EHP-69 Series EHP-69/GT01C-P01/TR Received ■ MASS PRODUCTION □ PRELIMINARY □ CUSTOMER DESIGN DEVICE NO. : * PAGE : 12 Revised record REV. DESCRIPTION RELEASE DATE 1 New spec 2011.04.08 2 Modify VF and white bin label 2011.05.31 3 Modify Luminous Flux bin label 2011.06.02 4 Modify typical electro-optical characteristics curves increase lux with lm,modify tolerances unless mentioned ±0.15mm. Unit =mm。 2011.08.30 5 Modify the product dimension of height to 1.70mm and change format。 2011.11.17 6 Revision Copyright © Added the Viewing Angle : 6Everlight All Rights Reserved. Release Date :06.07.2012. Issue No: DHE-0001528 Release 2012, LifecyclePhase: 2012.06.07 Date:2012-06-15 10:49:13.0 www.everlight.com Expired Period: Forever DATASHEET EHP-69 Series EHP-69/GT01C-P01/TR EHP-69 Series EHP-69/GT01C-P01/TR Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ Small & compact package and with high efficiency Typical luminous flux: 100 lm @ 500mA Typical color temperature: 6000 K@500mA Optical efficiency@500mA : 65 lm/W ESD protection (according to JEDEC 3b) up to 2KV Moisture Sensitivity Level (MSL) Class 3 Grouping parameter: Total luminous flux, Color coordinates, Forward voltage. RoHS compliant & Pb free Description ◆ ◆ ◆ ◆ Encapsulating Resin: Silicone resin with phosphor Electrodes: Ag plating Die attach: Silver paste Chip: InGaN Applications ◆ Camera flash light /strobe light for mobile devices ◆ Torch light for DV(Digital Video) application ◆ Signal and Symbol Luminaries for orientation maker lights (e.g. steps, exit ways, etc.) 2 Copyright Revision :6© LifecyclePhase: Date:2012-06-15 10:49:13.0 2012, Everlight All Rights Reserved. Release Date : 06.07.2012. Issue No:Release DHE-0001528 www.everlight.com Expired Period: Forever DATASHEET EHP-69 Series EHP-69/GT01C-P01/TR Device Selection Guide Chip Emitted Color Materials InGaN Shiny White Absolute Maximum Ratings (Ts=25℃) Parameter Symbol Rating Unit IF 350 mA Peak Pulsed Forward Current(Pulse Mode)(2) Ipulse 500 mA ESD Resistance (JEDEC 3b) VB 2000 V Reverse Voltage VR Note 3 V Junction Temperature TJ 125 ℃ Operating Temperature TOP -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Soldering Temperature Tsol 260 ℃ Allowable Reflow Cycles N/A 2 Viewing Angle 2θ1/2 60 DC operating Current(Torch Mode)(1) deg Notes: 1. Pulse time > 50ms, Tsoldering = 25℃ 2. 1 Duty≦0.1, pulse width≦50ms, Tsoldering = 25℃ 3. EHP-69 series are not designed for reverse bias used. 4. All specification are assured by reliability test for 1000hr, IV degradation less than 30% 5. All reliability items are tested under good thermal management with 1.0x1.0 cm2 MCPCB 6. Operate LED component at maximum rating conditions continuously will cause possible permanent damage and de-rating parameters. Exercise multiple maximum rating parameters simultaneously should not be allowed. When maximum rating parameters are applied over a long period will result potential reliability iss JEDEC Moisture Sensitivity Floor Life Soak Requirements Standard Level Time (hours) Conditions Time (hours) Conditions 3 168 ≦ 30℃/ 60%RH 192 +5/-0 30℃/ 60%RH 3 Copyright Revision :6© LifecyclePhase: Date:2012-06-15 10:49:13.0 2012, Everlight All Rights Reserved. Release Date : 06.07.2012. Issue No:Release DHE-0001528 www.everlight.com Expired Period: Forever DATASHEET EHP-69 Series EHP-69/GT01C-P01/TR Electro-Optical Characteristics (Ts=25℃) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Flux(1) IV 80 100 140 lm Forward Voltage(2) VF 2.95 ---- 4.15 V Color Temperature CCT 4500 ---- 7000 K Bin Min. Typ. Max. Unit Condition 2932 2.95 ---- 3.25 3235 3.25 ---- 3.55 3538 3.55 ---- V IF = 500mA 3.85 3841 3.85 ---- 4.15 Bin Min. Typ. Max. Unit Condition F8 80 ---- 90 F9 90 ---- 100 J1 100 ---- Lm IF = 500mA 120 J2 120 ---- 140 IF = 500mA(3) Forward Voltage Binning Luminous Flux Binning Note. 1. Brightness measurement tolerance: ±10%. 