AMD Opteron™ 3300 Series processor Real-World Performance. Real-World Value. Do the Math. Quick Reference Guide AMD Opteron™ 3300 Series processor Entry level, enterprise-class servers at desktop pricing – a single-socket, money-in-pocket server solution What’s New? Second generation of AMD’s modular core architecture – codenamed “Piledriver” 13% higher performance expected1 New 25W EE power band offering at 6.25W/core Product Specifications 1 Model Num ber Core Count 3380 8 3365 8 3350 HE 4 3320 EE 4 Base Frequency/ North Bridge 2.6 GHz/ 2.0 GHz 2.3 GHz/ 2.0 Ghz 2.8 GHz/ 2.0 GHz 1.9 GHz/ 1.4 GHz AMD Turbo AMD Turbo CORE CORE Frequency P1 Frequency P0 Pow er Band Max DDR3 speed L2 Cache L3 Cache 2.9 GHz 3.6 GHz 65W 1866 MHz 4 x 2M 8M 2.6 GHz 3.3 Ghz 65W 1866 MHz 4 x 2M 8M 3.1 GHz 3.8 GHz 45W 1866 MHz 2 x 2M 8M 2.1 GHz 2.5 GHz 25W 1333 MHz 2 x 2M 8M Estimate based on preliminary SPECint®_rate2006 results in AMD labs as of October 2012 comparing AMD Opteron™ processor Models 3380 and 3280. SVR-310. AMD Opteron™ 3300 Series Processor Specifications Total Cache: 16MB (8 core), 12MB (4 core) Cache Sizes AMD SP5100 Southbridge Product Specifications L2 Cache: up to 8MB total L3 Cache: up to 8MB total Processor Technology HyperTransport™ 32nm technology 1x HT3 at up to 5.2GT/s* per link Technology Links Memory Integrated DDR3 memory controller with up to 32 GB memory per socket Number of Channels/ Types of Memory Dual Channel DDR3 ECC UDIMM, SODIMM support; 1333, 1600, 1866* MHz memory speeds Die Size 315 mm2 Package AM3+ USB Ports 12 USB 2.0 + 2 USB 1.1 PCI Bus Support PCI rev 2.3 Serial ATA AHCI 1.1 SATA 3.0Gb/s with SW RAID Support SATA Ports 6 (can be independently disabled) Max TDP/Idle 4W/1W Process Technology TSMC .13um Package 528 ball FCBGA, 21x21mm, 0.8mm pitch * *1866MHz supported only with a single physical DIMM per memory channel in AMD Opteron processor models 3350 HE, 3365 and 3380. AMD SR5650, SR5670, SR5690 I/O Hub Product Specifications Model Num ber Processor Interface SR5650 HyperTransport™ 3.0 Technology (5.2 GT/s) SR5670 HyperTransport™ 3.0 Technology (5.2 GT/s) Num ber of PCI PCIe® Ports/ Virtualization Express® Engines Error Detection/ Isolation Hy perTransport error handling, PCIe® Adv anced Error Reporting, PCIe® endto-end Cy cle Redundancy Check Max TDP/Idle Process (w /c1e) Technology Package v2.0 22 lanes/ 8 engines AMD-Vi (IOMMU 1.26) TSMC 65nm 29 x 29 mm FCBGA v2.0 30 lanes/ 9 engines AMD-Vi (IOMMU Error Reporting, PCIe® end- 15.4W/5.75W TSMC 65nm 1.26) to-end Cy cle Redundancy 29 x 29 mm FCBGA 12.6W/5.4W Hy perTransport error handling, PCIe® Adv anced Check SR5690 HyperTransport™ 3.0 Technology (5.2 GT/s) v2.0 42 lanes/ 11 engines AMD-Vi (IOMMU 1.26) Hy perTransport error handling, PCIe® Adv anced Error Reporting, PCIe® endto-end Cy cle Redundancy Check 18W/6.15W TSMC 65nm 29 x 29 mm FCBGA ©2013 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, AMD Opteron, AMD Virtualization, AMD -V and combinations thereof are trademarks of Advanced Micro Devices, Inc. HyperTransport is a lic ensed trademark of the HyperTransport Technology Consortium. Other names are for reference only and may be the trademarks of their respective owners.