AVR32714: UC3A Schematic Checklist

AVR32714: UC3A Schematic Checklist
Features
•
•
•
•
•
•
•
Power circuit
Reset circuit
USB connection
External bus interface
ABDAC sound DAC interface
JTAG and Nexus debug ports
Clocks and crystal oscillators
32-bit
Microcontrollers
Application Note
1 Introduction
A good hardware design comes from a proper schematic. Since UC3A devices
have a fair number of pins and functions, the schematic for these devices can be
large and quite complex.
This application note describes a common checklist which should be used when
starting and reviewing the schematics for a UC3A design.
Rev. 32090E-AVR32-12/08
2 Power circuit
2.1 Single 3.3 volt power supply
Figure 2-1. Single 3.3 volt power example schematic
Common for
pin groups
Close to device
(every pin)
Close to pin
VDDIO
DC/DC converter
4.7µF
100nF
33nF
VDDIN
4.7µF
100nF
33nF
3.33.3
volt
volt
Voltage
regulator
VDDOUT
2.2µF
470pF
VDDCORE
2.2µF
100nF
33nF
2.7nF
VDDPLL
2.2µF
33nF
2.7nF
Table 2-1. Single 3.3 volt power supply checklist
Signal name
Recommended pin connection
VDDIO
3.0 V to 3.6 V
Decoupling/filtering capacitors
33 nF(1)(2), 100 nF(1)(3) and 4.7 µF(1)
VDDIN
3.0 V to 3.6 V
Decoupling/filtering capacitors
(1)(2)
(1)(3)
(1)
33 nF
, 100 nF
and 4.7 µF
Description
Powers I/O lines and USB transceiver.
Decoupling/filtering capacitors must be added to improve startup
stability and reduce source voltage drop.
Powers on-chip voltage regulator.
Decoupling/filtering capacitors must be added to improve startup
stability and reduce source voltage drop.
Output of the on-chip 1.8V voltage regulator.
2
VDDOUT
Decoupling/filtering capacitors
470 pF(1)(2) and 4.7 µF(1)
VDDCORE
1.65 V to 1.95 V
Connected to VDDOUT
Decoupling/filtering capacitors
(1)(2),
33 nF(1)(3), 100 nF(1) and
2.7 nF
(1)
4.7 µF
Decoupling/filtering capacitors must be added to guarantee 1.8V
stability.
Powers device, flash logic and on-chip RC.
Decoupling/filtering capacitors must be added to improve startup
stability and reduce source voltage drop.
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Signal name
Recommended pin connection
Description
Powers the main oscillator and the PLL.
VDDPLL
1.65 V to 1.95 V
Connected to VDDOUT
Decoupling/filtering capacitors
(1)(2),
33 nF(1)(3) and 4.7 µF(1)
2.7 nF
Note 1:
These values are given only as a typical example.
Decoupling/filtering capacitors must be added to improve startup
stability and reduce source voltage drop.
Note 2:
Decoupling capacitor should be placed as close as possible to each pin in the signal group, vias should be avoided.
Note 3:
Decoupling capacitor should be placed close to the device for each pin in the signal group.
2.2 Dual 3.3 volt and 1.8 volt power supply
Figure 2-2. Dual 3.3 volt and 1.8 volt power example schematic
DC/DC converter
Common for
pin groups
Close to device
(every pin)
Close to pin
VDDIO
4.7µF
100nF
33nF
3.33.3
volt
volt
VDDIN
Voltage
regulator
VDDOUT
DC/DC converter
VDDCORE
2.2µF
100nF
33nF
2.7nF
1.83.3
volt
volt
VDDPLL
2.2µF
33nF
2.7nF
Table 2-2. Dual 3.3 volt and 1.8 volt power supply checklist
Signal name
Recommended pin connection
Description
VDDIO
3.0 V to 3.6 V
Decoupling/filtering capacitors
33 nF(1)(2), 100 nF(1)(3) and 4.7 µF(1)
Decoupling/filtering capacitors must be added to improve startup
stability and reduce source voltage drop.
VDDIN
Connected to ground
On-chip voltage regulator not in use.
