TMD2671

TAOS Inc.
is now
ams AG
The technical content of this TAOS datasheet is still valid.
Contact information:
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TMD2671
DIGITAL PROXIMITY DETECTOR
r
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TAOS144B − SEPTEMBER 2012
Features
PACKAGE
MODULE−8
(TOP VIEW)
D Digital Proximity Detector, LED Driver, and
IR LED in a Single Optical Module
D
D
D
Description
SCL 2
7 INT
GND 3
6 LDR
LEDA 4
5 LEDK
Package Drawing is Not to Scale
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D
8 SDA
Applications
D Cell Phone Touch Screen Disable
D Automatic Speakerphone Enable
D Automatic Menu Popup
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D
− Calibrated to 100-mm Detection
− Integrated IR LED and Synchronous LED
Driver
− Programmable Number of IR Pulses
− Programmable Current Sink for the IR
LED — No Limiting Resistor Needed
− Programmable Interrupt Function with
Upper and Lower Threshold
Programmable Wait Timer
− Wait State — 65 mA Typical Current
− Programmable from 2.72 ms
to > 8 Seconds
2
I C Interface Compatible
− Up to 400 kHz (I2C Fast Mode)
Dedicated Interrupt Pin
3.94 mm 2.36 mm 1.35 mm Package
Sleep Mode — 2.5 mA Typical
VDD 1
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D Proximity Detection
The TMD2671 family of devices provides a complete proximity detection system and digital interface logic in
a single 8-pin package. The proximity detector includes a digital proximity sensor with integrated LED driver,
and IR LED. The proximity function is calibrated to 100 mm (without cover glass), thus eliminating the need for
end-equipment or sub-assembly factory calibration. The proximity detection feature operates from sunlight to
dark rooms. The wide dynamic range also allows for operation in short distance detection behind dark glass
such as with a cell phone. An internal state machine provides the ability to put the device into a low-power mode
providing very low average power consumption. The addition of the micro-optics lenses within the module
provide highly efficient transmission and reception of infrared energy, which lowers overall power dissipation
for the detection function.
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The proximity function specifically targets near-field proximity applications. In cell phones, the proximity
detection can detect when the user positions the phone close to their ear. The device is fast enough to provide
proximity information at a high repetition rate needed when answering a phone call. This provides both improved
green power saving capability and the added security to lock the screen when the user may accidently deploy
a touch.
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Communication with the device is accomplished with a simple 2-wire I2C interface with data rates up to 400 kHz.
An interrupt output pin is provided for connection to the host processor. This interrupt pin can be used to
eliminate the need to poll the device on a repetitive basis. There is also a digital filter that compares the proximity
ADC results to programmed values so that an interrupt is only generated upon a proximity event.
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The TMD2671 is packaged in a very small form factor 8-pin optical package. The PCB board area required is
only 9.36 mm2, which is far smaller than discrete solutions. Also, the package height is only 1.35 mm, which
makes the TMD2671 device suitable for very thin mechanical applications.
The LUMENOLOGY r Company
Copyright E 2012, TAOS Inc.
r
Texas Advanced Optoelectronic Solutions Inc.
1001 Klein Road S Suite 300 S Plano, TX 75074 S (972)
r 673-0759
www.taosinc.com
1
TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
Functional Block Diagram
VDD
Interrupt
Prox Control
LEDA
Prox
Integration
Prox
ADC
Upper Limit
Prox
Data
Lower Limit
Channel 0
INT
SCL
SDA
Wait Control
LEDK
GND
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Channel 1
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IR LED Constant
Current Sink
I2C Interface
LDR
Detailed Description
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A fully integrated proximity detection solution is provided with an 850-nm IR LED, LED driver circuit, and
proximity detection engine. An internal LED driver (LDR) pin, is connected to the LED cathode (LEDK) to provide
a factory calibrated proximity of 100 mm, ± 20 mm. This is accomplished with a proprietary current calibration
technique that accounts for all variances in silicon, optics, package, and most important, IR LED output power.
This eliminates or greatly reduces the need for factory calibration that is required for most discrete proximity
sensor solutions. While the device is factory calibrated at a given pulse count, the number of proximity LED
pulses can be programmed from 1 to 255 pulses, which allows different proximity distances to be achieved.
Each pulse has a 16 μs period, with a 7.2 μs on time.
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The device provides a separate pin for level-style interrupts. When interrupts are enabled and a pre-set value
is exceeded, the interrupt pin is asserted and remains asserted until cleared by the controlling firmware. The
interrupt feature simplifies and improves system efficiency by eliminating the need to poll a sensor for a proximity
value. An interrupt is generated when the value of a proximity conversion exceeds either an upper or lower
threshold. In addition, a programmable interrupt persistence feature allows the user to determine how many
consecutive exceeded thresholds are necessary to trigger an interrupt.
Copyright E 2012, TAOS Inc.
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
Terminal Functions
TERMINAL
NAME
NO.
TYPE
DESCRIPTION
3
Power supply ground. All voltages are referenced to GND.
INT
7
O
Interrupt — open drain.
LDR
6
I
LED driver input for proximity IR LED, constant current source LED driver.
LEDA
4
I
LED anode.
LEDK
5
O
LED cathode. Connect to LDR pin when using internal LED driver circuit.
