AS3685C

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austriamicrosystems
AS3685C
Datasheet
Datasheet
AS3685C
1 General Description
ƒ
LED cathode disconnect in Shutdown
ƒ
Overtemperature Protection
ƒ
Automatic Flash Timeout to protect the LED
− Adjustable between off, 100ms…1500ms
ƒ
Two Wire Interface
− Accurate Control of Currents and Modes
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Additionally the AS3685 limits the flash time
automatically to protect the flash LED.
ƒ
2 Key Features
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The AS3685 is low noise high efficiency capacitive
charge pump with 1:1, 1:1.5 and 1:2 operating
modes in a small 3x3mm DFN10 or a tiny 2x1.5mm
WL-CSP (Wafer Level Chip Scale Package)
package. It can drive one flash led at up to 1000mA
current. It supports flash/torch and indicator mode
for the flash led.
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Ultra Small High Efficiency 1000mA Charge Pump for White
LED Flash with Two Wire Serial Interface
High Efficiency capactive charge pump with 1:1,
1:1.5 and 1:2 modes
− 1:2 Mode can be disabled by interface
ƒ
Up to 1000mA Led Current
ƒ
Automatic Charge Pump Mode switching (Up)
Package
− DFN10 3x3mm (10 pins + exposed pad)
− WL-CSP (Wafer Level Chip Scale Package)
3x4 balls 0.5mm pitch (2x1.5mm)
3 Applications
ƒ
Flash / Torch for Mobile Phones, Digital
Cameras and PDA
4 Application Diagram
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Figure 1 – Application Diagram of AS3685C
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AS3685C
Datasheet
Table of Contents
General Description........................................................................................................................................... 1
Key Features ..................................................................................................................................................... 1
Applications ....................................................................................................................................................... 1
Application Diagram .......................................................................................................................................... 1
Characteristics................................................................................................................................................... 3
5.1 Absolute Maximum Ratings..................................................................................................................... 3
5.2 Operating Conditions .............................................................................................................................. 3
5.3 Electrical Characteristics ......................................................................................................................... 4
6 Typical Operation Characteristics...................................................................................................................... 6
7 Detailed Functional Description ......................................................................................................................... 8
7.1 Low Noise Charge Pump ........................................................................................................................ 8
7.1.1 Mode Switching........................................................................................................................ 8
7.1.2 Soft Start .................................................................................................................................. 9
7.2 Current Source (Sink).............................................................................................................................. 9
7.2.1 AS3685 TXMask Function...................................................................................................... 12
7.3 Protection Functions.............................................................................................................................. 13
7.3.1 Overtemperature Protection ................................................................................................... 13
7.3.2 Flash Timeout ........................................................................................................................ 13
7.4 Layout Recommendations..................................................................................................................... 13
8 External Components ...................................................................................................................................... 14
8.1 Capacitor and Resistor Selection .......................................................................................................... 14
8.2 Usage of PCB Wire Inductance............................................................................................................. 14
8.3 External Component Specifications ...................................................................................................... 14
9 Pinout and Packaging...................................................................................................................................... 15
9.1 DFN10 3x3mm ...................................................................................................................................... 15
9.1.1 Pin Assignments DFN10 3x3mm ........................................................................................... 15
9.1.2 Pin Descriptions DFN10 3x3mm ............................................................................................ 15
9.1.3 Package Drawings and Marking DFN10 3x3.......................................................................... 16
9.2 WL-CSP 2x1.5mm (Wafer Level Chip Scale Package) ......................................................................... 18
9.2.1 Pin Assignments WL-CSP 2x1.5mm...................................................................................... 18
9.2.2 Pin Descriptions WL-CSP 2x1.5mm....................................................................................... 18
9.2.3 Package Drawings and Marking WL-CSP 2x1.5mm .............................................................. 19
10 Ordering Information........................................................................................................................................ 20
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1
2
3
4
5
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AS3685C
Datasheet
5 Characteristics
5.1 Absolute Maximum Ratings
Stresses beyond those listed in Table 1 may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in Section 5
Electrical Characteristics is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameter
Min
Max
Unit
VBATMAX
Maximum Supply Voltage
-0.3
7.0
V
IIN
Input Pin Current without causing
latchup
-25
+25
mA
TSTRG
Storage Temperature Range
-55
125
°C
Humidity
5
85
%
VESD
Electrostatic Discharge
-1000
1000
V
PT
Total Continuous Power Dissipation
TBODY
Notes:
1.
