EHP-69 Series EHP-69/GT01C-P01/TR Received Revised record

EHP-69 Series
EHP-69/GT01C-P01/TR
Received
■ MASS PRODUCTION
□ PRELIMINARY
□ CUSTOMER DESIGN
DEVICE NO. : *
PAGE : 12
Revised record
REV.
DESCRIPTION
RELEASE DATE
1
New spec
2011.04.08
2
Modify VF and white bin label
2011.05.31
3
Modify Luminous Flux bin label
2011.06.02
4
Modify typical electro-optical
characteristics curves increase lux with
lm,modify tolerances unless mentioned
±0.15mm. Unit =mm。
2011.08.30
5
Modify the product dimension of height
to 1.70mm and change format。
2011.11.17
6
Revision
Copyright ©
Added the Viewing Angle
: 6Everlight All Rights Reserved. Release Date :06.07.2012. Issue No: DHE-0001528
Release
2012,
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Date:2012-06-15
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DATASHEET
EHP-69 Series
EHP-69/GT01C-P01/TR
EHP-69 Series
EHP-69/GT01C-P01/TR
Features
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Small & compact package and with high efficiency
Typical luminous flux: 100 lm @ 500mA
Typical color temperature: 6000 [email protected]
Optical [email protected] : 65 lm/W
ESD protection (according to JEDEC 3b) up to 2KV
Moisture Sensitivity Level (MSL) Class 3
Grouping parameter: Total luminous flux, Color coordinates, Forward voltage.
RoHS compliant & Pb free
Description
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Encapsulating Resin: Silicone resin with phosphor
Electrodes: Ag plating
Die attach: Silver paste
Chip: InGaN
Applications
◆ Camera flash light /strobe light for mobile devices
◆ Torch light for DV(Digital Video) application
◆ Signal and Symbol Luminaries for orientation maker lights (e.g. steps, exit ways, etc.)
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DATASHEET
EHP-69 Series
EHP-69/GT01C-P01/TR
Device Selection Guide
Chip
Emitted Color
Materials
InGaN
Shiny White
Absolute Maximum Ratings (Ts=25℃)
Parameter
Symbol
Rating
Unit
IF
350
mA
Peak Pulsed Forward Current(Pulse Mode)(2)
Ipulse
500
mA
ESD Resistance (JEDEC 3b)
VB
2000
V
Reverse Voltage
VR
Note 3
V
Junction Temperature
TJ
125
℃
Operating Temperature
TOP
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Soldering Temperature
Tsol
260
℃
Allowable Reflow Cycles
N/A
2
Viewing Angle
2θ1/2
60
DC operating Current(Torch Mode)(1)
deg
Notes:
1. Pulse time > 50ms, Tsoldering = 25℃
2. 1 Duty≦0.1, pulse width≦50ms, Tsoldering = 25℃
3. EHP-69 series are not designed for reverse bias used.
4. All specification are assured by reliability test for 1000hr, IV degradation less than 30%
5. All reliability items are tested under good thermal management with 1.0x1.0 cm2 MCPCB
6. Operate LED component at maximum rating conditions continuously will cause possible
permanent damage and de-rating parameters. Exercise multiple maximum rating parameters
simultaneously should not be allowed. When maximum rating parameters are applied over a
long period will result potential reliability iss
JEDEC Moisture Sensitivity
Floor Life
Soak Requirements Standard
Level
Time (hours)
Conditions
Time (hours)
Conditions
3
168
≦ 30℃/ 60%RH
192 +5/-0
30℃/ 60%RH
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DATASHEET
EHP-69 Series
EHP-69/GT01C-P01/TR
Electro-Optical Characteristics (Ts=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Luminous Flux(1)
IV
80
100
140
lm
Forward Voltage(2)
VF
2.95
----
4.15
V
Color Temperature
CCT
4500
----
7000
K
Bin
Min.
Typ.
Max.
Unit
Condition
2932
2.95
----
3.25
3235
3.25
----
3.55
3538
3.55
----
V
IF = 500mA
3.85
3841
3.85
----
4.15
Bin
Min.
Typ.
Max.
Unit
Condition
F8
80
----
90
F9
90
----
100
J1
100
----
Lm
IF = 500mA
120
J2
120
----
140
IF = 500mA(3)
Forward Voltage Binning
Luminous Flux Binning
Note.
