High Radiant Flux Density 400nm Violet LED Emitter LZP-00UA00 Key Features Ultra-bright, compact 24-die, 400nm Violet LED Very high Radiant Flux density, 30 W/cm2 Small high density foot print, 12.0mm x 12.0mm x 6.7mm package Surface mount ceramic package with integrated glass lens Exceptionally low Thermal Resistance (0.6°C/W) Electrically neutral thermal slug Autoclave complaint (JEDEC JESD22-A102-C) JEDEC Level 1 for Moisture Sensitivity Level Lead (Pb) free and RoHS compliant Reflow solderable (up to 6 cycles) Emitter available on MCPCB (optional) Typical Applications Curing Sterilization Medical Currency Verification Fluorescence Microscopy Inspection of dyes, rodent and animal contamination, Leak detection Forensics Description The LZP-series emitter is rated for 90W power handling in an ultra compact package. With a small 12.0mm x 12.0mm x 6.7mm footprint, this package provides exceptional radiant flux density. The patented design has unparalleled thermal and optical performance. The high quality materials used in the package are chosen to optimize Radiant Flux and minimize stresses which results in monumental reliability and radiant flux maintenance. The robust product design thrives in outdoor applications with high ambient temperatures and high humidity. UV RADIATION Avoid exposure to the beam Wear protective eyewear Table of Contents Product Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 IPC/JEDEC Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Luminous Flux Binning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Dominant Wavelength Binning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Forward Voltage Binning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Optical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Pin-Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Recommended Solder Pad Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Reflow Soldering Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Typical Radiation Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Typical Relative Spectral Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Typical Relative Dominant Wavelength Shift over Temperature . . . . . . . . . . . . . . . . . . 8 Typical Relative Radiant Flux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Typical Relative Radiant Flux over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Typical Forward Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Current Derating Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Emitter Tape & Reel Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 MCPCB Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Company Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2 LZP-00UA00 (R.1.6 – 110523) Product Nomenclature The LZ Series part number designation is defined as follows: LZA–BCDE00 Where: A – designate the number of available LED die locations (“P” for 25-die package) B – designate the package level (“0” for Emitter) C – designate the radiation pattern (“0” for Lambertian) D and E – designate the color (“UA” for Violet - 400nm Peak Wavelength) Ordering information: For ordering LedEngin products, please reference the base part number. The base part number represents any of the flux, dominant wavelength, or forward voltage bins specified in the binning tables below. For ordering products with special bin selections, please contact a LedEngin sales representative or authorized distributor. IPC/JEDEC Moisture Sensitivity Level Table 1 - IPC/JEDEC J-STD-20D.1 MSL Classification: Soak Requirements Standard Accelerated Floor Life Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 Unlimited ≤ 30°C/ 85% RH 168 +5/-0 85°C/ 85% RH n/a n/a Notes for Table 1: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor’s facility. Average Radiant Flux Maintenance Projections Lumen maintenance generally describes the ability of an emitter to retain its output over time. The useful lifetime for power LEDs is also defined as Radiant Flux Maintenance, with the percentage of the original light output remaining at a defined time period. Based on long-term WHTOL testing, LedEngin projects that the LZ Series will deliver, on average, 70% Radiant Flux Maintenance (RP70%) at 25,000 hours of operation at a forward current of 700 mA per die. This projection is based on constant current operation with junction temperature maintained at or below 110°C. 3 LZP-00UA00 (R.1.6 – 110523) Luminous Flux Bins Table 2: Bin Code Minimum Radiant Flux (Φ) @ IF = 700mA [1,2] (mW) Maximum Radiant Flux (Φ) @ IF = 700mA [1,2] (mW) Y Z 9500 12000 12000 15000 Notes for Table 2: 1. Luminous flux performance guaranteed within published operating conditions. LedEngin maintains a tolerance of ± 10% on flux measurements. 