Non condensing
Norm: MIL 883 E Method 3015
W
DFN10 3x3mm, TA = 70°C 1
1.02
W
WL-CSP 2x1.5mm, TA = 70°C 1
16.3
mW/
°C
DFN10 3x3mm
14.7
mW/
°C
WL-CSP 2x1.5mm
Junction Temperature
150
°C
Body Temperature during Soldering
260
°C
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TJUNC
At 25ºC, Norm: Jedec 17
1.14
PT Derating Factor 2
PDERATE
Note
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Symbol
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Table 1 – Absolute Maximum Ratings
according to IPC/JEDEC JSTD-020
Depending on actual PCB layout and PCB used; for peak power dissipation during flashing see
document ‘AS3685 Thermal Measurements’
For 1A flash current see application notes ‘AN3685_1Aflash’ and ‘AN3685_1Aflash_thermal_1v0’.
The PT derating factor changes the total continuous power dissipation, if the ambient temperature
is different to 70°C. Therefore for e.g. 85°C calculate PT85°C = PT – PDERATE * (85°C – 70 °C)
2.
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5.2 Operating Conditions
Table 2 – Operating Conditions
VBAT
Parameter
Min
Typ
Max
Unit
Note
Battery Supply Voltage
3.0
3.6
5.5
V
Supply voltage range
Battery Supply Voltage,
Functionally working
2.6
V
AS3685 functionally working,
but not all parameters fulfilled
0.4
A
Depending on load current
and charge pump mode
2.0
A
Limited lifetime, max 20,000s
25
85
°C
1.0
4.0
μA
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VBATFUNC
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IBAT
Operating Current
TAMB
Ambient Temperature
IOFF
Off mode current
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Mode setting=off;
VBAT<=4.2V
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AS3685C
Datasheet
Table 2 – Operating Conditions
Symbol
Parameter
IOPERATING
Min
Typ
Power Consumption without
load
Max
Unit
Note
0.85
mA
1:1 Mode
6.6
mA
1:1.5 Mode
8.1
mA
1:2 Mode
Max
Unit
Note
VBAT *
CPmode
V
CP-mode is 1, 1.5 or 2
(automatically selected)
Parameter
VCPOUT
V(VCP) Output voltage
without load – do not short to
VSS
Output limitation
Min
Typ
Charge Pump effective
Resistance
RCP
Eta
5.4
5.6
0.28
0.53
internally limited
Ω
1:1 Mode
VBAT = 3.6V, ICPOUT = 200mA
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Symbol
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Table 3 – Charge Pump Characteristics
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5.3 Electrical Characteristics
Efficiency
1.37
2.00
Ω
1:1.5 Mode
VBAT = 3.3V, ICPOUT = 500mA,
TJUNCTION<=85°C
1.95
2.44
Ω
1:2 Mode
VBAT = 3.0V, ICPOUT=700mA,
TJUNCTION<=85°C
93
%
Vin=3.0V-4.5V, Iout=100mA
(Charge Pump alone)
mVpp
Vin=3.0-4.5V, Iout=350mA,
75
VRIPPLE
Output ripple voltage
fclk
Operating Frequency
tUP_DEB_LONG
Initial Mode Switching
Debounce Time
256
μs
tUP_DEB
Mode Switching Debounce
Time
16
μs
100
-20%
1.0
+20%
MHz
Mode switching up-debounce
time after enabling of the
charge pump or after mode
switching between 1:1 to 1:1.5
Mode switching up-debounce
time in normal operation
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Table 4 – Current Source (Sink) Characteristics
Symbol
Parameter
Output Current Range
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ILED
Min
IACCURACY
Current Setting Accuracy
-10%
Typ
Max
Unit
Note
700
1000
mA
700mA: RISET = 14.2kΩ
1000mA: RISET = 10kΩ
500
+10%
mA
Measured with RISET = 19.9kΩ
and maximum flash current
Indicator Current setting
1.0
mA
VISET
Current Generator Set Point
Voltage (pin ISET)
1.3
V
IISET
Current Generator operating
range
IFLASH2ISET
Flash Current to Bias Current
Ratio
VSWITCH
Mode Switching Threshold on
V(ILED) between 1:1 -> 1:1.5
and 1:1.5 -> 1:2
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IINDICATOR
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10.0
130
7650
350
400
1.1
μA
A/A
450
mV
IISET = VISET / RISET
if the resulting bias current is
higher than 200μA (typ.), the
current source is disabled
At full flash current
(700mA with RISET = 14.2kΩ)
Data1<7:0>(flash LED current)
>= 0x80h in flash mode;
