LAMP 339-9SUGSURSUBW/S1174 Features Popular T-1 3/4 package. High efficiency. Available on tape and reel. Built in red, green, and blue chips. UV resistance epoxy. The product itself will remain within RoHS compliant version Descriptions The series is specially designed for applications requiring higher brightness The LED lamps are available with different colors, intensities, epoxy, colors, etc. Superior performance in outdoor environment Applications Status indicators. Commercial use. Advertising Signs. Message board 1 Revision :3 © Copyright LifecyclePhase: Release Date:2012-12-17 17:22:01.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : DEC. 13, 2012 Issue No: DLE-0000514 Rev.3 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBW/S1174 Device Selection Guide Chip LED Part No. Materials Emitted Color InGaN AlGaInP InGaN Brilliant Green Brilliant Red Blue 339-9SUGSURSUBW/S1174 Resin Color White diffused Absolute Maximum Ratings (Ta=25℃) Parameter Symbol SUB/SUG SUR Units Forward Current IF 30 50 mA Pulse Forward Current (Duty1/10@ 1KHz) IFP 100 100 mA Operating Temperature Topr -40 ~ +85 -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 -40 ~ +100 ℃ ESD 150 2000 V Soldering Temperature Tsol 260 260 ℃ Power Dissipation Pd 110 120 mW Reverse Voltage VR 5 5 V Electrostatic Discharge *Notes: Soldering time≦5 seconds. 2 Revision :3 © Copyright LifecyclePhase: Release Date:2012-12-17 17:22:01.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : DEC. 13, 2012 Issue No: DLE-0000514 Rev.3 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBW/S1174 Electro-Optical Characteristics (Ta=25℃) Parameter Luminous Intensity Symb ol IV Color Min. Typ. Max. SUB 100 ----- 360 SUG 565 ----- 1425 SUR 565 ----- 1425 ----- 60 ----- Unit Condition mcd SUB Viewing Angle 2θ1/2 SUG deg SUR SUB Peak Wavelength Dominant Wavelength Spectrum half-width λp λD △λ SUG 468 ----- SUR 632 SUB 470 SUG ----- VF 522 SUR 624 SUB 35 SUG ----- SUR Forward Voltage 518 35 IR IF=20mA ----- ----- SUB 2.8 ----- 3.6 SUG 2.8 ----- 3.6 SUR 1.6 ----- 2.4 SUG nm 20 SUB Reverse Current ----- V 50 ----- SUR ----- 50 μA VR=5V 10 *Measurement Uncertainty of Luminous Intensity: ±10% *Measurement Uncertainty of Dominant Wavelength:±1.0nm *Measurement Uncertainty of Forward Voltage：±0.1V 3 Revision :3 © Copyright LifecyclePhase: Release Date:2012-12-17 17:22:01.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : DEC. 13, 2012 Issue No: DLE-0000514 Rev.3 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBW/S1174 Rank Combination (IF=20mA) Rank G Luminous Intensity B G J K 5 A C D 565~845 845~1125 1125~1425 100~140 140~240 240~285 285~360 Rank R Luminous Intensity 1 2 565~900 900-1425 *Measurement Uncertainty of Luminous Intensity: ±10% Rank Unit: mcd G Dominant Wavelength R 1 2 2 3 1 2 522~530 530~535 620~624 624~628 465~470 470~475 *Measurement Uncertainty of Dominant Wavelength ±1.0nm 4 Revision :3 © Copyright LifecyclePhase: B Unit:nm Release Date:2012-12-17 17:22:01.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : DEC. 13, 2012 Issue No: DLE-0000514 Rev.3 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBW/S1174 Typical Electro-Optical Characteristics Curves Directivity (Ta=25℃) Radiation Angle Relative Intensity (a.u.) Relative Intensity vs. Wavelength (Ta=25℃) Wavelength (nm) Relative Intensity vs. Forward Current (Ta=25℃) Forward Current (mA) Relative Intensity(a.u.) Forward Current vs. Forward Voltage (Ta=25℃) Relative Intensity (a.u.) Forward Voltage (V) Forward Current (mA) Ambient Temperature Ta(℃) 5 Revision :3 © Copyright LifecyclePhase: Forward Current vs. Ambient Temp. Forward Current (mA) Relative Intensity(a.u.) Relative Intensity vs. Ambient Temp. Ambient Temperature Ta(℃) Release Date:2012-12-17 17:22:01.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : DEC. 13, 2012 Issue No: DLE-0000514 Rev.3 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBW/S1174 Package Dimensions Notes: ˙All dimensions are in millimeters,tolerance is 0.25mm except being specified. ˙Lead spacing is measured where the lead emerges from the package. ˙Protruded resin under flange is 1.5mm Max LED. 6 Revision :3 © Copyright LifecyclePhase: Release Date:2012-12-17 17:22:01.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : DEC. 13, 2012 Issue No: DLE-0000514 Rev.3 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBW/S1174 Packing Specification ■ Anti-electrostatic bag Label Pb EL EC TR OSTA TI C E LEC T RON AGNE TI C MAG NET IC OR RA DIO AC TIVE RE LDS an ti-sta tic for 7 50 ■ Inner Carton ■ Label Form Specification CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Rank of Luminous Intensity ■ Outside Carton HUE: Rank of Dominant Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place ■ Packing Quantity 1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton 2. 10 Inner Cartons/1 Outside Carton 7 Revision :3 © Copyright LifecyclePhase: Release Date:2012-12-17 17:22:01.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : DEC. 13, 2012 Issue No: DLE-0000514 Rev.3 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBW/S1174 Notes 1. Lead Forming During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Lead forming should be done before soldering. Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs. Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs. When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2. Storage The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3. Soldering Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. Recommended soldering conditions: Hand Soldering Temp. at tip of iron DIP Soldering 300℃ Max. (30W Max.) Preheat temp. 100℃ Max. (60 sec Max.) Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min.(From solder joint Distance 3mm Min. to epoxy bulb) (From solder joint to epoxy bulb) Recommended soldering profile laminar wave Fluxing Prehead 8 Revision :3 © Copyright LifecyclePhase: Release Date:2012-12-17 17:22:01.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : DEC. 13, 2012 Issue No: DLE-0000514 Rev.3 Expired Period: Forever DATASHEET LAMP 339-9SUGSURSUBW/S1174 Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering. Dip and hand soldering should not be done more than one time After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the LEDs. Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED. 5. Heat Management Heat management of LEDs must be taken into consideration during the design stage of LED application. The current should be de-rated appropriately by referring to the de-rating curve found in each product specification. The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating curve. 6. ESD (Electrostatic Discharge) Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs. An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs. All devices, equipment and machinery must be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing. 7. Other Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent. 9 Revision :3 © Copyright LifecyclePhase: Release Date:2012-12-17 17:22:01.0 www.everlight.com 2010, Everlight All Rights Reserved. Release Date : DEC. 13, 2012 Issue No: DLE-0000514 Rev.3 Expired Period: Forever