AS3930 - Datasheet

AS3930
Single Channel Low Frequency
Wakeup Receiver
General Description
The AS3930 is a single-channel low power ASK receiver that is
able to generate a wake-up upon detection of a data signal
which uses a LF carrier frequency between 110 - 150 kHz. The
integrated correlator can be used for detection of a
programmable 16-bit wake-up pattern.
The AS3930 provides a digital RSSI value, it supports a
programmable data rate. The AS3930 offers a real-time clock
(RTC), which is either derived from a crystal oscillator or the
internal RC oscillator.
The programmable features of AS3930 enable to optimize its
settings for achieving a longer distance while retaining a
reliable wake-up generation. The sensitivity level of AS3930 can
be adjusted in presence of a strong field or in noisy
environments. The device is available in a 16-pin TSSOP and a
16-LD QFN (4x4) package.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS3930, Single Channel Low
Frequency Wakeup Receiver are listed below:
Figure 1:
Added Value of Using AS3930
Benefits
Features
Enables low power active tags
Single channel ASK wake-up receiver
Selectable carrier frequency
Carrier frequency range 110 – 150 kHz
Highly resistant to false wake-ups
16-bit programmable wake-up pattern
Improved immunity to false wake-ups
Supporting doubling of wake-up pattern
Allows frequency only detection
Wake-up without pattern detection selectable
Improved range with best-in-class sensitivity
Wake-up sensitivity 100μVRMS (typ.)
Adjustable range
Sensitivity level adjustable
Provides tracking of false wake-ups
False wake-up counter
Ensures wake-up in a noise environment
Periodical forced wake-up supported (1s – 2h)
Extended battery life
Current consumption in listening mode 1.37 μA (typ.)
Flexible clock configuration
RTC based 32 kHz XTAL, RC-OSC, or external clock
ams Datasheet
[v1-62] 2014-Nov-27
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AS3930 − General Description
Benefits
Features
Operates from a 3V battery
Operating supply range 2.4V – 3.6V (TA = 25°C)
Industrial temperature range
Operation temperature range -40°C to +85°C
Applications
The AS3930, Single Channel Low Frequency Wakeup Receiver
is ideal for Active RFID tags, real-time location systems, operator
identification, access control, and wireless sensors.
Figure 2:
AS3930 Typical Application Diagram with Crystal Oscillator
VCC
CL
CBAT
VCC
CS
XIN
TRANSMITTER
TX
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Transmitting Antenna
XTAL
XOUT
DAT
LF1P
NC
WAKE
AS3930
SCL
NC
SDO
LFN
SDI
VSS
GND
ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − General Description
Figure 3:
AS3930 Typical Application Diagram without Crystal Oscillator
VCC
VCC
CS
CBAT
TRANSMITTER
TX
Transmitting Antenna
XIN
XOUT
DAT
LF1P
WAKE
AS3930
NC
SCL
NC
SDO
LFN
SDI
VSS
GND
Figure 4:
AS3930 Typical Application Diagram with Clock from External Source
VCC
CBAT
External Clock
VCC
CS
R
XIN
C
TX
ams Datasheet
[v1-62] 2014-Nov-27
Transmitting Antenna
XOUT
TRANSMITTER
DAT
LF1P
NC
AS3930
WAKE
SCL
NC
SDO
LFN
SDI
VSS
GND
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AS3930 − Pin Assignments
Pin Assignments
16-pin TSSOP
Figure 5:
Pin Diagram (Top View)
CS
1
16
NC
SCL
2
15
DAT
SDI
3
14
WAKE
SDO
4
13
VSS
VCC
5
12
XOUT
GND
6
11
XIN
NC
7
10
LFN
NC
8
9
AS3930
LF1P
Figure 6:
Pin Description
Pin Number
Pin Name
1
CS
2
SCL
3
SDI
4
SDO
5
VCC
Pin Type
Description
Chip select
Digital input
SDI interface clock
SDI data input
Digital output / tristate
SDI data output (tristate when CS is low)
Positive supply voltage
Supply pad
6
GND
7
NC
8
NC
9
LF1P
10
LFN
Negative supply voltage
-
Not Connected
Input antenna
Antenna ground
Analog I/O
11
XIN
Crystal oscillator input
12
XOUT
Crystal oscillator output
13
VSS
14
WAKE
Supply pad
Substrate
Wake-up output IRQ
Digital output
15
DAT
16
NC
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Data output
-
Not connected
ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Pin Assignments
QFN 4x4 16 LD
Figure 7:
Pin Diagram (Top View)
VSS
Figure 8:
Pin Description
Pin Number
Pin Name
Pin Type
Description
1
NC
-
2
NC
-
3
LF1P
Input antenna
4
LFN
Antenna ground
5
XIN
6
XOUT
7
VSS
8
WAKE
Not connected
Analog I/O
Crystal oscillator input
Crystal oscillator output
Supply pad
Substrate
Wake-up output IRQ
Digital output
9
DAT
10
NC
11
CS
12
SCL
13
SDI
14
SDO
15
VCC
Data output
-
Not connected
Chip select
Digital input
SDI interface clock
SDI data input
Digital output / tristate
SDI data output (tristate when CS is low)
Positive supply voltage
Supply pad
16
ams Datasheet
[v1-62] 2014-Nov-27
GND
Negative supply voltage
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AS3930 − Absolute Maximum Ratings
Stresses beyond those listed in Absolute Maximum Ratings may
cause permanent damage to the device. These are stress ratings
only. Functional operation of the device at these or any other
conditions beyond those indicated in Electrical Characteristics
is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Figure 9:
Absolute Maximum Ratings
Parameter
Min
Max
Unit
Note
Electrical Parameters
DC supply voltage (VDD)
-0.5
5
V
Input pin voltage (VIN)
-0.5
5
V
Input current (latch up immunity)
(ISOURCE)
-100
100
mA
Norm: Jedec 78
Electrostatic Discharge
Electrostatic discharge (ESD)
±2
kV
Norm: MIL 883 E method 3015 (HBM)
Continuous Power Dissipation
Total power dissipation
(all supplies and outputs)
(Pt)
0.07
mW
Temperature Ranges and Storage Conditions
Storage temperature (Tstrg)
-65
150
Package body temperature
(Tbody)
Humidity non-condensing
Moisture Sensitivity Level (MSL)
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5
3
°C
260
°C
85
%
Norm: IPC/JEDEC J-STD-020
The reflow peak soldering temperature
(body temperature) is specified according
IPC/JEDEC J-STD-020 “Moisture/Reflow
Sensitivity Classification for Non-hermetic
Solid State Surface Mount Devices”.
