AMD embedded product selection guide

AMD EMBEDDED SOLUTIONS:
Product Selection Guide
AMD Embedded: The Next Generation of Embedded Computing
AMD helps deliver the right balance of CPU, GPU and chipset
capabilities, to give designers the solutions they need to create the
next generation of embedded applications. Along with a broad range
of varied solutions, AMD supports the x86 embedded marketplace
with design tools and technology partnerships that offer simplicity
and flexibility to help create high-performance, feature-rich, and
customer-driven products. AMD has long been a leader in innovation
with its continued focus on improving both x86 processor and
graphics processor designs. AMD’s embedded products offer
designers a balanced foundation for overall system performance
with the quick time-to-market typically offered by commercial
off-the-shelf components. AMD embedded solutions give designers
ample flexibility to design scalable, x86-based, cost-efficient and
feature-rich products, and help drive energy conservation into their
systems without compromising application performance or
compatibility, graphics performance or features. AMD technologybased products are leading edge from enterprise-class servers and
consumer systems to traditional embedded markets.
This brochure presents the full array of AMD’s embedded solutions
that help deliver maximum performance with low overall system
power consumption and are supported by longer than standard
availability1, a full library of x86 software development applications,
and hardware tools. It’s time to design and produce the nextgeneration embedded systems your customers demand — quickly,
easily, and efficiently.
AMD’s unique processor designs help deliver high performance
and balanced system design.
AMD’s range of embedded solutions provides flexible features
and a balanced performance approach for the overall system.
FEATURES INCLUDE
> Integrated low power processor and GPU2
> Industry-leading performance-per-watt
> Native eight-core processor design provides highly scalable
performance gains within a consistent thermal envelope
> Lead-free, four-layer processes with maximum on-board space
> Efficient heat dissipation reduces or eliminates the need
for heat sinks and reduces ambient cooling requirements
> Range of available packaging and pin counts meets
variety of design requirements
Along with these and other technical features, embedded designers
can enjoy long-term component availability, comprehensive design
support, and AMD’s commitment to continue offering new, customeroriented products.
Tools and support for developers
AMD offers:
> A full range of RDK (Reference Design Kit) products designed to
enable designers to go from concept to finished product quickly
> A broad array of development boards for creating efficient x86
system designs
> Industry collaborations with leading software and hardware
specialists, fostering maximum choice for your unique design
Get to market faster with superior products
Ready to create high-performance, low-power embedded designs
that give your innovative new products an edge in the marketplace?
Experience the AMD advantage.
Note 1: Most models support a planned 5 year availability from Product Release. See AES Product Roadmap: Backup - Product Longevity & Features
document for last time buy schedules on specific products.
Note 2: On some models
The AMD Fusion Family of Accelerated Processing Units (APU)
AMD Fusion is a new approach to processor design and software
development, delivering powerful CPU and GPU capabilities for HD,
3D and data-intensive workloads in a single-die processor called an
APU. APUs combine high-performance serial and parallel processing
cores with other special-purpose hardware accelerators, enabling
breakthroughs in visual computing, security, performance-per-watt
and device form factor. The first introduction of this technology for
embedded applications is the new AMD Embedded G-Series Family
of APUs, targeted at delivering the ideal combination of price, power
and performance for applications such as integrated digital signage,
x86 set-top-box (xSTB), IP-TV, Thin Client, Point-of-Sale,
Infotainment, and Casino Gaming markets.
The AMD64 embedded family: leading-edge technology
for high-end embedded systems
AMD64 embedded solutions are each uniquely matched to a
defined set of product applications. These solutions include
high-performance dual-, quad-, six- and eight-core AMD Opteron™
processors and dual-core AMD Turion™ II Neo processors with
Direct Connect Architecture for enterprise-class telecom, networking
and storage equipment. The ASB1 (BGA) family of processors are
designed with unique computing features and a thin, compact form
factor to help enable new and uncompromising designs. The ASB2
processors are the second generation BGA platform, featuring the
AMD Turion™ II Neo dual-core processors coupled with the AMD
785E chipset, are designed to deliver exceptional performance while
maintaining low average solution power draw with greater levels of
performance and power efficiency over the previous generation
ASB1 (BGA) processor family.
