AS8525 Datasheet

AS8525
L I N Tr a n s c e i v e r w i t h Vol t a g e R e g u l a t o r s , P r o g r a m m a b l e G a i n H i g h
S i d e A m p l i f i e r, a n d Vo l t a g e A t t e n u a t o r
1 General Description
Power-On Reset with OTP adjustable reset timeout and brown-
The AS8525 is a companion IC for automotive battery sensor
systems for both low-side and high-side current sensing
applications.
Over temperature warning & shutdown functions
The device provides two regulated 3.3V supplies from the battery
supply, attenuated battery voltage in differential form, and amplified
version of a high-side current-sense element’s voltage with a
translated common-mode voltage. The device also communicates
the system output to a LIN bus.
AS8525 is designed in a high-voltage 0.35µm CMOS process and
packaged on QFN-32.
out detection
Operating modes: Normal, Standby, Sleep, Temporary shut
down
Microcontroller 4-wire interface
RC oscillator and programmable timer
Optional window watchdog in normal mode and time-out
watchdog in standby mode
8 backup registers to store MCU data during VCC shut down
Load dump protection for all battery supplied pins, LIN bus pin
2 Key Features
Operating voltage 4.3V to 18V, max. 42V for 500 ms
Two linear low-drop voltage regulators: VCC = 3.3V with 50mA
drive capability
Typical 50µA quiescent current in standby mode
Typical 35µA quiescent current in sleep mode
Precision voltage attenuator with power down facility
- 0.05% ratio drift accuracy and disable
Precision fully-differential programmable gain amplifier (PGA)
- High-voltage to low-voltage common-mode translation
- Gain steps 5, 25, 50, 100
LIN bus transceiver
-
Load independent slew control conforming to LIN 2.1
Short circuit protection
TX time out fail safe feature
Over temperature warning and shut down
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and Enable pin
Internal reverse polarity protection (up to -27V) for all battery-
sensing pins and LIN bus pin
Chip ID for traceability
-40ºC to +115ºC ambient operating temperature
32-pin QFN (5x5) package
3 Applications
The AS8525 is suitable for LIN networked 14V battery sensor slaves
for current measurement in positive battery power rail (high side) or
in minus rail (PGA is left un-used in that case).
The device is also ideal for general purpose system basis chip for
actuator LIN slaves with battery voltage sensing and actuator high
side current sensing.
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AS8525
Datasheet - A p p l i c a t i o n s
Figure 1. AS8525 Block Diagram
ALDO
AVCC
VSUP
LDO
LDO
PORVSUP
EN
VCC
PORVCC
Temp
Limiter
Mode
Control
LIN Wakeup
Window
Watchdog
AS8525
Signal Path
Mode Control
Control
Registers
OTP Memory
Diagnostic
Registers
VSUP
Receiver
Backup Registers
RX
TX
RESET
Timeout
Watchdog
INT
MEN
RESET
VSS2
CS
SCLK
SDO
SDI
LIN
Slew
Control
Transmitter
LIN Transceiver
PGA with
common-mode translation
AVCC
CHP
-
HRSHL
+
HRSHH
G
LRSHH
-
VSUP2
VCMREF
Generator
+
VBG_IN
LRSHL
CLK
Attenuator
+
-
VBAT
VBAT_DIV
VBAT_DIVN
VSS1
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Revision 2.4
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AS8525
Datasheet - C o n t e n t s
Contents
1 General Description ..................................................................................................................................................................
1
2 Key Features.............................................................................................................................................................................
1
3 Applications...............................................................................................................................................................................
1
4 Pin Assignments .......................................................................................................................................................................
5
4.1 Pin Descriptions....................................................................................................................................................................................
5
5 Absolute Maximum Ratings ......................................................................................................................................................
7
6 Electrical Characteristics...........................................................................................................................................................
8
6.1 Characteristics of Digital Inputs and Outputs .......................................................................................................................................
8
6.2 Detailed System and Block Specifications ...........................................................................................................................................
9
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
6.2.8
6.2.9
Programmable Gain Amplifier (PGA).........................................................................................................................................
VCMREF Generator ..................................................................................................................................................................
Voltage Attenuator .....................................................................................................................................................................
Voltage Regulators (LDO & ALDO) ...........................................................................................................................................
LIN Transceiver .........................................................................................................................................................................
TX Timeout Watchdog ...............................................................................................................................................................
Temperature Limiter ..................................................................................................................................................................
Other Modules ...........................................................................................................................................................................
4-Wire Serial Port Interface .......................................................................................................................................................
6.3 Timing Diagrams ................................................................................................................................................................................
7 Detailed Description................................................................................................................................................................
10
11
11
11
12
13
13
14
15
16
17
7.1 Programmable-Gain Amplifier (PGA) / Current-Sense Amplifier (CSA) .............................................................................................
17
7.2 Voltage Attenuator ..............................................................................................................................................................................
17
7.3 Voltage Regulators (LDO & ALDO) ....................................................................................................................................................
17
7.4 LIN Transceiver ..................................................................................................................................................................................
18
7.5 Temperature Monitor / Limiter.............................................................................................................................................................
18
7.6 VSUP Under-Voltage Reset ...............................................................................................................................................................
18
7.7 RESET................................................................................................................................................................................................
18
7.8 VCC Under-Voltage Reset..................................................................................................................................................................
19
7.9 Window Watchdog (WWD) .................................................................................................................................................................
19
7.10 Timeout Watchdog (TWD) ................................................................................................................................................................
19
8 Application Information ...........................................................................................................................................................
20
8.1 Operating Modes and States..............................................................................................................................................................
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
Normal Mode .............................................................................................................................................................................
Standby Mode............................................................................................................................................................................
Sleep Mode................................................................................................................................................................................
Temporary Shutdown Mode ......................................................................................................................................................
Thermal Shutdown Mode...........................................................................................................................................................
20
20
20
20
20
20
8.2 State Transition Diagram....................................................................................................................................................................
21
8.3 Initialization.........................................................................................................................................................................................
23
8.4 Wake-Up.............................................................................................................................................................................................
24
8.5 LIN BUS Transceiver..........................................................................................................................................................................
24
8.5.1 Transmit Mode........................................................................................................................................................................... 24
8.5.2 Receive Mode............................................................................................................................................................................ 24
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AS8525
Datasheet - C o n t e n t s
8.6 RX and TX Interface ...........................................................................................................................................................................
25
8.6.1 Input TX ..................................................................................................................................................................................... 25
8.6.2 Output RX .................................................................................................................................................................................. 25
8.7 MODE Input EN..................................................................................................................................................................................
26
8.8 4-Wire SPI Interface ...........................................................................................................................................................................
28
8.8.1
8.8.2
8.8.3
8.8.4
SPI Frame..................................................................................................................................................................................
Write Command.........................................................................................................................................................................
Read Command.........................................................................................................................................................................
Timing ........................................................................................................................................................................................
8.9 Configuration and Diagnostic Registers .............................................................................................................................................
28
28
29
30
31
8.9.1 Register Definitions.................................................................................................................................................................... 32
9 Package Drawings and Markings ...........................................................................................................................................
34
10 Ordering Information.............................................................................................................................................................
