCLK2
PA16
SPI0_MISO
PA17
SPI0_MOSI
PA18
SPI0_SPCK
PA19
CANRX
PA20
CANTX
PA21
TF
SPI1_NPCS0
PA22
TK
SPI1_SPCK
PA23
TD
SPI1_MOSI
PA24
RD
SPI1_MISO
PA25
RK
SPI1_NPCS1
PA26
RF
SPI1_NPCS2
PA27
DRXD
PCK3
PA28
DTXD
PA29
FIQ
SPI1_NPCS3
PA30
IRQ0
PCK2
Function
Comments
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10.5
PIO Controller B Multiplexing
Table 10-3.
Multiplexing on PIO Controller B
PIO Controller B
Application Usage
I/O Line
Peripheral A
Peripheral B
Comments
PB0
ETXCK/EREFCK
PCK0
PB1
ETXEN
PB2
ETX0
PB3
ETX1
PB4
ECRS
PB5
ERX0
PB6
ERX1
PB7
ERXER
PB8
EMDC
PB9
EMDIO
PB10
ETX2
SPI1_NPCS1
PB11
ETX3
SPI1_NPCS2
PB12
ETXER
TCLK0
PB13
ERX2
SPI0_NPCS1
PB14
ERX3
SPI0_NPCS2
PB15
ERXDV/ECRSDV
PB16
ECOL
SPI1_NPCS3
PB17
ERXCK
SPI0_NPCS3
PB18
EF100
ADTRG
PB19
PWM0
TCLK1
PB20
PWM1
PCK0
PB21
PWM2
PCK1
PB22
PWM3
PCK2
PB23
TIOA0
DCD1
PB24
TIOB0
DSR1
PB25
TIOA1
DTR1
PB26
TIOB1
RI1
PB27
TIOA2
PWM0
AD0
PB28
TIOB2
PWM1
AD1
PB29
PCK1
PWM2
AD2
PB30
PCK2
PWM3
AD3
Function
Comments
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10.6
10.7
Ethernet MAC

DMA Master on Receive and Transmit Channels

Compatible with IEEE Standard 802.3

10 and 100 Mbit/s operation

Full- and half-duplex operation

Statistics Counter Registers

MII/RMII interface to the physical layer

Interrupt generation to signal receive and transmit completion

28-byte transmit FIFO and 28-byte receive FIFO

Automatic pad and CRC generation on transmitted frames

Automatic discard of frames received with errors

Address checking logic supports up to four specific 48-bit addresses

Support Promiscuous Mode where all valid received frames are copied to memory

Hash matching of unicast and multicast destination addresses

Physical layer management through MDIO interface

Half-duplex flow control by forcing collisions on incoming frames

Full-duplex flow control with recognition of incoming pause frames

Support for 802.1Q VLAN tagging with recognition of incoming VLAN and priority tagged frames

Multiple buffers per receive and transmit frame

Jumbo frames up to 10240 bytes supported
Serial Peripheral Interface


10.8
Supports communication with external serial devices

Four chip selects with external decoder allow communication with up to 15 peripherals

Serial memories, such as DataFlash® and 3-wire EEPROMs

Serial peripherals, such as ADCs, DACs, LCD Controllers, CAN Controllers and Sensors

External co-processors
Master or slave serial peripheral bus interface

8- to 16-bit programmable data length per chip select

Programmable phase and polarity per chip select

Programmable transfer delays per chip select, between consecutive transfers and between clock and data

Programmable delay between consecutive transfers

Selectable mode fault detection

Maximum frequency at up to Master Clock
Two-wire Interface

Master Mode only

Compatibility with I2C compatible devices (refer to the TWI section of the datasheet)

One, two or three bytes internal address registers for easy Serial Memory access

7-bit or 10-bit slave addressing

Sequential read/write operations
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10.9
USART