VDDOUT
Connected to ground
On-chip voltage regulator not in use.
Powers device, flash logic and on-chip RC.
VDDCORE
1.65 V to 1.95 V
Decoupling/filtering capacitors
2.7 nF(1)(2), 33 nF(1)(3), 100 nF(1) and
(1)
2.2 µF
Powers I/O lines and USB transceiver.
Decoupling/filtering capacitors must be added to improve startup
stability and reduce source voltage drop.
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Signal name
Recommended pin connection
VDDPLL
1.65 V to 1.95 V
Decoupling/filtering capacitors
2.7 nF(1)(2), 33 nF(1)(3) and 2.2 µF(1)
Description
Powers the main oscillator and the PLL.
Note 1:
Decoupling/filtering capacitors must be added to improve startup
stability and reduce source voltage drop.
These values are given only as a typical example.
Note 2:
Decoupling capacitor should be placed as close as possible to each pin in the signal group, vias should be avoided.
Note 3:
Decoupling capacitor should be placed close to the device for each pin in the signal group.
2.3 ADC reference power supply
The following schematic checklist is only necessary if the design is using the internal
analog to digital converter.
Figure 2-3. ADC reference power supply example schematic
Close to device
(every pin)
Close to pin
VDDANA
DC/DC converter
100nF
33nF
ADVREF
3.33.3
volt
volt
Table 2-3. ADC reference power supply checklist
Signal name
Recommended pin connection
Description
VDDANA
3.0 V to 3.6 V
Decoupling/filtering capacitors
33 nF(1)(2) and 100 nF(1)(3)
Decoupling/filtering capacitors must be added to improve startup
stability and reduce source voltage drop.
ADVREF
2.6 V to VDDANA
Connect with VDDANA
ADVREF is a pure analog input.
Powers on-chip ADC.
Note 1:
4
These values are given only as a typical example.
Note 2:
Decoupling capacitor should be placed as close as possible to each pin in the signal group, vias should be avoided.
Note 3:
Decoupling capacitor should be placed close to the device for each pin in the signal group.
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2.4 No ADC power supply
The following schematic checklist is only necessary if the design is not using the
internal analog to digital converter.
Figure 2-4. No ADC power supply example schematic
DC/DC converter
VDDANA
3.33.3
volt
volt
ADVREF
Table 2-4. No ADC power supply checklist
Signal name
Recommended pin connection
VDDANA
3.0 V to 3.6 V
ADVREF
Connected to ground
Description
3 Reset circuit
Figure 3-1. Reset circuit example schematic
VDDIO
10k ohm
Reset
100nF
Table 3-1. Reset circuit checklist
Signal name
Recommended pin connection
Description
RESET
Can be left unconnected in case no
The RESET_N pin is a Schmitt input and integrates a permanent pullreset from the system needs to be
applied to the product
up resistor to VDDIO.
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4 Clocks and crystal oscillators
4.1 External clock source
Figure 4-1. External clock source schematic
Table 4-1. External clock source checklist
Signal name
Recommended pin connection
Description
XIN
Connected to clock output from
external clock source
Up to VDDIO volt square wave signal up to 50 MHz.
XOUT
Can be left unconnected or used as
GPIO
4.2 Crystal oscillator
Figure 4-2. Crystal oscillator example schematic
Table 4-2. Crystal oscillator checklist
Signal name
Recommended pin connection
(1)(2)
XIN
Biasing capacitor 22 pF
XOUT
Biasing capacitor 22 pF(1)(2)
Note 1:
Description
External crystal between 450 kHz and 16 MHz.
These values are given only as a typical example. The capacitance C of the biasing capacitors can be computed based
on the crystal load capacitance CL and the internal capacitance Ci of the MCU as follows:
C = 2 (CL – Ci)
The value of CL can be found in the crystal datasheet and the value of Ci can be found in the MCU datasheet.
Note 2:
6
Decoupling capacitor should be placed as close as possible to each pin in the signal group, vias should be avoided.