SCL
2
I
I2C serial clock input terminal — clock signal for I2C serial data.
SDA
8
I/O
VDD
1
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GND
I2C serial data I/O terminal — serial data I/O for I2C .
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Supply voltage.
Available Options
ADDRESS
0x39
LEADS
INTERFACE DESCRIPTION
ORDERING NUMBER
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DEVICE
TMD26711
TMD26713
0x39
8
I2C Vbus = VDD Interface
TMD26711
8
I2C
TMD26713
Vbus = 1.8 V Interface
Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8 V
Digital output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.8 V
Digital output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1 mA to 20 mA
Analog voltage range, LDR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.8 V
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
ESD tolerance, human body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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NOTE 1: All voltages are with respect to GND.
Recommended Operating Conditions
NOM
MAX
2.6
3
3.6
−3
3
%
Operating free-air temperature, TA (Note 2)
−30
85
°C
UNIT
V
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MIN
Supply voltage, VDD
Supply voltage accuracy, VDD total error including transients
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NOTE 2: While the device is operational across the temperature range, functionality will vary with temperature. Specifications are stated only
at 25°C unless otherwise noted.
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Copyright E 2012, TAOS Inc.
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3
TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
Operating Characteristics, VDD = 3 V, TA = 25C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Active: Proximity and Wait Delay states
Supply current
VOL
INT SDA output low voltage
INT,
I LEAK
Leakage current, SDA, SCL, INT pins
I LEAK
Leakage current, LDR pin
VIH
SCL SDA input high voltage
SCL,
VIL
SCL SDA input low voltage
SCL,
MAX
175
250
Wait mode
65
Sleep mode
2.5
UNIT
μA
4
3 mA sink current
0
0.4
6 mA sink current
0
0.6
−5
5
μA
10
μA
TMD26711
0.7 VDD
TMD26713
1.25
V
0.3 VDD
TMD26711
0.54
V
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TMD26713
V
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IDD
TYP
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Proximity Characteristics, VDD = VLEDA = 3 V, TA = 25C, PEN = 1 (unless otherwise noted)
PARAMETER
IDD
TEST CONDITIONS
MIN
Supply current — LDR pulse on
ADC conversion time step size
PTIME = 0xFF
ADC number of integration steps
ADC counts per step
PTIME = 0xFF
Proximity IR LED pulse count
Proximity pulse period
ILEDA
MAX
3
mA
2.72
ms
256
steps
0
1023
counts
0
255
pulses
16.3
LED current @ V 600 mV,
mV LDR pin sink (Note 1)
UNIT
1
PDRIVE = 0 (100% current)
100
PDRIVE = 1 (50% current)
50
PDRIVE = 2 (25% current)
25
PDRIVE = 3 (12.5% current)
TLDR
TYP
μs
mA
12.5
PDRIVE = 1
7.2
μs
Proximity response, no target (offset)
PDRIVE = 0, PPULSE = 8 (Note 2)
100
Counts
Prox count, 100-mm target (Note 3)
73 mm × 83 mm, 90% reflective Kodak
Gray Card,
PPULSE = 8, PDRIVE = 0, PTIME =
0xFF (Note 4)
On time per pulse
414
520
624
counts
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NOTES: 1. Value is factory-adjusted to meet the Prox count specification. Considerable variation (relative to the typical value) is possible after
adjustment.
2. No reflective surface above the module. Proximity offset varies with power supply characteristics and noise.
3. ILEDA is factory calibrated to achieve this specification. Offset and crosstalk directly sum with this value and is system dependent.
4. No glass or aperture above the module. Tested value is the average of 5 consecutive readings.
5. These parameters are ensured by design and characterization and are not 100% tested.
6. Proximity test was done using the following circuit. See the Application Information: Hardware section for recommended
application circuit.
Copyright E 2012, TAOS Inc.
VDD
VDD
4
1
TMD2671
1 mF
GND
3
5
6
LEDA
LEDK
LDR
1 mF
22 mF
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
IR LED Characteristics, VDD = 3 V, TA = 25C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
1.4
1.5
UNIT
VF
Forward Voltage
IF = 20 mA
VR
Reverse Voltage
IR = 10 μA
5
PO
Radiant Power
IF = 20 mA
4.5
λp
Peak Wavelength
IF = 20 mA
850
Δλ
Spectral Radiation Bandwidth
IF = 20 mA
40
TR
Optical Rise Time
IF = 100 mA, TW = 125 ns, duty cycle = 25%
20
40
ns
TF
Optical Fall Time
IF = 100 mA, TW = 125 ns, duty cycle = 25%
20
40
ns
TYP
MAX
TEST CONDITIONS
Wait step size
MIN
nm
nm
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PARAMETER
V
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Wait Characteristics, VDD = 3 V, TA = 25C, WEN = 1 (unless otherwise noted)
WTIME = 0xFF
2.72
1
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Wait number of integration steps
V
UNIT
2.9
ms
256
steps
AC Electrical Characteristics, VDD = 3 V, TA = 25C (unless otherwise noted)
PARAMETER†
TEST CONDITIONS
0
TYP
MAX
UNIT
400
kHz
f(SCL)
Clock frequency
t(BUF)
Bus free time between start and stop condition
1.3
μs
t(HDSTA)
Hold time after (repeated) start condition. After
this period, the first clock is generated.