ILED>350mA @ RISET=14.2kΩ
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AS3685C
Datasheet
Table 4 – Current Source (Sink) Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
Note
150
200
250
mV
All lower currents
Min
Typ
Max
Unit
Note
Parameter
VIH
High Level Input voltage
1.5
VBAT
V
VIL
Low Level Input voltage
0.0
0.5
V
ILEAKAGE
Input pin leakage current
-10
10
μA
Max
Unit
Table 6 – Protection Functions
Parameter
Min
Typ
Note
If the junction temperature
exceeds TOVTEMP, the current
sink will be disabled and the
charge pump switched back
into 1:1 mode until the
temperature drops below
TOVTEMP - TOVTEMPHYST
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Symbol
For Pins SCL and SDA
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Symbol
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Table 5 –Digital Interface characteristics
TOVTEMP
Overtemperature protection
140
°C
TOVTEMPHYST
Overtemperature protection
Hysteresis
5
°C
tFLASHTIMEOUT
Flash Timeout Time
100…
1500
+20%
ms
adjustable by register Flash
Timeout Timer
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-20%
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AS3685C
Datasheet
6 Typical Operation Characteristics
Figure 2 – Efficiency vs. Battery Voltage (with Lumiled PWF1)
Figure 3 – Battery Current vs. Battery Voltage (with Lumiled PWF1)
1.6
100
ILED=100m
ILED=200m
ILED=300m
ILED=400m
90
1.4
1.2
ILED=500m
80
70
ILED=700m
ILED=600m
0.6
ILED=700m
ILED=500m
ILED=400m
ILED=300m
0.4
50
ILED=200m
0.2
ILED=50m
ILED=100m
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ILED=600m
60
0.8
0.0
40
2.8
3.2
3.6
4.0
4.4
4.8
2.8
5.2
3.2
3.6
4.0
5.2
Figure 5 – Linearty of Current Sink
0.8
0.7
ILED=700m
0.6
0.6
ILED=500m
0.3
ILED [A]
ILED=300m
ILED=100m
0.1
ILED=50m
0.0
2.8
3.2
ILED=500m
ILED=400m
0.4
0.3
ILED=200m
0.2
ILED=600m
0.5
ILED=400m
0.4
ILED=700m
0.7
ILED=600m
0.5
ILED [A]
4.8
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Figure 4 – LED current I(ILED) vs. Battery Voltage (with Lumiled PWF1)
ILED=300m
ILED=200m
0.2
ILED=100m
0.1
ILED=50m
3.6
4.0
4.4
4.8
0.0
5.2
0.0
VBAT [V]
0.5
1.0
1.5
2.0
2.5
VILED [V]
Figure 6 –I(ILED) vs. R(ISET)
Figure 7 – Typical Operating Waveforms 1:1.5 Mode
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1200
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1000
Maximum Flash
Current
800
600
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ILED [mA]
4.4
VBAT [V]
VBAT [V]
0.8
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1.0
IBAT [A]
Efficiency of Charge Pump [%]
ILED=50m
400
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200
0
0k
20k
40k
60k
80k
100k
120k
140k
VCP ac-coupled, 100mV/div 1µs/div
RISET [Ohm]
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VBAT=3.3V, ILED=500mA
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AS3685C
Datasheet
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Figure 8 – Typical Operating Waveforms 1:2 Mode
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VCP ac-coupled, 50mV/div 250ns/div
VBAT=3.3V, ILED=500mA
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AS3685C
Datasheet
7 Detailed Functional Description
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Figure 9 – Internal Circuit Diagram of AS3685C
7.1 Low Noise Charge Pump
The AS3685 charge pump uses two external flying capacitors to generate output voltages higher than the battery
voltage. The charge pump can operate in three different modes:
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1:1 Bypass Mode or Off Mode
− Battery input and output are connected by a low-impedance switch
− Battery current = output current
1:1.5 Mode
− The output voltage is 1.5 times the battery voltage (without load)
− Battery current = 1.5 times output current
1:2 Mode
− The output voltage is 2 times the battery voltage (without load)
− Battery current = 2 times output current
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The flying capacitors are switched at the fixed frequency fclk.