2. Future products will have even higher levels of luminous flux performance. Contact LedEngin Sales for updated information. Dominant Wavelength Bins Table 3: Bin Code Minimum Peak Wavelength (λP) @ IF = 700mA [1] (nm) Maximum Peak Wavelength (λP) @ IF = 700mA [1] (nm) U5 U6 U7 U8 390 395 400 405 395 400 405 410 Notes for Table 3: 1. Dominant wavelength is derived from the CIE 1931 Chromaticity Diagram and represents the perceived hue. 2. LedEngin maintains a tolerance of ± 0.5nm on dominant wavelength measurements. Forward Voltage Bins Table 4: Bin Code Minimum Forward Voltage (VF/Ch) @ IF = 700mA [1,2] (V) Maximum Forward Voltage (VF/Ch) @ IF = 700mA [1,2] (V) 0 20.64 23.52 Notes for Table 4: 1. LedEngin maintains a tolerance of ± 0.24V for forward voltage measurements. 2. All 4 Channels have matched Vf for parallel operation 3. Forward Voltage is binned with 6 LED dies connected in series. The LED is configured with 4 Channels of 6 dies in series each. 4 LZP-00UA00 (R.1.6 – 110523) Absolute Maximum Ratings Table 5: Parameter DC Forward Current [1] Peak Pulsed Forward Current [2] Reverse Voltage Storage Temperature Junction Temperature Soldering Temperature [4] Allowable Reflow Cycles Symbol IF IFP VR Tstg TJ Tsol ESD Sensitivity [5] Value 1000 /Channel 1000 /Channel See Note 3 -40 ~ +150 125 260 6 > 2,000 V HBM Class 2B JESD22-A114-D Unit mA mA V °C °C °C Notes for Table 5: 1. Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current derating. 2. Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3. 5. LedEngin recommends taking reasonable precautions towards possible ESD damages and handling the LZP-00UA00 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ TC = 25°C Table 6: Parameter Radiant Flux (@ IF = 700mA) [1] Peak Wavelength Viewing Angle [2] Total Included Angle [3] Symbol ΦV λD 2Θ1/2 Θ0.9V Typical 12400 400 95 115 Unit mW nm Degrees Degrees Notes for Table 6: 1. Luminous flux typical value is for all four LED dice operating concurrently at rated current. 2. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value. 3. Total Included Angle is the total angle that includes 90% of the total luminous flux. Electrical Characteristics @ TC = 25°C Table 7: Parameter Forward Voltage (@ IF = 700mA) [1] Temperature Coefficient of Forward Voltage [1] Thermal Resistance (Junction to Case) Symbol VF Typical 22 /Channel Unit V ΔVF/ΔTJ -14.2 mV/°C RΘJ-C 0.6 °C/W Notes for Table 7: 1. Forward Voltage is measured for a single string of 6 dies connected in series. The LED is configured with 4 Channels of 6 dies in series each. 5 LZP-00UA00 (R.1.6 – 110523) Mechanical Dimensions (mm) Pin Out Ch. Pad 18 1 24 17 2 3 15 3 5 14 4 Figure 3: Package outline drawing. Notes for Figure 3: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Thermal slug is electrically isolated 3. Ts is a thermal reference point 5 8 2 23 Die E D C B A F J I H G L K O N S R Q P T Y X W V U M M Color UA UA UA UA UA UA UA UA UA UA UA UA UA UA UA UA UA UA UA UA UA UA UA UA - Function Anode na na na na Cathode Anode na na na na Cathode Anode na na na na Cathode Anode na na na na Cathode na na Recommended Solder Pad Layout (mm) +18 -24 -3 +17 +15 -5 -8 +14 +2 -23 Figure 4: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad. Note for Figure 4: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 6 LZP-00UA00 (R.1.6 – 110523) Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering. Typical Radiation Pattern 100 Relative Intensity (%) 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement (Degrees) Figure 4: Typical representative spatial radiation pattern. 7 LZP-00UA00 (R.1.6 – 110523) Typical Relative Spectral Power Distribution 1 Relative Spectral Power 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 300 350 400 450 500 Wavelength (nm) Figure 5: Relative spectral power vs. wavelength @ TC = 25°C. Typical Relative Dominant Wavelength Shift over Temperature Peak Wavelength Shift (nm) 5.0 4.0 3.0 2.0 1.0 0.0 0 20 40 60 80 100 120 Case Temperature (ºC) Figure 6: Typical dominant wavelength shift vs. case temperature. 