0.6
μs
t(SUSTA)
Repeated start condition setup time
0.6
μs
t(SUSTO)
Stop condition setup time
0.6
μs
t(HDDAT)
Data hold time
0
μs
t(SUDAT)
Data setup time
100
ns
t(LOW)
SCL clock low period
1.3
μs
t(HIGH)
SCL clock high period
0.6
μs
tF
Clock/data fall time
300
ns
tR
Clock/data rise time
300
ns
Ci
Input pin capacitance
10
pF
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only)
MIN
Specified by design and characterization; not production tested.
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†
(I2C
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
PARAMETER MEASUREMENT INFORMATION
t(LOW)
t(R)
t(F)
VIH
SCL
VIL
t(HDSTA)
t(BUF)
t(HIGH)
t(HDDAT)
t(SUSTA)
t(SUSTO)
t(SUDAT)
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VIH
SDA
VIL
S
S
P
Start
Condition
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P
Stop
Condition
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Figure 1. Timing Diagrams
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
TYPICAL CHARACTERISTICS
LDR OUTPUT COMPLIANCE
SPECTRAL RESPONSIVITY
112.5
1
Ch 0
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100
0.8
Load Current — mA
87.5
0.4
Ch 1
75
62.5
50 mA
50
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0.6
37.5
25 mA
25
0.2
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Normalized Responsivity
100 mA
12.5 mA
12.5
0
300
400
500
600
700
800
0
0
900 1000 1100
0.3
0.6
0.9
1.2
VOL − Output Low Voltage − V
λ − Wavelength − nm
Figure 2
Figure 3
NORMALIZED IDD
vs.
VDD and TEMPERATURE
110%
108%
104%
50C
25C
102%
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IDD Normalized @ 3 V, 25C
75C
106%
100%
0C
96%
94%
92%
2.7
2.8
The LUMENOLOGY r Company
2.9
3
3.1
3.2
3.3
VDD — V
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98%
Figure 4
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
PRINCIPLES OF OPERATION
System State Machine
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The device provides control of proximity detection and power management functionality through an internal
state machine. After a power-on-reset, the device is in the sleep mode. As soon as the PON bit is set, the device
will move to the start state. It will then cycle through the Proximity and Wait states. If these states are enabled,
the device will execute each function. If the PON bit is set to a 0, the state machine will continue until the current
conversion is complete and then go into a low-power sleep mode.
Sleep
PON = 1 (r 0:b0)
PON = 0 (r 0:b0)
Prox
lv
Start
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Wait
Figure 5. Simplified State Diagram
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NOTE: In this document, the nomenclature uses the bit field name in italics followed by the register number and
bit number to allow the user to easily identify the register and bit that controls the function. For example, the
power on (PON) is in register 0, bit 0. This is represented as PON (r0:b0).
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
Proximity Detection
Proximity detection is accomplished by measuring the amount of IR energy, from the internal IR LED, reflected
off an object to determine its distance. The internal proximity IR LED is driven by the integrated proximity LED
current driver as shown in Figure 6.
IR
LED
PPULSE(r0x0E)
PDRIVE(r0x0F, b7:6)
LEDK
PTIME(r0x02)
Prox LED
Current Driver
LDR
Prox Control
Prox
Data
PDATAH(r0x019)
PDATAL(r0x018)
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Prox
ADC
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Prox
Integration
PDIODE(r0x0F, b5:4)
Object
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LEDA
CH1
CH0
Background Energy
Figure 6. Proximity Detection
The LED current driver provides a regulated current sink on the LDR terminal that eliminates the need for an
external current limiting resistor. The PDRIVE register setting sets the sink current to 100%, 50%, 25%, or 12.5%
of the factory trimmed full scale current.
Referring to the Detailed State Machine figure, the LED current driver pulses the IR LED as shown in Figure 7
during the Prox Accum state. Figure 7 also illustrates that the LED On pulse has a fixed width of 7.3 μs and
period of 16.0 μs. So, in addition to setting the proximity drive current, 1 to 255 proximity pulses (PPULSE) can
be programmed. When deciding on the number of proximity pulses, keep in mind that the signal increases
proportionally to PPULSE, while noise increases by the square root of PPULSE.
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Reflected IR LED +
Background Energy
LED On
Background
Energy
LED Off
7.3 ms
16.0 ms
IR LED Pulses
Figure 7. Proximity LED Current Driver Waveform
Figure 6 illustrates light rays emitting from the internal IR LED, reflecting off an object, and being absorbed by
the CH0 and CH1 photodiodes. The proximity diode selector (PDIODE) determines which of the two
photodiodes is used for a given proximity measurement. Note that neither photodiode is selected when the
device first powers up, so PDIODE must be set for proximity detection to work.
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
Referring again to Figure 7, the reflected IR LED and the background energy is integrated during the LED On
time, then during the LED Off time, the integrated background energy is subtracted from the LED On time
energy, leaving the IR LED energy to accumulate from pulse to pulse.