Represents a maximum floor life time of
168h
ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Electrical Characteristics
Electrical Characteristics
Figure 10:
Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Operating Conditions
VDD
Positive supply voltage
2.4
3.6
V
VSS
Negative supply voltage
0
0
V
TAMB
Ambient temperature
-40
85
°C
DC/AC Characteristics for Digital Inputs and Outputs
CMOS Input
VIH
High level input voltage
0.58*
VDD
0.7*
VDD
0.83*
VDD
V
VIL
Low level input voltage
0.125*
VDD
0.2*
VDD
0.3*
VDD
V
ILEAK
Input leakage current
100
nA
CMOS Output
VOH
VDD 0.4
High level output voltage
V
With a load current of 1mA
VOL
Low level output voltage
CL
Capacitive load
For a clock frequency of 1 MHz
VSS +
0.4
V
400
pF
Tristate CMOS Output
VOH
VDD 0.4
High level output voltage
V
With a load current of 1mA
VOL
Low level output voltage
IOZ
Tristate leakage current
ams Datasheet
[v1-62] 2014-Nov-27
To VDD and VSS
VSS +
0.4
V
100
nA
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AS3930 − Electrical Characteristics
Figure 11:
Electrical System Specifications
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Input Characteristics
RIN
Input Impedance
Fmin
Fmax
In case no antenna damper is
set (R1<4>=0)
2
MΩ
Minimum Input
Frequency
110
kHz
Maximum Input
Frequency
150
kHz
Current Consumption
IPWD
Power Down Mode
400
nA
ICHRC
Current Consumption
in standard listening
mode with channel
active all the time and
RC-oscillator as RTC
2.7
μA
ICHOORC
Current Consumption
in ON/OFF mode and
RC-oscillator as RTC
ICHXT
Current Consumption
in standard listening
mode and crystal
oscillator as RTC
IDATA
Current Consumption
in Preamble detection
/ Pattern correlation /
Data receiving mode
(RC-oscillator)
11% Duty Cycle
1.37
50% Duty Cycle
2
μA
With 125 kHz carrier frequency
and 1kbps data-rate.
No load on the output pins.
3.5
5.9
μA
5.3
9
μA
Input Sensitivity
SENS
Input Sensitivity
With 125 kHz carrier frequency,
chip in default mode, 4 half bits
burst + 4 symbols preamble
and single preamble detection
100
μVrms
250
μs
32.768
kHz
Channel Settling Time
TSAMP
Amplifier settling time
Crystal Oscillator
FXTAL
Frequency
Crystal dependent
TXTAL
Start-up Time
IXTAL
Current consumption
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1
1
s
μA
ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
External Clock Source
IEXTCL
Current consumption
μA
1
RC Oscillator (1)
FRCNCAL
If no calibration is performed
27
32.768
42
kHz
FRCCAL32
If calibration with 32.768 kHz
reference signal is performed
31
32.768
34.5
kHz
Frequency
FRCCALMAX
Maximum achievable
frequency after calibration
35
kHz
FRCCALMIN
Minimum achievable
frequency after calibration
30
kHz
TRC
Start-up time
TCALRC
Calibration time
IRC
Current consumption
From RC enable (R1<0> = 0)
200
1
s
65
Periods
of
reference
clock
nA
Note(s) and/or Footnote(s):
1. RC calibration is only successful after start-up is completed.
ams Datasheet
[v1-62] 2014-Nov-27
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AS3930 − Typical Operating Characteristics
Typical Operating
Characteristics
Figure 12:
Sensitivity over Voltage and Temperature
120
95 oC
100
27 oC
-40 oC
Sensitivity [μVrms]
80
60
40
20
0
2.4
3
3.6
Supply Voltage [V]
Figure 13:
Sensitivity over RSSI
1000000
VIN = 2.4V
100000
Input Voltage [μVrms]
VIN = 1.5V
10000
VIN = 1.0V
1000
100
10
1
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30
RSSI [dB]
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[v1-62] 2014-Nov-27
AS3930 − Typical Operating Characteristics
Figure 14:
RC-Oscillator Frequency over Voltage (calibr.)
34.5
RC-OSC Frequency [KHz]
34
33.5
33
32.5
32
31.5
31
2.4
2.6
2.8
3
3.2
3.4
3.6
Supply Voltage [V]
Figure 15:
RC-Oscillator Frequency over Temperature (calibr.)
34.5
RC-OSC Frequency [KHz]
34
33.5
33
32.5
32
31.5
31
-36 -30 -20 -10
0
10
20
30
40
50
60
70
80
90
Operating Temperature [oC]
ams Datasheet
[v1-62] 2014-Nov-27
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AS3930 − Detailed Description
The AS3930 is a one-dimensional low power low-frequency
wake-up receiver. The AS3930 is capable of detecting the
presence of an inductive coupled carrier and extract the
envelope of the ON-OFF-Keying (OOK) modulated carrier. In
case the carrier is Manchester coded, then the clock is recovered
from the transmitted signal and the data can be correlated with
a programmed pattern. If the detected pattern corresponds to
the stored one, then a wake-up signal (IRQ) is risen up. The
pattern correlation can be bypassed in which case the wake-up
detection is based only on the frequency detection.
Detailed Description
The AS3930 is made up of a single receiving channel, one
envelop detector, one data correlator, 8 programmable
registers with the main logic and a real time clock.
The digital logic can be accessed by an SDI. The real time clock
can be based on a crystal or on an internal RC. If the internal RC
oscillator is used, a calibration procedure can be performed to
improve its accuracy.
Figure 16:
Block Diagram of LF Wake-up Receiver AS3930
AS3930, 1-D LF Wakeup Receiver
IRQ
Wakeup
SCL
Main
Logic
SDI
SDI
SDO
RSSI
LF1P
CS
Channel
Amplifier1
Envelope Detector / Data Slicer
Correlator
DAT
I/V
Bias
Xtal RTC
RC RTC
LFN
VCC
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GND
XIN
XOUT
ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Detailed Description
AS3930 needs the following external components:
• Power supply capacitor - CBAT - 100 nF.
• 32.768 kHz crystal with its two pulling capacitors - XTAL
and CL - (it is possible to omit these components if the
internal RC oscillator is used instead of the crystal
oscillator).
