Data Sheets - Skyworks Solutions, Inc.

DATA SHEET
SE2577L: Dual-Band 802.11n Wireless LAN Front-End Module
Applications
 802.11n, MIMO solutions
 IEEE 802.11g OFDM WLAN
 IEEE 802.11a OFDM WLAN
 Access points, PCMCIA, PC cards
TXG
RXG
ANT
RXA
TXA
Features
Y0147
 Passive front end, including two SPDT switches and diplexer
Figure 1. SE2577L Block Diagram
(RF Ports are DC Blocked)
 Integrated 2 GHz low pass filter
 Able to accept 20 dBm of linear input power in both bands with
no EVM contribution
 Lead free, Halogen Free and RoHS compliant
 Thin lead-free plated QFN package (20-pin, 3 x 3 x 0.9 mm,
(MSL1, 260 °C per JEDEC J-STD-020)
GND
GND
VRX
14
13
1
17
RXG
2
RXA
3
VTX 8
GND 6
5
4
TXA
GND
11
GND
10
ANT
9
GND
The SE2577L is a dual-band passive 802.11n WLAN RF front-end
module providing the functionality of spurious filters, switches
and diplexer. All RF ports are matched to 50 Ω to simplify PCB
layout and the interface to the transceiver RFIC.
The Front End is packaged in a very compact RoHS compliant,
Halogen Free, and Lead Free 3mm x 3mm x 0.9mm QFN style
package.
A functional block diagram of the SE2577L is provided in Figure 1.
Figure 2 shows the pinout for the SE2577L. Table 1 lists the
signal pin assignments and functional pin descriptions.
19
18
GND
12
20
GND 7
GND
15
16
TXG
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
Description
Y0148
Figure 2. SE2577L Pinout – 20-Pin QFN (Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE
Table 1. SE2577L Signal Descriptions
Pin
Name
Description
Pin
GND
Ground
11
2
RXG
2 GHz Receive Output
3
RXA
5 GHz Receive Output
4
GND
5
Name
Description
GND
Ground
12
GND
Ground
13
VRX
Receive Switch Control
Ground
14
GND
Ground
TXA
5 GHz Transmit Input
15
GND
Ground
6
GND
Ground
16
TXG
2 GHz Transmit Input
7
GND
Ground
17
GND
Ground
8
VTX
Transmit Switch Control
18
GND
Ground
9
GND
Ground
19
GND
Ground
10
ANT
Antenna
20
GND
Ground
1
Electrical and Mechanical Specifications
The absolute maximum ratings of the SE2577L are provided in
Table 2. The recommended operating conditions are specified in
Table 3 and electrical specifications are provided in Tables 4
through 7.
Table 2. SE2577L Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
High-level logic control voltage
VCTL_ON
3.6
V
CW power on port 2TX, 5TX, ANT terminated into 50 Ω match
TXRF
+33
dBm
Operating temperature
TA
–40
+85
°C
Storage temperature
TS2TX
–40
+150
°C
Electrostatic discharge:
ESD
200
1500
V
V
All pins
Antenna pin with external 4 pF blocking capacitor
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SE2577L Recommended Operating Conditions
Parameter
Ambient temperature
Symbol
TA
Minimum
Typical
Maximum
Units
–40
+25
+85
°C
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DATA SHEET • SE2577L: DUAL-BAND 802.11 WIRELESS FRONT-END MODULE
Table 4. SE2577L Electrical Specifications: RF Switch Characteristics (Note 1)
(TA = +25 C, as Measured on the Evaluation Board [De-Embedded to the Device], All Unused Ports are Terminated with 50 Ω,
Unless Otherwise Noted)
Parameter
Symbol
Control voltage:
ON state
OFF state
Test Condition
VCTL_ON
VCTL_OFF
Min
Typical
Max
Units
3.0
0
3.3
3.6
0.3
V
V
0.5
0.5
1.5
1.5
mA
mA
10
pF
ICTL_ON
Switch control bias circuit:
RF applied
No RF
On pin (VTX, VRX) driven high
On pin (VTX, VRX) driven high
10% to 90 % rise fall time
Switch speed
Control input capacitance
CCTL
250
ns
Note 1: Performance is guaranteed only under the conditions listed in this table.