The AMD64 solutions are each uniquely equipped to provide the
processing needs for a large number of target markets. These
solutions enable unique high-performance, smaller form factor
products, with maximum versatility, and minimum design challenge.
AMD Geode™ LX processors: optimized for low-power,
high-performance applications
AMD Geode™ LX processors are configured to deliver developers a
versatile and flexible suite of x86 solutions that enable fast design
cycles and short time-to-market roadmaps. Ideal for applications
ranging from thin-client and set-top boxes to point-of-sale devices
and kiosks. AMD has also introduced technology that allows the
AMD Geode LX family to use DDR2 memory modules in an existing
design. With a minor change in the memory voltage and an updated
BIOS, a current AMD Geode LX processor based design can use a
DDR2 memory module from AStint which helps ensure memory
longevity and results in system level power efficiency. In addition to
processors, the family includes a broad range of design tools
including Development Boards (DBs) and Reference Design Kits
(RDKs) to empower designers to make maximum use of the
established world of x86 software applications.
The AMD Radeon™ embedded graphics family: game-changing
graphics for embedded systems.
AMD Radeon™ graphics for embedded applications are designed to
deliver exciting, desktop-level visual experiences to embedded
systems. Built with advanced 3D graphics engines supporting
Microsoft® DirectX® and OpenGL graphics APIs, AMD graphics
solutions enable market-leading, rich, immersive images.
Outstanding multimedia capabilities are supported by an integrated
multi-standard video decoder delivering enhanced video quality from
MPEG-2, H.264 or VC-1 video streams. The ultimate in display
flexibility is provided by dual display controllers driving high-resolution
displays through VGA, DVI, DisplayPort or HDMI interfaces. AMD
graphics solutions are designed to perform, engineered to lead and
built to win. With a product portfolio including AMD chipsets, discrete
graphics processors, MXM modules and PC add-in boards, AMD
provides system designers with exciting and innovative graphics
solutions for their embedded systems.
AMD Embedded Solutions
Eight-Core AMD Opteron™ 6100 Series Processor - Socket G34
Model
OPN
Multi-CPU Scalability
Core Frequency
Cache
TDP
Memory Interface
HyperTransport™ Interface
Product Release
61KS
OE61KSWKT8EGO
up to 4
2.0GHz
L2 512KB x6; L3 12MB
115W1
DDR3-1333 4-ch Registered
ECC & Chipkill
Four 16-lane @ up to 3.2GHz
Full Duplex
Q1-10
61QS
OE61KSWKT8EGO
up to 4
2.3GHz
L2 512KB x6; L3 12MB
115W1
DDR3-1333 4-ch Registered
ECC & Chipkill
Four 16-lane @ up to 3.2GHz
Full Duplex
Q1-10
Note 1. Temperature is server part.