7.1.1 Mode Switching
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The AS3685 monitors the voltage at the current sink V(ILED) and if this voltage falls below VSWITCH, for a time
longer than the debounce time, the charge pump automatically switches into a higher mode. The debounce time
is set to tUP_DEB_LONG at enabling of the charge pump or immediately after a 1:1 to 1:1.5 mode change. Afterwards
the debounce time is reduced to tUP_DEB. (This allows the LED current to settle properly on startup or after a
mode change)
The charge pump enters always 1:1 mode in off mode or in case of overtemperature.
It is possible to avoid the 1:2 mode (register programmable) to limit the battery current to 1.5 times the output
(=LED) current.
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AS3685C
Datasheet
7.1.2 Soft Start
The soft start mechanism reduces the inrush current. Battery current is smoothed when switching the
charge pump on and also at each switching condition. This precaution reduces electromagnetic radiation
significantly.
7.2 Current Source (Sink)
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The AS3685 operates in three different modes:
ƒ
Indicator Mode: A small (average) current is used to obtain an indication function with the flash LED (e.g.
indication for camera operation)
ƒ
Torch Mode: A moderate current of e.g. 150mA allows the use of the flash LED as a torch or video light
ƒ
Flash Mode: A high current of e.g. 700mA (up to 1000mA) is set for a high brightness flash. Only in this
mode, the flash timeout timer limits the total flash time.
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The current through the LED and the operating mode is controlled by the two digital interface connected to SCL
and SDA.
The current is controlled with a two wire bus interface commands similar to I2C communication (device address
82h, only commands writing to the AS3685 are possible, no readback) as shown in following figure:
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Figure 10 – Two wire interface waveform
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Data from the bus is always captured on the rising edge of the SCL signal; therefore the data on SDA has to be
stable slightly before this rising edge.
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The strobe command is merged with the interface commands and all other devices connected to the bus will
ignore these commands. Only the AS3685 will also use these commands and switch on/off the flash led with the
strobe pin (The strobe function can be enabled/disabled by the interface and its polarity is selectable):
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AS3685C
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Using the above external circuit, an active strobe function can be implemented as follows:
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Figure 12 – Timing Diagram of the AS3685 using active High strobe function
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Figure 11 – External circuit of the AS3685 using active High strobe function
Alternatively (if the device driving SCL has only the possibility to pulldown the SCL line, but does not actively
control high/low/tristate of the SCL line) use following circuit:
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Figure 13 – External circuit of the AS3685 using active Low strobe function
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AS3685C
Datasheet
The control waveform is shown in the next figure:
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Figure 14 – Timing Diagram of the AS3685 using active Low strobe function
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If the strobe function is not used at all, the interface can be addressed like a normal slave (only writing access).
The strobe function does not violate the two wire interface specification.
Data1 setups the flash current from 0mA to 1000mA, Data2 can be used to set the preview current and Data3
will set the operating mode, can lock 1:2 charge pump mode and set or disable the flash mode timeout time.
Table 7 – Current and Mode Setting for the AS3685
Register
Purpose
Data1<7:0>
Data2<6:0>
Current Setting Torch (Preview)
not used – leave at 0
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Data2<7>
Current Setting Flash
Mode setting
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Data3<2:0>
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Comments
Flash Mode current setting, Flash Timeout timer used if the
mode setting uses this current
0mA to 1000mA (for RISET=10kΩ)
0mA to 700mA (for RISET=14.2kΩ)
Torch (=Preview or Assist) Mode current setting, no timeout
timer used for this current setting
0mA to 500mA
0mA to 350mA
(for RISET=10kΩ)
(for RISET=14.2kΩ)
not used
000 … Off (Power down; Charge Pump in 1:1 mode)
001 … Indicator Mode
Data2<7> = 0: ILED = 0.5mA
Data2<7> = 1: ILED = 1.0mA
010 … Torch (=Preview) Mode (Data2 sets current)
011 … Flash Mode (Data1 sets current)
100 … Preview / Flash Mode, STROBE active high
STROBE=H: Flash mode (Data1 sets current)