Programmable Baud Rate Generator

5- to 9-bit full-duplex synchronous or asynchronous serial communications

1, 1.5 or 2 stop bits in Asynchronous Mode

1 or 2 stop bits in Synchronous Mode

Parity generation and error detection

Framing error detection, overrun error detection

MSB or LSB first

Optional break generation and detection

By 8 or by 16 over-sampling receiver frequency

Hardware handshaking RTS - CTS

Modem Signals Management DTR-DSR-DCD-RI on USART1

Receiver time-out and transmitter timeguard

Multi-drop Mode with address generation and detection

RS485 with driver control signal

ISO7816, T = 0 or T = 1 Protocols for interfacing with smart cards

IrDA modulation and demodulation



NACK handling, error counter with repetition and iteration limit
Communication at up to 115.2 Kbps
Test Modes

Remote Loopback, Local Loopback, Automatic Echo
10.10 Serial Synchronous Controller

Provides serial synchronous communication links used in audio and telecom applications

Contains an independent receiver and transmitter and a common clock divider

Offers a configurable frame sync and data length

Receiver and transmitter can be programmed to start automatically or on detection of different event on the frame
sync signal

Receiver and transmitter include a data signal, a clock signal and a frame synchronization signal
10.11 Timer Counter

Three 16-bit Timer Counter Channels



Two output compare or one input capture per channel
Wide range of functions including:

Frequency measurement

Event counting

Interval measurement

Pulse generation

Delay timing

Pulse Width Modulation

Up/down capabilities
Each channel is user-configurable and contains:

Three external clock inputs
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
Five internal clock inputs, as defined in Table 10-4
Table 10-4.
Timer Counter Clocks Assignment
TC Clock input
Clock
TIMER_CLOCK1
MCK/2
TIMER_CLOCK2
MCK/8
TIMER_CLOCK3
MCK/32
TIMER_CLOCK4
MCK/128
TIMER_CLOCK5
MCK/1024

Two multi-purpose input/output signals

Two global registers that act on all three TC channels
10.12 Pulse Width Modulation Controller

Four channels, one 16-bit counter per channel

Common clock generator, providing thirteen different clocks


One Modulo n counter providing eleven clocks

Two independent linear dividers working on modulo n counter outputs
Independent channel programming

Independent enable/disable commands

Independent clock selection

Independent period and duty cycle, with double buffering

Programmable selection of the output waveform polarity

Programmable center or left aligned output waveform
10.13 USB Device Port

USB V2.0 full-speed compliant,12 Mbits per second

Embedded USB V2.0 full-speed transceiver

Embedded 1352-byte dual-port RAM for endpoints

Six endpoints


Endpoint 0: 8 bytes

Endpoint 1 and 2: 64 bytes ping-pong

Endpoint 3: 64 bytes

Endpoint 4 and 5: 256 bytes ping-pong

Ping-pong Mode (two memory banks) for bulk endpoints
Suspend/resume logic
10.14 CAN Controller
•
•
•
Fully compliant with CAN 2.0A and 2.0B
Bit rates up to 1Mbit/s
Eight object oriented mailboxes each with the following properties:

CAN Specification 2.0 Part A or 2.0 Part B Programmable for each Message

Object configurable to receive (with overwrite or not) or transmit

Local tag and mask filters up to 29-bit identifier/channel

32-bit access to data registers for each mailbox data object

Uses a 16-bit time stamp on receive and transmit message

Hardware concatenation of ID unmasked bitfields to speedup family ID processing
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
16-bit internal timer for time stamping and network synchronization

Programmable reception buffer length up to 8 mailbox objects

Priority management between transmission mailboxes

Autobaud and listening mode

Low power mode and programmable wake-up on bus activity or by the application

Data, remote, error and overload frame handling
10.15 Analog-to-Digital Converter

8-channel ADC

10-bit 384 K samples/sec. Successive Approximation Register ADC

±2 LSB Integral Non Linearity, ±1 LSB Differential Non Linearity

Integrated 8-to-1 multiplexer, offering eight independent 3.3V analog inputs

External voltage reference for better accuracy on low voltage inputs

Individual enable and disable of each channel

Multiple trigger sources


Hardware or software trigger

External trigger pin

Timer Counter 0 to 2 outputs TIOA0 to TIOA2 trigger
Sleep Mode and conversion sequencer