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After the programmed number of proximity pulses have been generated, the proximity ADC converts and scales
the proximity measurement to a 16-bit value, then stores the result in two 8-bit proximity data (PDATAx)
registers. ADC scaling is controlled by the proximity ADC conversion time (PTIME) which is programmable from
1 to 256 2.73-ms time units. However, depending on the application, scaling the proximity data will equally scale
any accumulated noise. Therefore, in general, it is recommended to leave PTIME at the default value of one
2.73-ms ADC conversion time (0xFF).
For additional information on using the proximity detection function behind glass and for optical system design
guidance, please see available TAOS application notes.
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Optical Design Considerations
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The TMD2671 device simplifies the optical system design by integrating an IR LED into the package, and also
by providing an effective barrier between the LED and proximity sensor. In addition the package contains
integrated lenses and apertures over both the LED and the sensor, which significantly extends the maximum
proximity detection distance and helps to reduce optical crosstalk.
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Although the package integrates an optical barrier between the IR LED and detector, placing the device behind
a cover glass potentially provides another significant path for IR light to reach the detector, via reflection from
the inside and outside faces of the cover glass. Because it is cost prohibitive to use anti-reflection coatings
on the glass, the faces of the glass will reflect significantly (typically on the order of 4% of the light), and it is crucial
that the system be designed so that this reflected light cannot find an efficient path back to the optical detector.
See TAOS Application Note DN28: Proximity Detection Behind Glass for a detailed discussion of optical design
considerations.
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
Interrupts
The interrupt feature simplifies and improves system efficiency by eliminating the need to poll the sensor for
a proximity value. The interrupt mode is determined by the state of the PIEN field in the ENABLE register.
Two 16-bit-wide interrupt threshold registers allow the user to define upper and lower threshold limits. An
interrupt can be generated when the proximity data (PDATA) exceeds the upper threshold value (PIHTx) or falls
below the lower threshold (PILTx).
Upper Limit
Prox
ADC
Prox Persistence
Prox
Data
Lower Limit
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Prox
Integration
PPERS(r 0x0C, b7:4)
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PIHTH(r 0x0B), PIHTL(r 0x0A)
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To further control when an interrupt occurs, the device provides an interrupt persistence feature. This feature
allows the user to specify a number of conversion cycles for which an event exceeding the proximity interrupt
threshold must persist (PPERS) before actually generating an interrupt. See the register descriptions for details
on the length of the persistence.
Channel 0
Channel 1
PILTH(r 0x09), PILTL(r 0x08)
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Figure 8. Programmable Interrupt
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
State Diagram
The following state diagram shows a more detailed flow for the state machine. The device starts in the sleep
mode. The PON bit is written to enable the device. A 2.72-ms Start Delay will occur before entering the start
state. If the PEN bit is set, the state machine will step through the proximity accumulate, then proximity ADC
conversion states. As soon as the conversion is complete, the state machine will move to the Wait Check state.
Start
Delay
PON = 0
Start
2.72 ms
5.44 ms
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1 to 255 LED Pulses
Pulse Frequency: 62.5 kHz
Time: 16.3 ms − 4.2 ms
PEN = 1
Sleep
Prox
Check
Wait
Delay
PEN = 0
WEN = 0
Prox
Accum
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PON = 1
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If the WEN bit is set, the state machine will then cycle through the wait state. If the WLONG bit is set, the wait
cycles are extended by 12× over normal operation. When the wait counter terminates, the state machine will
move to the 2.72-ms Wait Delay state before returning to the Start state.
Wait
Check
WEN = 1
1 to 256 steps
Prox
Step: 2.72 ms
ADC
Time: 2.72 ms − 696 ms
Recommended − 2.72 ms 1023 Counts
Wait
WLONG = 0
1 to 256 steps
Step: 2.72 ms
Time: 2.72 ms − 696 ms
WLONG = 1
1 to 256 steps
Step: 32.6 ms
Time: 32.6 ms − 8.35 s
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Figure 9. Expanded State Diagram
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
Power Management
Power consumption can be controlled through the use of the wait state timing because the wait state consumes
only 65 μA of power. Figure 10 shows an example of using the power management feature to achieve an
average power consumption of 136 μA current with four 100-mA pulses of proximity detection.
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4 IR LED Pulses
65 ms (29 ms LED On Time)
Prox Accum
Prox ADC
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2.72 ms
Example: ~49 ms Cycle TIme
Wait
State
Prox Accum
LED On
Prox ADC
Wait
Wait Delay
Duration (ms)
Current (mA)
0.065 (Note 1)
0.029 (Note 2)
2.72
43.52
2.72
100.0
0.175
0.065
0.175
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43.52 ms
Wait
Delay
2.72 ms
Average Current = ((0.029 100) + (2.72 0.175) + (43.52 0.065) + (2.72 0.175)) / 49 = 136 mA
Note 1: Prox Accum = 16.3 ms per pulse 4 pulses = 65 ms = 0.065 ms
Note 2: LED On = 7.2 ms per pulse 4 pulses = 29 ms = 0.029 ms
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Figure 10. Power Consumption Calculations
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
I2C Protocol
Interface and control are accomplished through an I2C serial compatible interface (standard or fast mode) to
a set of registers that provide access to device control functions and output data. The devices support the 7-bit
I2C addressing protocol.
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The I2C standard provides for three types of bus transaction: read, write, and a combined protocol (Figure 11).