36
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Revision 2.4
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AS8525
Datasheet - P i n A s s i g n m e n t s
4 Pin Assignments
EN
29
VSUP
30
VSUP
31
LIN
VSS1
32
VSS2
Figure 2. Pin Assignments (Top View)
28
27
26
25
24 VCC
1
23 AVCC
VBAT 2
22 TX
HRSHH 3
VSUP2 4
HRSHL 5
AS8525
21 RX
(QFN-32)
20 CS
19 SDO
6
18 SCLK
VBAT_DIV 7
17 SDI
13
14
15
16
CLK
RESET
12
MEN
LRSHH
11
INT
10
VBG_IN
9
LRSHL
VBAT_DIVN 8
4.1 Pin Descriptions
Table 1. Pin Descriptions
Pin Name
Pin Number
NC
1
VBAT
2
HRSHH
3
VSUP2
4
Supply
HRSHL
5
Analog Input
NC
6
VBAT_DIV
7
VBAT_DIVN
8
LRSHL
9
LRSHH
10
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Pin Type
Description
Not connected
Battery voltage input
Analog Input
Battery-side connection to high-side current-sense element
Supply input for the high-side amplifier
Load-side connection to high-side current-sense element
Not connected
Attenuated battery voltage output (differential)
Analog Output
Gained current-sense element voltage output with translated
common-mode voltage (differential)
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AS8525
Datasheet - P i n A s s i g n m e n t s
Table 1. Pin Descriptions
Pin Name
Pin Number
Pin Type
VBG_IN
11
Analog Input
NC
12
INT
13
Digital Input
MEN
14
Digital I/O with Pull-Down
CLK
15
RESET
16
SDI
17
SCLK
18
SDO
19
Digital Output / Tristate
Serial data out
CS
20
Digital Input with Pull-Up
Chip select
RX
21
TX
22
AVCC
23
VCC
24
EN
25
VSUP
26
27
LIN
28
NC
29
VSS1
30
VSS2
31
NC
32
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Description
Low noise Bandgap reference voltage input
Not connected
Reference input for time-out Watchdog in the device standby
mode
Enable input for analog signal paths in the device standby mode
Digital Input with Pull-Down Chopper clock input
Reset output (active low)
Digital Output
Serial data in
Digital Input
Serial clock
Digital I/O with Pull-Up
LIN transceiver receive pin
LIN transceiver transmit pin
Regulated 3.3V regulated output supply-2 for loads up to 50mA
Supply
Note: The OTP selection option is common for VCC & AVCC
Regulated 3.3V regulated output supply-1 for loads up to 50mA
Digital Input with Pull-Down Enable input
Supply input from battery (through external reverse polarity
protection device)
Supply
Analog Input / Output
LIN bus
Not connected
Ground
Ground
Ground (VCC and AVCC are generated with reference to this
ground)
Not connected
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AS8525
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 8 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Parameter
VSUP
Min
Supply voltages
VSUP2
Typ
Max
-0.3
42
-27
42
Units
V
VBAT,
HRSHH,
HRSHL
Battery voltage inputs
-27
42
V
EN
Enable input
-0.3
42
V
VCC,
AVCC
Regulated output supplies
-0.3
7
V
LIN
LIN bus
-27
40
V
Analog & digital inputs and
outputs
-0.3
7
V
Input current (latchup immunity)
-100
100
mA
Iscr
ESD
Ptot
2
Electrostatic Discharge
Norm: AEC-Q100
1
Package thermal resistance
Tstg
Storage temperature
Tbody
MSL
Moisture Sensitive Level
Norm: AEC-Q100
For VCC, AVCC, TX, RX, Reset, CS, SCLK,
SDO, SDI, EN, VBAT_DIV, VBAT_DIVN,
LRSHH, LRSHL, VBG_IN, CLK, INT, MEN,
VSUP2, HRSHH and HRSHL
±4
VSUP, VBAT
Short of VSUP2, HRSHH and HRSHL
(shorted by shunt)
kV
±8
LIN to VSS1, HBM Model
±6
LIN to VSS1, IEC6100-4-2
±0.5
LIN to VSS1, CDM
±0.1
LIN to VSS1, MM
500
25
-55
5
mW
QFN 32 in still air, soldered on JEDEC
standard board @115º ambient, static
operation = no time limit
ºC/W
+150
Package body temperature
Humidity non-condensing
Maximum allowed potential difference
between any two pins in the set HRSHH,
HRSHL and VSUP2 is 0.3V
±2
Total operating power
dissipation (all supplies and
outputs)
Ro
Comments
ºC
+260
ºC
85
%
3
The reflow peak soldering temperature
(body temperature) is specified according
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non hermetic
Solid State Surface Mount Devices”. The
lead finish for Pb-free leaded packages in
matte tim (100% Sn).
Represents a maximum floor time of 168h
1. ESD Human Body model: R=1500Ω and C=150pF
2. Total power dissipation cannot exceed 0.500W to avoid increase in junction temperature, i.e. greater than 130ºC. VCC LDO can supply
current externally, which is not greater than 15mA at 18V VSUP and 18mA at 16V VSUP. AVCC LDO can supply current externally,
which is not greater than 10mA at 18V VSUP and 12mA at 16V VSUP.
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Revision 2.4
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AS8525
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
Table 3. Operating Conditions
Symbol
Parameter
VSUP
Supply voltages
Conditions
Min
Regulators after power-on reset
4.3
Regulators for power-on reset
6
VSUP2
Typ
Max
Units
18
V
4.5
18
V
4.5
18
V
±0.2
V
VBAT,
HRSHH,
HRSHL
Battery voltage inputs
ΔVHiSide
Difference between any two pins in
the set HRSHH, HRSHL and VSUP2
LIN
LIN bus
0
18
V
EN
Enable input
0
18
V
VCC,
AVCC
Regulated output supplies
0
3.6
V
ΔVCC
Difference in regulated supplies
±0.2
V
VBG_IN
Bandgap reference input
0
1.32
V
Analog & digital inputs and outputs
0
3.6
V
-40
+115
ºC
65
mA
Max
Units
TAMB
Ambient temperature
Maximum junction temperature (TJ)=130ºC
Isup
Supply Current
Though the two regulators are individually
capable of 50mA, the total current is limited.
6.1 Characteristics of Digital Inputs and Outputs
All pull-up, pull-downs have been implemented with active devices. RX, SDO, RESET have been measured with 100pF load.
Table 4. Characteristics of Digital Inputs and Outputs
Symbol
Parameter
Conditions
Min
Typ
EN Input
VIH
High level input voltage
VIL
Low level input voltage
ILEAK
Input leakage current
EN=VSS
Ipd_en
Pull down current
EN=VCC
0.8*VCC
V
0.2*VCC
V
-1
+1
µA
30
100
µA
TX, CS, INT Inputs
VIH
High level input voltage
VIL
Low level input voltage
ILEAK
Input leakage current
TX=VCC
Ipu
Pull up current
TX,CS, INTN pulled down to VSS
0.8*VCC
V
0.2*VCC
V
-1
+1
µA
-30
-100
µA
CLK, MEN Inputs
VIH
High level input voltage
VIL
Low level input voltage
ILEAK
Input leakage current
Ipd_spi
Pull down current
0.8*VCC
CLK, MEN pulled up to VCC
V
0.2*VCC
V
-1
+1
µA
30
100
µA
SDI, SCLK
VIH
High level input voltage
VIL
Low level input voltage
ILEAK
Input leakage current
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0.8*VCC
-1
Revision 2.4
V
0.2*VCC
V
+1
µA
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AS8525
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Table 4. Characteristics of Digital Inputs and Outputs (Continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
RX Output
VOH
High level output voltage
VOL
Low level output voltage
IOUT = 1mA, VSUP ≥ 6V
VSS+0.
4
V
Ipu_reset
Pull-up current
Pulled down to VSS
-100
µA
V
SDO, RESET Output
VOH
High level output voltage
VOL
Low level output voltage
V
VSUP ≥ 6V
VSS+0.