• Input LC resonator.
In case the internal RC-oscillator is used (no crystal oscillator is
mounted), the pin XIN has to be connected to the supply, while
pin XOUT should stay floating. Application diagrams with and
without crystal are shown in Figure 2 and Figure 3.
Operating Modes
Power Down Mode
In Power Down Mode AS3930 is completely switched OFF. The
typical current consumption is 400 nA.
Listening Mode
In listening mode only the channel amplifier and the RTC are
running. In this mode the system detects the presence of a
carrier. In case the carrier is detected, the RSSI can be displayed.
In this mode it is possible to distinguish the following three sub
modes:
Standard Listening Mode
The channel amplifier that is capable of detecting the presence
of the carrier frequency, is active all the time.
ON/OFF Mode (Low Power mode )
The channel amplifier is active for one millisecond after which
it is switched OFF. The OFF-time is programmable (see R4<7:6>).
Figure 17:
ON/OFF Mode
Channel
t0
t0 + 1ms
t0 + T
t0 + T + 1ms
t0 + 2T
Time
Presence
of Carrier
Time
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[v1-62] 2014-Nov-27
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AS3930 − Detailed Description
Further, for both sub modes, it is possible to enable a feature
called Artificial Wake-up. If the Artificial Wake-up is enabled,
then the AS3930 produces an interrupt after a certain time
regardless of whether any activity is detected on the input. The
period of the Artificial Wake-up is defined in the register
R8<2:0>. The user can distinguish between Artificial Wake-up
and Wake-up based on the field detection (frequency or pattern
detection) since the Artificial Wake-up interrupt lasts only
128μs. With this interrupt the microcontroller (μC) can get
feedback on the surrounding environment (e.g. read the false
wake-up register R13<7:0>) and/or take actions in order to
change the setup.
Preamble Detection / Pattern Correlation
The preamble detection and pattern correlation are only
considered for the wake-up when the data correlator function
is enabled (see R1<1>). The correlator searches first for
preamble frequency (constant frequency of Manchester clock
defined according to bit-rate transmission, see Figure 36) and
then for data pattern.
If the pattern is matched, then the wake-up interrupt is
displayed on the WAKE output and the chip goes in data
receiving mode. If the pattern fails, then the internal wake-up
is terminated and no IRQ is produced.
Data Receiving
After a successful wake-up the chip enters the data receiving
mode. In this mode the chip can be retained a normal OOK
receiver. The received data are streamed out on the pin DAT. It
is possible to put the chip back to listening mode either with a
direct command (CLEAR_WAKE see Figure 24) or by using the
timeout feature. This feature automatically sets the chip back
to listening mode after a certain time R7<7:5>.
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ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Detailed Description
System and Block Specification
Main Logic and SDI
Figure 18:
Register Table
7
6
R0
N.A..
R1
ABS_HY
R2
S_ABSH
R3
HY_20m
R4
5
4
3
ON_OFF
AGC_TLIM
AGC_UD
ATT_ON
N.A.
HY_POS
R_VAL<1:0>
T_OUT<2:0>
EN_WPAT
EN_RTC
S_WU1<1:0>
T_HBIT<4:0>
N.A.
T_AUTO<2:0>
N.A.
Reserved
N.A..
RSSI1<4:0>
R11
N.A..
R12
N.A..
R13
F_WAKE
ams Datasheet
[v1-62] 2014-Nov-27
PWD
GR<3:0>
TS1<7:0>
R10
EN_A
FS_ENV<2:0>
R6
R9
EN_PAT2
FS_SLC<2:0>
TS2<7:0>
R8
0
Reserved
R5
R7
1
Reserved
W_PAT_T<1:0>
T_OFF<1:0>
2
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Register Table Description and Default Values
Figure 19:
Description and Default Values of Registers
Register
Name
Type
Default Value
Description
R0<5>
ON_OFF
R/W
0
ON/OFF operation mode. (Duty-cycle defined in the
register R4<7:6>
R0<4>
MUX_123
R/W
0
Reserved (it is not allowed to set this bit to 1)
R0<3>
Reserved
1
Reserved
R0<2>
Reserved
1
Reserved
R0<1>
EN_A
R/W
1
Channel enable
R0<0>
PWD
R/W
0
Power down
R1<7>
ABS_HY
R/W
0
Data slicer absolute reference
R1<6>
AGC_TLIM
R/W
0
AGC acting only on the first carrier burst
R1<5>
AGC_UD
R/W
1
AGC operating in both direction (up-down)
R1<4>
ATT_ON
R/W
0
Antenna damper enable
R1<3>
Reserved
0
Reserved
R1<2>
EN_PAT2
R/W
0
Double wake-up pattern correlation
R1<1>
EN_WPAT
R/W
1
Data correlation enable
R1<0>
EN_RTC
R/W
1
Crystal oscillator enable
R2<7>
S_ABSH
R/W
0
Data slicer threshold reduction
R2<6:5>
W_PAT
R/W
00
Pattern correlation tolerance (see Figure 37)
R2<4:2>
Reserved
000
Reserved
R2<1:0>
S_WU1
R/W
00
Tolerance setting for the stage wake-up (see
Figure 31)
R3<7>
HY_20m
R/W
0
Data slicer hysteresis
if HY_20m = 0 then comparator hysteresis = 40mV
if HY_20m = 1 then comparator hysteresis = 20mV
R3<6>
HY_POS
R/W
0
Data slicer hysteresis on both edges (HY_POS = 0 →
hysteresis on both edges; HY_POS = 1 → hysteresis
only on positive edges)
R3<5:3>
FS_SCL
R/W
100
Data slicer time constant (see Figure 35)
R3<2:0>
FS_ENV
R/W
000
Envelop detector time constant (see Figure 34)
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AS3930 − Detailed Description
Register
Name
Type
Default Value
Description
OFF time in ON/OFF operation mode
R4<7:6>
T_OFF
R/W
00
T_OFF=00
1ms
T_OFF=01
2ms
T_OFF=10
4ms
T_OFF=11
8ms
R4<5:4>
D_RES
R/W
01
Antenna damping resistor (see Figure 33)
R4<3:0>
GR
R/W
0000
R5<7:0>
TS2
R/W
01101001
2nd Byte of wake-up pattern
R6<7:0>
TS1
R/W
10010110
1st Byte of wake-up pattern
R7<7:5>
T_OUT
R/W
000
R7<4:0>
T_HBIT
R/W
01011
Gain reduction (see Figure 32)
Automatic time-out (see Figure 38)
Bit rate definition (see Figure 36)
Artificial wake-up
R8<2:0>
T_AUTO
R9<6:0>
Reserved
R10<4:0>
RSSI1
R/W
000
000000
T_AUTO=000
No artificial wake-up
T_AUTO=001
1 sec
T_AUTO=010
5 sec
T_AUTO=011
20 sec
T_AUTO=100
2 min
T_AUTO=101
15min
T_AUTO=110
1 hour
T_AUTO=111
2 hour
Reserved
R
RSSI channel
R11<4:0>
R
N.A.