During a write operation, the first byte written is a command byte followed by data. In a combined protocol, the
first byte written is the command byte followed by reading a series of bytes. If a read command is issued, the
register address from the previous command will be used for data access. Likewise, if the MSB of the command
is not set, the device will write a series of bytes at the address stored in the last valid command with a register
address. The command byte contains either control information or a 5-bit register address. The control
commands can also be used to clear interrupts.
...
Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
Repeated Start Condition
Write (0)
Continuation of protocol
Master-to-Slave
Slave-to-Master
1
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st
il
A
N
P
R
S
Sr
W
lv
The I2C bus protocol was developed by Philips (now NXP). For a complete description of the I2C protocol, please
review the NXP I2C design specification at http://www.i2c−bus.org/references/.
7
S
1
Slave Address
W
1
8
A
1
Command Code
8
A
1
Data Byte
A
8
1
1
...
P
I2C Write Protocol
1
7
S
1
Slave Address
R
1
8
A
1
Data
A
Data
1
...
A
P
I2C Read Protocol
1
S
Slave Address
W
1
8
1
1
7
1
1
Command Code
A
Sr
Slave Address
R
A
ca
7
A
8
1
Data
A
8
Data
1
A
1
...
P
I2C Read Protocol — Combined Format
Figure 11. I2C Protocols
Te
ch
ni
1
Copyright E 2012, TAOS Inc.
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r
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
Register Set
The device is controlled and monitored by data registers and a command register accessed through the serial
interface. These registers provide for a variety of control functions and can be read to determine results of the
ADC conversions. The register set is summarized in Table 1.
Table 1. Register Address
ADDRESS
RESISTER NAME
R/W
−−
COMMAND
W
REGISTER FUNCTION
0x00
ENABLE
R/W
Enables states and interrupts
0x01
ATIME
R/W
ALS ADC time
0x02
PTIME
R/W
Proximity ADC time
0x03
WTIME
R/W
Wait time
0x08
PILTL
R/W
Proximity interrupt low threshold low byte
0x09
PILTH
R/W
Proximity interrupt low threshold high byte
0x0A
PIHTL
R/W
Proximity interrupt high threshold low byte
0x0B
PIHTH
R/W
Proximity interrupt high threshold high byte
0x0C
PERS
R/W
Interrupt persistence filter
0x00
0x0D
CONFIG
R/W
Configuration
0x00
0x0E
PPULSE
R/W
Proximity pulse count
0x00
0x0F
CONTROL
R/W
Control register
0x00
0x12
ID
R
Device ID
0x13
STATUS
R
Device status
0x00
0x18
PDATAL
R
Proximity ADC low data register
0x00
0x19
PDATAH
R
Proximity ADC high data register
0x00
RESET VALUE
0x00
al
id
Specifies register address
0x00
0x001
0xFF
0xFF
lv
0x00
0x00
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0x00
0x00
ID
NOTE 1: Following power on, this register should be initialized to 0xFF.
Te
ch
ni
ca
The mechanics of accessing a specific register depends on the specific protocol used. See the section on I2C
protocols on the previous pages. In general, the COMMAND register is written first to specify the specific
control/status register for following read/write operations.
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
Command Register
The command registers specifies the address of the target register for future write and read operations.
Table 2. Command Register
6
FIELD
BITS
COMMAND
7
TYPE
6:5
3
2
TYPE
1
0
−−
ADD
DESCRIPTION
Select Command Register. Must write as 1 when addressing COMMAND register.
Selects type of transaction to follow in subsequent data transfers:
FIELD VALUE
DESCRIPTION
00
Repeated byte protocol transaction
01
Auto-increment protocol transaction
10
Reserved — Do not use
11
Special function — See description below
lv
COMMAND
4
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COMMAND
5
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7
Transaction type 00 will repeatedly read the same register with each data access.
Transaction type 01 will provide an auto-increment function to read successive register bytes.
ADD
4:0
Address register/special function register. Depending on the transaction type, see above, this field either
specifies a special function command or selects the specific control-status-register for following write and
read transactions:
FIELD VALUE
DESCRIPTION
00000
Normal — no action
00101
Proximity interrupt clear
Proximity Interrupt Clear clears any pending proximity interrupt. This special function is self clearing.
Enable Register (0x00)
The ENABLE register is used to power the device on/off, enable functions, and interrupts.
Table 3. Enable Register
7
6
4
3
PIEN
Resv
Reserved
WEN
ca
Reserved
ENABLE
5
2
1
PEN
0
PON
Address
0x00
FIELD
BITS
Reserved
7:6
PIEN
5
Proximity interrupt mask. When asserted, permits proximity interrupts to be generated.
4
Reserved. Write as 0.
3
Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait timer. Writing a 0 disables the
wait timer.
PEN
2:1
Proximity enable. These bits activate the proximity function. Writing a 11b enables proximity. Writing a 00b
disables proximity. The Wait Time register should be configured before asserting proximity enable.
PON 1, 2
0
Power ON. This bit activates the internal oscillator to permit the timers and ADC channel to operate. Writing
a 1 activates the oscillator. Writing a 0 disables the oscillator.
Te
ch
WEN
Reserved. Write as 0.
ni
Reserved
DESCRIPTION
NOTES: 1. See Power Management section for more information.