Six-Core and Four-Core AMD Opteron™ 4100 Series Processors - Socket C32
Model
OPN
Multi-CPU Scalability
Core Frequency
Cache
TDP
Memory Interface
HyperTransport™ Interface
Product Release
41KX HE
OE41KXOHU6DGOE
6 cores up to 2 sockets
2.2GHz
L2 512K x6; L3 6MB
65W
DDR3-1333 2-ch Registered ECC & Chipkill
Two [email protected]
Full Duplex
Q3-10
41QS HE
OE41QSOHU4DGOE
4 cores up to 2 sockets
2.5GHz
L2 512K x4; L3 6MB
65W
DDR3-1333 2-ch Registered ECC & Chipkill
Two [email protected]
Full Duplex
Q3-10
41LE HE
OE41LEOHU4DGOE
4 cores up to 2 sockets
2.3GHz
L2 512K x4; L3 6MB
65W
DDR3-1333 2-ch Registered ECC & Chipkill
Two [email protected]
Full Duplex
Q3-10
41GL EE
OE41GLHKU6DGOE
6 cores up to 2 sockets
1.8GHz
L2 512K x6; L3 6MB
40W
DDR3-1333 2-ch Registered ECC & Chipkill
Two [email protected]
Full Duplex
Q3-10
Six-Core AMD Opteron™ Processors - Socket F (1207)A
Model
OPN
Multi-CPU Scalability
Core Frequency
Cache
TDP
Memory Interface
HyperTransport™ Interface
Product Release
84QS
OE84QSWJS6DGNE
up to 8
2.4GHz
L2 512KB x6; L3 6MB
115W1
DDR2-800 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
Q1-10
84KS
OE84QSWJS6DGNE
up to 8
2.0GHz
L2 512KB x6; L3 6MB
79W1
DDR2-800 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
Q1-10
24QS
OE24QSWJS6DGNE
up to 2
2.4GHz
L2 512KB x6; L3 6MB
115W1
DDR2-800 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
Q1-10
24KS
OE24QSWJS6DGNE
up to 2
2.0GHz
L2 512KB x6; L3 6MB
79W1
DDR2-800 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
Q1-10
Note 1. Temperature is server part.
Quad-Core AMD Opteron™ Processors - Socket F (1207)A
Model
OPN
Multi-CPU Scalability
Core Frequency
Cache
Peak Power
(worst case) TDP
Memory Interface
HyperTransport™ Technology
Product Release
83VS
OE83VSWHP4DGIE
Up to 8
2.8GHz
L2: 512KB x4
115W
DDR2-800 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
Q3-09
71W
DDR2-800 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
Q3-09
L3: 6MB
83QS HE
OE83QSMAP4DGIE
Up to 8
2.4GHz
23VS
OE23VSWHP4DGIE
Up to 2
2.8GHz
115W
DDR2-800 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
Q3-09
23QS HE
OE23QSMAP4DGIE
Up to 2
2.4GHz
71W
DDR2-800 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
Q3-09
23KS EE
OE23KSFLP4DGIE
Up to 2
2.0GHz
50W
DDR2-800 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
Q3-09
13QS HE
OE13QSMAP4DGIE
Up to 1
2.4GHz
71W
DDR2-800 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
Q3-09
13KS EE
OE13KSFLP4DGIE
Up to 1
2.0GHz
50W
DDR2-800 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
Q3-09
Dual-Core AMD Opteron™ Processors - Socket F (1207)A
Model
OPN
Multi-CPU
Scalability
Core Frequency
L2 Cache/Core
Thermal Design Power
Memory Interface
HyperTransport™
Technology
Tcase
Product Release
8214 HE
OSP8214GAU6CYE
up to 8
2.2GHz
1MB x2
68W
DDR2-667, 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
83ºC
Q4-06
8210 EE
OSH8210GAS6CYE
up to 8
1.8GHz
1MB x2
45W
DDR2-667, 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
80ºC
Q4-06
2214 HE
OSP2214GAU6CXE
up to 2
2.2GHz
1MB x2
68W
DDR2-667, 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
83ºC
Q4-06
2210 EE
OSH2210GAS6CXE
up to 2
1.8GHz
1MB x2
45W
DDR2-667, 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
80ºC
Q4-06
2208 HE
OSP2208GAA5CXE
up to 2
1.8GHz
512KB x2
68W
DDR2-667, 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
76ºC
Q4-06
1214 HE
OSP1214GAU6DGE
1
2.2GHz
1MB x2
68W
DDR2-667, 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
83ºC
Q4-06
1210 EE
OSH1210GAS6DGE
1
1.8GHz
1MB x2
45W
DDR2-667, 2-ch Registered
ECC & Chipkill
Three [email protected]
Full Duplex
80ºC
Q4-06
Note A: AMD Opteron processors in Socket F (1207) type is packaged in Lidded 1207 pad LGA package.