2. Forward Voltage measurement tolerance: ±0.1V. 3. 1 Duty≦0.1, pulse width≦50ms, Tsoldering = 25℃ 4 Copyright Revision :6© LifecyclePhase: Date:2012-06-15 10:49:13.0 2012, Everlight All Rights Reserved. Release Date : 06.07.2012. Issue No:Release DHE-0001528 www.everlight.com Expired Period: Forever DATASHEET EHP-69 Series EHP-69/GT01C-P01/TR White Bin Structure Cool-White Bin Coordinate Bin CIE X CIE Y 0.3738 0.4378 4550 0.3524 0.4061 (1) 0.3440 0.3420 0.3620 0.3720 Reference Range: 4500~5000K Bin CIE X CIE Y 0.303 0.333 5770 0.33 0.373 (3) 0.33 0.32 0.311 0.292 Bin CIE X CIE Y 0.3524 0.4061 5057 0.3300 0.3730 (2) 0.3300 0.3200 0.3440 0.3420 Reference Range: 5000~5700K Reference Range: 5700~7000K Notes: 1. Color coordinates measurement allowance : ±0.01 2. Color bins are defined at IF=500mA and 50ms pulse operation condition 5 Copyright Revision :6© LifecyclePhase: Date:2012-06-15 10:49:13.0 2012, Everlight All Rights Reserved. Release Date : 06.07.2012. Issue No:Release DHE-0001528 www.everlight.com Expired Period: Forever DATASHEET EHP-69 Series EHP-69/GT01C-P01/TR Typical Electro-Optical Characteristics Curves Forward Voltage vs. Forward Current 1.0 3.3 0.8 3.2 Forward Voltage(V) Relative Luminous Intenstiy Relative Spectral Distribution, IF=500mA 0.6 0.4 0.2 0.0 400 500 600 700 800 3.1 3.0 2.9 2.8 100 200 Wavelength(nm) Corelated Color Temperature (K) Relative Luminous Intensity 0.8 0.6 0.4 0.2 200 300 500 Correlated Color Temperature (CCT) vs. Forward current 1.0 100 400 Forward Current(mA) Relative Luminous Intensity vs Forward Current 0.0 300 400 Forward Current (mA) 500 5800 5700 5600 5500 100 200 300 400 500 Forward current(mA) Note. 1. Data was tested at pulse time = 50ms 2. Data was tested under superior thermal management, T soldering <70℃. 6 Copyright Revision :6© LifecyclePhase: Date:2012-06-15 10:49:13.0 2012, Everlight All Rights Reserved. Release Date : 06.07.2012. Issue No:Release DHE-0001528 www.everlight.com Expired Period: Forever DATASHEET EHP-69 Series EHP-69/GT01C-P01/TR Typical Representative Spatial Radiation Pattern 1.0 0.9 Relative Intensity 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -80 -60 -40 -20 0 20 40 60 80 Degree (2) Note. 1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2. Viewing angle tolerance is ± 10∘. Luminous Intensity(lm) VS Center lux(lux) Luminous Intensity(lm) 120 100 80 60 40 20 20 40 60 80 100 120 Center lux (lux) 7 Copyright Revision :6© LifecyclePhase: Date:2012-06-15 10:49:13.0 2012, Everlight All Rights Reserved. Release Date : 06.07.2012. Issue No:Release DHE-0001528 www.everlight.com Expired Period: Forever DATASHEET EHP-69 Series EHP-69/GT01C-P01/TR Mechanical Dimension Note: Tolerances unless mentioned ±0.15mm. Unit = mm 8 Copyright Revision :6© LifecyclePhase: Date:2012-06-15 10:49:13.0 2012, Everlight All Rights Reserved. Release Date : 06.07.2012. Issue No:Release DHE-0001528 www.everlight.com Expired Period: Forever DATASHEET EHP-69 Series EHP-69/GT01C-P01/TR Moisture Resistant Packing Materials Label Explanation CPN : Customer’s Production Number P/N : Production Number QTY : Packing Quantity CAT: Rank of Luminous Flux HUE: Color Rank REF: Rank of Forward Voltage LOT No: Lot Number MADE IN Production Place TAIWAN: Reel Dimensions 9 Copyright Revision :6© LifecyclePhase: Date:2012-06-15 10:49:13.0 2012, Everlight All Rights