4
V
Max
Units
6.2 Detailed System and Block Specifications
Table 5. System Specifications
Symbol
Parameter
No load on VCC, AVCC, LIN bus in
recessive state, Current sense channel ON
Ivsupnom
Ivbatnom
Conditions
Current consumption normal mode
Min
Typ
850
Ivsup2nom
Current sense channel ON
600
Ivsupstdby
No load on VCC, AVCC, LIN bus in
recessive state
40
Ivsupsleep
Ivbatoff
Current consumption standby /
sleep mode
Ivsup2off
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µA
60
30
µA
Voltage sense channel OFF
2
Current sense channel OFF
5
Revision 2.4
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AS8525
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6.2.1
Programmable Gain Amplifier (PGA)
Table 6. Programmable Gain Amplifier (PGA)
Symbol
Parameter
Conditions
Min
G1
Max
Units
5
G2
Gain
G3
25
DC gain
V/V
50
G4
100
VIN_AMP
Input signal range
V(HRSHH)-V(HRSHL)
Gx represents typical gain value (x=1,2,3,4)
after Offset trimming
VICM_AMP
Input common-mode voltage
V(HRSHH), VSUP2
4.5
VOCM_AMP
Output common-mode voltage
When AVCC=3.3V
Only for information
1.5
εp1,G
Gain error
εp2,G
TSettle_AMP
Typ
Time for settling to within 0.05%
final value
f-3dB AMP
3-dB bandwidth
±0.18*5/
Gx
V
12
18
V
1.65
1.8
V
Temperature: -40 to +115ºC
@ VSUP2 = 12V
Post system calibration
±0.5
%
At room temperature
V(HRSHH), VSUP2=12V
Without system calibration
±5
%
Includes the settling of chopper
45
µs
G1
650
G2
250
G3
150
G4
75
VNDin_AMP
Input referred thermal noise density
(rms)
This excludes 1/f noise
Guaranteed by design
THDAMP
Total harmonic distortion
Till 500Hz single-ended sinusoidal inputs
(after offset trimming).
Guaranteed by design
CL_AMP
Load capacitance
Single ended (Includes the capacitance
presented by the pad and pin of the host
chip)
VBG_AMP
Bandgap reference voltage
External low noise reference
VNDBG_AMP
Bandgap reference thermal noise
density
VOSin_AMP
VOSinT_AMP
kHz
35
nV/√Hz
70
dB
100
pF
1.224
V
When noise bandwidth < signal bandwidth,
take it as 200nV/√Hz (Noise Bandwidth /
Signal Bandwidth)
200
nV/√Hz
Input referred offset before
trimming
Refers to the standalone amplifier without
chopper stabilization
±37.5
mV
Input referred offset after trimming
Refers to the standalone amplifier without
chopper stabilization;
Only at room temperature
±1.5
mV
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Revision 2.4
1.176
1.2
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AS8525
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6.2.2
VCMREF Generator
Table 7. VCMREF Generator
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VCMREF_AMP
Common-mode reference voltage
When AVCC=3.3V
1.55
1.65
1.75
V
Conditions
Min
Typ
Max
Units
6.2.3
Voltage Attenuator
Table 8. Voltage Attenuator
Symbol
Parameter
RDIV
Division ratio
VBAT
Input voltage range/
Battery voltage range
εp,RDIV
Ratio error
εdt1,RDIV
Ratio drift
(w.r.t Temperature)
εdt2,RDIV
6.2.4
481
Factory option
V/V
21
4.5
12
At room temperature, VBAT=12V
18
V
±1
%
Temperature: -25 to +65ºC
@VBAT = 12V
±0.05
0.1
Temperature: -40 to +115ºC
@VBAT = 12V
0.1
0.2
Min
Typ
Max
Units
%
Voltage Regulators (LDO & ALDO)
Table 9. Voltage Regulators (LDO & ALDO)
Symbol
Parameter
Conditions
VSUP
Input Supply Voltage
4.3
12
18
V
VCC
AVCC
Output Voltage Range
3.15
3.3
3.45
V
50
mA
50
mA
LDO Load Current
ILOAD
ALDO Load Current
0.01
ICC_SH
Output Short Circuit Current
Normal mode
250
mA
dVCC1
Line Regulation
ΔVCC / ΔVSUP for VSUP range
8
mV/V
LOREG
Load Regulation
ΔVCC / ΔICCn
(0.5mA < ILOAD < 50mA)
1
mV/mA
Output Capacitor1 LDO
Electrolytic
2.2
10
µF
1
10
Ω
Output Capacitor2 LDO
Ceramic
100
220
nF
0.02
1
Ω
Output Capacitor1 ALDO
Electrolytic
2.2
5
µF
CL1
ESR1
CL2
ESR2
CL1
ESR1
CL2
ESR2
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Output Capacitor2 ALDO
Ceramic
Revision 2.4
1
10
Ω
100
220
nF
0.02
1
Ω
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AS8525
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6.2.5
LIN Transceiver
Table 10. DC Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Ibus_lim
Current limitation in Dominant State LIN=VSUP_max
40
120
200
mA
LIN_VOL
Output Voltage BUS (dominant state), ILIN=40mA
(short-circuit condition tested at VOL=2.5V)
2
V
60
kΩ
20
µA
Driver
Pull-up resistor
Ibus_leak_rec
Normal mode (recessive BUS level on TX pin)
20
40
Driver OFF; 7.3V < VSUP < 18;
8V < VBUS < 18, VSUP < VBUS < 1.08 * VSUP
(to be tested at VBUS=18V)
Receiver
Ibus_leak_dom
Input Leakage current at receiver
Driver OFF; Vbus=0V; VSUP=12V; VCC=3.3V
-1
Ibus_no_GND
VSS=VSUP;
VSUP=12V; 0V < VBUS < 18V, VCC=3.3V
(to be tested at VBUS=18V)
-1
Ibus_no_bat
VSUP=VSS; 0V < VBUS < 18V, VCC=VSS
(to be tested at VBUS=18V)
mA
Vbus_dom
Vbus_rec
1
mA
100
µA
0.4
VSUP
0.6
1
Vbus_cnt
Vbus_cnt = (Vth_dom + Vth_rec)/2
Vhys
Vhys = (Vth_dom – Vth_rec)
1
VSUP
0.475
0.525
VSUP
0.05
0.175
VSUP
1. Vth_dom: Receiver threshold of the recessive to dominant LIN bus edge,
Vth_rec: Receiver threshold of the dominant to recessive LIN bus edge
Table 11. AC Electrical Characteristics
Symbol
Conditions
Min
Typ
Max
Units
LIN Driver, Bus load conditions (CBUS; RBUS): 1nF; 1kΩ / 6.8nF; 660Ω / 10nF; 500Ω
D1
Worst case 20Kbps
transmission
Vth_rec (max) = 0.744 x VSUP;
Vth_dom (max) = 0.581 x VSUP;
VSUP = 6.0V...18V; tbit = 50μs;
D1 = tbus_rec (min) / (2 x tbit)
OTP selection = High Slew Mode
D2
Worst case 20kbps
transmission
Vth_rec (min) = 0.422 x VSUP;
Vth_dom (min) = 0.284 x VSUP;
VSUP = 6V...18V; tbit = 50μs;
D2 = tbus_rec (max) / (2 x tbit)
OTP selection = High Slew Mode
D3
Worst case 10.4kbps
transmission
Vth_rec (max) = 0.778 x VSUP;
Vth_dom (max) = 0.616 x VSUP;
VSUP = 6.0V...18V; tbit = 96μs;
D3 = tbus_rec (min) / (2 x tbit)
OTP selection = Low Slew Mode
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Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Table 11. AC Electrical Characteristics (Continued)
Symbol
Conditions
D4
Worst case 10.4kbps
transmission
Vth_rec (min) = 0.389 x VSUP;
Vth_dom (min) = 0.251 x VSUP;
VSUP = 6V...18V; tbit = 96μs;
D4 = tbus_rec (max) / (2 x tbit)
OTP selection = Low Slew Mode
0.59
tdLR
VCC= 3.3V; Propagation delay bus dominant to RX LOW
6
µs
tdHR
VCC= 3.3V; Propagation delay bus dominant to RX HIGH
6
µs
tRS
Receiver Delay symmetry
-2
2
µs
twake
Wake-up delay time
30
150
µs
tsln
Transition from standby mode to normal mode
(clock frequency is 128kHz ±25%)
4
Clock
cycles
tnsl
Transition from standby mode to normal mode
(clock frequency is 128kHz ±25%)
6
Clock
cycles
trec_deb
Receiver De-bounce time
Cint
Internal capacitance of the LIN node
6.2.6
Min
Typ
Max
0.6
Units
1
µs
250
pF
TX Timeout Watchdog
Table 12. TX Timeout Watchdog
Symbol
Parameter
tlin_wdog
Time out period for the dominant
state
6.2.7
Conditions
Min
Typ
Max
Units
0.5
1
2
s
Temperature Limiter
Table 13. Temperature Limiter
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Tsd
