ROHM BD63960EFV

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STRUCTURE
Silicon monolithic integrated circuits
PRODUCT SERIES
Bipolar stepping motor driver
TYPE
BD63960EFV
FUNCTION
・PWM constant current controllable two H bridge driver
・Forward, Reverse, Brake mode
・Parallel IN control
○Absolute maximum ratings(Ta=25℃)
Item
Supply voltage
Symbol
VCC1,2
Limit
Unit
-0.2~+36.0
V
1
W
1.1※
Power dissipation
Pd
4.0※2
W
Input voltage for control pin
VIN
-0.2~+5.5
V
RNF maximum voltage
VRNF
0.5
V
3
Maximum output current
IOUT
1.5※
A/phase
Operating temperature range
Topr
-25~+85
℃
Storage temperature range
Tstg
-55~+150
℃
Junction temperature
Tjmax
+150
℃
※1
70mm×70mm×1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃.
※2
4-layer recommended board. Derating in done at 32.0mW/℃ for operating above Ta=25℃.
※3
Do not, however exceed Pd, ASO and Tjmax=150℃.
○Recommended operating conditions (Ta=-25~+85℃)
Item
Symbol
Min.
Supply voltage
VCC1,2
19
Output current
IOUT
※4
Do not, however exceed Pd, ASO.
Typ.
24
1.0
This product isn’t designed for protection against radioactive rays.
REV. A
Max.
28
1.2※4
Unit
V
A/phase
2/4
○Electrical characteristics (Unless otherwise specified Ta=25℃, VCC1,2=24V)
Item
Min.
Limit
Typ.
Max.
-
0.6
2.7
2.0
7.0
mA
mA
2.0
-
-
0.8
V
V
RON
-
1.1
1.4
Ω
ILEAK
-
-
10
μA
IRNF
IVREF
VREF
VCOF
tONMIN
-40
-2.0
0
-20
0.3
-20
-0.1
0
0.7
0.4
20
1.2
μA
μA
V
mV
μs
Symbol
Whole
Circuit current at standby
ICCST
Circuit current
ICC
Control input (IN1A, IN1B, IN2A, IN2B, PS)
H level input voltage
VINH
L level input voltage
VINL
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Output ON resistance
Output leak current
Current control
RNFX input current
VREFX input current
VREFX input voltage range
Comparator offset
Minimum on time
REV. A
Unit
Conditions
PS=L
PS=H, VREFX=0.4V
IOUT=1.0A,
Sum of upper and lower
RNFX=0V
VREFX=0V
VREFX=0.4V
R=39kΩ,C=1000pF
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○Package outline
Product No.
BD63960
Lot No.
HTSSOP-B24 (Unit: mm)
○Block diagram
○Pin No. / Pin name
IN1A 13
LOGIC
IN1B 11
CR1 9
VREF1 10
ONE
SHOT
16 OUT1A
Predriver
18 OUT1B
17 RNF1
OCP
Current
Limit
Comp.
22 VCC2
IN2A 24
LOGIC
IN2B 2
CR2 4
VREF2 3
ONE
SHOT
21 OUT2A
Predriver
19 OUT2B
20 RNF2
OCP
Current
Limit
Comp.
PGND 1
Regulator
PGND 14
TSD
GND 7
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
15 VCC1
OVLO
RESET
Pin name
PGND
IN2B
VREF2
CR2
NC
TEST
GND
PS
CR1
VREF1
IN1B
NC
6 TEST
NC : Non Connection
8 PS
UVLO
REV. A
Pin No.
13
14
15
16
17
18
19
20
21
22
23
24
Pin name
IN1A
PGND
VCC1
OUT1A
RNF1
OUT1B
OUT2B
RNF2
OUT2A
VCC2
NC
IN2A
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○Operation Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating
conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a
short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings,
consider adding circuit protection devices, such as fuses.
(2) Power supply lines
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no
problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor
to decide capacity value. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the
product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to
implement a physical safety measure such as the insertion of a voltage clamp diode between the power
supply and GND pins.
(3) GND potential
The potential of GND pin must be minimum potential in all operating conditions.
(4) Metal on the backside (Define the side where product markings are printed as front)
The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND.
Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than
GND.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed
to use after providing heat dissipation treatment to improve heat dissipation efficiency . Try to occupy as
wide as possible with heat dissipation pattern not only on the board surface but also the backside.
(6) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the
IC to malfunction.
(7) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(8) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃,
and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not
use the TSD function to protect peripheral equipment.
(9) Ground Wiring Pattern
When using both large current and small signal GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the ground potential of application so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal
ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
(10) Mounting errors and Inter-pin short
When attaching to a printed circuit board, pay attention to the direction of the IC and displacement.
Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short
circuits which can be caused by foreign matter entering between outputs or an output and the power supply
or GND.
(11) TEST pin
Be sure to connect TEST pin to GND.
REV. A
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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