R12<4:0>
R
N.A.
R
False wake-up register
R13<7:0>
F_WAK
ams Datasheet
[v1-62] 2014-Nov-27
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AS3930 − Detailed Description
Serial Data Interface (SDI)
This 4-wires interface is used by the Microcontroller (μC) to
program the AS3930. The maximum clock frequency of the SDI
is 2MHz.
Figure 20:
Serial Data Interface (SDI) pins
Name
Signal
Signal Level
Description
CS
Digital Input with pull down
CMOS
Chip Select
SDI
Digital Input with pull down
CMOS
Serial Data input for writing registers, data to
transmit and/or writing addresses to select
readable register
SDO
Digital Output
CMOS
Serial Data output for received data or read
value of selected registers
SCLK
Digital Input with pull down
CMOS
Clock for serial data read and write
Note(s): SDO is set to tristate if CS is low. In this way more than
one device can communicate on the same SDO bus.
SDI Command Structure. To program the SDI the CS signal has
to go high. A SDI command is made up by a two bytes serial
command and the data is sampled on the falling edge of SCLK.
Figure 21 shows how the command looks like, from the MSB
(B15) to LSB (B0). The command stream has to be sent to the
SDI from the MSB (B15) to the LSB (B0).
Figure 21:
SDI Command Structure
Mode
B15
B14
Register address / Direct Command
B13
B12
B11
B10
B9
B8
Register Data
B7
B6
B5
B3
B2
B1
B0
The first two bits (B15 and B14) define the operating mode.
There are three modes available (write, read, direct command)
plus one spare (not used), as shown in Figure 22.
Figure 22:
Bits B15, B14
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B15
B14
Mode
0
0
WRITE
0
1
READ
1
0
NOT ALLOWED
1
1
DIRECT COMMAND
ams Datasheet
[v1-62] 2014-Nov-27
In case a write or read command happens the next 6 bits (B13
to B8) define the register address which has to be written
respectively read, as shown in Figure 23.
Figure 23:
Bits B13-B8
B13
B12
B11
B10
B9
B8
Read/Write register
0
0
0
0
0
0
R0
0
0
0
0
0
1
R1
0
0
0
0
1
0
R2
0
0
0
0
1
1
R3
0
0
0
1
0
0
R4
0
0
0
1
0
1
R5
0
0
0
1
1
0
R6
0
0
0
1
1
1
R7
0
0
1
0
0
0
R8
0
0
1
0
0
1
R9
0
0
1
0
1
0
R10
0
0
1
0
1
1
R11
0
0
1
1
0
0
R12
0
0
1
1
0
1
R13
The last 8 bits are the data that has to be written respectively
read. A CS toggle high-low-high terminates the command
mode.
If a direct command is sent (B15-B14=11) the bits from B13 to
B8 defines the direct command while the last 8 bits are omitted.
Figure 24 shows all possible direct commands:
Figure 24:
List of Direct Commands
COMMAND_MODE
B13
B12
B11
B10
B9
B8
clear_wake
0
0
0
0
0
0
reset_RSSI
0
0
0
0
0
1
trim_osc
0
0
0
0
1
0
clear_false
0
0
0
0
1
1
preset_default
0
0
0
1
0
0
ams Datasheet
[v1-62] 2014-Nov-27
Page 19
Document Feedback
AS3930 − Detailed Description
All direct commands are explained below:
• clear_wake: Clears the wake state of the chip. In case the
chip has woken up (WAKE pin is high) the chip is set back
to listening mode.
• reset_RSSI: Resets the RSSI measurement.
• trim_osc: Starts the trimming procedure of the internal
RC oscillator (see Figure 45).
• clear_false: Resets the false wake-up register
(R13<7:0>=00).
• preset_default: Sets all register in the default mode, as
shown in Figure 19.
Note(s): In order to get the AS3930 work properly after sending
the preset_default direct command, it is mandatory to write
R0<3>=0 and R0<2>=0.
Writing of Data to Addressable Registers (WRITE Mode).
The SDI is sampled at the falling edge of SCLK (as shown in the
following diagrams).
A CS toggling high-low-high indicates the end of the WRITE
command after register has been written. The following
example shows a write command.
Figure 25:
Writing of a Single Byte (falling edge sampling)
CS
SCLK
SDI
X
0
0
Two leading
Zeros indicate
WRITE Mode
A5
A4
A3
SCLK rising
edge Data is
transfered from
μC
A2
A1
A0
D7
D6
D5
D4
D3
SCLK
falling edge
Data is
sampled
D2
D1
X
D0
Data is moved
to Address
A5-A0
CS falling
edge signals
end of
WRITE Mode
Figure 26:
Writing of Register Data with Auto-incrementing Address
CS
SCLK
SDI
A A A A A D D D D D D D D D D D D D D D D D D
X 0 0 A
5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6
Two leading
Zeros indicate
WRITE Mode
Page 20
Document Feedback
Data is moved
to Address
<A5-A0 >
Data is moved
to Address
<A5-A0 > + 1
D D D D D D D D D D
1 0 7 6 5 4 3 2 1 0
Data is moved
to Address
<A5-A0 > + (n-1)
Data is moved
to Address
<A5-A0 > + n
X
CS falling
edge signals
end of
WRITE Mode
ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Detailed Description
Reading of Data from Addressable Registers (READ Mode).
Once the address has been sent through SDI, the data can be
fed through the SDO pin out to the microcontroller.
A CS LOW toggling high-low-high has to be performed after
finishing the read mode session, in order to indicate the end of
the READ command and prepare the Interface to the next
command control Byte.
To transfer bytes from consecutive addresses, SDI master has to
keep the CS signal high and the SCLK clock has to be active as
long as data need to be read.
