SMD B 69-23BUMD/TR8

SMD  B
69-23BUMD/TR8
Features
․Super luminosity white LED.
․Built in 3 LED chips.
․Soldering methods: Reflow soldering.
․High performance.
․Package in 12mm tape on 7〞diameter reel.
․Pb-free.
․The product itself will remain within RoHS compliant version.
Description
․The 69-23B SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher
packing density, reduced storage space and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for miniature applications. etc.
Applications
․Amusement equipment.
․Information boards.
․Flashlight for digital camera of cellular phone.
․Lighting for small size device.
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Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May.2013. Issue No: DSE-0003764 Rev.3
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DATASHEET
SMD  B
69-23BUMD/TR8
Device Selection Guide
Chip
Materials
InGaN
Emitted Color
Resin Color
White
Yellow Diffused
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
30
mA
IFP
100
mA
Power Dissipation
Pd
111
mW
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Electrostatic Discharge
ESDHBM
1000
V
Soldering Temperature
Tsol
Peak Forward Current
(Duty 1/10 @1KHz)
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
* The value are base d on the 1-die performance.
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Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0003764 Rev.3
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DATASHEET
SMD  B
69-23BUMD/TR8
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Luminous Intensity*1
Iv
9100
-----
18000
mcd
IF=20mA*2
Viewing Angle*1
2θ1/2
-----
60
-----
deg
IF=20mA*2
Forward Voltage*2
VF
2.7
3.3
3.7
V
IF=20mA*2
Reverse Current
IR
-----
-----
50
μA
VR=5V*2
*1 When 3 LED dies are operated simultaneously.
*2 For each die.
Note:
1. The products are sensitive to static electricity and care must be fully taken when
2. Tolerance of Luminous Intensity ±11%
handling products.
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
Unit
Condition
Z12
Z21
Z22
9100
11500
14400
11500
14400
18000
mcd
IF =20mA*2
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Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0003764 Rev.3
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DATASHEET
SMD  B
69-23BUMD/TR8
Chromaticity Coordinates Specifications for Bin Grading
Rank
CCT
V4
V5
5000K~5650K
V6
V7
Rank
CCT
W4
W5
W6
W7
W8
4
5650K~6300K
IF=20mA*2
CIE_X
CIE_Y
0.329
0.357
0.329
0.369
0.348
0.385
0.347
0.372
0.329
0.345
0.329
0.357
0.347
0.372
0.346
0.359
0.329
0.331
0.329
0.345
0.346
0.359
0.344
0.344
0.329
0.331
0.344
0.344
0.343
0.331
0.329
0.32
CIE_X
CIE_Y
0.329
0.369
0.329
0.357
0.315
0.344
0.314
0.355
0.329
0.345
0.316
0.333
0.315
0.344
0.329
0.357
0.329
0.345
0.329
0.331
0.317
0.32
0.316
0.333
0.329
0.331
0.329
0.32
0.318
0.31
0.317
0.32
0.329
0.321
0.329
0.31
0.319
0.3
0.318
0.31
Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0003764 Rev.3
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DATASHEET
SMD  B
69-23BUMD/TR8
Rank
CCT
X4
X5
6300K~7000K
X6
X7
CIE_X
CIE_Y
0.301
0.342
0.314
0.355
0.315
0.344
0.303
0.333
0.305
0.322
0.303
0.333
0.315
0.344
0.316
0.333
0.308
0.311
0.305
0.322
0.316
0.333
0.317
0.320
0.308
0.311
0.317
0.320
0.319
0.300
0.311
0.293
CIE Chromaticity Diagram
*1 When 3 LED dies are operated simultaneously.
*2 For each die.
*3 The C.I.E. 1931 chromaticity diagram ( Tolerance ±0.01).
Note: 1. The products are sensitive to static electricity and care must be fully taken when
handling products.
2. Tolerance of Luminous Intensity ±11%
5
Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0003764 Rev.3
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DATASHEET
SMD  B
69-23BUMD/TR8
Typical Electro-Optical Characteristics Curves
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Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0003764 Rev.3
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DATASHEET
SMD  B
69-23BUMD/TR8
Package Dimension
0.85
1.5
0.3
0.85
0.85
(1)
(2)
(3)
(4)
0.6
0.3
1.05
0.85
1.05
0.85
0.625 0.625
2.1
1.05
1.05
0.85
(6)
0.6
(5)
CL
3.3
0.6
CL
0.625 0.625
3.3
(1)
(2)
(5)
(6)
(3)
(4)
0.85
0.85
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
Suggested pad dimension is just for reference only.
Please modify the pad dimension based on individual need.
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Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0003764 Rev.3
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DATASHEET
SMD  B
69-23BUMD/TR8
Moisture Resistant Packing Materials
Label Explanation
Pb
EVERLIGHT
CPN :
P N : XXXXXXXXXXXXX
RoHS
XXXXXXXXXXXXX
‧CPN: Customer’s Product Number
‧P/N: Product Number
‧QTY: Packing Quantity
‧CAT: Luminous Intensity Rank
‧HUE: Chromaticity Coordinates & Dom. Wavelength Rank
‧REF: Forward Voltage Rank
‧LOT No: Lot Number
CAT : XXX
HUE : XXX
REF : XXX
QTY : XXX
LOT NO : XXXXXXXXXX
Reference : XXXXXXXX
MADE IN TAIWAN
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
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Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0003764 Rev.3
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DATASHEET
SMD  B
69-23BUMD/TR8
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label
9
Aluminum moisture-proof bag
Desiccant
Label
Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0003764 Rev.3
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DATASHEET
SMD  B
69-23BUMD/TR8
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
260°C Max.
10sec. Max.
Above255°C
30sec.Max.
3°C/sec.Max.
6°C/sec.Max.
Pre-heating
Above 217°C
60~150sec.
150~200°C
60~120sec.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the
soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because
the damage of the product is often started at the time of the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering
iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will
not be damaged by repairing.
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Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0003764 Rev.3
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DATASHEET
SMD  B
69-23BUMD/TR8
Application Restrictions
High reliability applications such as military/aerospace, automotive safety/security systems,and medical equipment may
require different product. If you have any concerns, please contact Everlight before using this product in your application.
This specification guarantees the quality and performance of the product as an individual component. Do not use this
product beyond the specification described in this document.
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Copyright © 2010, Everlight All Rights Reserved. Release Date : 09-May-2013. Issue No: DSE-0003764 Rev.3
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