Reserved. Release Date : 06.07.2012. Issue No:Release DHE-0001528 www.everlight.com Expired Period: Forever DATASHEET EHP-69 Series EHP-69/GT01C-P01/TR Carrier Tape Dimensions: Loaded Quantity 1000 pcs Per Reel Note: Tolerances unless mentioned ±0.1mm. Unit = mm Moisture Resistant Packaging Label Aluminum moisture-proof bag Aluminum Label Note: Tolerances unless mentioned ±0.1mm. Unit = moistue-proof mm bag Desiccant Desiccant Label Label Precautions for Use 1. Over-current-proof Although the EHP-69 series has a conductive ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shifts may cause significant current change resulting in burn out failure. 2. Storage i. Do not open the moisture proof bag before the devices are ready to use. ii. Before the package is opened, LEDs should be stored at temperatures less than 30℃and 10 Copyright Revision :6© LifecyclePhase: Date:2012-06-15 10:49:13.0 2012, Everlight All Rights Reserved. Release Date : 06.07.2012. Issue No:Release DHE-0001528 www.everlight.com Expired Period: Forever DATASHEET EHP-69 Series EHP-69/GT01C-P01/TR humidity less than 90%. iii. LEDs should be used within a year. iv. After the package is opened, LEDs should be stored at temperatures less than 30℃and humidity less than 60%. v. LEDs should be used within 168 hours (7 days) after the package is opened. vi. If the moisture absorbent material (silicone gel) has faded away or LEDs have exceeded the storage time, baking treatment should be implemented based on the following conditions: pre-curing at 60±5℃ for 24 hours. 3. Thermal Management i. For maintaining the high flux output and achieving reliability, EHP-69 series LEDs should be mounted on a metal core printed circuit board (MCPCB) or other kinds of heat sink with proper thermal connection to dissipate approximately 1W of thermal energy at 350mA operation. ii. Heat dissipation or thermal conduction design is strongly recommended on MCPCB for reflow soldering purposes. ■ Temperature of soldering pad should be controlled under 70℃ iii. Sufficient thermal management must be implemented. Otherwise, the junction temperature of die may exceed over the limit at high current driving conditions and the LEDs’ lifetime may be decrease dramatically. iv. For further thermal management suggestions, please consult the Everlight Design Guide or local representatives for assistance. v. The solder pad should be controlled below 70OC when turn on the device, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically. 11 Copyright Revision :6© LifecyclePhase: Date:2012-06-15 10:49:13.0 2012, Everlight All Rights Reserved. Release Date : 06.07.2012. Issue No:Release DHE-0001528 www.everlight.com Expired Period: Forever DATASHEET EHP-69 Series EHP-69/GT01C-P01/TR 4. Proper Handling To avoid contamination of materials, damage of internal components, and shortening of LED lifetime, do not subject LEDs to conditions as those listed below. Pick and Place Nozzle for Surface Tweezers Mount Assembly. Avoid directly contacting with nozzle. Do not touch the resin to avoid scratching or other damage. 5. Reflow Soldering Process a. EHP-69 series are suitable for SMT process. b. Curing of glue in oven according to standard operation flow processes. c. Reflow soldering should not be done more than twice. d. In soldering process, stress on the LEDs during heating should be avoided. e. After soldering, do not warp the circuit board. 12 Copyright Revision :6© LifecyclePhase: Date:2012-06-15 10:49:13.0 2012, Everlight All Rights Reserved. Release Date : 06.07.2012. Issue No:Release DHE-0001528 www.everlight.com Expired Period: Forever