CHIN Series ELCH06-BJ4J6Z10-N0 Received Revised

CHIN Series
ELCH06-BJ4J6Z10-N0
Received
■ MASS PRODUCTION
□ PRELIMINARY
□ CUSTOMER DESIGN
DEVICE NO. : DHE-0001303
PAGE : 13
Revised record
1
REV.
DESCRIPTION
RELEASE DATE
1
New spec
2010.12.01
2
1.Change format
2.Change IV、CCT、VF BIN
3.Change Package Dimension
2011.11.03
3
Add page 3 note.
2012.12.26
4
Input Low current low VF
Aug.20.2013
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
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DATASHEET
CHIN Series
ELCH06-BJ4J6Z10-N0
CHIN Series
ELCH06-BJ4J6Z10-N0
MASS
PRODUTION
Features
 Small
& compact package and with high efficiency
 Typical
luminous flux: 200 lm @ 1000mA
 Typical
color temperature: 6000 [email protected]
 Optical
[email protected] : 54 lm/W
 ESD
protection up to 8KV
 Moisture
Sensitivity Level (MSL) Class 1
 Grouping
parameter: total luminous flux, color coordinates.
 RoHS
compliant & Pb free.
Applications
 Mobile
 Torch
Phone Camera Flash(Camera flash light /strobe light for mobile devices )
light for DV(Digital Video) application
 Indoor
lighting applications
 Signal
and symbol luminaries for orientation maker lights (e.g. steps, exit ways, etc.)
 TFT backlighting
 Exterior
and interior illumination applications
 Decorative
 Exterior
2
and Entertainment Lighting
and interior automotive illumination
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
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DATASHEET
CHIN Series
ELCH06-BJ4J6Z10-N0
Device Selection Guide
Chip
Emitted Color
Materials
InGaN
White
Absolute Maximum Ratings (Tsolder pad =25℃)
Parameter
Symbol
Rating
Unit
DC Forward Current (mA)
IF
350
mA
IPulse
1500
mA
ESD Resistance
VB
8000
V
Reverse Voltage
VR
[1]
V
Junction Temperature
TJ
125
℃
Thermal Resistance(junction to case)
Rs
10
℃/W
Operating Temperature
TOpr
-40 ~ +85
℃
Storage Temperature
TStg
-40 ~ +110
℃
Power Dissipation (Pulse Mode)
Pd
6.5
W
Soldering Temperature
TSol
260
℃
Allowable Reflow Cycles
n/a
2
cycles
Viewing Angle(2)
2θ1/2
120
deg
Peak Pulse Current (mA)
(400ms : ON,3600ms : OFF)
Note:
1. The Chin series LEDs are not designed for reverse bias used
2. View angle tolerance is ± 5∘
3. Avoid operating Chin series LEDs at maximum operating temperature exceed 1 hour.
4. All specification are assured by reliability test for 1000hr, IV degradation less than 30%.
5. For 1500 mA all reliability items are tested under good thermal management with 1.0x 1.0 cm2 MCPCB.
6. Peak pulse current shall be applied under conditions as max duration time 50ms and max duty cycle 10%
7. Operate LED component at maximum rating conditions continuously will cause possible permanent damage and de-rating parameters.
Exercise multiple maximum rating parameters simultaneously should not be allowed. When maximum rating parameters are applied over a
long period will result potential reliability issue.
3
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
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DATASHEET
CHIN Series
ELCH06-BJ4J6Z10-N0
JEDEC Moisture Sensitivity
Soak Requirements
Standard
Floor Life
Level
1
Time
(hours)
Conditions
Time
(hours)
Conditions
unlimited
≦30℃ / 85% RH
168(+5/-0)
85℃/ 85 RH
Electro-Optical Characteristics (Tsolder pad =25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Luminous Flux(1)
Фv
VF
200
----
250
4.45
lm
Forward Voltage(2) (3)
160
2.95
Low current low [email protected](4)
VF
2.0
----
----
V
Correlated Color Temperature
CCT
4500
----
7000
K
Bin Code
Min.
Typ.
Max.
Unit
2932
3235
3538
3841
4144
2.95
3.25
3.55
3.85
4.15
----------------
3.25
3.55
3.85
4.15
4.45
V
V
Condition
IF=1000mA
Note:
1. Luminous flux measurement tolerance: ±10%
2. Forward voltage measurement tolerance: ±0.1V
3. Electric and optical data is tested at 50 ms pulse condition
4. Low current voltage measurement tolerance: ±10%
Bin Range of Forward Voltage Binning
4
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
Condition
IF=1000mA
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DATASHEET
CHIN Series
ELCH06-BJ4J6Z10-N0
Bin Range of Luminous Intensity
5
Bin Code
Min.
Typ.
Max.