Automatic wakeup on trigger and back to sleep mode after conversions of all enabled channels
Four of eight analog inputs shared with digital signals
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11.
Package Drawings
11.1
100-lead LQFP Package
Figure 11-1.
100-lead LQFP Package Drawing
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Table 11-1.
100-lead LQFP Package Dimensions
Millimeter
Symbol
Min
Nom
A
Inch
Max
Min
Nom
1.60
A1
0.05
A2
1.35
1.40
0.15
0.002
1.45
0.053
0.006
0.055
D
16.00 BSC
0.630 BSC
D1
14.00 BSC
0.551 BSC
E
16.00 BSC
0.630 BSC
E1
14.00 BSC
0.551 BSC
R2
0.08
R1
0.08
0.20
0.003
0°
θ1
0°
θ2
11°
12°
13°
θ3
11°
12°
13°
c
0.09
0.20
0.004
L
0.45
0.60
0.75
0.018
0.20
b
0.17
e
3.5°
7°
0°
0.008
3.5°
7°
11°
12°
13°
11°
12°
13°
0.024
0.030
0°
1.00 REF
S
0.057
0.003
Q
L1
Max
0.063
0.008
0.039 REF
0.008
0.20
0.27
0.007
0.50 BSC
0.008
0.011
0.020 BSC
D2
12.00
0.472
E2
12.00
0.472
aaa
0.20
Tolerances of Form and Position
0.008
bbb
0.20
0.008
ccc
0.08
0.003
ddd
0.08
0.003
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11.2
100-ball TFBGA Package
Figure 11-2.
100-ball TFBGA Package Drawing and Dimensions
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12.
AT91SAM7X Ordering Information
Table 12-1.
Ordering Information
MRL A
Ordering Code
MRL B
Ordering Code
AT91SAM7X512-AU
AT91SAM7X512B-AU
–
AT91SAM7X512B-AUR
AT91SAM7X512-CU
AT91SAM7X512B-CU
AT91SAM7X256-AU
AT91SAM7X256B-AU
AT91SAM7X256C-AU
LQFP 100
AT91SAM7X256-CU
AT91SAM7X256B-CU
AT91SAM7X256C-CU
TFBGA 100
AT91SAM7X128-AU
AT91SAM7X128B-AU
AT91SAM7X128C-AU
LQFP 100
AT91SAM7X128-CU
AT91SAM7X128B-CU
AT91SAM7X128C-CU
TFBGA 100
Note:
1.
MRL C
Ordering Code
Package
Package
Type
Temperature
Operating Range
Green
Industrial
(-40°C to 85°C)
Green
Industrial
(-40°C to 85°C)
Green
Industrial
(-40°C to 85°C)
LQFP 100
–
LQFP 100(1)
TFBGA 100
Packing type is tape and reel.
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Revision History
The most recent version appears first in the tables that follow.
The acronymn “rfo” indicates change requests made by technical experts during document approval.
Table 12-2.
Doc. Rev
6120IS
6120HS
6120GS
6120FS
6120ES
6120DS
Revision History
Comments
Section 12. ”AT91SAM7X Ordering Information”
Added three ordering codes for AT91SAM7X512 MRL B.
Ordering Information:
Table 12-1, “Ordering Information”, removed ‘MRL C’ column
Section 12. ”AT91SAM7X Ordering Information”, MRL C parts added to ordering information
Section 9.5 ”Debug Unit”
“Chip ID Registers” , Chip IDs updated with reference to MRL A, B or C.
Product Series Naming Convention:
Except for part ordering and library references, AT91 prefix dropped from most nomenclature.
AT91SAM7X becomes SAM7X.
Table 3-1, “Signal Description List” footnote added to JTAGSEL, ERASE and TST pin comments.
Section 6.1 ”JTAG Port Pins”, Section 6.2 ”Test Pin” and Section 6.4 ”ERASE Pin”, updated.
Section 8.4.3 ”Internal Flash”, updated: “At any time, the Flash is mapped... if GPNVM bit 2 is set and
before the Remap Command.”
Figure 9-1,”System Controller Block Diagram”, RTT is reset by power_on_reset.