Figure 27:
Reading of Single Register Byte
CS
SCLK
SDI
X
0
1
A5
SDO
A4
A3
A2
A1
X
D7
SCLK rising
edge Data is
transfered from
μC
01 pattern
indicates
READ Mode
X
A0
SCLK
falling edge
Data is
sampled
D6
D5
SCLK rising
edge Data is
moved from
Address
<A5-A0>
D4
D3
D2
D1
D0
X
CS falling
edge signals
end of READ
Mode
SCLK falling
edge Data is
transfered to
μC
Figure 28:
Send Direct COMMAND Byte
CS
SCLK
SDI
X
1
1
Two leading
ONE indicate
COMMAND
Mode
ams Datasheet
[v1-62] 2014-Nov-27
C5
C4
C3
SCLK rising
edge Data is
transfered from
μC
C2
C1
SCLK
falling edge
Data is
sampled
C0
X
CS falling edge
signals the end of
COMMAND Mode
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AS3930 − Detailed Description
SDI Timing
Figure 29:
SDI Timing Parameters
Symbol
Parameter
Min
Typ
Max
Units
TCSCLK
Time CS to Sampling Data
500
ns
TDCLK
Time Data to Sampling Data
300
ns
THCL
SCLK High Time
200
ns
TCLK
SCLK period
500
ns
TCLKCS
Time Sampling Data to CS down
500
ns
TCST
CS Toggling time
500
ns
Figure 30:
SDI Timing Diagram
TCST
CS
SPI
SCLK
SCL
t
TCSCLK
TDCLK
t
THCL
TCLKCS
t
TCLK
Channel Amplifier and Frequency Detector
The channel amplifier consists of a variable gain amplifier
(VGA), an automatic gain control, and a frequency detector. The
latter detects the presence of a carrier. As soon as the carrier is
detected the AGC is enabled, the gain of the VGA is reduced
and set to the right value and the RSSI can be displayed.
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ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Detailed Description
Frequency Detector / AGC
The frequency detection uses the RTC as time base. In case the
internal RC oscillator is used as RTC, it must be calibrated, but
the calibration is guaranteed for a 32.768 kHz crystal oscillator
only. The frequency detection criteria can be tighter or more
relaxed according to the setup described in R2<1:0> (see
Figure 31).
Figure 31:
Tolerance Settings for Wake-up
R2<1>
R2<0>
Tolerance
0
0
Relaxed
0
1
Tighter (Medium)
1
0
Stringent
1
1
Reserved
The AGC can operate in two modes:
• AGC down only (R1<5>=0)
• AGC up and down (R1<5>=1)
As soon as the AGC starts to operate, the gain in the VGA is set
to maximum. If the AGC down only mode is selected, the AGC
can only decrease the gain. Since the RSSI is directly derived
from the VGA gain, the system holds the RSSI peak.
When the AGC up and down mode is selected, the RSSI can
follow the input signal strength variation in both directions.
Regardless which AGC operation mode is used, the AGC needs
maximum 35 carrier periods to settle.
The RSSI is stored in the register R10<4:0>.
Both AGC modes (only down or down and up) can also operate
with time limitation. This option allows AGC operation only in
time slot of 256μs following the internal wake-up. Then the AGC
(RSSI) is frozen till the wake-up or RSSI reset occurs.
The RSSI is reset either with the direct command 'clear_wakeup'
or 'reset_RSSI'. The 'reset_RSSI' command resets only the AGC
setting but does not terminate wake-up condition. This means
that if the signal is still present the new AGC setting (RSSI) will
appear not later than 300μs (35 LF carrier periods) after the
command was received. The AGC setting is reset if for duration
of 3 Manchester half symbols no carrier is detected. If the
wake-up IRQ is cleared the chip will go back to listening mode.
In case the maximum amplification at the beginning is a
drawback (e.g. in noisy environment) it is possible to set a
smaller starting gain on the amplifier Figure 32. In this way it is
possible to reduce the false frequency detection.
ams Datasheet
[v1-62] 2014-Nov-27
Page 23
Document Feedback
AS3930 − Detailed Description
Figure 32:
Bit Setting of Gain Reduction
R4<3>
R4<2>
R4<1>
R4<0>
Gain Reduction
0
0
0
0
No gain reduction
0
0
0
1
N.A..
0
0
1
0 or 1
N.A..
0
1
0
0 or 1
-4dB
0
1
1
0 or 1
-8dB
1
0
0
0 or 1
-12dB
1
0
1
0 or 1
-16dB
1
1
0
0 or 1
-20dB
1
1
1
0 or 1
-24dB
Antenna Damper
The antenna damper allows the chip to deal with higher field
strength, it is enabled by register R1<4>. It consists of shunt
resistors which degrade the quality factor of the resonator by
reducing the signal at the input of the amplifier. In this way the
resonator sees a smaller parallel resistance (in the band of
interest) which degrades its quality factor in order to increase
the linear range of the channel amplifier (the amplifier doesn't
saturate in presence of bigger signals). Figure 33 shows the bit
setup.
Figure 33:
Antenna Damper Bit Setup
Page 24
Document Feedback
R4<5>
R4<4>
Shunt resistor (parallel to the
resonator at 125 kHz)
0
0
1 kΩ
0
1
3 kΩ
1
0
9 kΩ
1
1
27 kΩ
ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Detailed Description
Demodulator / Data Slicer
The performance of the demodulator can be optimized
according to bit rate and preamble length as described in
Figure 34 and Figure 35.
Figure 34:
Bit Setup for Envelop Detector for Different Symbol Rates
R3<2>
R3<1>
R3<0>
Symbol Rate
[Manchester symbol/s]
0
0
0
4096
0
0
1
2184
0
1
0
1490
0
1
1
1130
1
0
0
910
1
0
1
762
1
1
0
655
1
1
1
512
If the bit rate gets higher, the time constant in the envelop
detector must be set to a smaller value. This means that higher
noise is injected because of the wider band. The next table is a
rough indication of how the envelop detector looks like for
different bit rates. By using proper data slicer settings it is
possible to improve the noise immunity paying the penalty of
a longer preamble. In fact if the data slicer has a bigger time
constant it is possible to reject more noise, but every time a
transmission occurs, the data slicer need time to settle. This
settling time will influence the length of the preamble.
