Custom Modules Brochure

C U S T O M D E S I G N E D P O W E R M O D U L E S
Solutions for High Power Applications
C U S T O M
D E S I G N E D
●
High Power
●
●
Solutions in
●
Custom Module
●
Design
●
●
Powerex has addressed
●
the need for application
●
specific custom power
●
modules with its Custom
●
Power Products Division.
●
Dedicated to the task of
providing cost effective
P O W E R
Extended temperature range, -55˚ - 125˚C
Moisture resistance
Hermetic modules
Different circuit configurations –
i.e. common emitter, chopper
High voltage isolation
Low module weight
Larger free wheel diodes
Package height, width and length
Integrated heatsinks – both air and liquid cooled
by eliminating the baseplate
Over current shutdown
Temperature and
current sense
Different termination
styles – i.e. thicker bus bars,
D-sub connectors,
press on pins, etc.
solutions to complex
High Voltage Discretes
semiconductor applications,
Powerex brings its
formidable experience
and knowledge to bear
on chip manufacturing,
electronic materials and
design/engineering
techniques.
M O D U L E S
IGBT Modules
P O W E R E X
A N D
M O D U L E
T E C H N O L O G Y
Customizing an electronic package
specifically for your needs involves
the precise selection of many
components. High power IGBT’s,
Hermetic Modules
MOSFETs, SCR’s, Diodes and
Darlington Transistors, along with
driver circuits, isolated materials,
packages and terminals, are the key
elements in custom package
design. Powerex has continuing
access to the most advanced circuit
and chip design.
Compression Bonded
Encapsulation (CBE)
Hermetic Modules
MOSFET Module
P O W E R E X
C U S T O M
M O D U L E S
T E C H N O L O G Y
Standard
Packages
●
Standard Cases, including IGBT, IPM, CIB, HVIGBT
●
Picture Frame
●
Custom Package Development, including plastic and hermetic
P
O
W
E
Material
R
E
X
Composition
SOLDER
BASEPLATES
SUBSTRATES
Silicon
Die Selection
Alumina
BeO
IMS insul
Copper
Aluminum
AlSiC
Molybdenum
Braze
28Cu72Ag
Solder High
95Pb 5Sn
Solder Low
40Pb 60Sn
Solder Low
63Pb 37Sn
Solder Med
95Sn 5Sb
Kovar
OTHER
In addition to its exclusive access to IGBT, FWD,
Bipolar, GTO chips manufactured by its strategic
partner, and the Thyristor, Diode, and Darlington
chips created in its own facility, Powerex can also use
any other manufacturer’s chip on the market.
AIN
Chotherm
Steel
Tungsten
1646
Picture Frame
Complete Custom
C U S T O M
M O D U L E
M A T E R I A L S
Conductivity
W/InchC
Conductivity
W/mC
W/mmC
Density
g/cm3
g/mm3
Specific
Heat
cal/gram
J/gm
TCE
ppm/c
Solid
(C)
3.8354
151
1.510E-01
2.4
2.400E-03
0.18
0.752741233
4.2
1410
4.3180
170
1.700E-01
3.21
3.210E-03
0.16
0.669103318
4.5
2300
0.8890
35
3.500E-02
3.7
3.700E-03
0.21
0.878198105
6.4
2030
6.5786
259
2.590E-01
2.91
3.910E-03
0.25
1.045473934
6.7
2530
0.0762
3
3.000E-03
9.9822
393
3.930E-01
8.95
8.950E-03
0.092
0.384734408
16.8
1083
5.1816
204
2.040E-0
2.69
2.690E-03
0.22
0.920017062
23.4
660
4.3180
140-170
1.700E-01
2.9
2.900E-03
0.181
0.756923128
8.6-9.6
660
3.5560
140
1.400E-01
10.22
1.022E-02
0.0599
0.250495555
5.3
2600
10.01
1.001E-02
19.6
780
780
29.8
310
314
371
Liquid
(C)
0.9378
37
3.700E-02
10.96
1.096E-02
0.9100
35.82677165
3.583E-02
8.52
8.520E-03
0.0358
0.149711867
25.2
174
185
0.9100
50
3.593E-02
8.52
8.520E-03
0.0358
0.150
25
185
185
7.25
7.250E-03
31.1
232
240
8.37
8.370E-03
0.105
0.439099052
4.9
1450
17.6
1.7610E-02
0.031564632
0.132
4.5
28
0.3556
14
1.400E-02
0.1500
5.905511811
5.906E-03
0.1000
3.937007874
3.937E-03
3.2800
129.1338583
1.291E-01
C H I P
M A N U F A C T U R I N G / D E S I G N
T O O L S
Powerex Custom Power Modules employ performance
proven features. Soldered-down and wire bonding
fabrication and compression bonded encapsulation
(CBE) of SCR/Diode elements offer increased
switching speeds, lower losses, more efficient cooling
and higher power handling capabilities.
●
●
●
Thermal, Mechanical and Electro-Static Simulation
using Algor Software – both Static and Dynamic
Simulation
Two Dimensional and Three Dimensional CAD
Mechanical Desktop Tools
Thermal Mechanical and Electro-Static Simulation
Vacuum Soldering
Wire Bonding
Two Dimensional and Three Dimensional CAD
R E L I A B I L I T Y /
Q U A L I F I C A T I O N
T E S T I N G
Complete facility for Military and
other high reliability testing.
Reliability and qualification testing
can be performed in accordance to
military specifications, including
Group A, B and C and specific
customer requirements.
Highly Accelerated Stress Testing (H.A.S.T.) is also a part of the
Powerex custom module design process.
Baseplate Flatness Verification
The alliance between Powerex and its
strategic partners continues the
advancement of new classes of power
semiconductor technology. Powerex’s
commitment to the discovery process is
on-going and results in power
semiconductor innovation that embraces
customer system issues for decreased size,
reduced costs, increased energy efficiency,
switches that operate at higher frequencies,
are more durable and offer integrated
functions.
Anticipating future industry demands
and proactive involvement with each
customer results in the continued expansion
of manufacturing facilities, research
commitment and product development
to meet customer power semiconductor
needs for shortened product to market cycles.
Powerex is a leading producer to OEM’s
and component producers and supports
many markets including: transportation,
AC and DC motor controls, UPS,
welding, industrial heating, electrical
vehicles, aircraft, and communications.
Global
Power-Semiconductor
Call the Power Line at
1-800-451-1415
®
200 E. Hillis Street, Youngwood, PA 15697-1800
FAX 724-925-4393
www.pwrx.com
Lit. Code #135-5K-4/05
Solution
Provider
Similar pages