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5 USB connection
5.1 Device mode, powered from bus connection
Figure 5-1. USB in device mode, bus powered connection example schematic
VDD
3.3 volt
regulator
USB_VBOF
VBUS
VBUS
D-
D39 ohm
D+
D+
39 ohm
ID
USB_ID
GND
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32090E-AVR32-12/08
Table 5-1. USB bus powered connection checklist
Signal name
Recommended pin connection
Description
USB_VBOF
Can be left unconnected
USB power control pin.
VBUS
Directly to connector
USB power measurement pin.
D-
39 ohm series resistor
Placed as close as possible to pin
Negative differential data line.
D+
39 ohm series resistor
Placed as close as possible to pin
Positive differential data line.
USB_ID
Can be left unconnected
Mini connector USB identification pin.
5.2 Device mode, self powered connection
Figure 5-2. USB in device mode, self powered connection example schematic
USB_VBOF
VBUS
VBUS
D-
D39 ohm
D+
D+
39 ohm
USB_ID
ID
GND
Table 5-2. USB self powered connection checklist
8
Signal name
Recommended pin connection
Description
USB_VBOF
Can be left unconnected
USB power control pin.
VBUS
Directly to connector
USB power measurement pin.
D-
39 ohm series resistor
Placed as close as possible to pin
Negative differential data line.
D+
39 ohm series resistor
Placed as close as possible to pin
Positive differential data line.
USB_ID
Can be left unconnected
Mini connector USB identification pin.
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AVR32714
5.3 Host/OTG mode, power from bus connection
Figure 5-3. USB host and OTG powering connection example schematic
5.0 volt
regulator
USB_VBOF
VBUS
VBUS
D-
D39 ohm
D+
D+
39 ohm
USB_ID
ID
GND
Table 5-3. USB host and OTG powering connection checklist
Signal name
Recommended pin connection
Description
USB_VBOF
GPIO connected to VBUS 5.0 volt
regulator enable signal
USB power control pin.
VBUS
Directly to connector
USB power measurement pin.
D-
39 ohm series resistor
Placed as close as possible to pin
Negative differential data line.
D+
39 ohm series resistor
Placed as close as possible to pin
Positive differential data line.
USB_ID
GPIO directly connected to
connector, mandatory in OTG
mode
Mini connector USB identification pin. For OTG it will be tied to ground
in host mode, and left floating in device mode. Pull-up on GPIO pin
must be enabled.
6 Ethernet interface
When designing in the Ethernet physical device (PHY) the designer should refer to
the datasheet for the PHY. This datasheet usually contains layout advice, connection
schematics, reference design, etc.
The information in the PHY datasheet is vital to get optimal performance and stability.
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32090E-AVR32-12/08
6.1 Ethernet interface in MII mode
Figure 6-1. Ethernet interface in MII mode example schematic
TX_CLK/REF_CLK
CRS
TX_CLK
Ethernet
PHY
COL
CRS
COL
MDIO
MDIO
MDC
MDC
CRS
RX_DV
RX[0:3]
RX_ER
RXD[0:3]
RX_CLK
TX_EN
RX_ER
TXD[0:3]
RX_CLK
TX_ER
TX_EN
TXD[0:3]
TX_ER
10
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Table 6-1. Ethernet interface in MII mode checklist
Signal name
Recommended pin connection
Description
TX_CLK/
REF_CLK
Transmit clock, 25 MHz for 100 Mb/s data rate
CRS
Carrier sense
COL
Collision detect