Shut down temperature
Junction temperature
155
170
185
ºC
Totset
Over-temperature warning
Junction temperature
142
157
172
ºC
Tret
Return temperature
Junction temperature
125
140
155
ºC
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Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6.2.8
Other Modules
Table 14. Other Modules
Symbol
Parameter
Conditions
Min
Vuvr_off
VCC under-voltage threshold off (default)
Rising edge of VCC
Vuvr_on
VCC under-voltage threshold on (default)
Vuvr1_off
Typ
Max
Units
2.55
2.95
V
Falling edge of VCC
2.3
2.7
V
VCC under voltage threshold off (factory
option)
Rising edge of VCC
3.0
3.4
V
Vuvr1_on
VCC under voltage threshold on (factory
option)
Falling edge of VCC
2.75
3.15
V
Vuvr2_off
VCC under voltage threshold off (factory
option)
Rising edge of VCC
3.5
3.9
V
Vuvr2_on
VCC under voltage threshold on (factory
option)
Falling edge of VCC
3.25
3.65
V
Vuvr3_off
VCC under-voltage threshold off (factory
option)
Rising edge of VCC
4.0
4.4
V
Vuvr3_on
VCC under voltage threshold on (factory
option)
Falling edge of VCC
3.75
4.15
V
Vhyst_vcc
Hysteresis of under-voltage threshold on/
off VCC
For all OTP options
0.1
0.4
V
trr
Glitch filter on VCC under-voltage
detection
See Reset Functionality (page 18)
4
µs
Vsuvr_off
VSUP under-voltage threshold off
Rising edge of VSUP
5.1
V
Vsuvr_on
VSUP under-voltage threshold on
Falling edge of VSUP
3.8
V
WD_TCL
WWD non-service time (factory option)
RESET will be generated
0-75
WD_TSV
WWD Service time (factory option)
RESET will not be generated
75-150
0.25
0-100
0-125
100-200 125-250
0-80
0-100
ms
ms
WD_TCL1
WWD non-service time (factory option)
RESET will be generated
0-60
WD_TSV1
WWD Service time (factory option)
RESET will not be generated
60-120
WD_TCL2
WWD non-service time (factory option)
RESET will be generated
0-45
0-60
0-75
ms
WD_TSV2
WWD Service time (factory option)
RESET will not be generated
45-90
60-120
75-150
ms
WD_TCL3
WWD non-service time (factory option)
RESET will be generated
0-150
0-200
0-250
ms
WD_TSV3
WWD Service time (factory option)
RESET will not be generated
WD_TCL4
WWD non-service time (factory option)
RESET will be generated
WD_TSV4
WWD Service time (factory option)
RESET will not be generated
80-160 100-200
150-300 200-400 250-500
0-120
0-160
0-200
120-240 160-320 200-400
ms
ms
WD_TCL5
WWD non-service time (factory option)
RESET will be generated
0-90
WWD Service time (factory option)
RESET will not be generated
90-180
WD_T
TWD service time
T is configured through SPI
0.75*T
T
1.25*T
s
tRes
Reset period
Min = -25% and Max = +50%
6
8
12
ms
Tshd
Temporary shutdown reset active time
1
s
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0-150
ms
WD_TSV5
0.1
0-120
ms
ms
120-240 150-300
ms
ms
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Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6.2.9
4-Wire Serial Port Interface
Table 15. 4-Wire Serial Port Interface
Symbol
Parameter
Conditions
Min
Typ
Max
Units
250
Kbps
General
BRSPI
Bit rate
TSCLKH
Clock high time
2
µs
TSCLKL
Clock low time
2
µs
tDIS
Data in setup time
20
ns
tDIH
Data in hold time
10
ns
TCSH
CS hold time
20
ns
Write Timing
Read Timing
tDOD
Data out delay
tDOHZ
Data out to high impedance delay
Time for the SPI to release the SDO bus
80
ns
80
ns
Timing parameters when entering 4-Wire SPI mode (for determination of CLK polarity)
tCPS
Clock setup time
(CLK polarity)
Setup time of SCLK with respect to CS
falling edge
20
ns
tCPHD
Clock hold time
(CLK polarity)
Hold time of SCLK with respect to CS
falling edge
20
ns
TSTNDY_trigger
TX high time from EN falling edge
To enter into Sleep/Standby mode
5
cycles
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6.3 Timing Diagrams
Figure 3. Timing Diagrams for Propagation Delays
TxD
50%
tdf_TXD
tdr_TXD
VBUS
100%
95%
BUS
50%
50%
5%
0%
tdf_RXD
RxD
tdr_RXD
50%
Figure 4. Timing Diagram for Duty Cycle According to LIN 2.1 and J2602
tbit
tbit
TXD
tbus_dom(max)
tbus_rec(min)
tbus_dom(min)
tbus_rec(max)
LIN
Vth_rec(max)
Vth_dom(max)
Vth_rec(min)
Vth_dom(min)
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7 Detailed Description
The following modules are described in detail under this section:
Programmable-Gain Amplifier (PGA) / Current-Sense Amplifier (CSA)
Voltage Attenuator
Voltage Regulators (LDO & ALDO)
LIN Transceiver
Temperature Monitor/Limiter
VSUP Under-Voltage Reset
RESET
VCC Under-Voltage Reset
Window Watchdog (WWD)
Timeout Watchdog (TWD)
7.1 Programmable-Gain Amplifier (PGA) / Current-Sense Amplifier (CSA)
The current-sense amplifier primarily serves the purpose of shifting the common-mode level of the signal from around the battery voltage to a low
voltage which is nominally half the regulated supply voltage. The input to the amplifier can be optionally chopped for offset and low-frequency
noise mitigation. As the name indicates, it also provides a programmable gain for the measurement of different battery current ranges which can
be programmed through SPI.
7.2 Voltage Attenuator
A resistive divider is used as a battery voltage attenuator. Like the amplifier, the attenuator can be enabled or disabled through SPI, and in the
device standby mode, we additionally need logic high on MEN pin for enabling. Internal reverse polarity protection is provided for VBAT pin.
Figure 5. Attenuator Implementation
VBAT
PD
VBAT_DIV
VBAT_DIVN
7.3 Voltage Regulators (LDO & ALDO)
The device has two low-dropout voltage regulators, named LDO and ALDO, with one-time programmable 3.3V voltage output. The output of the
LDO is VCC and that of the ALDO is AVCC. The regulated voltage choice is common to both the regulators. The regulators are always ON
except when the device enters the sleep mode or over-temperature shutdown.
The two regulators have inbuilt short-circuit current limitation feature.
The regulators can be temporarily shut down for hard reset of the external circuitry by configuring the device to temporary shutdown mode
through SPI.
The LDO power-up happens when the POR-VSUP event occurs (RESET_VSUP_N switching from low to high), and the ALDO powers up when
POR-VCC event occurs (RESET_VCC_N switching from low to high). The start-up sequence is the same even after a temporary shutdown
phase. The ALDO will be switched off if there is an under-voltage on VCC, that is, when RESET_VCC_N switches back to low.
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7.4 LIN Transceiver
The device has a LIN transceiver with slew-controlled bus driver for controlling the electromagnetic emissions from the LIN bus. Further, the slew
rate is independent of the bus load. The transmitter relays the data from the LIN controller (TX pin) to the bus (LIN pin), and the receiver provides
the data on the bus to the controller (RX pin). The transceiver conforms to the LIN 2.1 standard.