Figure 35 gives a correlation between data slicer setup and
minimum required preamble length.
ams Datasheet
[v1-62] 2014-Nov-27
Page 25
Document Feedback
AS3930 − Detailed Description
Figure 35:
Bit Setup for Data Slicer for Different Preamble Length
R3<5>
R3<4>
R3<3>
Minimum Preamble
Length [ms]
0
0
0
0.8
0
0
1
1.15
0
1
0
1.55
0
1
1
1.9
1
0
0
2.3
1
0
1
2.65
1
1
0
3
1
1
1
3.5
Note(s): These times are minimum required, but it is
recommended to prolong the preamble.
The comparator of the data slicer can work only with positive
or with symmetrical threshold R3<6>. In addition the threshold
can be 20 or 40 mV R3<7>. In case the length of the preamble
is an issue the data slicer can also work with an absolute
threshold R1<7>. In this case the bits R3<2:0> would not
influence the performance. It is even possible to reduce the
absolute threshold in case the environment is not particularly
noisy R2<7>.
Correlator
After frequency detection the data correlation is only
performed if the correlator is enabled (R1<1>=1).
The data correlation consists of checking the presence of a
preamble (ON/OFF modulated carrier) followed by a certain
pattern.
After the frequency detection the correlator waits 16 bits (see
bit rate definition in Figure 36) and if no preamble is detected
the chip is set back to listening mode and the false wake-up
register (R13<7:0>) is incremented by one.
To get started with the pattern correlation the correlator needs
to detect at least 4 bits of the preamble (ON/OFF modulated
carrier).
The bit duration is defined in the register R7<4:0>(Figure 36) as
function of the Real Time Clock (RTC) periods.
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ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Detailed Description
Figure 36:
Bit Rate Setup
R7
<4>
R7
<3>
R7
<2>
R7
<1>
R7
<0>
Bit Duration in
RTC Clock Periods
Bit Rate
(bits/s)
Symbol Rate
(Manchester symbols/s)
0
0
0
1
1
4
8192
4096
0
0
1
0
0
5
6552
3276
0
0
1
0
1
6
5460
2730
0
0
1
1
0
7
4680
2340
0
0
1
1
1
8
4096
2048
0
1
0
0
0
9
3640
1820
0
1
0
0
1
10
3276
1638
0
1
0
1
0
11
2978
1489
0
1
0
1
1
12
2730
1365
0
1
1
0
0
13
2520
1260
0
1
1
0
1
14
2340
1170
0
1
1
1
0
15
2184
1092
0
1
1
1
1
16
2048
1024
1
0
0
0
0
17
1926
963
1
0
0
0
1
18
1820
910
1
0
0
1
0
19
1724
862
1
0
0
1
1
20
1638
819
1
0
1
0
0
21
1560
780
1
0
1
0
1
22
1488
744
1
0
1
1
0
23
1424
712
1
0
1
1
1
24
1364
682
1
1
0
0
0
25
1310
655
1
1
0
0
1
26
1260
630
1
1
0
1
0
27
1212
606
1
1
0
1
1
28
1170
585
1
1
1
0
0
29
1128
564
1
1
1
0
1
30
1092
546
1
1
1
1
0
31
1056
528
1
1
1
1
1
32
1024
512
ams Datasheet
[v1-62] 2014-Nov-27
Page 27
Document Feedback
AS3930 − Detailed Description
If the preamble is detected correctly the correlator keeps
searching for a data pattern. The duration of the preamble plus
the pattern should not be longer than 40 bits (see bit rate
definition in Figure 36). The data pattern can be defined by the
user and consists of two bytes which are stored in the registers
R5<7:0> and R6<7:0>. The two bytes define the pattern
consisting of 16 half bit periods. This means the pattern and the
bit period can be selected by the user. The only limitation is that
the pattern (in combination with preamble) must obey
Manchester coding and timing. It must be noted that according
to Manchester coding a down-to-up bit transition represents a
symbol "0", while a transition up-to-down represents a symbol
"1". If the default code is used (96 [hex]) the binary code is
(10 01 01 10 01 10 10 01). MSB has to be transmitted first.
The user can also select (R1<2>) if single or double data pattern
is used for wake-up. In case double pattern detection is set, the
same pattern has to be repeated 2 times.
Additionally it is possible to set the number of allowed missing
zero bits (not symbols) in the received bitstream (R2<6:5>), as
shown in the Figure 37.
Figure 37:
Allowed Pattern Detection Errors
R2<6>
R2<5>
Maximum allowed error in the
pattern detection
0
0
No error allowed
0
1
1 missed zero
1
0
2 missed zeros
1
1
3 missed zeros
If the pattern matches the wake-up, interrupt is displayed on
the WAKE output.
If the pattern detection fails, the internal wake-up (on all active
channels) is terminated with no signal sent to MCU and the false
wake-up register will be incremented (R13<7:0>).
The wake-up state is terminated with the direct command
‘clear_wake’ (see Figure 24). This command terminates the MCU
activity. The termination can also be automatic in case there is
no response from MCU. The time out for automatic termination
is set in a register R7<7:5>, as shown in theFigure 38.
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ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Detailed Description
Figure 38:
Timeout Setup
R7<7>
R7<6>
R7<5>
Time out
0
0
0
0 sec
0
0
1
50 msec
0
1
0
100 msec
0
1
1
150 msec
1
0
0
200 msec
1
0
1
250 msec
1
1
0
300 msec
1
1
1
350 msec
Wake-up Protocol - Carrier Frequency 125 kHz
Without Pattern Detection
Figure 39:
Wake-up Protocol Overview without Pattern Detection (only carrier frequency detection)
Carrier Burst
Data
Carrier Burst > 550 us
DAT
WAKE
Clear_wake
ams Datasheet
[v1-62] 2014-Nov-27
Page 29
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AS3930 − Detailed Description
In case the data correlation is disabled (R1<1>=0) the AS3930
wakes up upon detection of the carrier frequency only as shown
in Figure 39. In order to ensure that AS3930 wakes up the carrier
burst has to last longer than 550 μs. To set AS3930 back to
listening mode there are two possibilities: either the
microcontroller sends the direct command clear_wake via SDI
or the time out option is used ( R7<7:5>). In case the latter is
chosen, AS3930 is automatically set to listening mode after the
time defined in T_OUT ( R7<7:5>), counting starts at the
low-to-high WAKE edge on the WAKE pin.
