LAMP 334-15/FNC1-4YZA

LAMP
334-15/FNC1-4YZA
Features
• Popular T-1 3/4 round package
• High luminous power
• Typical chromaticity coordinates x=0.30, y=0.29
according to CIE1931
• Bulk, available taped on reel.
• ESD-withstand voltage: up to 4KV
• The product itself will remain within RoHS compliant version
Description
• The series is designed for application required high luminous intensity.
• The phosphor filled in the reflector converts the blue emission of InGaN chip to ideal white.
Applications
• Message panels
• Optical Indicators
• Backlighting
• Marker Lights
Revision
: 3© 2014, Everlight All Rights Reserved. Release Date : Feb. 2014/11. Issue No:Release
Date:2014-12-01 18:04:55.0
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334-15/FNC1-4YZA
Device Selection Guide
Chip
Emitted Color
Materials
InGaN
Resin Color
White
Water Clear
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Continuous Forward Current
IF
30
mA
Peak Forward Current (Duty 1/10 @ 1KHZ)
IFP
100
mA
Reverse Voltage
VR
5
V
Power Dissipation
Pd
110
mW
Operating Temperature
Topr
-40 ~ +85
℃
Tstg
-40 ~ +100
℃
ESDHBM
4K
V
Zener Reverse Current
Iz
100
mA
Soldering Temperature
Tsol
Storage Temperature
ESD
260 ℃ for 5 sec.
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Forward Voltage
VF
2.8
-----
3.6
V
IF=20mA
Zener Reverse Voltage
Vz
5.2
-----
-----
V
Iz=5mA
Reverse Current
IR
-----
-----
50
μA
VR=5V
Luminous Intensity
IV
22500
----
36000
mcd
IF=20mA
2θ1/2
----
15
----
deg
IF=20mA
x
----
0.30
----
----
y
----
0.29
----
----
Viewing Angle
Chromaticity Coordinates
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IF =20mA
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334-15/FNC1-4YZA
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
Unit
Condition
Y
Z
22500
28500
28500
36000
mcd
IF =20mA
Bin Code
Min.
Max.
Unit
Condition
0
1
2
3
2.8
3.0
3.2
3.4
3.0
3.2
3.4
3.6
V
IF =20mA
Note:
Tolerance of Luminous Intensity: ±10%
Forward Voltage Combination
Note:
Measurement Uncertainty of Forward Voltage:±0.1V
Color Combination ( at 20mA)
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:3 ©
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Group
Bins
4
A0+B5+B6
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LAMP
334-15/FNC1-4YZA
CIE Chromaticity Diagram
0.8
CIE-Y
0.6
5600K
7000K
0.4
9000K
14000K
AO B5
B6
0.2
0.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
CIE-X
Color Ranks (IF=20mA,Ta=25℃)
Color Ranks
CIE
A0
X
Y
0.264
0.267
0.283
0.305
0.296
0.267
0.28
0.248
B5
X
Y
0.287
0.295
0.307
0.315
0.311
0.294
0.296
0.276
B6
X
Y
0.307
0.315
0.33
0.339
0.33
0.318
0.311
0.294
Note:
Measurement uncertainty of the color coordinates:±0.01
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Release Date:2014-12-01 18:04:55.0
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334-15/FNC1-4YZA
Typical Electro-Optical Characteristics Curves
Relative Intensity vs. Wavelength (Ta=25℃)
Directivity (Ta=25℃)
O
O
90
1.0
O
60
O
30
0
Radiation Angle
Relative Luminusity
Relative Intensity (a.u.)
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
O
20
O
30
O
40
O
50
O
60
0.5
O
70
O
80
O
0
0
90
1.0
0.5
800
Wavelength (nm)
Relative Intensity (a.u.)
Forward Current vs. Forward Voltage (Ta=25℃)
Relative Intensity vs. Forward Current (Ta=25℃)
30
1.5
25
Relative Intensity(a.u.)
Forward Current (mA)
O
10
1.0
20
15
10
5
0
1.5
2.0
2.5
3.0
3.5
4.0
1.0
0.5
0.0
4.5
0
5
Forward Voltage (V)
10
15
20
25
Forward Current (mA)
Chromaticity Coordinate vs. Forward Current(Ta=25℃)
Forward Current vs. Ambient Temp.
0.330
40
Forward Current (mA)
Chromaticity Coordinate
0.320
0.310
x
0.300
y
0.290
0.280
0.270
0.260
0
10
20
30
Forward Current(mA)
Forward Current (mA)
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40
50
30
20
10
0
0
20
40
60
80
Ambient Temperature Ta(℃)
Release Date:2014-12-01 18:04:55.0
2014, Everlight All Rights Reserved. Release Date : Feb.2014/11. Issue No: DLE-0002829 _Rev.3
Expired Period: Forever
100
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334-15/FNC1-4YZA
Package Dimension
Note:
1.All dimensions are in millimeters, and tolerance is 0.25mm except being specified.
2.Lead spacing is measured where the lead emerges from the package.
3.Protruded resin under flange is 1.5mm Max. LED.
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334-15/FNC1-4YZA
Moisture Resistant Packing Materials
Label Explanation
‧CPN: Customer’s Production Number
‧P/N : Production Number
‧QTY: Packing Quantity
‧CAT: Ranks of Luminous Intensity and Forward Voltage
‧HUE: Color Rank
‧REF: Reference
‧LOT No: Lot Number
Packing Specification
■
Anti-electrostatic bag
■
Inner Carton
■
Outside Carton
Pb
EL ECTR OSTATIC ELECTR ONAGNET IC
MAGNETIC OR RADIOACTIVE RELDS
anti-static for 750
■ Packing Quantity
1. Min 200 to Max 500 PCS/1 Bag, 5 Bags/1 Inner Carton
2. 10 Inner Cartons/1 Outside Carton
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334-15/FNC1-4YZA
Production Designation
334-15/FNC1-
□□□□
Voltage Group
Luminous Intensity Bins
Color Group
Notes
1. Lead Forming