STROBE=L: Preview mode (Data2 sets current)
101 … Preview / Flash Mode, STROBE active low
STROBE=L: Flash mode (Data1 sets current)
STROBE=H: Preview mode (Data2 sets current)
110 … Force Charge Pump into 1:1.5 mode; no current is
flowing through the current sink (AS3685 can be
used as voltage generator for e.g. backlight LEDs
with additional external current source(s))
111 … Force Charge Pump into 1:2 mode; no current is
flowing through the current sink (AS3685 can be
used as voltage generator for e.g. backlight LEDs
with additional external current source(s))
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AS3685C
Datasheet
Table 7 – Current and Mode Setting for the AS3685
Purpose
Data3<3>
Avoid 1:2 Mode
Data3<7:4>
Comments
0 … Charge Pump can use 1:2 Mode
1 … Charge Pump does not use 1:2 Mode; ignored if
Data3<2:0> is set to 111 (forced 1:2 mode)
0000 … Disable Timeout timer for Flash Mode
0001 … 100ms Timeout timer for Flash Mode
0010 … 200ms Timeout timer for Flash Mode
Flash Timeout Timer
…
1111 … 1500ms Timeout timer for Flash Mode
7.2.1 AS3685 TXMask Function
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Register
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If the battery has to supply two high currents at the same time (e.g. the AS3685 flash and a RF-power amplifier) it
is possible, that the total current causes a high voltage drop on the battery resulting in a shutdown of the
complete system. In order to avoid this shutdown, the AS3685 (AS3685A or AS3685B) can reduce its current
with the signal ‘TXMask’ using the following circuit:
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Figure 15 – TXMask function of the AS3685
The TXMask signal is connected to e.g. the (RF-) power amplifier enable pin (active high if the PA is enabled).
This reduces the flash current if the power amplifier is enabled and avoids the unexpected shutdown of the
system.
Note: The internal flash timeout timer (tFLASHTIMEOUT) to limit the total flash duration, is not affected by the
TXMask function (see also section ‘Flash Timeout’).
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The IISET current (current into the pin ISET) for TXMask = 0 can be calculated with:
0
V ISET
VISET
R ISET
RTXMASK
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IISET , TXMask
1.3 V
RISET
1.3 V
R TXMASK
For TXMask = 1 the current IISET is reduced to:
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IISET , TXMask
V ISET
V ISET V TXMask
R ISET
R TXMASK
1.3 V
RISET
1.3 V V TXMask
RTXMASK
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V(TXMask) is the actual voltage for the high level (‘1’) for the signal TXMask
The maximum flash current ILEDMAX for TXMask=0 or 1 can be calculated according to the following formula
using the above obtained IISET values:
ILEDMAX IFLASH2BIAS IISET 7650 I ISET
Choose the values for RISET and RTXMASK according to your application requirements.
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AS3685C
Datasheet
7.3 Protection Functions
7.3.1 Overtemperature Protection
If the AS3685 junction temperature exceeds TOVTEMP, the current sink will be disabled and the charge pump
forced into 1:1 mode. If the junction temperature drops below TOVTEMP – TOVTEMPHYST, the device enables the
current sink again and the charge pump resumes normal operation.
7.3.1.1 LED Shortcircuit protection
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If the LED is shorted (VCP to ILED), then depending on the set current and the resulting high power dissipation
inside the AS3685, the overtemperature protection will trigger. This protects the AS3685 and the system against
damage. If the AS3685 is in off-mode, then shorting of the diode will have no influence on the system.
Note: Do not short VCP to VSS if the supply is not current limited (e.g. by an internal protection inside the
battery), as there is an internal diode between VBAT (anode) and VCP (cathode).
7.3.2 Flash Timeout
7.4 Layout Recommendations
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To improve the heat dissipation, use a massive ground plane.
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The flash duration of a single flash is limited automatically to tFLASHTIMEOUT (applies only for ‘Flash’ mode(s)).
This protects the flash LED against thermal damage.
Figure 16 – AS3685 DFN10 3x3mm Layout Recommendation
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Figure 17 – AS3685 WL-CSP 2x1.5mm Layout Recommendation
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AS3685C
Datasheet
8 External Components
8.1 Capacitor and Resistor Selection
Use low-ESR ceramic capacitors with X7R or X5R dielectric. These capacitors allow good filtering and have a
wide temperature range. The connections of all external capacitors should be kept as short as possible. All
resistors should have a tolerance of ±1%.
8.2 Usage of PCB Wire Inductance
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The inductance between the battery and pin VBAT can be used as a filter to reduce disturbance on the battery.