Single Pattern Detection
The Figure 40 shows the wake-up protocol in case the pattern
correlation is enabled (R1<1>=1) for a 125 kHz carrier
frequency. The initial carrier burst has to be longer than 550 μs
and can last maximum 16 bits (see bit rate definition in
Figure 36). If the ON/OFF mode is used ( R1<5>=1), the
minimum value of the maximum carrier burst duration is
limited to 10 ms. This is summarized in Figure 41. In case the
carrier burst is too long the internal wake-up will be set back to
low and the false wake-up counter (R13<7:0>) will be
incremented by one.
The carrier burst must be followed by a preamble (0101...
modulated carrier with a bit duration defined in Figure 36) and
the wake-up pattern stored in the registers R5<7:0> and
R6<7:0>. The preamble must have at least 4 bits and the
preamble duration together with the pattern should not be
longer than 40 bits. If the wake-up pattern is correct, the signal
on the WAKE pin goes high one bit after the end of the pattern
and the data transmission can get started. To set the chip back
to listening mode the direct command clear_wake, as well as
the time out option ( R7<7:5>) can be used.
Figure 40:
Wake-up Protocol Overview with Single Pattern Detection
Carrier Burst
Preamble
Pattern
Data
1-bit Preamble
Carrier Burst>360 us
Carrier Burst<16-bit duration
Preamble > 4-bit duration
Preamble + Pattern < 40-bit duration
DAT
WAKE
Clear_wake
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ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Detailed Description
Figure 41:
Preamble Requirements in Standard Mode, Scanning Mode and ON/OFF Mode
Bit Rate
(bits/s)
Maximum Duration of the Carrier Burst in
Standard Mode and Scanning Mode (ms)
Maximum Duration of the Carrier
Burst in ON/OFF Mode (ms)
8192
1.95
10
6552
2.44
10
5460
2.93
10
4680
3.41
10
4096
3.90
10
3640
4.39
10
3276
4.88
10
2978
5.37
10
2730
5.86
10
2520
6.34
10
2340
6.83
10
2184
7.32
10
2048
7.81
10
1926
8.30
10
1820
8.79
10
1724
9.28
10
1638
9.76
10
1560
10.25
10.25
1488
10.75
10.75
1424
11.23
11.23
1364
11.73
11.73
1310
12.21
12.21
1260
12.69
12.69
1212
13.20
13.20
1170
13.67
13.67
1128
14.18
14.18
1092
14.65
14.65
1056
15.15
15.15
1024
15.62
15.62
ams Datasheet
[v1-62] 2014-Nov-27
Page 31
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AS3930 − Detailed Description
False Wake-up Register
The wake-up strategy in the AS3930 is based on 2 steps:
1. Frequency Detection: In this phase the frequency of
the received signal is checked.
2. Pattern Correlation: Here the pattern is demodulated
and checked whether it corresponds to the valid one.
If there is a disturber or noise capable to overcome the first step
(frequency detection) without producing a valid pattern, then
a false wake-up call happens.Each time this event is recognized
a counter is incremented by one and the respective counter
value is stored in a memory cell (false wake-up register). Thus,
the microcontroller can periodically look at the false wake-up
register, to get a feeling how noisy the surrounding
environment is and can then react accordingly (e.g. reducing
the gain of the LNA during frequency detection, set the AS3930
temporarily to power down etc.), as shown in the Figure 42. The
false wake-up counter is a useful tool to quickly adapt the
system to any changes in the noise environment and thus avoid
false wake-up events.
Most wake-up receivers have to deal with environments that
can rapidly change. By periodically monitoring the number of
false wake-up events it is possible to adapt the system setup to
the actual characteristics of the environment and enables a
better use of the full flexibility of AS3930.
Figure 42:
Concept of the False Wake-up Register Together with System
Wakeup
Level 1
Frequency Detector
Wakeup
Level 2
Pattern Correlator
WAKE
Unsuccessful
pattern
correlation
CHANGE SETUP TO
MINIMIZE THE FALSE
WAKEUP EVENTS
Register Setup
False wakeup
register
READ FALSE WAKEUP REGISTER
Microcontroller
Page 32
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ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Detailed Description
Real Time Clock (RTC)
The RTC can be based on a crystal oscillator (R1<0>=1), the
internal RC-oscillator (R1<0>=0), or an external clock source
(R1<0>=1). The crystal has higher precision of the frequency
but a higher current consumption and needs three external
components (crystal plus two capacitors). The RC-oscillator is
completely integrated and can be calibrated if a reference
signal is available for a very short time to improve the frequency
accuracy. The calibration gets started with the trim_osc direct
command. Since no non-volatile memory is available the
calibration must be done every time after the RCO was turned
OFF. The RCO is turned OFF when the chip is in power down
mode, a POR happened, or the crystal oscillator is enabled.
Since the RTC defines the time base of the frequency detection,
the selected frequency (frequency of the crystal oscillator or
the reference frequency used for calibration of the RC oscillator)
should be about one forth of the carrier frequency:
(EQ1)
F RTC ∼ F CAR∗ 0.25
Where:
F CAR is the carrier frequency
F RTC is the RTC frequency
Note(s): The third option for the RTC is the use of an external
clock source, which must be applied directly to the XIN pin
(XOUT floating).
Crystal Oscillator
Figure 43:
Characteristics of XTAL
Parameter
Conditions
Crystal accuracy (initial)
Overall accuracy
Min
Typ
Crystal motional resistance
Max
Units
±120
p.p.m.
60
KΩ
Frequency
32.768
kHz
Contribution of the oscillator to
the frequency error
±5
p.p.m
1
s
Start-up Time
Duty cycle
Current consumption
ams Datasheet
[v1-62] 2014-Nov-27
Crystal dependent
45
50
1
55
%
μA
Page 33
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AS3930 − Detailed Description
RC-Oscillator
Figure 44:
Characteristics of RCO
Parameter
Conditions
Min
Typ
Max
Units
If no calibration is performed
27
32.768
42
kHz
If calibration is performed
31
32.768
34.5
kHz
65
cycles
Frequency
Calibration time
Periods of reference clock
Current consumption
200
nA
To trim the RC-Oscillator, set the chip select (CS) to high before
sending the direct command trim_osc over SDI. Then 65 digital
clock cycles of the reference clock (e.g. 32.768 kHz) have to be
sent on the clock bus (SCLK), as shown in Figure 45. After that
the signal on the chip select (CS) has to be pulled down.
The calibration is effective after the 65th reference clock edge
and it will be stored in a volatile memory. In case the
RC-oscillator is switched OFF or a power-ON-reset happens (e.g.
battery change) the calibration has to be repeated.