During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.

Lead forming should be done before soldering.

Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s
characteristics or it may break the LEDs.

Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of
the LEDs.

When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED.
If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade
the LEDs.
2. Storage

The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the
storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a
sealed container with a nitrogen atmosphere and moisture absorbent material.

Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where
condensation can occur.
3. Soldering

Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to
epoxy bulb, and soldering beyond the base of the tie bar is recommended.

Recommended soldering conditions:
Hand Soldering
300℃ Max. (30W
Temp. at tip of iron
Max.)
Soldering time
3 sec Max.
Distance
3mm Min.(From
solder joint to epoxy
bulb)
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DIP Soldering
100℃ Max. (60 sec
Preheat temp.
Max.)
Bath temp. & time
260 Max., 5 sec Max
Distance
3mm Min. (From solder
joint to epoxy bulb)
Release Date:2014-12-01 18:04:55.0
2014, Everlight All Rights Reserved. Release Date : Feb.2014/11. Issue No: DLE-0002829 _Rev.3
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334-15/FNC1-4YZA

Recommended soldering profile
laminar wave
Fluxing
Prehead

Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when
soldering.

Dip and hand soldering should not be done more than one time

After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the
LEDs return to room temperature.

A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the
lowest possible temperature is desirable for the LEDs.

Wave soldering parameter must be set and maintain according to recommended temperature and dwell time
in the solder wave.
4. Cleaning

When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no
more than one minute. Dry at room temperature before use.

Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning
on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning
shall be pre-qualified to ensure this will not cause damage to the LED
5. Circuit Protection

Below the zener reference voltage Vz, all the current flows through LED and as the voltage rises to Vz, the
zener diode “breakdown." If the voltage tries to rise above Vz current flows through the zener branch to keep
the voltage at exactly Vz.

When the LED is connected using serial circuit, if either piece of LED is no light up but current can’t flow through
causing others to light down. In new design, the LED is parallel with zener diode. if either piece of LED is no
light up but current can flow through causing others to light up.
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Expired Period: Forever
ATASHEET
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334-15/FNC1-4YZA
6. Heat Management

Heat management of LEDs must be taken into consideration during the design stage of LED application. The
current should be de-rated appropriately by referring to the de-rating curve found in each product
specification.

The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet
de-rating curve.
7. ESD (Electrostatic Discharge)

Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.

An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs.

All devices, equipment and machinery must be properly grounded.

Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as
a result of friction between LEDs during storage and handing.
8. Other

Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for
above specification.

When using this product, please observe the absolute maximum ratings and the instructions for using outlined
in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of
the product which does not comply
with the absolute maximum ratings and the instructions included in these specification sheets.

These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please
don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.
Revision
:3 ©
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LifecyclePhase:
Release Date:2014-12-01 18:04:55.0
2014, Everlight All Rights Reserved. Release Date : Feb.2014/11. Issue No: DLE-0002829 _Rev.3
Expired Period: Forever