2. A minimum interval of 2.72 ms must pass after PON is asserted before proximity can be initiated. This required time is enforced
by the hardware in cases where the firmware does not provide it.
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
ALS Timing Register (0x01)
Although this part is proximity only, the ATIME period still occurs. Note that the power-on default value is 0x00
(the longest duration). This register should be initialized by the application code to 0xFF.
Table 4. ALS Timing Register
BITS
7:0
DESCRIPTION
VALUE
INTEG_CYCLES
0xFF
1
0x00
256
TIME
al
id
FIELD
ATIME
2.72 ms
696 ms
lv
Proximity Time Control Register (0x02)
The proximity timing register controls the integration time of the proximity ADC in 2.72 ms increments. It is
recommended that this register be programmed to a value of 0xFF (1 integration cycle).
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Table 5. Proximity Time Control Register
FIELD
BITS
PTIME
7:0
DESCRIPTION
VALUE
INTEG_CYCLES
TIME
MAX COUNT
0xFF
1
2.72 ms
1023
Wait Time Register (0x03)
Wait time is set 2.72 ms increments unless the WLONG bit is asserted, in which case the wait times are 12×
longer. WTIME is programmed as a 2’s complement number.
Table 6. Wait Time Register
FIELD
BITS
WTIME
7:0
DESCRIPTION
REGISTER VALUE
WAIT TIME
TIME (WLONG = 0)
TIME (WLONG = 1)
0xFF
1
2.72 ms
0.032 sec
0xB6
74
200 ms
2.4 sec
0x00
256
700 ms
8.3sec
ca
NOTE: The Wait Time register should be configured before PEN is asserted.
ni
Proximity Interrupt Threshold Register (0x08 − 0x0B)
ch
The proximity interrupt threshold registers provide the values to be used as the high and low trigger points for
the comparison function for interrupt generation. If the value generated by proximity channel crosses below the
lower threshold specified, or above the higher threshold, an interrupt is signaled to the host processor.
Table 7. Proximity Interrupt Threshold Register
ADDRESS
BITS
PILTL
0x08
7:0
Proximity low threshold lower byte
Te
REGISTER
DESCRIPTION
PILTH
0x09
7:0
Proximity low threshold upper byte
PIHTL
0x0A
7:0
Proximity high threshold lower byte
PIHTH
0x0B
7:0
Proximity high threshold upper byte
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
Persistence Register (0x0C)
The persistence register controls the filtering interrupt capabilities of the device. Configurable filtering is
provided to allow interrupts to be generated after each ADC integration cycle or if the ADC integration has
produced a result that is outside of the values specified by threshold register for some specified amount of time.
Table 8. Persistence Register
PERS
5
4
3
2
PPERS
FIELD
BITS
PPERS
7:4
Address
0x0C
DESCRIPTION
Proximity interrupt persistence. Controls rate of proximity interrupt to the host processor.
FIELD VALUE
MEANING
0000
−−−
INTERRUPT PERSISTENCE FUNCTION
0001
1
1 proximity value out of range
2
2 consecutive proximity values out of range
Every proximity cycle generates an interrupt
am
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3:0
0
Reserved
0010
Reserved
1
al
id
6
lv
7
...
...
...
1111
15
15 consecutive proximity values out of range
Default setting is 0x00.
Configuration Register (0x0D)
The configuration register sets the wait long time.
Table 9. Configuration Register
7
CONFIG
6
5
4
3
2
Reserved
1
0
WLONG
Reserved
Address
0x0D
FIELD
BITS
Reserved
7:2
DESCRIPTION
WLONG
1
Wait Long. When asserted, the wait cycles are increased by a factor 12× from that programmed in the
WTIME register.
Reserved
0
Reserved. Write as 0.
Te
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ni
ca
Reserved. Write as 0.
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
Proximity Pulse Count Register (0x0E)
The proximity pulse count register sets the number of proximity pulses that will be transmitted. PPULSE defines
the number of pulses to be transmitted at a 62.5-kHz rate.
While the value can be programmed up to 255 pulses, the practical limit of the device is 32 pulses. It is
recommended that 32 or fewer pulses be used to achieve maximum signal-to-noise ratio.
7
6
5
4
PPULSE
3
2
1
BITS
PPULSE
7:0
0
Address
0x0E
PPULSE
FIELD
al
id
Table 10. Proximity Pulse Count Register
DESCRIPTION
lv
Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
am
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Control Register (0x0F)
The Control register provides four bits of control to the analog block. These bits control the diode drive current
and diode selection functions.
Table 11. Control Register
7
CONTROL
6
5
PDRIVE
FIELD
BITS
PDRIVE
7:6
4
3
2
ResvPDIODE
Reserved
5:4
LED STRENGTH
00
100%
01
50%
10
25%
11
12.5%
Proximity Diode Select.
ca
DIODE SELECTION
00
Reserved
01
Proximity uses the Channel 0 diode
10
Proximity uses the Channel 1 diode
11
Proximity uses both diodes
ni
3:0
Address
0x0F
DESCRIPTION
FIELD VALUE
Reserved
0
LED Drive Strength.
FIELD VALUE
PDIODE
1
Reserved. Write bits as 0.