Figure 45:
RC-Oscillator Calibration via SDI
65 clock cycles
CS
SCLK
SDI
X
1
1
0
0
0
DIRECT COMMAND
Trim_osc
0
1
X
0
REFERENCE CLOCK
External Clock Source
To clock the AS3930 with an external signal the crystal oscillator
has to be enabled (R1<0>=1). As shown in the Figure 4 the clock
must be applied on the pin XIN while the pin XOUT must stay
floating. The RC time constant has to be 100μs with a tolerance
of ±10% (e.g. R=680 kΩ and C=22pF). In the Figure 46 the clock
characteristics are summarized.
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ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Detailed Description
Figure 46:
Characteristics of External Clock
Symbol
Parameter
Min
VI
Low level
Vh
High level
Tr
Max
Units
0
0.1 * VDD
V
0.9 * VDD
VDD
V
Rise-time
3
μs
Tf
Fall-time
3
μs
T =1/2πRC
RC Time constant
110
μs
90
Typ
100
Note(s): In power down mode the external clock has to be set
to V DD.
ams Datasheet
[v1-62] 2014-Nov-27
Page 35
Document Feedback
AS3930 − Package Drawings & Mark ings
Package Drawings & Markings
The product is available in a 16-pin TSSOP and QFN 4×4 16 LD
package.
Figure 47:
16-pin TSSOP Package
AS3930 @
YYWWMZZ
Symbol
Min
Nom
Max
A
-
-
1.20
A1
0.05
-
0.15
A2
0.80
1.00
1.05
b
0.19
-
0.30
c
0.09
-
0.20
D
4.90
5.00
5.10
E
-
6.40 BSC
-
E1
4.30
4.40
4.50
e
-
0.65 BSC
-
L
0.45
0.60
0.75
L1
-
1.00 REF
-
R
0.09
-
-
R1
0.09
-
-
-
S
0.20
Θ1
0º
-
Θ2
-
12 REF
-
Θ3
-
12 REF
-
8º
aaa
-
0.10
-
bbb
-
0.10
-
ccc
-
0.05
-
ddd
-
0.20
-
N
16
Green
RoHS
Note(s) and/or Footnote(s):
1. Dimensions and tolerancing conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters. Angles are in degrees.
Figure 48:
Marking: @YYWWMZZ
@
YY
WW
M
ZZ
Sublot identifier
Year
Manufacturing Week
Assembly plant identifier
Assembly traceability code
Page 36
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ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Package Drawings & Markings
Figure 49:
QFN 4× 4 16 LD Package
AS3930
YYWWXZZ
@
Symbol
Min
Nom
Max
A
0.80
0.85
0.90
A1
0
A3
0.05
0.203 REF
b
0.18
0.23
0.28
D
4.00 BSC
E
4.00 BSC
D2
2.60
2.70
2.80
E2
2.60
2.70
2.80
e
0.65 BSC
L
0.35
L1
0.00
0.40
0.10
aaa
0.10
bbb
0.10
ccc
0.10
ddd
0.05
eee
0.08
RoHS
0.45
Green
Note(s) and/or Footnote(s):
1. Dimensions and tolerancing conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters. Angles are in degrees.
3. Dimension b applies to metallized terminal and is measured between 0.25mm and 0.30mm from terminal tip. Dimension L1
represents terminal full back from package edge up to 0.15mm is acceptable.
4. Coplanarity applies to the exposed heat slug as well as the terminal.
5. Radius on terminal is optional.
Figure 50:
Marking: [email protected]
YY
WW
X
ZZ
@
Year
Manufacturing Week
Assembly plant identifier
Assembly traceability code
Sublot identifier
ams Datasheet
[v1-62] 2014-Nov-27
Page 37
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AS3930 − Ordering & Contact Information
Ordering & Contact Information
Figure 51:
Ordering Information
Ordering
Code
Type
Marking
Delivery Form(1)
Delivery Quantity
AS3930-BTST
16-pin TSSOP
AS3930
7 inches Tape & Reel
1000 pcs
AS3930-BQFT
QFN (4×4) 16LD
AS3930
7 inches Tape & Reel
1000 pcs
Note(s) and/or Footnote(s):
1. Dry Pack: Moisture Sensitivity Level (MSL) = 3, according to IPC/JEDEC J-STD-033A.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Page 38
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ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
ams Datasheet
[v1-62] 2014-Nov-27
Page 39
Document Feedback
AS3930 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141
Unterpremstaetten, Austria-Europe. Trademarks Registered. All
rights reserved. The material herein may not be reproduced,
adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Page 40
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ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
ams Datasheet
[v1-62] 2014-Nov-27
Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Page 41
Document Feedback
AS3930 − Revision Information
Revision Information
Changes from 1.5 (2013-Feb-04) to current revision 1-62 (2014-Nov-27)
Page
Content was updated to the latest ams design
Updated General Description & Figure 1
1
Updated Pin Assignments section
4
Added TRC (start-up time) parameter in Figure 11 and a note under it
8
Updated Figure 29
22
Updated Package Drawings & Markings section
36
Note(s) and/or Footnote(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Page 42
Document Feedback
ams Datasheet
[v1-62] 2014-Nov-27
AS3930 − Content Guide
Content Guide
ams Datasheet
[v1-62] 2014-Nov-27
1
1
2
General Description
Key Benefits & Features
Applications
4
4
5
Pin Assignments
16-pin TSSOP
QFN 4x4 16 LD
6
7
10
Absolute Maximum Ratings
Electrical Characteristics
Typical Operating Characteristics
12
13
13
13
13
13
14
14
15
15
16
18
22
22
23
24
25
26
29
29
30
32
33
33
34
34
Detailed Description
Operating Modes
Power Down Mode
Listening Mode
Standard Listening Mode
ON/OFF Mode (Low Power mode )
Preamble Detection / Pattern Correlation
Data Receiving
System and Block Specification
Main Logic and SDI
Register Table Description and Default Values
Serial Data Interface (SDI)
SDI Timing
Channel Amplifier and Frequency Detector
Frequency Detector / AGC
Antenna Damper
Demodulator / Data Slicer
Correlator
Wake-up Protocol - Carrier Frequency 125 kHz
Without Pattern Detection
Single Pattern Detection
False Wake-up Register
Real Time Clock (RTC)
Crystal Oscillator
RC-Oscillator
External Clock Source
36
38
39
40
41
42
Package Drawings & Markings
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
Page 43
Document Feedback