Instead of using one capacitor (CBAT) it is recommended to split CBAT into CBAT1 and CBAT2 with the capacitance
of
CBAT1 = CBAT2 = CBAT
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It is recommended to apply a minimum of 20nH (maximum 200nH) with low impedance. This inductance can be
realized on the PCB without any discrete coil. Assuming that a 1mm signal line corresponds to approximately
1nH (valid if the length (L) is significantly bigger than the width (W) of the line (L/W <10)), a line length of
20mm < L < 200mm
is recommended. The shape of the line is not important.
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Figure 18 – PCB Wire Inductance Example1
L
Battery
Connector
AS3685
Pin VBAT
CBAT1
VSS
LTOTAL = L
CBAT2
VSS
Figure 19 – PCB Wire Inductance Example2
L1
CBAT1
VSS
AS3685
Pin VBAT
CBAT2
L2
Battery
Connector
LTOTAL = L1 + 10*L2
VSS
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8.3 External Component Specifications
Table 8 – External Components List
Tol
(Min)
Rating
(Max)
2.2μF
+/-20%
6.3V
CFLY1, CFLY2
1.0μF
+/-20%
6.3V
CVCP
2.2μF
+/-20%
6.3V
Min
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CBAT 1
RISET
RTXMASK
DLED
Notes:
Value
Typ
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Part
10kΩ
Max
130kΩ
See section ‘TXMask function’
Notes
Package
(min)
Ceramic, X5R
0603
e.g. Murata GRM21BR71A225KA01L
Ceramic, X5R
e.g. Murata GRM188R60J105K
Ceramic, X5R
e.g. Murata GRM21BR71A225KA01L
0603
(0402, 0405)
0603
+/-1%
Current Set Resistor
0201
+/-1%
TXMask Set Resistor
0201
Flash Led
1. See section ‘Usage of PCB Wire Inductance’
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AS3685C
Datasheet
9 Pinout and Packaging
9.1 DFN10 3x3mm
9.1.1
Pin Assignments DFN10 3x3mm
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Figure 20 –Pin Assignments DFN10 3x3mm
9.1.2 Pin Descriptions DFN10 3x3mm
Table 9 – Pin Type Descriptions DFN10 3x3mm
Pin Type
Description
AI/O
Analog Pin
DI
Digital Input
S
Supply Pin
Table 10 – Pin Descriptions DFN10 3x3mm
Pin Number
Pin Name
Type
Description
1
C2-
AI/O
Flying Capacitor 2 connection – connect 1μF ceramic
capacitor CFLY2 between C2- and C2+
VBAT
S
C1+
AI/O
2
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3
4
AI/O
SCL
DI
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5
VCP
Battery Supply Voltage
Flying Capacitor 1 connection – connect 1μF ceramic
capacitor CFLY1 between C1- and C1+
Charge Pump Output voltage – connect flash LED anode
to this pin and add CVCP capacitor with 2.2μF to VSS
Digital Control Signal two wire interface clock input
ISET
AI/O
Current Generator input pin – connect current set resistor
RISET between this pin and VSS (and optional RTXMASK)
SDA
DI/O
Digital Input/Output Control two wire interface data signal
8
C2+
AI/O
Flying Capacitor 2 connection – connect 1μF ceramic
capacitor CFLY2 between C2- and C2+
9
ILED
AI/O
Current Source input pin – connect flash LED cathode to
this pin
10
C1-
AI/O
Flying capacitor 1 connection – connect 1μF ceramic
capacitor CFLY1 between C1- and C1+
Exposed Pad
VSS
S
6
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7
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(ptr)
Ground Connection – a proper thermal connection with
several vias to the ground plane is recommended
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AS3685C
Datasheet
9.1.3 Package Drawings and Marking DFN10 3x3
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Figure 21 – DFN10 – 3x3mm Pacakge Drawing
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Top View
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Bottom View
(rotated)
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Marking:
Line 1: AYWW
A = Pb-Free Identifier
Y = Year
WW = Week
Line 2: XZZ
X = Plant Identifier
ZZ = Letters of Free Choice
Line 3: AS8C for AS3685C
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16 - 21
AS3685C
Datasheet
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Figure 22 – DFN10 – 3x3mm Detail Dimensions
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17 - 21
AS3685C
Datasheet
9.2 WL-CSP 2x1.5mm (Wafer Level Chip Scale Package)
9.2.1 Pin Assignments WL-CSP 2x1.5mm
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9.2.2 Pin Descriptions WL-CSP 2x1.5mm
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Figure 23 – WL-CSP 2x1.5mm Pin Assignments
Table 11 – Pin Type Descriptions WL-CSP 2x1.5mm
Pin Type
Description
AI/O
Analog Pin
DI
Digital Input
S
Supply Pin
Table 12 – Pin Descriptions WL-CSP 2x1.5mm
Pin Number
Pin Name
Type
A1
SCL
DI
Digital Control Signal two wire interface clock input
VSS
S
Ground Connection – a proper thermal connection to the