Unit
J4
J5
J6
160
180
200
----------
180
200
250
lm
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
Condition
IF=1000mA
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DATASHEET
CHIN Series
ELCH06-BJ4J6Z10-N0
White Bin Structure
0.45
4500
5000
0.42
5700
0.39
y
(1)
0.36
(2)
7000
0.33
(3)
0.30
0.27
0.27
0.30
0.33
0.36
0.39
0.42
0.45
x
Notes:
1. Color Bin (1):4550K
2. Color Bin (2):5057K
3. Color Bin (3):5770K
White Bin Coordinate
Bin
CIE-X
CIE-Y
CCT Reference Range
4550
0.3738
0.3524
0.3440
0.3620
0.4378
0.4061
0.3420
0.3720
4500K ~ 5000K
5057
0.3300
0.3300
0.3440
0.3524
0.3200
0.3730
0.3420
0.4061
5000K ~ 5700K
5770
0.3030
0.3300
0.3300
0.3110
0.3330
0.3730
0.3200
0.2920
5700K ~ 7000K
Note:
1. Color coordinates measurement allowance : ±0.01
2. Color bins are defined at IF =1000mA and 50ms pulse operation condition.
6
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
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DATASHEET
CHIN Series
ELCH06-BJ4J6Z10-N0
Typical Electro-Optical Characteristics Curves
Relative Spectral Distribution, [email protected], Tsolder pad =25℃
CCT : 6333K
1.0
Relative Intensity(a.u.)
0.8
0.6
0.4
0.2
0.0
400
500
600
700
800
Wavelength(nm)
Typical Radiation Patterns
Typical Polar Radiation Pattern for Lambertian
X axis
Y axis
0.8
Relative Intensity(a.u.)
Relativety Luminous intensity
1.0
-15
-30
1.0
0
15
30
0.6
-45
0.8
0.6
0.4
-60
45
60
0.4
-75
0.2
75
0.2
0.0
-90
0.0
-60
-30
0
2q (Degree)
30
60
-90
90
90
0.2
0.4
0.6
Degree
0.8
1.0
Note:
1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2. View angle tolerance is ± 5∘.
7
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
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DATASHEET
CHIN Series
ELCH06-BJ4J6Z10-N0
Forward Voltage vs Forward Current,
Tsolder pad =25℃
Correlated Color Temperature(CCT) vs. Forward Current
Correlated Color Temperatrue(K)
6200
6000
5800
5600
5400
0
250
500
750
1000
1250
1500
Forward Current([email protected])
Luminous Flux vs Forward Current,
Tsolder pad =25℃
Forward Current Derating Curve,
Derating based on T j MAX=125℃ at torch mode
1.4
600
Forward Current (mA)
Relative Luminous Flux(lm)
1.2
1.0
0.8
0.6
0.4
500
400
300
200
100
0.2
0.0
0
0
250
500
750
1000
1250
1500
0
25
Forward Current([email protected])
50
75
100
o
Solder temperature ( C)
Note:
1. All correlation data is tested under superior thermal management with 1.0x 1.0 cm2 MCPCB
8
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
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DATASHEET
CHIN Series
ELCH06-BJ4J6Z10-N0
Package Dimension
0.3 -0.05/+0
0.3
1,64
Optical center
2,04
0.75
Chip position
Top view
1,64
0,25
1,1
Optical center
1,45
0,725±0.05
0,5
Anode pad
Cathode pad
0,125
Note:
1. Dimensions are in millimeters.
2. Tolerances unless mentioned are ± 0.1mm.
9
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
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DATASHEET
CHIN Series
ELCH06-BJ4J6Z10-N0
Moisture Resistant Packing Materials
Label Explanation
‧CPN: Customer Specification (when required)
‧P/N: Everlight Production Number
‧QTY: Packing Quantity
‧CAT: Luminous Flux (Brightness) Bin
‧HUE: Color Bin
‧REF: Forward Voltage Bin
‧LOT No: Lot Number
Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel
Progress Direction
Polarity
Note:
1. Dimensions are in millimeters.
2. Tolerances unless mentioned are ± 0.1mm.
10
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
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DATASHEET
CHIN Series
ELCH06-BJ4J6Z10-N0
Reel Dimensions
Note:
1. Dimensions are in millimeters.
Moisture Resistant Packing Process
11
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
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DATASHEET
CHIN Series
ELCH06-BJ4J6Z10-N0
Reflow Soldering Characteristics
Soldering and Handling
1.
Over-current-proof
Though Chin series has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors
for extra protection. Otherwise, slight voltage shift may cause enormous current shift and burn out failure would happen
2.
Storage
i.
Do not open the moisture-proof bag before the products are ready to use.
ii.
Before opening the package, the LEDs should be stored at temperature less than 30℃ and less and relative humidity less than 90%.
After opening the package, the LEDs should be stored at temperature less than 30℃ and relative humidity less than 85%.
iii.
If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be
implemented based on the following conditions: Pre-curing at 60±5℃ for 24 hours.
3.
Thermal Management
i.
For maintaining the high flux output and achieving reliability, Chin series LEDs should be mounted on a metal core printed circuit board
(MCPCB), with proper thermal connection to dissipate approximately 1W to 5W of thermal energy under normal operation.
ii.
Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving
and LEDs lifetime will decrease critically
iii.
When operating , the solder pad temperature ( or the board temperature nearby the LED) must controlled under 70℃.
4. Soldering Condition
4.1 Soldering Pad
12
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
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DATASHEET
CHIN Series
ELCH06-BJ4J6Z10-N0
4.2 For Reflow Process
i. Lead reflow soldering temperature profile
ii. Reflow soldering should not be done more than two times.
iii. While soldering, do not put stress on the LEDs during heating.
iv. After soldering, do not warp the circuit board.
13
Copyright © 2010, Everlight All Rights Reserved. Release Date : Aug.20.2013. Issue No: DHE-0001303
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