Table 5. SE2577L Electrical Specifications: RF Switch Logic and Function Characteristics
RF Switch Logic
RF Switch Function
VTX
VRX
TXG, TXA <-> ANT
RXG, RXA <-> ANT
VCTL_OFF
VCTL_OFF
OFF
OFF
VCTL_ON
VCTL_OFF
ON
OFF
VCTL_OFF
VCTL_ON
OFF
VCTL_ON
VCTL_ON
ON
Not a supported state
Table 6. SE2577L Electrical Specifications: 2.4 GHz AC Electrical Characteristics (1 of 2)
(TA = +25 C, as Measured on the Evaluation Board [De-Embedded to Device], All Unused Ports Terminated at 50 Ω,
Unless Otherwise Noted)
Parameter
Symbol
Condition
Frequency
f
Reference input impedance
ΩL
All RF ports
RF input power
PIN
DSSS
OFDM
Input return loss
S11
RxG ↔ ANT; TxG ↔ ANT
Transmit insertion loss
S21 TX
Min
Typ
2400
Max
Unit
2485
MHz
50
Ω
+23
+22
dBm
15
dB
TxG ↔ ANT:
Excluding external filter components
Includes losses from external filter components
Receive insertion loss
S21 RX
RxG ↔ ANT
Output return loss
S22
RxG ↔ ANT; TxG ↔ ANT
0.1dB compression
P0.1dB
rd
3 order intercept
1.8
2.1
1.1
1.4
15
+29
IIP3
1.5
1.8
dB
dB
dB
dB
+31
+50
dBm
dBm
TxG ↔ ANT:
2nd harmonics rejection
2fo
3rd harmonics rejection
3fo
With external components on EK1 PCB
Without external components
50
35
55
40
dB
dB
50
25
55
28
dB
dB
TXG ↔ ANT:
With external components on EK1 PCB
Without external components
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DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE
Table 6. SE2577L Electrical Specifications: 2.4 GHz AC Electrical Characteristics (2 of 2)
(TA = +25 C, as Measured on the Evaluation Board [De-Embedded to Device], All Unused Ports Terminated at 50 Ω,
Unless Otherwise Noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Output 2nd harmonic power
generated at PIN = +22 dBm, CW
PSD2
TXG ↔ ANT, no source contribution to harmonics
–50
dBm
Output 3rd harmonic power
generated at PIN = +22 dBm, CW
PSD3
TXG ↔ ANT, no source contribution to harmonics
–50
dBm
TXG ↔ ANT, Measure @RXA
40
50
dB
TXG ↔ ANT, Measure @TXA
20
40
dB
RXG to TXG
TXG ↔ ANT, Measure @RXG
20
30
dB
RXG to ANT
TXG ↔ ANT, Measure @RXG; TXG is not
terminated
20
27
RF to non-RF
Any RF pin to VRX, VTX, with 1.6pF cap on control
lines
40
Isol
5 to 2 GHz isolation
33
dB
dB
Table 7. Electrical Specifications: 5 GHz AC Electrical Characteristics (TA = 25 C, as Measured on the Evaluation Board [De-Embedded to
Device], All Unused Ports Terminated with 50 Ω, Unless Otherwise Noted)
Parameter
Symbol
Frequency
f
Reference input impedance
ΩL
Test Condition
Min
Typ
4900
All RF ports
Max
Unit
5875
MHz
50
Ω
+21
dBm
RF input power
PIN
OFDM
Input return loss
S11
RxA ↔ ANT; TxA ↔ ANT
Transmit insertion loss
S21 TX
TxA ↔ ANT
2.1
dB
Receive insertion loss
S21 RX
RxA ↔ ANT
2.1
dB
Output return loss
S22
RxA ↔ ANT; TxA ↔ ANT
15
dB
15
dB
0.1dB compression
P0.1dB
+29
3rd order intercept
IIP3
+50
2nd harmonics rejection
2fo
TxA ↔ ANT
20
dB
3 harmonics rejection
3fo
TxA ↔ ANT
15
dB
Output 2nd harmonic power
generated at PIN = +22 dBm, OFDM
PSD2
TxA ↔ ANT
–50
dBm/MHz
Output 3rd harmonic power generated
at PIN = +22 dBm, OFDM
PSD3
TxA ↔ ANT
–50
dBm/MHz
Isolation: 2 to 5 GHz
ISOL
TxA ↔ ANT, Measure @ RXG
TxA ↔ ANT, Measure @ TXG
40
20
dB
dB
RXA to TXA
ISOL
TxA ↔ ANT, Measure @ RXA
20
dB
RXG to ANT
ISOL
TxA ↔ ANT, Measure @ RXA; TXA is not
terminated
20
RF to non-RF
ISOL
Any RF pin to VRX, VTX
(with 1.6 pF cap on control lines)
40
rd
+31
dBm
dBm
33