The LIN transceiver has a timeout watchdog for TX. After the timeout, the LIN bus will be released to the recessive state from the dominant state.
The bus driver has an inbuilt short-circuit current limitation facility to protect the device from damage when there is a short between the bus and
the supply.
In addition to the data receiver, there is a low-power receiver active in the device standby/sleep mode which received a wake-up event from the
bus to bring the device to normal mode.
7.5 Temperature Monitor / Limiter
The temperature limiter circuit powers down the device when the junction temperature exceeds 170°C (nominal). It also issues an overtemperature warning at 160°C (nominal). The device is powered up again when the junction temperature falls below 140°C (nominal). The overtemperature warning flag is also cleared at this temperature.
The temperature limiter circuit can be optionally disabled through SPI.
7.6 VSUP Under-Voltage Reset
When VSUP drops below VSUVR_ON, the RESET_VSUP_N switches back to low level. This is treated as a master reset and will have the
highest priority over all other signals. In this case, the regulators, LIN transceiver, and all other blocks are shut off, and the device comes to a
complete stop. The device returns to the normal mode when VSUP rises over VSUVR_OFF again irrespective of the mode it was in prior to this
under-voltage condition.
7.7 RESET
RESET module generates an active-low reset signal for the external circuitry supplied by VCC. The behavior of the reset output is depicted in
Figure 6 in different cases. As shown, RESET signal is affected by an under-voltage condition on VCC and Watchdogs which are described in
detail in the subsequent sections.
The reset period can be one-time programmed to 4, 16, and 32 ms with a default value of 8 ms.
Figure 6. Reset Functionality
VSUP
T>Tj
VCC
T<Tj
t<trr
VUVR_OFF
VUVR_ON
tRes
tRes
tRes
tRes
trr
tRes
RESET
Start-up
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Over-temp
Shutdown
Glitch in
VSUP
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VSUP UV
Reset by
Watchdog
SC Current
Limitation Active
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7.8 VCC Under-Voltage Reset
When VCC drops below VUVR_ON, the RESET_VCC_N switches back to low level. This event generates a reset output. The reset output is
released again only a reset period (tRes) later after VCC rises above VUVR_OFF. If the time difference between the VCC falling below VUVR_ON
and rising above VUVR_OFF is less than trr, there will be no reset output. The reset output is affected in the conditions like over-temperature
shutdown and temporary shutdown only through VCC under-voltage.
VCC under-voltage reset thresholds (VUVR_ON and VUVR_OFF) can be chosen by OTP.
7.9 Window Watchdog (WWD)
The Window Watchdog ensures that the Microcontroller is properly functioning in the normal mode of the device. The Watchdog is started after a
reset and the Microcontroller needs to send a trigger in the window of WD_TSV (service time). If the trigger occurs early, in the period WD_TCL,
or after WD_TSV, a reset output is generated.
The Microcontroller can access the trigger bit for the watchdog through SPI. The WWD can be enabled and the window times can be
programmed through OTP bits.
Figure 7. Window Watchdog Functionality
Period
Non-Service time (WD_TCL)
Service time (WD_TSV)
50 %
100 %
Trigger
restart
period
Trigger
via SPI
Last trigger
Earliest point for
correct trigger
(No RESET)
Latest point for
correct trigger
(No RESET)
Correct trigger
(No RESET)
Wrong trigger
(RESET generation)
Wrong trigger
(RESET generation)
7.10 Timeout Watchdog (TWD)
The Timeout Watchdog ensures that the Microcontroller is in proper functional state in the device standby mode. The Watchdog timer will be
started upon a rising edge on INT and will generate a reset output if the Microcontroller doesn’t send a trigger before the timeout.
The Microcontroller can access the trigger bit for the watchdog through SPI. The TWD can be enabled by OTP and the timeout interval can be
programmed through SPI.
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8 Application Information
The AS8525 chip consists of a programmable gain amplifier, a resistive divider, two low drop-out regulators, and a LIN bus transceiver.
Additionally integrated are a RESET unit with a power-on-reset delay and programmable window watchdog and timeout watchdog timers. It also
includes a watchdog time-out on LIN TX node to indicate if the Microcontroller is stuck in a loop and the LIN bus remains in dominant time for
more than the necessary time.
8.1 Operating Modes and States
The device provides four main operating modes ‘normal’, ‘sleep/stand-by’ (programmed by OTP), “temporary shutdown” and ‘thermal shutdown’.
The LIN transceiver can be programmed to operate with lower slew in the normal mode. A detailed state transition table is shown in the following
section (see Table 16).
8.1.1
Normal Mode
This is the mode after the power-up. In this mode, voltage regulators, LIN transceiver, window Watchdog are all active. The PGA and resistive
divider can be enabled through SPI. LIN transceiver is capable of sending the TX data from micro-controller to the LIN bus at a maximum rate of
20Kbps.
8.1.2
Standby Mode
Standby mode is a functional low-power mode and is entered by pulling EN to ground. The LIN transceiver, PGA, resistive divider, window
watchdog, and TX timeout watchdog circuits are disabled. But, it is possible to selectively enable the voltage and current measurement paths in
this mode using an externally generated measurement enable (MEN) signal on the MEN pin. The timeout Watchdog can be enabled in this mode
to make sure that the Microcontroller is active.
8.1.3
Sleep Mode
Sleep mode is the current saving mode. The voltage regulators are disabled in this mode. Also, the PGA, resistive divider, LIN transceiver, and
the reset and Watchdog units are switched off. The LIN wake-up circuit and oscillator are active. Wake-up is possible only through remote wakeup through LIN pin pulling it to dominant state for 100us.
8.1.4
Temporary Shutdown Mode
In this mode, the regulators are powered down and the VCC, AVCC are pulled down. This provides an alternative way to reset those components
powered by AS8525. The feature has to be enabled by an OTP bit and can be invoked through SPI. The LIN transceiver along with the LIN
wake-up circuit is powered down. No remote wake-up functionality is possible. LIN bus enters into recessive state. The system goes out of this
mode to normal mode after the timeout of an internal timer.
8.1.5
Thermal Shutdown Mode
If the junction temperature TJ is higher than Tsd, the device will be switched into the thermal shutdown mode. The regulators and the transceiver
are completely disabled. Only the over-temperature monitor is active. As soon as the temperature returns back to Tret, the system enters normal
mode.
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.2 State Transition Diagram
The complete functional state machine of AS8525 is shown in this section. Soft states like “TXWD Wait” and “Standby Wait”, and other wait
states have also been included here for completeness.
Figure 8. Finite State Machine Model of AS8525
INIT0
por_vsup
! temp160
OTP LOAD
otp_load
temp160
128msec
temp160
Temp Shut
T
shu emp
tdo
wn
reset
timeout
! por_vcc ||
wwdtimeout
rwake
SLEEP
temp160
y
nd b
s ta
mp n
Te tdow
u
sh
temp160
by
e_
wa
it
! por_vcc
rw
ak
rwake
and
! st
NORMAL
p
Tem own
td
s hu
STANDBY
Temp
own
shutd
Standby &
sleep
Txwd_timeout
temp160
temp160
RESET
TIMEOUT
TX=1
OVTEMP
STANDBY
WAIT
! por_vcc
! por_vcc ||
wwdtimeout
TXWD WAIT
temp160
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 16. Transition Table
Transition
From mode
Reg.