ground plane is recommended
ISET
AI/O
Current Generator input pin – connect current set resistor
RISET between this pin and VSS (and optional RTXMASK)
C1+
AI/O
Flying Capacitor 1 connection – connect 1μF ceramic
capacitor CFLY1 between C1- and C1+
A2
A3
B2
Charge Pump Output voltage – connect flash LED anode
to this pin and add CVCP capacitor with 2.2μF to VSS
SDA
DI/O
Digital Input/Output Control two wire interface data signal
VBAT
S
C2+
AI/O
Flying Capacitor 2 connection – connect 1μF ceramic
capacitor CFLY2 between C2- and C2+
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C2
AI/O
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B3
C1
VCP
ca
B1
Description
Battery Supply Voltage
ILED
AI/O
Current Source input pin – connect flash LED cathode to
this pin
D1
C2-
AI/O
Flying Capacitor 2 connection – connect 1μF ceramic
capacitor CFLY2 between C2- and C2+
D2
C1-
AI/O
Flying capacitor 1 connection – connect 1μF ceramic
capacitor CFLY1 between C1- and C1+
D3
VSS
S
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C3
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(ptr)
Ground Connection – a proper thermal connection to the
ground plane is recommended
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AS3685C
Datasheet
9.2.3 Package Drawings and Marking WL-CSP 2x1.5mm
Marking:
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Line 1: austriamicrosystems logo
Line 2: AS3685C
Line 3: AYWWIZZ
A = Pb-Free Identifier
Y = Year
WW = Week
I = Plant Identifier
ZZ = Letters of Free Choice
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Figure 24 – WL-CSP 2x1.5mm Package Drawing
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Figure 25 – WL-CSP 2x1.5mm Detail Dimensions
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AS3685C
Datasheet
10 Ordering Information
Table 13 – Delivery Information
Package Type
Delivery Form
Description
AS3685C
WL-CSP
2x1.5mm
Tape&Reel
AS3685C Interface
Wafer Level Chip Scale Package,
Size 2x1.5mm, 4x3 balls, 0.5mm pitch,
RoHS compliant / Pb-free
AS3685C-ZWLT
AS3685C-ZDFT1
AS8C
DFN 10 3x3mm
Tape&Reel
AS3685C Interface
DFN Package, 3x3mm, 10 pins, 0.4mm
pitch, RoHS compliant / Pb-free
Description:
AS3685C-ZPPT
AS3685
-
…
AS3685C Interface Version
Two wire interface signal with STROBE
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Marking
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Part Number
…
Temperature range:
Z = -30°C – 85°C
PP
…
Package:
WL = Wafer Level Chip Scale Package
DF = DFN10
T
…
Delivery Form:
T = Tape&Reel
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Z
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Contact austriamicrosystems for availability.
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AS3685C
Datasheet
Copyright
Copyright © 1997-2010, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, AustriaEurope. Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted,
merged, translated, stored, or used without the prior written consent of the copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Diclaimer
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Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions
appearing in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by
description regarding the information set forth herein or regarding the freedom of the described devices from
patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time
and without notice. Therefore, prior to designing this product into a system, it is necessary to check with
austriamicrosystems AG for current information. This product is intended for use in normal commercial
applications. Applications requiring extended temperature range, unusual environmental requirements, or high
reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not
recommended without additional processing by austriamicrosystems AG for each application. For shipments of
less than 100 parts the manufacturing flow might show deviations from the standard production flow, such as test
flow or test location.
The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,
austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not
limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect,
special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise
or flow out of austriamicrosystems AG rendering of technical or other services
ch
Contact Information
Te
Headquarters
austriamicrosystems AG
Tobelbaderstrasse 30
Schloss Premstätten
A-8141 Austria
Tel:
Fax:
+43 (0) 3136 500 0
+43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
http://www.austriamicrosystems.com/contact
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