Te
ch
NOTE: The PDRIVE values are relative to the factory-trimmed current necessary to meet the Prox Coun
specification shown on page 4.
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
ID Register (0x12)
The ID Register provides the value for the part number. The ID register is a read-only register.
Table 12. ID Register
7
6
5
4
ID
3
2
1
0
Address
0x12
FIELD
BITS
ID
7:0
al
id
ID
DESCRIPTION
0x20 = TMD26711
Part number identification
lv
0x29 = TMD26713
Status Register (0x13)
am
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The Status Register provides the internal status of the device. This register is read only.
Table 13. Status Register
7
STATUS
6
Reserved
FIELD
BIT
Reserved
7:6
PINT
5
Reserved
4:0
5
4
3
PINT
Resv
2
1
0
Address
0x13
Reserved
DESCRIPTION
Reserved.
Proximity Interrupt. Indicates that the device is asserting a proximity interrupt.
Reserved.
Proximity Data Register (0x18 − 0x19h)
ca
Proximity data is stored as a 16-bit value. To ensure the data is read correctly, a two-byte I2C read transaction
should be utilized with auto increment protocol bits set in the command register. With this operation, when the
lower byte register is read, the upper eight bits are stored into a shadow register, which is read by a subsequent
read to the upper byte. The upper register will read the correct value even if the next ADC cycle ends between
the reading of the lower and upper registers.
Table 14. PDATA Registers
ADDRESS
BITS
PDATAL
0x18
7:0
Proximity data low byte
PDATAH
0x19
7:0
Proximity data high byte
DESCRIPTION
Te
ch
ni
REGISTER
Copyright E 2012, TAOS Inc.
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r
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
APPLICATION INFORMATION: HARDWARE
LED Driver Pin with Proximity Detection
al
id
In a proximity sensing system, the included IR LED can be pulsed with more than 100 mA of rapidly switching
current, therefore, a few design considerations must be kept in mind to get the best performance. The key goal
is to reduce the power supply noise coupled back into the device during the LED pulses. Averaging of multiple
proximity samples is recommended to reduce the proximity noise.
The first recommendation is to use two power supplies; one for the device VDD and the other for the IR LED.
In many systems, there is a quiet analog supply and a noisy digital supply. By connecting the quiet supply to
the VDD pin and the noisy supply to the LEDA pin, the key goal can be met. Place a 1-μF low-ESR decoupling
capacitor as close as possible to the VDD pin and another at the LEDA pin, and a 22-μF capacitor at the output
of the LED voltage regulator to supply the 100-mA current surge.
Voltage
Regulator
LDR
RP
RP
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1 mF
C*
GND
Voltage
Regulator
LEDK
VDD
lv
VBUS
TMD2671
RPI
INT
SCL
LEDA
22 mF
SDA
1 mF
* Cap Value Per Regulator Manufacturer Recommendation
Figure 12. Proximity Sensing Using Separate Power Supplies
If it is not possible to provide two separate power supplies, the device can be operated from a single supply.
A 22-Ω resistor in series with the VDD supply line and a 1-μF low ESR capacitor effectively filter any power supply
noise. The previous capacitor placement considerations apply.
VBUS
Voltage
Regulator
22 W
LEDK
VDD
LDR
1 mF
GND
TMD2671
RP
RP
RPI
INT
SCL
LEDA
SDA
ni
ca
22 mF
ch
1 mF
Figure 13. Proximity Sensing Using Single Power Supply
Te
VBUS in the above figures refers to the I2C bus voltage which is either VDD or 1.8 V. Be sure to apply the specified
I2C bus voltage shown in the Available Options table for the specific device being used.
The I2C signals and the Interrupt are open-drain outputs and require pull−up resistors. The pull-up resistor (RP)
value is a function of the I2C bus speed, the I2C bus voltage, and the capacitive load. The TAOS EVM running
at 400 kbps, uses 1.5-kΩ resistors. A 10-kΩ pull-up resistor (RPI) can be used for the interrupt line.
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
APPLICATION INFORMATION: HARDWARE
PCB Pad Layout
0.60 0.05
0.80 0.05
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lv
0.72 0.05
al
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Suggested PCB pad layout guidelines for the surface mount module are shown in Figure 14. Flash Gold is
recommended surface finish for the landing pads.
0.25 0.05
NOTES: A. All linear dimensions are in mm.
B. This drawing is subject to change without notice.
Te
ch
ni
ca
Figure 14. Suggested Module PCB Layout
Copyright E 2012, TAOS Inc.
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r
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
PACKAGE INFORMATION
MODULE
Dual Flat No-Lead
TOP VIEW
SIDE VIEW
al
id
Detector
1.0
3.94
0.2
2.40
3.73
0.1
lv
0.9
LED
0.58
END VIEW
am
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1.18
2.36 0.2
1.35
0.2
2.10 0.1
BOTTOM VIEW
0.80
ca
0.60
0.25
ch
ni
0.72
0.05
Lead Free
All linear dimensions are in millimeters. Dimension tolerance is ± 0.05 mm unless otherwise noted.
Contacts are copper with NiPdAu plating.
This package contains no lead (Pb).
This drawing is subject to change without notice.
Te
NOTES: A.
B.
C.
D.