MDIO
PHY maintenance data
MDC
PHY maintenance clock
RX_DV
Receive data valid
RXD[0:3]
Receive data 4-bit
RX_ER
Receive error
RX_CLK
Receive clock, 25 MHz for 100 Mb/s data rate
TX_EN
Transmit enable
TXD[0:3]
Transmit data 4-bit
TX_ER
Transmit error
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32090E-AVR32-12/08
6.2 Ethernet interface in RMII mode
Figure 6-2. Ethernet interface in RMII mode example schematic
TX_CLK/REF_CLK
CRS
COL
Ethernet
PHY
X1
MDIO
MDIO
MDC
MDC
CRS
RX[0:1]
RX_DV
RX_ER
TX_EN
RXD[0:3]
TX[0:1]
RX_ER
RX_CLK
TX_EN
TXD[0:3]
TX_ER
12
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Table 6-2. Ethernet interface in RMII mode checklist
Signal name
Recommended pin connection
TX_CLK/
REF_CLK
Description
Reference clock, 50 MHz for 100 Mb/s data rate
CRS
Not used in RMII mode
COL
Not used in RMII mode
MDIO
PHY maintenance data
MDC
PHY maintenance clock
RX_DV
Carrier sense, data valid
RXD[0:1]
Receive data 2-bit
RXD[2:3]
Not used in RMII mode
RX_ER
RX_CLK
Receive error
Not used in RMII mode
TX_EN
Transmit enable
TXD[0:1]
Transmit data 2-bit
TXD[2:3]
Not used in RMII mode
TX_ER
Not used in RMII mode
7 External bus interface
7.1 Static memory
7.1.1 16-bit static memory
Table 7-1. 16-bit static memory pin wiring
SMC EBI signal
16-bit static memory
D[0:15]
D[0:15]
A[1:23]
A[0:22]
NBS0
LBE
NBS1
HBE
NWE
WE
NRD
OE
NWAIT
WAIT
NCSx
CS
7.1.2 8-bit static memory
Table 7-2. 8-bit static memory pin wiring
SMC EBI signal
8-bit static memory
D[0:7]
D[0:7]
A[0:23]
A[0:23]
NWE
WE
NRD
OE
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32090E-AVR32-12/08
SMC EBI signal
8-bit static memory
NWAIT
WAIT
NCSx
CS
7.1.3 2 x 8-bit static memory
Table 7-3. 2 x 8-bit static memory pin wiring
SMC EBI signal
8-bit static memory
D[0:7]
D[0:7]
D[8:15]
8-bit static memory
D[0:7]
A[1:23]
A[0:22]
NWE0
WE
NWE1
A[0:22]
WE
NRD
OE
OE
NWAIT
WAIT
WAIT
NCSx
CS
CS
7.2 SDRAM
7.2.1 16-bit SDRAM
Table 7-4. 16-bit SDRAM pin wiring
SMC EBI signal
16-bit SDRAM
D[0:15]
DQ[0:15]
A[2:11]
A[0:9]
SDA10
A[10]
A[13:14]
A[11:12]
BA[0:1]
BA[0:1]
SDCK
CLK
SDCKE
CKE
SDWE
WE
RAS
RAS
CAS
CAS
NBS0
DQML
NBS1
DQMH
SDCS0
CS
7.2.2 2 x 8-bit SDRAM
Table 7-5. 2 x 8-bit SDRAM pin wiring
SMC EBI signal
8-bit SDRAM
D[0:7]
DQ[0:7]
D[7:15]
A[2:11]
14
8-bit SDRAM
DQ[0:7]
A[0:9]
A[0:9]
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SMC EBI signal
8-bit SDRAM
8-bit SDRAM
SDA10
A[10]
A[10]
A[13:14]
A[11:12]
A[11:12]
BA[0:1]
BA[0:1]
BA[0:1]
SDCK
CLK
CLK
SDCKE
CKE
CKE
SDWE
WE
WE
RAS
RAS
RAS
CAS
CAS
CAS
NBS0
DQM
NBS1
SDCS0
DQM
CS
CS
7.2.3 4 x 4-bit SDRAM
Table 7-6. 4 x 4-bit SDRAM pin wiring
SMC EBI signal
4-bit SDRAM
D[0:3]
DQ[0:3]
D[4:7]
4-bit SDRAM
4-bit SDRAM
4-bit SDRAM
DQ[0:3]
D[8:11]
DQ[0:3]
D[12:15]
DQ[0:3]
A[2:11]
A[0:9]
A[0:9]
A[0:9]
A[0:9]
SDA10
A[10]
A[10]
A[10]
A[10]
A[13:14]
A[11:12]
A[11:12]
A[11:12]
A[11:12]
BA[0:1]
BA[0:1]
BA[0:1]
BA[0:1]
BA[0:1]
SDCK
CLK
CLK
CLK
CLK
SDCKE
CKE
CKE
CKE
CKE
SDWE
WE
WE
WE
WE
RAS
RAS
RAS
RAS
RAS
CAS
CAS
CAS
CAS
CAS
NBS0
DQM
DQM
DQM
DQM
CS
CS
NBS1
SDCS0
CS
CS
8 ABDAC stereo sound DAC interface
The output from the ABDAC is not intended for driving headphones or speakers. The
pads are limiting the maximum amount of current. In the majority of all practical
cases, this will not be enough to drive a low impedance source.