0x05
D0
Interface
To mode
LIN
RX
Stand-By
X-RS
X-H
Sleep
X-RS
X-H
Temporary
Shutdown
X-RS
X-H
OverTemperature
X-RS
X-H
2-Wire Interface
X
X
H-L
H-L
Normal Mode
X
X
X
Temporary
Shutdown
X-RS
X-H
2
OverTemperature
X-RS
X-H
Normal (LW)
X
H-X
Normal (RW)
X
H-X
Temporary
Shutdown
RS
H
OverTemperature
RS
H
Temporary
Shutdown
Mode
Normal
RS-X
H-X
OverTemperature
Mode
Normal
RS-X
H-X
Normal
RS-X
H-X
OverTemperature
RS
Power Off
X
1
Normal Mode
2-Wire Interface
(This is a
testing
condition only)
Stand-By Mode
Sleep Mode
All States
2
2
TX
H
H
3
EN
H-L
3
H-L
Flags
rwake
Uvbat
OT
Uvcc
Comments
3
L
X
X
inactive
inactive
TX is high for
TSTNDY_trigger
3
L
X
X
inactive
set
TX is high for
1
TSTNDY_trigger
X
X
inactive
set
The Control Bit is set
through the 4-Wire SPI
interface
2
X
H
H
2
X
X
L
X
X
set
set
Temperature monitor
output asserted
(covered by scan)
L
X
X
inactive
inactive
TX goes High to low
within Ttx_SP_trigger
Window.
H
L
X
X
inactive
inactive
Completion of 2-Wire
Read/Write command
X
X
H
X
X
inactive
set
Completion of 2-Wire
Write command to 0x05
2
X
X
L
X
X
set
set
Temperature monitor
output asserted
(covered by scan)
2
X
L-H
L
X
X
inactive
inactive
2
H
X
L
set
X
inactive
inactive
Remote Wake up Event
occurred on LIN
2
H
L
H
X
X
inactive
set
The Control Bit is set
through the 4-Wire SPI
interface
2
H
L
L
X
X
set
set
Temperature monitor
output asserted
(covered by scan)
2
X
X
L
X
X
inactive
clear
Internal 128ms timer
expired
2
X
X
L
X
X
clear
clear
Temperature monitor
output de-asserted
(covered by scan)
2
X
X
L
set
X
inactive
clear
Remote Wake up Event
occurred on LIN
H
2
X
X
L
X
X
set
hold
Temperature monitor
output asserted
(covered by scan)
X
X
X
X
X
L-H
X
X
3
3
3
3
3
3
3
3
1. Chosen by OTP option
2. Effect of Transition
3. Cause for Transition
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Note: L = low state, H = high state, OT = Over-temperature Reset, Uvcc = Under-voltage VCC, Uvbat = Under-voltage VBAT, rwake =remote
wake, X = don’t care.
8.3 Initialization
When the power supply is switched on, when VSUP > VSUVR_OFF, RESET_VSUP_N becomes high. This starts the regulator LDO with 3.3V
and Vuvr_off option of 2.75V. When VCC > Vuvr_off (2.75V), active-low PORN_2_OTP is generated and the regulator ALDO is turned on with
3.3V. The rising edge of PORN_2_OTP loads contents of fuse onto the OTP latch after load access time TLoad. LOAD_OTP_IN_PREREG signal
loads contents of OTP latch onto a register. This register provides the actual settings of LDO (and ALDO), Vuvr_off and Reset Timeout period
TRes. This is done as the OTP block is powered by the VCC. If VCC > Vuvr_off (phase 2), Reset timeout is restarted. RESET signal is deasserted after Reset Timeout period TRes (phase 2) and then device enters into normal mode. The circuit also needs to initialize correctly for very
slow ramp rates on VSUP (of the order of 0.5V/min).
Figure 9. Initialization Sequence for AS8525
VSUP_POR_Threshold
VSUP
RESET_VSUP_N
PHASE 2
PHASE 1
Device
Settings
LDO On
VCC Por Threshold = 2.75V
LDO setting = 3.3V
Reset Timeout = 4msec
LDO Off
LDO On
VCC Por Threshold = from OTP Block
LDO setting = 3.3V
Reset Timeout = from OTP Block
LDO settings to 3.3 V
VCC_POR_Threshold
VCC
LDO settings to 3.3 V
AVCC
RESET_VCC_N
PORN_2_OTP
6 Cycles of
LOAD_OTP_IN_
PREREG
RC-Oscillator
RESET
If Phase 1 POR threshold != Phase 2 POR
threshold
Tres = Reset Timeout from OTP Block
If Phase 1 POR threshold == Phase 2 POR threshold
Tres = Reset Timeout from OTP Block
Table 17. VSUP>Vsuvr_on and VCC<Vuvr_on
Block
Output Signal
TRANSCEIVER=Enabled (disabled only during initial VSUP ramp-up)
LIN=high-z, RX=follows VCC…
LDO=Enabled (disabled only during initial ramp-up)
VCC=low…
RELAY DRIVER=Enabled
LDRIVE1=high… LDRIVE2=high…
RESET BLOCK=Enabled
RESET=high-z…
RESISTIVE DIVIDER=Enabled
VBAT=high…, VBAT_DIV=enabled
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Table 18. VSUP<Vsuvr_on
Block
Output Signal
TRANSCEIVER=Disabled
LIN=high-z, RX=high-z…
LDO=Disabled
VCC=low
RELAY DRIVER=Disabled
LDRIVE1=high LDRIVE2=high
RESET BLOCK=Disabled
RESET=high-z
RESISTIVE DIVIDER=Disabled
VBAT=high, VBAT_DIV=low
8.4 Wake-Up
When the device enters sleep/standby mode, it can be brought back to the normal mode with the BUS interface. A dominant state on the BUS for
twake will result in the device wakeup.
8.5 LIN BUS Transceiver
The AS8525 has an integrated bi-directional bus interface device for data transfer between LIN bus and the LIN protocol controller. The
transceiver consists of a driver with slew rate control, wave shaping and current limitation and a receiver with high voltage comparator followed
by a de-bouncing unit.
8.5.1
Transmit Mode
During transmission the data at the pin TX will be transferred to the BUS driver to generate a bus signal. To minimize the electromagnetic
emission of the bus line, the BUS driver has an integrated slew rate control and wave shaping unit.
Transmitting will be interrupted in the following cases:
Sleep mode
Thermal Shutdown active
Master Reset (VSUP < Vsuvr_on)
The recessive BUS level is generated from the integrated 30k pull up resistor in serial with an active diode This diode prevents the reverse
current of VBUS during differential voltage between VSUP and BUS (VBUS>VSUP). No additional termination resistor is necessary to use the
AS8525 in LIN slave nodes. If this IC is used for LIN master nodes it is necessary that the BUS pin is terminated via an external 1kΩ resistor in
series with a diode to VBAT.
8.5.2
Receive Mode
The data signals from the BUS pin will be transferred continuously to the pin RX. Short spikes on the bus signal are suppressed by the
implemented debouncing circuit. Including all tolerances the LIN specific receive threshold values of 0.4*VSUP and 0.6*VSUP will be securely
observed.
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Figure 10. Receive Mode Impulse Diagram
Vthr_max
60%
BUS
Vthr_hys
Vthr_cnt
50%
40%
Vthr_min
t < tdeb_BUS
t < tdeb_BUS
RX
8.6 RX and TX Interface
8.6.1
Input TX
The Tx input controls directly the BUS level. LIN Transmitter acts like a slew-controlled level shifter. A dominant state (low) on TX leads to the
LIN bus being pulled low (dominant state) too. The TX pin has an internal active pull up connected to VCC. This guarantees that an open TX pin
generates a recessive BUS level.
Figure 11. TX Interface
MCU
AS8525
VCC
VCC
IPU_TXD
8.6.2
TX
RC-Filter
(10ns)
Output RX
The received BUS signal will be output to the RX pin:
BUS < Vthr_cnt – 0.5 * Vthr_hys → RX = low
BUS > Vthr_cnt + 0.5 * Vthr_hys → RX = high
This output is a push-pull driver between VCC and GND with an output current of 1mA.
