Datasheet - Everlight

EHP-C04/NT01H-P01/TR
Received
■ MASS PRODUCTION
□ PRELIMINARY
□ CUSTOMER DESIGN
DEVICE NO. : DHE-0000991
PAGE : 12
Revised record
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REV.
DESCRIPTION
RELEASE DATE
1
New spec
2011.03.09
2
Change Format
2011.03.31
3
1. Change Color Binning
2. Change Typical Electro-Optical
Characteristics Curves
2010.08.06
4
Change Luminous Flux Binning
2010.09.06
5
1.Change format
2.Change IV、CCT、VF BIN
3.Change Package Dimension
4.Change Carrier Tape Dimensions
2012.03.12
6
Add page 3 note.
2012.12.26
Date:2013-01-04
13:41:25.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000991
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01H-P01/TR
EHP-C04/NT01H-P01/TR
MASS
PRODUTION
Features
Small
& compact package and with high efficiency
luminous flux: 85 lm @500mA
Typical color temperature: 5700 [email protected]
Optical [email protected] : 47 lm/W
ESD protection up to 8KV
Moisture Sensitivity Level (MSL) Class 1
Grouping parameter: total luminous flux, color coordinates.
RoHS compliant & Pb free.
Typical
Applications
Mobile
Phone Camera Flash(Camera flash light /strobe light for mobile devices )
light for DV(Digital Video) application
Indoor lighting applications
Signal and symbol luminaries for orientation maker lights (e.g. steps, exit ways, etc.)
TFT backlighting
Exterior and interior illumination applications
Decorative and Entertainment Lighting
Exterior and interior automotive illumination
Torch
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Date:2013-01-04
13:41:25.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000991
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01H-P01/TR
Device Selection Guide
Chip
Emitted Color
Materials
InGaN
White
Absolute Maximum Ratings (Tsolder pad=25℃)
Parameter
Symbol
Rating
Unit
DC Forward Current (mA)
IF
350
mA
IPulse
1500
mA
ESD Resistance
VB
8000
V
Reverse Voltage
VR
[1]
V
Junction Temperature
TJ
125
℃
Operating Temperature
TOpr
-40 ~ +85
℃
Storage Temperature
TStg
-40 ~ +110
℃
Power Dissipation (Pulse Mode)
Soldering Temperature
Pd
7.5
W
TSol
260
℃
Allowable Reflow Cycles
n/a
2
cycles
Viewing Angle(2)
2θ1/2
130
deg
Peak Pulse Current (mA)
(400ms : ON,3600ms : OFF)
Note:
1. The C04 series LEDs are not designed for reverse bias used.
2. View angle tolerance is ± 5∘.
3. Avoid operating C04 series LEDs at maximum operating temperature exceed 1 hour.
4. All specification are assured by reliability test for 1000hr, IV degradation less than 30%.
5. For 1500 mA all reliability items are tested under good thermal management with 1.0x 1.0 cm2 MCPCB.
For 1000 mA all reliability items are tested under good thermal management with 1.0x 1.0 cm2 FR4.
6. Peak pulse current shall be applied under conditions as max duration time 400ms and max duty cycle 10%.
7. Operate LED component at maximum rating conditions continuously will cause possible permanent damage and de-rating parameters.
Exercise multiple maximum rating parameters simultaneously should not be allowed. When maximum rating parameters are applied over a
long period will result potential reliability issue.
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Date:2013-01-04
13:41:25.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000991
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01H-P01/TR
JEDEC Moisture Sensitivity
Soak Requirements
Standard
Floor Life
Level
1
Time
(hours)
Conditions
Time
(hours)
Conditions
unlimited
≦30℃ / 85% RH
168(+5/-0)
85℃ / 85 RH
Electro-Optical Characteristics (T solder pad =25ºC)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Luminous Flux(1)
Фv
VF
85
----
---4.15
lm
Forward Voltage(2) (3)
70
2.95
CCT
4500
----
7000
K
Bin Code
Min.
Typ.
Max.
Unit
2932
3235
3538
3841
2.95
3.25
3.55
3.85
-------------
3.25
3.55
3.85
4.15
V
Bin Code
Min.
Typ.
Max.
Unit
F7
F8
F9
J1
J2
J3
70
80
90
100
120
140
-------------------
80
90
100
120
140
160
lm
Correlated Color Temperature
V
Condition
IF=500mA
Note:
1. Luminous flux measurement tolerance: ±10%.
2. Forward voltage measurement tolerance: ±0.1V.
3. Electric and optical data is tested at 50 ms pulse condition.
Bin Range of Forward Voltage Binning
Condition
IF=500mA
Bin Range of Luminous Intensity
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Condition
IF=500mA
Date:2013-01-04
13:41:25.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000991
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01H-P01/TR
White Bin Structure
0.45
4500
5000
0.42
5700
0.39
y
(1)
0.36
(2)
7000
0.33
(3)
0.30
0.27
0.27
0.30
0.33
0.36
0.39
0.42
0.45
x
Notes:
1.Color Bin (1) :4550K
2.Color Bin (2) :5057K
3.Color Bin (3) :5770K
White Bin Coordinate
Bin
CIE-X
CIE-Y
CCT Reference Range
4550
0.3738
0.3524
0.3440
0.3620
0.4378
0.4061
0.3420
0.3720
4500K ~ 5000K
5057
0.3300
0.3300
0.3440
0.3524
0.3200
0.3730
0.3420
0.4061
5000K ~ 5700K
5770
0.3030
0.3300
0.3300
0.3110
0.3330
0.3730
0.3200
0.2920
5700K ~ 7000K
Note:
1.Color coordinates measurement allowance : ±0.01 .