8 LZP-00UA00 (R.1.6 – 110523) Typical Relative Radiant Flux 1.4 Normalized Radiant Flux 1.2 1 0.8 0.6 0.4 0.2 0 0 200 400 600 800 1000 IF - Forward Current (mA) Figure 7: Typical relative Radiant Flux vs. forward current @ TC = 25°C. Typical Relative Radiant Flux over Temperature 1.2 Normalized Radiant Flux 1 0.8 0.6 0.4 0.2 0 0 20 40 60 80 100 120 Case Temperature (ºC) Figure 8: Typical relative Radiant Flux vs. case temperature. 9 LZP-00UA00 (R.1.6 – 110523) Typical Forward Current Characteristics 1200 If-Forward Current (mA) 1000 800 600 400 200 0 19 20 21 22 23 Vf-Forward Voltage (V) Figure 9: Typical forward current vs. forward voltage @ TC = 25°C. Note for Figure 9: 1. Forward Voltage curve is pro channel of 6 LED dies connected in series. The LED is configured with 4 Channels of 6 dies in series each. Current De-rating IF - Maximum Current (mA) 1200 1000 800 700 (Rated) 600 400 R=Θ C/W RΘJ-A = 1.0˚ 2.0°C/W J-A= R=Θ C/W RΘJ-A = 1.5˚ 3.0°C/W J-A= R=Θ = 2.0˚ C/W RΘJ-A = 4.0°C/W J-A 200 0 0 25 50 75 100 125 150 Maximum Ambient Temperature (°C) Figure 10: Maximum forward current vs. ambient temperature based on TJ(MAX) = 150°C. Notes for Figure 10: 1. Maximum current assumes that all LED dies are operating at rated current. 2. RΘJ-C [Junction to Case Thermal Resistance] for the LZP-series is typically 0.6°C/W. 3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance]. 10 LZP-00UA00 (R.1.6 – 110523) MCPCB Option – LZP-Dxxxxx Emitter heat slug mounts directly onto MCPCB copper core resulting into an extremely low 0.1C/W thermal resistance 5 Channels: 4 independent channels with strings of 6 white LED dies in series each; 1 channel for optional center pad function (not used with LZP-0xxx00 emitter) MCPCB contains zener diodes for each channel resulting in enhanced ESD protection 6 mounting features: o Allow for M3 or #4 screws for attaching the MCPCB to a heat sink o Allow for alignment of LLxx-3T11 series lens holder RΘJ-B Lookup Table Table 8: Product Typical Emitter RΘJ-C + Typical MCPCB RΘC-B = Typical Emitter + MCPCB RΘJ-B [1] LZP-series 0.6°C/W + 0.1°C/W = 0.70°C/W 4x6 MCPCB Mechanical Dimensions (mm) Pin Out Ch. 1 2 3 4 5 Figure 11: Standard MCPCB outline dimensions (mm). Pad 10 1 9 2 8 3 7 4 5 6 Color UA UA UA UA UA UA UA UA - Function Anode Cathode Anode Cathode Anode Cathode Anode Cathode na na +10 -1 -2 +9 +8 -3 -4 +7 +5 -6 Note for Figure 11: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Slots in MCPCB are for M3 or #4 mounting screws. 3. LedEngin recommends using plastic washers to electrically insulate screws from solder pads and electrical traces. 4. LedEngin recommends using thermally conductive adhesives when attaching the MCPCB to a heat sink. 5. MCPCB thermal resistance is based on tests conducted on a copper based SuperMCPCB from Bridge Semiconductor 11 LZP-00UA00 (R.1.6 – 110523) Company Information LedEngin, Inc. is a Silicon Valley based solid-state lighting company specializing in the development and manufacturing of unprecedented high-power LED emitters, modules and replacement lamps. LedEngin’s packaging technologies lead the industry with products that feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and efficient solid state lighting solutions. LedEngin’s LED emitters range from 3W to 90W with ultra-compact footprints and are available in single color products including Cool White, Neutral White, Warm White, Red, Green, Blue, Amber, Deep Red, Far Red, Dental Blue and UV as well as multi-color products with RGB, RGBA and RGBW options. LedEngin’s brightest White LEDs are capable of emitting 5,500 lumens. LedEngin’s robust emitters are at the core of its unique line of modules and replacement lamps producing unmatched beam quality resulting in true Lux on Target™ for a wide variety of spot and narrow flood directional lighting applications. LedEngin is committed to providing products that conserve natural resources and reduce greenhouse emissions. LedEngin reserves the right to make changes to improve performance without notice. Please contact [email protected] or (408) 492-0620 for more information. 12 LZP-00UA00 (R.1.6 – 110523)