1. Brightness measurement tolerance: ±10%.
2. Forward Voltage measurement tolerance: ±0.1V.
3. 1 Duty≦0.1, pulse width≦50ms, Tsoldering = 25℃
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DATASHEET
EHP-69 Series
EHP-69/GT01C-P01/TR
White Bin Structure
Cool-White Bin Coordinate
Bin
CIE X
CIE Y
0.3738
0.4378
4550
0.3524
0.4061
(1)
0.3440
0.3420
0.3620
0.3720
Reference Range: 4500~5000K
Bin
CIE X
CIE Y
0.303
0.333
5770
0.33
0.373
(3)
0.33
0.32
0.311
0.292
Bin
CIE X
CIE Y
0.3524
0.4061
5057
0.3300
0.3730
(2)
0.3300
0.3200
0.3440
0.3420
Reference Range: 5000~5700K
Reference Range: 5700~7000K
Notes:
1. Color coordinates measurement allowance : ±0.01
2. Color bins are defined at IF=500mA and 50ms pulse operation condition
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DATASHEET
EHP-69 Series
EHP-69/GT01C-P01/TR
Typical Electro-Optical Characteristics Curves
Forward Voltage vs. Forward Current
1.0
3.3
0.8
3.2
Forward Voltage(V)
Relative Luminous Intenstiy
Relative Spectral Distribution,
IF=500mA
0.6
0.4
0.2
0.0
400
500
600
700
800
3.1
3.0
2.9
2.8
100
200
Wavelength(nm)
Corelated Color Temperature (K)
Relative Luminous Intensity
0.8
0.6
0.4
0.2
200
300
500
Correlated Color Temperature (CCT) vs.
Forward current
1.0
100
400
Forward Current(mA)
Relative Luminous Intensity vs Forward
Current
0.0
300
400
Forward Current (mA)
500
5800
5700
5600
5500
100
200
300
400
500
Forward current(mA)
Note.
1. Data was tested at pulse time = 50ms
2. Data was tested under superior thermal management, T soldering <70℃.
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DATASHEET
EHP-69 Series
EHP-69/GT01C-P01/TR
Typical Representative Spatial Radiation Pattern
1.0
0.9
Relative Intensity
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-80
-60
-40
-20
0
20
40
60
80
Degree (2)
Note.
1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2. Viewing angle tolerance is ± 10∘.
Luminous Intensity(lm) VS Center lux(lux)
Luminous Intensity(lm)
120
100
80
60
40
20
20
40
60
80
100
120
Center lux (lux)
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DATASHEET
EHP-69 Series
EHP-69/GT01C-P01/TR
Mechanical Dimension
Note: Tolerances unless mentioned ±0.15mm. Unit = mm
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DATASHEET
EHP-69 Series
EHP-69/GT01C-P01/TR
Moisture Resistant Packing Materials
Label Explanation
CPN : Customer’s Production Number
P/N : Production Number
QTY : Packing Quantity
CAT: Rank of Luminous Flux
HUE: Color Rank
REF: Rank of Forward Voltage
LOT No: Lot Number
MADE IN Production Place
TAIWAN:
Reel Dimensions
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DATASHEET
EHP-69 Series
EHP-69/GT01C-P01/TR
Carrier Tape Dimensions: Loaded Quantity 1000 pcs Per Reel
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Aluminum
Label
Note: Tolerances
unless mentioned ±0.1mm.
Unit = moistue-proof
mm
bag
Desiccant
Desiccant
Label
Label
Precautions for Use
1. Over-current-proof
Although the EHP-69 series has a conductive ESD protection mechanism, customer must not use
the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage
shifts may cause significant current change resulting in burn out failure.
2. Storage
i. Do not open the moisture proof bag before the devices are ready to use.
ii. Before the package is opened, LEDs should be stored at temperatures less than 30℃and
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DATASHEET
EHP-69 Series
EHP-69/GT01C-P01/TR
humidity less than 90%.
iii. LEDs should be used within a year.
iv. After the package is opened, LEDs should be stored at temperatures less than 30℃and humidity
less than 60%.
v. LEDs should be used within 168 hours (7 days) after the package is opened.
vi. If the moisture absorbent material (silicone gel) has faded away or LEDs have exceeded the
storage time, baking treatment should be implemented based on the following conditions:
pre-curing at 60±5℃ for 24 hours.
3. Thermal Management
i.
For maintaining the high flux output and achieving reliability, EHP-69 series LEDs should be
mounted on a metal core printed circuit board (MCPCB) or other kinds of heat sink with proper
thermal connection to dissipate approximately 1W of thermal energy at 350mA operation.
ii. Heat dissipation or thermal conduction design is strongly recommended on MCPCB for reflow
soldering purposes.
■ Temperature of soldering pad should be controlled under 70℃
iii.
Sufficient thermal management must be implemented. Otherwise, the junction temperature of
die may exceed over the limit at high current driving conditions and the LEDs’ lifetime may
be decrease dramatically.
iv. For further thermal management suggestions, please consult the Everlight Design Guide or
local representatives for assistance.
v.
The solder pad should be controlled below 70OC when turn on the device, or the die junction
temperature will be over the limit under large electronic driving and LED lifetime will
decrease critically.
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DATASHEET
EHP-69 Series
EHP-69/GT01C-P01/TR
4. Proper Handling
To avoid contamination of materials, damage of internal components, and shortening of
LED lifetime, do not subject LEDs to conditions as those listed below.
Pick and Place Nozzle for Surface
Tweezers
Mount Assembly.
Avoid directly contacting with nozzle.
Do not touch the resin to avoid scratching
or other damage.
5. Reflow Soldering Process
a. EHP-69 series are suitable for SMT process.
b. Curing of glue in oven according to standard operation flow processes.
c. Reflow soldering should not be done more than twice.
d. In soldering process, stress on the LEDs during heating should be avoided.
e. After soldering, do not warp the circuit board.
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Date:2012-06-15
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2012, Everlight All Rights Reserved. Release Date : 06.07.2012. Issue No:Release
DHE-0001528
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Expired Period: Forever