Pb
The LUMENOLOGY r Company
Figure 15. Module Packaging Configuration
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
CARRIER TAPE AND REEL INFORMATION
TOP VIEW
8.00
1.75
4.00
1.50
al
id
2.00 0.05
B
5.50 0.05
B
1.00
0.05
Unit Orientation
A
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DETAIL A
A
lv
+ 0.30
12.00
− 0.10
DETAIL B
6 Max
8 Max
0.29
0.02
2.70
Ao
Bo
Ko
ca
All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001.
Each reel is 330 millimeters in diameter and contains 2500 parts.
TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
This drawing is subject to change without notice.
ni
NOTES: A.
B.
C.
D.
E.
F.
G.
4.30
1.70
Te
ch
Figure 16. Module Carrier Tape
Copyright E 2012, TAOS Inc.
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
SOLDERING INFORMATION
The module has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The
process, equipment, and materials used in these test are detailed below.
Table 15. Solder Reflow Profile
PARAMETER
REFERENCE
DEVICE
Average temperature gradient in preheating
2 to 3 minutes
Time above 217°C (T1)
t1
Max 60 sec
Time above 230°C (T2)
Time above Tpeak −10°C (T3)
Peak temperature in reflow
t2
Max 50 sec
t3
Max 10 sec
lv
tsoak
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Soak time
2.5°C/sec
Tpeak
260°C
Temperature gradient in cooling
Max −5°C/sec
Not to scale — for reference only
T3
T2
Temperature (C)
T1
ca
Tpeak
al
id
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
t3
t2
tsoak
t1
Figure 17. Solder Reflow Profile Graph
Te
ch
ni
Time (sec)
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
STORAGE INFORMATION
Moisture Sensitivity
al
id
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package. To ensure the package contains
the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping.
Devices are packed in a sealed aluminized envelope called a moisture barrier bag with silica gel to protect them
from ambient moisture during shipping, handling, and storage before use.
The Moisture Barrier Bags should be stored under the following conditions:
< 40°C
< 90%
No longer than 12 months from the date code on the aluminized envelope if
unopened.
lv
Temperature Range
Relative Humidity
Total Time
am
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Rebaking of the reel will be required if the devices have been stored unopened for more than 12 months and
the Humidity Indicator Card shows the parts to be out of the allowable moisture region.
Opened reels should be used within 168 hours if exposed to the following conditions:
Temperature Range
Relative Humidity
< 30°C
< 60%
If rebaking is required, it should be done at 50°C for 12 hours.
Te
ch
ni
ca
The Module has been assigned a moisture sensitivity level of MSL 3.
Copyright E 2012, TAOS Inc.
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r
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TMD2671
DIGITAL PROXIMITY DETECTOR
TAOS144B − SEPTEMBER 2012
PRODUCTION DATA — information in this document is current at publication date. Products conform to
specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard
warranty. Production processing does not necessarily include testing of all parameters.
LEAD-FREE (Pb-FREE) and GREEN STATEMENT
al
id
Pb-Free (RoHS) TAOS’ terms Lead-Free or Pb-Free mean semiconductor products that are compatible with the current
RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous
materials. Where designed to be soldered at high temperatures, TAOS Pb-Free products are suitable for use in specified
lead-free processes.
Green (RoHS & no Sb/Br) TAOS defines Green to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and
Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
am
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lv
Important Information and Disclaimer The information provided in this statement represents TAOS’ knowledge and
belief as of the date that it is provided. TAOS bases its knowledge and belief on information provided by third parties,
and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate
information from third parties. TAOS has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and
chemicals. TAOS and TAOS suppliers consider certain information to be proprietary, and thus CAS numbers and other
limited information may not be available for release.
NOTICE
Texas Advanced Optoelectronic Solutions, Inc. (TAOS) reserves the right to make changes to the products contained in this
document to improve performance or for any other purpose, or to discontinue them without notice. Customers are advised
to contact TAOS to obtain the latest product information before placing orders or designing TAOS products into systems.
TAOS assumes no responsibility for the use of any products or circuits described in this document or customer product
design, conveys no license, either expressed or implied, under any patent or other right, and makes no representation that
the circuits are free of patent infringement. TAOS further makes no claim as to the suitability of its products for any particular
purpose, nor does TAOS assume any liability arising out of the use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages.
ca
TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS, INC. PRODUCTS ARE NOT DESIGNED OR INTENDED FOR
USE IN CRITICAL APPLICATIONS IN WHICH THE FAILURE OR MALFUNCTION OF THE TAOS PRODUCT MAY
RESULT IN PERSONAL INJURY OR DEATH. USE OF TAOS PRODUCTS IN LIFE SUPPORT SYSTEMS IS EXPRESSLY
UNAUTHORIZED AND ANY SUCH USE BY A CUSTOMER IS COMPLETELY AT THE CUSTOMER’S RISK.
Te
ch
ni
LUMENOLOGY, TAOS, the TAOS logo, and Texas Advanced Optoelectronic Solutions are registered trademarks of Texas Advanced
Optoelectronic Solutions Incorporated.
The LUMENOLOGY r Company
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27
TMD2671
DIGITAL PROXIMITY DETECTOR
Te
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TAOS144B − SEPTEMBER 2012
Copyright E 2012, TAOS Inc.
The LUMENOLOGY r Company
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