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Figure 12. RX Interface
AS8525
MCU
VCC
RX
8.7 MODE Input EN
The AS8525 is switched from normal mode to the standby/sleep mode with a falling edge on EN and keeping TX high for TSTNDY_trigger time.
Device is switched from standby mode to normal mode with a rising edge at the EN pin. The mode change for AS8525 with a falling edge on EN
can be done independently from the state of the transceiver bus. The device enters into Serial port mode by forcing EN low and driving TX high
to low within Ttx_SP_trigger time after EN forced to low. This ensures the direct control of device to enter into standby/sleep mode by
microcontroller using EN pin.
Figure 13. EN Pin Functionality
Entry into
Serial Port
Mode
Ten_ENSCLK
EN
RD
LEN1 LEN0 A4
WR
TX
Ttx_su
Normal
Mode
TSTNDY_trigger
Ttx_hd
Standby/Sleep
Mode
D3
D2
D1
D0
Ttx_su
Ttx_SP_trigger
Serial Port
Mode
Normal
Mode
Normal
Mode
The EN input has an internal active pull down to secure that if this pin is not connected, a low level will be generated.
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Figure 14. Enable Interface
CLOAD
EN
VCC
+
+3.3V
VBAT
RESET
CIN
LIN
VSS
TX
AS8525
VSUP
+
MCU
RX
VBAT
If the application doesn’t need the low-power modes of the device, a direct connection of EN to VCC is possible. In this case the AS8525
operates in permanent normal mode. Also possible is the external (outside of the module) control of the EN line via VSUP signal as shown
below.
Figure 15. EN Connection for Permanent Normal Mode
CLOAD
EN
VCC
+
+3.3V
VBAT
CIN
LIN
VSS
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RESET
VSUP
TX
AS8525
+
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.8 4-Wire SPI Interface
SPI interface is essentially used for programming the gain of the PGA, to enable the PGA and resistive attenuator in the standby mode, to
temporarily shutdown the LDOs, etc. The SPI interface can also be used as interface between the AS8525 and an external micro-controller to
configure the device and access the status information. The interface is a slave and then only the microcontroller can start the communication.
The SPI protocol is very simple and the length of each frame is an integer multiple of byte except when a transmission is started. Basically each
frame has 1 command bits, 5 address/configuration bits, 1 or more data bytes. SPI clock polarity settings depend on the value of the SCLK on
the CS falling edge. This setting is done on each start of the SPI transaction. During the transaction SPI clock polarity will be fixed to the settings
done. On the CS falling edge the values on SCLK signal decide setting of the active SPI clock edge for data transfer (see Table below).
Table 19. CS and SCLK
8.8.1
CS
SCLK
Description
FALL
LOW
Serial data transferred on rising edge of SPI clock. Sampled at falling
edge of SPI clock.
FALL
HIGH
Serial data transferred on falling edge of SPI clock. Sampled at rising
edge of SPI clock.
ANY
ANY
Serial data transfer edge is unchanged.
SPI Frame
A frame is formed by a first byte for command and address/configuration and a following bit stream that can be formed by an integer number of
bytes. Command is coded on the 1 first bit, while address is given on LSB 5 bits (see table below).
Table 20. Command Bits
Command Bits
C0
Reserved
Register Address or Transmission Configuration
Reserved
A4
A3
A2
A1
C0
Command
<A4:A0>
Description
0
WRITE
ADDRESS
Writes data byte on the given starting address.
1
READ
ADDRESS
Reads data byte from the given starting address.
A0
If the command is read or write, one or more bytes follow. When the micro-controller sends more bytes (keeping CS LOW and SCLK toggling),
the SPI interface increments the address of the previous data byte and writes/reads data to/from consecutive addresses.
8.8.2
Write Command
For Write command C0 = 0.
After the command code C0 and two reserved bits, the address of register to be written has to be provided from the MSB to the LSB. Then one
or more data bytes can be transferred, always from the MSB to the LSB. For each data byte following the first one, used address is the
incremented value of the previously written address. Each bit of the frame has to be driven by the SPI master on the SPI clock transfer edge and
the SPI slave on the next SPI clock edge samples it. These edges are selected as per clock polarity settings. In the following figures two
examples of write command (without and with address self-increment.
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Figure 16. Protocol for Serial Data Write with Length = 1
CS
SCLK
0
SDI
RES1 RES0
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
SDO
Transfer edge
Sampling edge
Data D7 – D0 is moved
to Address A4..A0 here
Figure 17. Protocol for Serial Data Write with Length = 4
CS
SCLK
SDI
0
RR
EE A A A A A D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D
SS 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
10
SDO
Data D7-D0 is
Data D7-D0 is
Data D7-D0 is
Data D7-D0 is
Data D7-D0 is
moved to Address moved to Address moved to Address moved to Address moved to Address
A4-A0 +1 here
A4-A0 +3 here
A4-A0 here
A4-A0 +2 here
A4-A0 +4 here
8.8.3
Read Command
For Read command C0=1.
After the command code C0 and two reserved bits, the address of register to be read has to be provided from the MSB to the LSB. Then one or
more data bytes can be transferred from the SPI slave to the master, always from the MSB to the LSB. To transfer more bytes from consecutive
addresses, SPI master has to keep active the SPI CS signal and the SPI clock as long as it desires to read data from the slave. Each bit of the
command and address sections of the frame have to be driven by the SPI master on the SPI clock transfer edge and the SPI slave on the next
SPI clock edge samples it. Each bit of the data section of the frame has to be driven by the SPI slave on the SPI clock transfer edge and the SPI
master on the next SPI clock edge samples it. These edges are selected as per clock polarity settings. In the following figures, two examples of
read command (without and with address self-increment) have been shown.
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AS8525
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Figure 18. Protocol for Serial Data Read with Length = 1
CS
SCLK
1
SDI
RES1
RES
0
A4
A3
A2
A1
SDO
A0
D7
Transfer edge
Sampling edge
D6
D5
D4
Data D7 – D0 at
Address A4..A0 is
read here
D3
D2
D1
Transfer edge
D0
Sampling edge
Figure 19. Protocol for Serial Data Read with Length = 4
CS
SCLK
SDI
1
R
E
S
1
SDO
R
E A A A A A
S 4 3 2 1 0
0
D D D D D D D D D D D D D D D D D D D D D D D D D D D DD D D D D D D D D D D D
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
Data D7-D0 at
Address A4-A0
is read here
8.8.4
Data D7-D0 at
Address A4-A0 +1
is read here
Data D7-D0 at
Data D7-D0 at
Address A4-A0 +2 Address A4-A0 +3
is read here
is read here
Data D7-D0 at
Address A4-A0 +4
is read here
Timing
In the following figures timing waveforms and parameters are exposed.
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Figure 20. Timing for Writing
CS
...
t CPS
SCLK
t CPHD
t SCLKH
t SCLKL
t CSH
CLK
polarity
...
t DIS
SDI
t DIH
DATAI
...
DATAI
DATAI
...
SDO
Figure 21. Timing for Reading
CS
t SCLKH
t SCLKL
SCLK
SDI
DATAI
DATAI
t
SDO
DATAO (D7)
t
DOD
DOHZ
DATAO (D0)
8.9 Configuration and Diagnostic Registers
The serial interface can be used for communication between AS8525 and an external microcontroller. The device is only a slave and the
microcontroller has to initiate the communication. The device can be configured by writing into the control registers and the diagnostic
information can be read out from the diagnostic registers.
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.9.1
Register Definitions
A total of 32 registers, each of 8-bits which include configuration, diagnostic, and backup are available. The registers can be accessed using the
2-wire or the 4-wire serial interface. Table 21 provides a description of all registers.