Because of this limitation, an external amplifier should be connected to the output
lines to amplify these signals. This amplifier device could also be used to control the
volume.
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32090E-AVR32-12/08
For testing purposes a line in or microphone input on a sound system can be used to
evaluate the output signal.
8.1 Line out with passive filter
Figure 8-1. Line out with passive filter example schematic
Lowpass filter
1uF
DATA[0]
220pF 20k ohm
L
DATAN[0]
R
DATA[1]
220pF 20k ohm
1uF
DATAN[1]
Table 8-1. Line out with passive filter checklist
Signal name
Recommended pin connection
Description
DATA[0]
Connected to low pass filter and 1
µF capacitor to remove DC bias
DATAN[0]
Not in use
DATA[1]
Connected to low pass filter and 1
µF capacitor to remove DC bias
DATAN[1]
Not in use
8.2 High power output with external amplifier
Figure 8-2. High power output with external amplifier example schematic
100 ohm
20k ohm
330uF
8
TPA152
IN1-
Vo1
1
20k ohm
1uF
20k ohm
7
L
R
10uF
5V
100nF
6
5
GND
VDD
MUTE
BYPASS
Vo2
IN2-
3
20k ohm
20k ohm
DATA[0]
220pF 20k ohm
DATAN[0]
1uF
DATA[1]
4
20k ohm 1uF
330uF
100 ohm
2
Lowpass filter
220pF 20k ohm
DATAN[1]
Optional resistors
16
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Table 8-2. High power output with external amplifier checklist
Signal name
Recommended pin connection
DATA[0]
Connected to low pass filter and
external amplifier
DATAN[0]
Not in use
DATA[1]
Connected to low pass filter and
external amplifier
DATAN[1]
Not in use
Description
9 JTAG and Nexus debug ports
9.1 JTAG port interface
Figure 9-1. JTAG port interface example schematic
TMS
1
3
TCK
2x5
header
TDO
GND
VCC
TDO
2
4
VDD
TCK
100nF
5
7
9
TMS
RESET
6
RESET
8
EVTO
TDI
GND
10
TDI
Table 9-1. JTAG port interface checklist
Signal name
Recommended pin connection
Description
TMS
Test mode select, sampled on rising TCK.
TDO
Test data output, driven on falling TCK.
TCK
Test clock, fully asynchronous to system clock frequency.
RESET
Device external reset line.
TDI
Test data input, sampled on rising TCK.
EVTO
Event output, not used.
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9.2 Nexus port interface
Figure 9-2. Nexus port interface example schematic
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Table 9-2. Nexus port interface checklist
Signal name
Recommended pin connection
TDI
Description
Test data input, sampled on rising TCK.
TMS
Test mode select, sampled on rising TCK.
TCK
Test clock, fully asynchronous to system clock frequency.
TDO
Test data output, driven on falling TCK.
RESET
Device external reset line.
EVTI
Event input.
MDO[0:5]
Trace data output.
EVTO
Event output.
MCK0
Trace data output clock.
MSE[0:1]
Trace frame control.
10 Suggested reading
10.1 Device datasheet
The device datasheet contains block diagrams of the peripherals and details about
implementing firmware for the device. The datasheet is available on
http://www.atmel.com/AVR32 in the Datasheets section.
10.2 Evaluation kit schematic
The evaluation kit EVK1100 contains the full schematic for the board; it can be used
as a reference design. The schematic is available on http://www.atmel.com/AVR32 in
the Tools & Software section.
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32090E-AVR32-12/08
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32090E-AVR32-12/08