C U S T O M D E S I G N E D P O W E R M O D U L E S Solutions for High Power Applications C U S T O M D E S I G N E D ● High Power ● ● Solutions in ● Custom Module ● Design ● ● Powerex has addressed ● the need for application ● specific custom power ● modules with its Custom ● Power Products Division. ● Dedicated to the task of providing cost effective P O W E R Extended temperature range, -55˚ - 125˚C Moisture resistance Hermetic modules Different circuit configurations – i.e. common emitter, chopper High voltage isolation Low module weight Larger free wheel diodes Package height, width and length Integrated heatsinks – both air and liquid cooled by eliminating the baseplate Over current shutdown Temperature and current sense Different termination styles – i.e. thicker bus bars, D-sub connectors, press on pins, etc. solutions to complex High Voltage Discretes semiconductor applications, Powerex brings its formidable experience and knowledge to bear on chip manufacturing, electronic materials and design/engineering techniques. M O D U L E S IGBT Modules P O W E R E X A N D M O D U L E T E C H N O L O G Y Customizing an electronic package specifically for your needs involves the precise selection of many components. High power IGBT’s, Hermetic Modules MOSFETs, SCR’s, Diodes and Darlington Transistors, along with driver circuits, isolated materials, packages and terminals, are the key elements in custom package design. Powerex has continuing access to the most advanced circuit and chip design. Compression Bonded Encapsulation (CBE) Hermetic Modules MOSFET Module P O W E R E X C U S T O M M O D U L E S T E C H N O L O G Y Standard Packages ● Standard Cases, including IGBT, IPM, CIB, HVIGBT ● Picture Frame ● Custom Package Development, including plastic and hermetic P O W E Material R E X Composition SOLDER BASEPLATES SUBSTRATES Silicon Die Selection Alumina BeO IMS insul Copper Aluminum AlSiC Molybdenum Braze 28Cu72Ag Solder High 95Pb 5Sn Solder Low 40Pb 60Sn Solder Low 63Pb 37Sn Solder Med 95Sn 5Sb Kovar OTHER In addition to its exclusive access to IGBT, FWD, Bipolar, GTO chips manufactured by its strategic partner, and the Thyristor, Diode, and Darlington chips created in its own facility, Powerex can also use any other manufacturer’s chip on the market. AIN Chotherm Steel Tungsten 1646 Picture Frame Complete Custom C U S T O M M O D U L E M A T E R I A L S Conductivity W/InchC Conductivity W/mC W/mmC Density g/cm3 g/mm3 Specific Heat cal/gram J/gm TCE ppm/c Solid (C) 3.8354 151 1.510E-01 2.4 2.400E-03 0.18 0.752741233 4.2 1410 4.3180 170 1.700E-01 3.21 3.210E-03 0.16 0.669103318 4.5 2300 0.8890 35 3.500E-02 3.7 3.700E-03 0.21 0.878198105 6.4 2030 6.5786 259 2.590E-01 2.91 3.910E-03 0.25 1.045473934 6.7 2530 0.0762 3 3.000E-03 9.9822 393 3.930E-01 8.95 8.950E-03 0.092 0.384734408 16.8 1083 5.1816 204 2.040E-0 2.69 2.690E-03 0.22 0.920017062 23.4 660 4.3180 140-170 1.700E-01 2.9 2.900E-03 0.181 0.756923128 8.6-9.6 660 3.5560 140 1.400E-01 10.22 1.022E-02 0.0599 0.250495555 5.3 2600 10.01 1.001E-02 19.6 780 780 29.8 310 314 371 Liquid (C) 0.9378 37 3.700E-02 10.96 1.096E-02 0.9100 35.82677165 3.583E-02 8.52 8.520E-03 0.0358 0.149711867 25.2 174 185 0.9100 50 3.593E-02 8.52 8.520E-03 0.0358 0.150 25 185 185 7.25 7.250E-03 31.1 232 240 8.37 8.370E-03 0.105 0.439099052 4.9 1450 17.6 1.7610E-02 0.031564632 0.132 4.5 28 0.3556 14 1.400E-02 0.1500 5.905511811 5.906E-03 0.1000 3.937007874 3.937E-03 3.2800 129.1338583 1.291E-01 C H I P M A N U F A C T U R I N G / D E S I G N T O O L S Powerex Custom Power Modules employ performance proven features. Soldered-down and wire bonding fabrication and compression bonded encapsulation (CBE) of SCR/Diode elements offer increased switching speeds, lower losses, more efficient cooling and higher power handling capabilities. ● ● ● Thermal, Mechanical and Electro-Static Simulation using Algor Software – both Static and Dynamic Simulation Two Dimensional and Three Dimensional CAD Mechanical Desktop Tools Thermal Mechanical and Electro-Static Simulation Vacuum Soldering Wire Bonding Two Dimensional and Three Dimensional CAD R E L I A B I L I T Y / Q U A L I F I C A T I O N T E S T I N G Complete facility for Military and other high reliability testing. Reliability and qualification testing can be performed in accordance to military specifications, including Group A, B and C and specific customer requirements. Highly Accelerated Stress Testing (H.A.S.T.) is also a part of the Powerex custom module design process. Baseplate Flatness Verification The alliance between Powerex and its strategic partners continues the advancement of new classes of power semiconductor technology. Powerex’s commitment to the discovery process is on-going and results in power semiconductor innovation that embraces customer system issues for decreased size, reduced costs, increased energy efficiency, switches that operate at higher frequencies, are more durable and offer integrated functions. Anticipating future industry demands and proactive involvement with each customer results in the continued expansion of manufacturing facilities, research commitment and product development to meet customer power semiconductor needs for shortened product to market cycles. Powerex is a leading producer to OEM’s and component producers and supports many markets including: transportation, AC and DC motor controls, UPS, welding, industrial heating, electrical vehicles, aircraft, and communications. Global Power-Semiconductor Call the Power Line at 1-800-451-1415 ® 200 E. Hillis Street, Youngwood, PA 15697-1800 FAX 724-925-4393 www.pwrx.com Lit. Code #135-5K-4/05 Solution Provider