2.Color bins are defined at IF=500mA and 50ms pulse operation condition.
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Date:2013-01-04
13:41:25.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000991
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01H-P01/TR
Typical Electro-Optical Characteristics Curves
Relative Spectral Distribution, [email protected], Tsolder pad =25℃
Relative Intensity(a.u.)
1 .0
0 .8
0 .6
0 .4
0 .2
0 .0
4 0 0
5 0 0
6 0 0
7 0 0
Typical Radiation Patterns
8 0 0
)
W a v e le n g th ( n m
Typical Polar Radiation Pattern for Lambertian
X axis
Y axis
0.8
Relative Intensity(a.u.)
Relativety Luminous intensity
1.0
-15
1.2
0
-30
15
30
1.0
-45
0.6
45
0.8
0.6
0.4
0.4
-75
60
75
0.2
0.2
0.0
0.0
-90
-60
-60
-30
0
30
60
-90
90
90
2q (Degree)
Degree
Note:
1.2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2.View angle tolerance is ± 5∘.
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Date:2013-01-04
13:41:25.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000991
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01H-P01/TR
Forward Voltage vs Forward Current,
T solder pad =25ºC
Correlated Color Temperature(CCT) vs. Forward Current
4.8
Forward Voltage(V)
6000
Correlated Color Temperatrue(K)
5.2
4.4
4.0
3.6
3.2
5900
5800
5700
5600
5500
0
2.8
0
250
500
750
1000
1250
1500
750
1000
1250
1500
Forward Current Derating Curve,
Derating based on TjMAX=125°C at torch mode
2.0
600
500
Forward Current (mA)
Relative Luminous Flux(lm)
500
Forward Current([email protected])
Forward Current([email protected])
Luminous Flux vs Forward Current,
T solder pad =25ºC
250
1.5
1.0
0.5
400
300
200
100
0.0
0
250
500
750
1000
1250
1500
0
0
25
Forward Current([email protected])
50
75
o
Solder temperature ( C)
100
Note:
1. All correlation data is tested under superior thermal management with 1.0x 1.0 cm2 MCPCB
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Date:2013-01-04
13:41:25.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000991
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01H-P01/TR
Package Dimension
0.3 -0. 05/ +0
0.3
1,64
Optical center
2,04
0.75
Chip position
Top view
1,64
0,25
1,1
Optical center
1,45
0,5
Anode pad
Cathode pad
0,125
Note:
1.Dimensions are in millimeters.
2.Tolerances unless mentioned are ± 0.1mm.
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Date:2013-01-04
13:41:25.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000991
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01H-P01/TR
Moisture Resistant Packing Materials
Label Explanation
‧CPN: Customer Specification (when required)
‧P/N: Everlight Production Number
‧QTY: Packing Quantity
‧CAT: Luminous Flux (Brightness) Bin
‧HUE: Color Bin
‧REF: Forward Voltage Bin
‧LOT No: Lot Number
Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel
Progress Direction
Polarity
Note:
1.Dimensions are in millimeters.
2.Tolerances unless mentioned are ± 0.1mm.
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Date:2013-01-04
13:41:25.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000991
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01H-P01/TR
Reel Dimensions
Note:
1.Dimensions are in millimeters.
Moisture Resistant Packing Process
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Date:2013-01-04
13:41:25.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000991
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01H-P01/TR
Reflow Soldering Characteristics
Soldering and Handling
1.
Over-current-proof
Though EHP-C04 series has conducted ESD protection mechanism, customers must not use the device in reverse and should
apply resistors for extra protection. Otherwise, slight voltage shift may cause enormous current shift and burn out failure would
happen
2.
Storage
i.
ii.
iii.
iv.
3.
Do not open the moisture-proof bag before the products are ready to use.
Before opening the package, the LEDs should be stored at temperature less than 30°C and less and relative
humidity less than 90%.
After opening the package, the LEDs should be stored at temperature less than 30°C and relative humidity less than 85%.
If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking
treatment should be implemented based on the following conditions: Pre-curing at 60±5°C for 24 hours.
Thermal Management
i.
ii.
iii.
For maintaining the high flux output and achieving reliability, EHP-C04 series LEDs should be mounted on a metal
core printed circuit board (MCPCB), with proper thermal connection to dissipate approximately 1W to 5W of thermal
energy under normal operation.
Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large
electronic driving and LEDs lifetime will decrease critically
When operating , the solder pad temperature ( or the board temperature nearby the LED) must be controlled under 70℃.
4. Soldering Condition
4.1 Soldering Pad
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Date:2013-01-04
13:41:25.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000991
www.everlight.com
Expired Period: Forever
DATASHEET
EHP-C04/NT01H-P01/TR
4.2 For Reflow Process
i. Lead reflow soldering temperature profile
ii.
iii.
iv.
Reflow soldering should not be done more than two times.
While soldering, do not put stress on the LEDs during heating.
After soldering, do not warp the circuit board.
12 Copyright
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:6©
LifecyclePhase:
Date:2013-01-04
13:41:25.0
2010, Everlight All Rights Reserved. Release Date : 12.26.2012. Issue No:Release
DHE-0000991
www.everlight.com
Expired Period: Forever