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dB
dB
DATA SHEET • SE2577L: DUAL-BAND 802.11 WIRELESS FRONT-END MODULE
Evaluation Board Description
Evaluation Board Setup Procedure
The SE2577L Evaluation Board is used to test the performance of
the SE2577L FEM. A suggested application schematic diagram is
shown in Figure 3. An Evaluation Board assembly diagram is
shown in Figure 4. Component values for the SE2577L Evaluation
Board are listed in the Bill of Materials (BOM) in Table 8.
1. Connect system ground to pin 2 of connectors J6 and J20.
2. Test the Antenna to Receive Port by applying the switch
settings of RX – ANT as described in Table 5.
Circuit Design Considerations
3. The RX to ANT performance can be monitored by applying an
RF signal to J4 (ANT), and measuring the response from either
J1 (5 GHz) or J5 (2 GHz) RX outputs.
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
4. Test the Transmit to Antenna Port by applying the switch
settings of TX – ANT as described in Table 5.
 Paths to ground should be made as short as possible.
 The ground pad of the SE2577L has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
device.
Therefore, design the connection to the ground pad to dissipate
the maximum wattage produced by the circuit board. Multiple
vias to the grounding layer are required.
5. Amplifier performance at 2.5 GHz can be monitored by
applying an RF signal to connector J2 and monitoring the
output power on the antenna port connector J4 (ANT).
6. Amplifier performance at 5 GHz can be monitored by applying
an RF signal to connector J3 and monitoring the output power
on the antenna port connector J4 (ANT).
Caution: Care should be taken not to overdrive the amplifier by
applying too much RF on the input to the device. A
suitable starting input power for the device is
+20 dBm.
NOTE: A poor connection between the ground pad and ground
increases junction temperature (TJ), which reduces the life
of the device.
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DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE
J2
SMA
J20
C6
1.2 pF
2X1
Header
15
GND
14
GND
13
VRX
16
SE2577L
U1
12
GND
11
GND
10
ANT
9
GND
C3
4.0 pF
J4
SMA
5
TX_A
6
GND
7
GND
8
VTX
1
GND
2
RX_G
3
RX_A
4
GND
TX_G
17
PAD
J5
SMA
1
2
L1
2.7 nH
C7
1.2 pF
J1
SMA
J3
SMA
1
2
NOTE:
The PCB contains footprints for non-populated
components that are not shown in this schematic.
J6
2X1
Header
Y1582
Figure 3. SE2577L Suggested Application Schematic
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DATA SHEET • SE2577L: DUAL-BAND 802.11 WIRELESS FRONT-END MODULE
Y1583
Figure 4. SE2577L Evaluation Board Assembly Diagram
Table 8. SE2577L Evaluation Board Bill of Materials
Component
Value
Manufacturer
Mfr Part Number
Package
Description
C3
4.0 pF
Murata
GRM1555C1H4R0CZ01
0402
Multilayer ceramic
C6, C7
1.2 pF
Murata
GRM1555C1H1R2CZ01
0402
Thick film chip resistor
J1, J2, J3, J4, J5
SMA
Johnson Components
142-0701-851
End launch
SMA end launch straight jack receptacle – tab
contact
J6, J20
2X1
Molex
22-28-4023
100 mil
100 mil header
L1
2.7 nH
Murata
LQG15HN2N7S02D
0402
Monolithic Inductor (Air-core)
Skyworks
SE2577L
SE2577L
Dual band switch diplex FEM
U1
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DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE
Package Dimensions
when the part is subjected to high temperature during solder
assembly.