”Features”, ”Debug Unit (DBGU)”, added ”Mode for General Purpose 2-wire UART Serial
Communication”
Section 12. ”AT91SAM7X Ordering Information”, MRL B parts added to ordering information.
“Features” ,TWI updated to include Atmel TWI compatibility with I2C Standard.
Section 10.8 ”Two-wire Interface”, updated.
Section 7.4 ”Peripheral DMA Controller”, added PDC priority list.
Section 10.11 ”Timer Counter”, The TC has Two output compare or one input capture per channel.
Section 10.15 ”Analog-to-Digital Converter”, INL and DNL updated.
Added AT91SAM7X512 to product family.“Features” on page 2 and global
Reformatted Memories Section 8. “Memories” on page 17.
Reordered sub sections in Peripherals Section 10. “Peripherals” on page 30
Consolidated Memory Mapping in Figure 8-1 on page 18.
Added TFBGA information Section 4.3 “100-ball TFBGA Package Outline” on page 10.
added LQFP and TFBGA package drawings Section 11. on page 38.
System Controller block diagram Figure 9-1 on page 24, “ice_nreset” signals changed to
“power_on_reset”.
Section 10.1 ”User Interface” User Peripherals are mapped between 0xF000 0000 and 0XFFFF EFFF.
Table 10-1 on page 30 SYSIRQ changed to SYSC in “Peripheral Identifiers”
Change
Request
Ref.
rfo
8194
7371
rfo
5064
5850
5223
5846
6064
4247
4774
4210
4007
2723
2728
rfo review
SAM7X Series [SUMMARY DATASHEET]
6120IS–ATARM–14-Nov-13
42
Table 12-2.
Doc. Rev
6120CS
Revision History
Comments
Update to product functionalities including changes to “Features” on page 2, Figure 2-1 on page 5,
Section 9.5 “Debug Unit” on page 28 and to Peripheral mapping.
Updated PLL output range max value in Section 9.2 “Clock Generator” on page 26.
Updated information in Section 5.1 “Power Supplies” on page 11.
Updated ordering information in “Ordering Information” on page 41.
Change
Request
Ref.
05-457
05-462
05-491
05-471
6120BS
Corrections to maintain consistency with full datasheet:
In “Features” on page 2, corrected Page Programming Time and Full Erase Time; corrected number of
PDC channels, removed Wake-on-LAN support.
In Figure 2-1 on page 5, corrected number of PDC channels.
In Figure 2-1 on page 5, Table 3-1 on page 6, Table 10-2 on page 32 and Table 10-3 on page 33,
changed all SPI pin names.
In Section 5.2 “Power Consumption” on page 11, changed value of static current level and value of
dynamic power consumption level on VDDCORE
In Section 6.2 “Test Pin” on page 13, removed reference to SAM-BA boot recovery.
In Section 6.6 “I/O Lines Current Drawing” on page 14, changed value of total current level.
In Section 7.4 “Peripheral DMA Controller” on page 16, corrected number of PDC channels.
In Section 8. “Memories” on page 17, corrected Page Programming Time and Full Erase Time.
In Section 8.7 “SAM-BA Boot Assistant” on page 22, updated section.
In Figure 9-1 on page 24, changed range of periph_irq and periph_clk on AIC and for Embedded
Peripherals block.
In Section 10.6 “Ethernet MAC” on page 34, updated features.
6120AS
CSR 05-388
First issue - Unqualified on Intranet
Legal page updated.Qualified on Intranet
SAM7X Series [SUMMARY DATASHEET]
6120IS–ATARM–14-Nov-13
43
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