Table 21. Registers
Addr
Register Name
Default Value
RD/WR
Description
Configuration and Control Registers
0x00
Reserved
0x01
Reserved
0 x 02
Reserved
D0 Reserved
D1 Reserved
RD/WR D2 Enable/Disable Over-Temperature Monitor. (0-Disabled, 1-Enabled)
D3 Enable/Disable LIN Transceiver. (0-Disabled, 1-Enabled)
D4- D7 Reserved
0 x 03
Device
Configuration
Register
On POR_VCC
0000_1100
0 x 04
Device Control
Register
On POR_VSUP
RD/WR
0000_0001
D0 High Slew / Low Slew control.
1 High Slew mode
0 Low Slew Mode
D1- D7 Reserved
0 x 05
Temporary
Shutdown
Register
On POR_VCC
0000_0000
D0 Temporary shutdown control bit
1 Enter temporary shutdown
D1- D7 Reserved
0 x 06
Window Watch
Dog Trigger
Register
0 x 07
On POR_VCC
0000_0000
RD/WR
WR
D0 Window Watchdog Trigger
D1 Timeout Watchdog trigger bit
Upon a trigger, the bit will be cleared within 2 internal clock cycles.
D2- D7 Reserved
Reserved
0x0A
On POR_VCC
Signal Path
Control Register
0000_0000
0x0B
Reserved
0x0C
Reserved
0x0D
Reserved
0x0E
Watchdog Timer On POR_VCC
Control Register
0000_0000
0x0F
Reserved
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D0 Reserved
D1 Enable/Disable current channel chopper (0 Disabled, 1 Enabled)
D2 Reserved
D3 Reserved
RD/WR
D4 Enable/Disable voltage attenuator (0 Disabled, 1 Enabled)
D5 Enable/Disable PGA (0 Disabled, 1 Enabled)
D6-D7 PGA gain selection
10 00 Gain-5, 01 Gain-25, 10 Gain-50, 11 Gain-100
D0 Timer resolution
0 1 second, 1 32 seconds
RD/WR D1-D7 Timeout period
If D0=1, then timeout period = D[7:1]*64*0.512 seconds, else timeout period =
D[7:1]*0.512 seconds
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 21. Registers
Addr
Register Name
Default Value
RD/WR
Description
Backup Registers
8 backup registers
These registers can be used by MCU to backup any system configuration before
sending the device to sleep mode.
0x10
………
0x17
Backup-0
……………
Backup-7
If Test Control Register D[5] =1, Backup-0 to Backup-3 are used for testing
On POR_VSUP
RD/WR connectivity between OTP and digital modules.
0000_0000
Backup-0 = OTP[25:32]
Backup-1 = OTP[33:40]
Backup-2 = OTP[41:47]
Backup-3 = OTP[48:49]
Diagnostic Registers
0 x 08
0 x 09
Diagnostic
Register 1
Diagnostic
Register 2
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On POR_VSUP
0000_0011
On POR_VSUP
0000_0000
RD
D7-D0 = DR[7:0] 8-LSB bits of the 24-bit Diagnostic Register.
D0 POR-VSUP (set when VSUP < Vsuvr_on, cleared after µC read)
D1 UVVCC Under-voltage VCC (set when VCC < Vuvr_on, cleared after µC read)
D2 OTEMP160 Over-temperature Reset. (set when temp > Tsd, cleared after µC
read)
D3 OTEMP140 Over-temperature warning (set when temp > Totset, cleared after
µC read)
D4 OVVBAT Overvoltage VBAT. (set when VSUP > Vovthh, cleared after µC read)
D5 Reserved
D6 RWAKE Remote Wakeup. (set on Remote Wakeup event on LIN Bus, cleared
after µC read)
D7 WWDT Window watchdog timeout. (set on failure of Window watchdog
timeout, cleared after µC read)
RD
D7-.D0 = DR[15:8] Next 8 LSB bits of the 24 bit Diagnostic Register.
D0 TXTIMEOUT Tx timeout of 1sec. (set on TX low > 1sec, cleared after µC read)
D1 (TEMPSHUT) This bit is set on entering into temporary shutdown state and
cleared after µC read.
D2 Set on failure of timeout Watchdog trigger, cleared after µC read
D7- D3 Reserved
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Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
9 Package Drawings and Markings
The devices are available in a 32-pin QFN (5x5) package.
Figure 22. 32-pin QFN (5x5) Package
Symbol
A
A1
A2
A3
L
Θ
b
D
E
e
D2
E2
D1
E1
aaa
bbb
ccc
ddd
eee
fff
N
AS8525
AYWWIZZ
XXW @
Min
0.80
0
0.35
0º
0.18
3.40
3.40
-
Nom
0.90
0.02
0.65
0.20 REF
0.40
0.25
5.00 BSC
5.00 BSC
0.50 BSC
3.50
3.50
4.75 BSC
4.75 BSC
0.15
0.10
0.10
0.05
0.08
0.10
32
Max
1.00
0.05
1.00
0.45
14º
0.30
3.60
3.60
-
Green
RoHS
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Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Marking Info:
1st line is AS8525 - Product Name
2nd Line is YYWWIZZ - Date Code
3rd line: XXW is place holder for 2 numbers and one letter as factory option designator. Default option this is void. [email protected] is a place holder for
assembly lat designator.
Marking for default option:
YYWWIZZ
AS8525
@
For factory options please contact ams sales force for quotation, marking and order code.
Notes:
1.
2.
3.
4.
5.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
All dimensions are in millimeters, angle is in degrees.
Coplanarity applies to the exposed heat slug as well as the terminal.
Radius on terminal is optional.
N is the total number of terminals.
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AS8525
Datasheet - R e v i s i o n H i s t o r y
Revision History
Revision
Date
Owner
0.1
Oct 20, 2008
mbr
Initial revision
2.1
Nov 02, 2009
mbr
Updated the entire datasheet according to spec 2.1
2.2
Oct 11, 2012
mbr
Removed LDO 5V option, added Section 6.1 Characteristics of Digital Inputs and Outputs
Nov 23, 2012
mbr
Updated Section 6.2.1 Programmable Gain Amplifier (PGA)
Dec 31, 2012
sju
Updated ordering table.
2.3
Removed 5V LDO option, Removed SCLK & SDI pins and added Marking Information to Section 9.
Mar 14, 2013
Apr 17, 2013
2.4
Apr 19, 2013
mbr
Updated Table 2 & Section 6.2.3 Voltage Attenuator
Updated Marking Information to Section 9
Updated TAMB to 115ºC, Footnote added to Ptot in Table 2
May 17, 2013
Dec 22, 2014
Description
sju
Updated Ordering Information
Note: Typos may not be explicitly mentioned under revision history.
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Datasheet - O r d e r i n g I n f o r m a t i o n
10 Ordering Information
The devices are available as the standard products shown in Table 22.
Table 22. Ordering Information
Ordering Code
Description
Delivery Form
Package
1
High Side current sensor companion IC
Tape and Reel (4000 pcs)
32-pin QFN (5x5)
1
High Side current sensor companion IC
Tape and Reel (500 pcs)
32-pin QFN (5x5)
2
High Side current sensor companion IC
Tape and Reel (4000 pcs)
32-pin QFN (5x5)
2
High Side current sensor companion IC
Tape and Reel (500 pcs)
32-pin QFN (5x5)
AS8525-AQFP
AS8525-AQFM
AS8525-AQFP-21
AS8525-AQFM-21
1. For version (attenuator ratio 481)
2. For version (attenuator ratio 21)
Note: All products are RoHS compliant and ams green.
Buy our products or get free samples online at www.ams.com/ICdirect
Technical Support is available at www.ams.com/Technical-Support
Provide feedback about this document at:www.ams.com/Document-Feedback
For further information and requests, e-mail us at [email protected]
For sales offices, distributors and representatives, please visit www.ams.com/contact
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Datasheet - C o p y r i g h t s & D i s c l a i m e r
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material
herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.
Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of Trade. ams AG
makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change
specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with
ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range,
unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are
specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and
any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are
disclaimed.
ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of
profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out
of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of
ams AG rendering of technical or other services.
Contact Information:
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
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