The recommended land and solder patterns for the SE2577L are
provided in Figure 5. Typical case markings are shown in Figure
6. Package dimensions for the are shown in Figure 7, and tape
and reel dimensions are provided in Figure 8.
The SE2577L is rated to Moisture Sensitivity Level 1 (MSL1) at
260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
3.20
0.25 Typ
16
15
13
14
0.50 Typ
1
12
20
17
0.500
Typ
2
3
10
18
3.20
0.10
11
19
0.675 Typ
9
4
5
0.10
6
7
8
0.675 Typ
Stencil Pattern
(Note 5)
63% Solder Coverage on Center Pad
Package
Outline
3.20
0.25 Typ
16
15
16
13
14
15
13
14
0.60 Typ
0.50 Typ
1
12
3.30
3.20
3.30
0.35 Typ
Package
Outline
1
12
20
17
2
11
3
10
1.80
18
19
0.58
Typ
9
4
20
17
0.500
Typ
2
11
3
10
1.70
18
19
9
4
0.500
Typ
5
6
7
8
5
9X Ø0.254
0.58 Typ
6
7
8
1.70
1.80
Board Metal and Via Pattern
(Note 4)
Solder Mask Pattern
(Note 6)
Notes:
1.
2.
3.
4.
All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
Unless specified, dimensions are symmetrical about center lines.
Via hole recommendations: 30-35 µm Cu via wall plating; via holes
should be tented with solder mask on the back side and filled with solder.
5. Stencil recommendations: 0.125 mm stencil thickness, laser cut apertures,
trapezoidal walls and rounded corners offer better paste release.
6. Solder mask recommendations: Contact board fabricator for recommended
solder mask offset and tolerance.
Figure 5. SE2577L Recommended Land and Solder Patterns
(Top View)
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Y0152
DATA SHEET • SE2577L: DUAL-BAND 802.11 WIRELESS FRONT-END MODULE
Pin 1
Indicator
Pin 1
Indicator
SiGe
2577L
XXXXX
SKY
2577L
XXXXX
Part Number
Lot Code
Part Number
Lot Code
Y0141
Figure 6. Typical Case Markings
(Top View)
2X
A
3.000 ±0.050
0.15 C
1.700 ±0.050
0.10 M C A B
0.850 ±0.050
See Note 3
B
16
15
14
1
12
17
20
2
13
11
1.700 ±0.050
10
18
15
16
1
11
9
20
17
19
18
2
0.500
10
19
4
14
12
3.000 ±0.050
3
0.300 X 45°
0.203 Ref.
13
3
R0.075 Typ.
9
4
0.10 M C A B
2X
0.15 C
5
6
7
8
0.000 – 0.050
Seating
Plane
C
8
16X 0.250 ±0.050
0.10 M C A B
0.05 M C
Top View
7
6
5
16X 0.350 ±0.050
Bottom View
NOTES:
1. All measurements are in millimeters.
2. Dimensioning and tolerancing according to ASME Y14.5M-1994.
Unless otherwise specified the following values apply:
Decimal Tolerance: Angular Tolerance:
X.X (1 place) ± 0.1 mm
±1°
X.XX (2 places) ± 0.05 mm
X.XXX (3 places) ± 0.025 mm
3. Terminal #1 identification mark located within marked area.
4. Coplanarity applies to the exposed heat sink ground pad as well as the terminals.
5. Unless specified, dimensions are symmetrical about center lines.
Y0150
Figure 7. SE2577L Package Dimensions
Pin 1 Corner
Figure 8. SE2577L Tape and Reel Dimensions
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DATA SHEET • SE2577L: DUAL-BAND 802.11N WIRELESS FRONT-END MODULE
Ordering Information
Model Name
SE2577L-S
SE2577L-R
Manufacturing Part Number
Evaluation Board Part Number
SE2577L-EK1
Copyright © 2013-2014 Skyworks Solutions, Inc. All Rights Reserved.
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information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
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Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
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