ROHM BD63875EFV

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STRUCTURE
Silicon monolithic integrated circuits
PRODUCT SERIES
Bipolar stepping motor driver
TYPE
BD63875EFV
FUNCTION
・PWM constant current controllable two H bridge driver
・Built-in translator circuit for CLK-IN control
・Full, Half, and Quarter step modes
・Mix decay control
○Absolute maximum ratings(Ta=25℃)
Item
Supply voltage
Symbol
VCC1,2
Limit
Unit
-0.2~+36.0
V
※1
W
1.45
Power dissipation
Pd
4.70※2
W
Input voltage for control pin
VIN
-0.2~+5.5
V
RNF maximum voltage
VRNF
0.7
V
Maximum output current
IOUT
1.5※3
A/phase
Maximum output current(peak)※4
IOUTPEAK
2.0※3
A/phase
Operating temperature range
Topr
-25~+85
℃
Storage temperature range
Tstg
-55~+150
℃
Junction temperature
Tjmax
+150
℃
※1
70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/℃ for operating above Ta=25℃.
※2
4-layer recommended board. Derating in done at 37.6mW/℃ for operating above Ta=25℃.
※3
Do not, however exceed Pd, ASO and Tjmax=150℃.
※4
Pulse width tw≦1ms, duty 20%.
○Recommended operating conditions (Ta=-25~+85℃)
Item
Symbol
Min.
Supply voltage
VCC1,2
19
Output current
IOUT
※5
Do not, however exceed Pd, ASO.
Typ.
24
1.0
Max.
28
1.2※5
Unit
V
A/phase
This product isn’t designed for protection against radioactive rays.
.
REV. A
2/4
○Electrical characteristics (Unless otherwise specified, Ta=25℃, VCC1,2=24V)
Item
Symbol
Min.
Limit
Typ.
Whole
Circuit current at standby
ICCST
1.0
Circuit current
ICC
2.5
Control input (CLK, CW_CCW, MODE0, MODE1, ENABLE, PS)
H level input voltage
VINH
2.0
L level input voltage
VINL
H level input current
IINH
35
50
L level input current
IINL
-10
0
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Output ON resistance
Output leak current
Current control
RNFXS input current
RNFX input current
VREF input current
VREF input voltage range
MTH input current
MTH input voltage range
Comparator threshold
Minimum on time (Blank time)
Unit
Conditions
2.5
5.0
mA
mA
PS=L
PS=H, VREF=3V
0.8
100
-
V
V
μA
μA
VIN=5V
VIN=0V
Max.
RON
-
1.0
1.3
Ω
ILEAK
-
-
10
μA
IRNFS
IRNF
IVREF
VREF
IMTH
VMTH
VCTH
tONMIN
-2.0
-40
-2.0
0
-2.0
0
0.57
0.3
-0.1
-20
-0.1
-0.1
0.60
0.8
3.0
3.5
0.63
1.5
μA
μA
μA
V
μA
V
V
μs
REV. A
IOUT=1.0A,
Sum of upper and lower
RNFXS=0V
RNFX=0V
VREF=0V
MTH=0V
VREF=3V
C=1000pF, R=39kΩ
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○Package outline
Product No.
BD63875EFV
Lot No.
HTSSOP-B28 (Unit:mm)
○Block diagram
○Pin No. / Pin name
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Regulator
CLK 15
9 GND
CW_CCW 16
MODE0 18
Translator
RESET
MODE1 19
ENABLE 20
14 PS
UVLO
OVLO
TSD
VREF 13
+
-
2bit DAC
OCP
7 VCC1
2 OUT1B
OSC
Predriver
Blank time
PWM control
3 RNF1
Control logic
+
-
RNF2S 25
CR 10
5 OUT1A
+
-
RNF1S 4
22 VCC2
24 OUT2A
27 OUT2B
MTH 12
TEST 17
Mix decay
control
Pin name
GND
OUT1B
RNF1
RNF1S
OUT1A
NC
VCC1
NC
GND
CR
NC
MTH
VREF
PS
NC : Non Connection
26 RNF2
1 GND
REV. A
Pin No.
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Pin name
CLK
CW_CCW
TEST
MODE0
MODE1
ENABLE
NC
VCC2
NC
OUT2A
RNF2S
RNF2
OUT2B
NC
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○Operation Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating
conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a
short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings,
consider adding circuit protection devices, such as fuses.
(2) Power supply lines
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no
problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor
to decide capacity value. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the
product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to
implement a physical safety measure such as the insertion of a voltage clamp diode between the power
supply and GND pins.
(3) GND potential
The potential of GND pin must be minimum potential in all operating conditions.
(4) Metal on the backside (Define the side where product markings are printed as front)
The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND.
Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than
GND.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed
to use after providing heat dissipation treatment to improve heat dissipation efficiency . Try to occupy as
wide as possible with heat dissipation pattern not only on the board surface but also the backside.
(6) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the
IC to malfunction.
(7) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(8) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃,
and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not
use the TSD function to protect peripheral equipment.
(9) Ground Wiring Pattern
When using both large current and small signal GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the ground potential of application so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal
ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
(10) TEST pin
Be sure to connect TEST pin to GND.
REV. A
Notice
Notes
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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
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The technical information specified herein is intended only to show the typical functions of and
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R1010A