All AMD Opteron processors in socket F (1207) generation support DDMP, AMD CoolCoreTM technology, enhanced PowerNow!TM technology, AMD wide floating point accelerator, AMD memory optimizer technology, AMD balanced smart cache, AND-V
with Rapid Virtualization Indexing, EVP and OPMA support.
AMD Embedded Solutions, cont.
AMD G-Series Accelerated Processing Units
Model
OPN
Package
CPU
Cores
L2
Cache
/Core
Memory
Interface
CPU Core
Frequency
Discrete Class
Graphics
GPU Core
Frequency
Graphics
Hardware
Video
Acceleration12
Display
Outputs13
T56N
GET56NGBB22GTE
2
512KB
DDR3-1066,
Unbuffered
1.6GHz
AMD Radeon™
HD 6310
500MHz
UVD 3 for H.264,
VC-1 and MPEG2
with Blu-ray
support
T48N
GET48NGBB22GTE
2
512KB
DDR3-1066,
Unbuffered
1.4GHz
AMD Radeon™
HD 6310
500MHz
UVD 3 for H.264,
VC-1 and MPEG2
with Blu-ray
support
Dual independent
display controllers
DDR3-1066,
Unbuffered15
1.0GHz
AMD Radeon™
HD 6250
280MHz
UVD 3 for H.264,
VC-1 and MPEG2
1x VGA
DirectX® 11
T40N
GET40NFPB22GTE
19mm
FCBGA
2
512KB
Shader Model 5
Open CL™ 1.1
T52R
GET52RGBB12GTE
1
512KB
DDR3-1066,
Unbuffered
1.5GHz
AMD Radeon™
HD 6310
500MHz
T44R
GET44RFPB12GTE
1
512KB
DDR3-1066,
Unbuffered15
1.2GHz
AMD Radeon™
HD 6250
280MHz
OpenGL 3.2, 2.1
2 active outputs
from:
1x single-link LVDS
UVD 3 for H.264,
VC-1 and MPEG2
with Blu-ray
support
VGA: 2560x1600 (HD
6310) or 1920x1200
(HD 6250) 30 bpp
Single-link DVI:
1920x1200 24 bpp
2x single-link DVI
2x DisplayPort v1.1a
1x HDMI
1x DVO
UVD 3 for H.264,
VC-1 and MPEG2
Thermal
Design
Power
Display
Resolutions
HDMI™: 1920x1080p
36 bpp Single-link
LVDS14: 1400x1050
18 bpp
DisplayPort v1.1a:
2560x1600 (HD 6310)
or 1920x1200 (HD
6250) @ 30 bpp
Tcase
Product
Release
18W
90°C
Q1-11
18W
90°C
Q1-11
9W
90°C
Q1-11
18W
90°C
Q1-11
9W
90°C
Q1-11
AMD G-Series Platform Controller Hubs
Model
OPN
CPU
Interface
Package
PCI
Express
PCI
SATA
FISBased
Switching
Ethernet
MAC
EEE
USB
HD Audio
LPC
SPI
SMBus
Max
GPIOs
APU Fan
Control
APU
Clock
Gen
Power16
A50M
100-CG2198
1X4 Gen 1
23mm
FCBGA
4x1 Gen 2
No
6x 6Gb/s
No
No
No
14 v2.0
2 v1.1
Up to 4-channels
Yes
102
Yes
Yes
2.7W5.9W
A55E
100-CG2188 1X4 Gen 2
23mm
FCBGA
4x1 Gen 2
33MHz
4 Slots
6x 6Gb/s
with RAID
0,1,5,10
Yes
Yes
Yes
14 v2.0
2 v1.1
Up to 4-channels
Yes
102
Yes
Yes
2.7W5.9W
12: Refer to the Brazos Platform Minimum System Recommendations for HD Video Playback, order# 48826 to view the minimum system
configurations required to enable HD playback and the maximum resolution supported for each advanced video quality feature.
13: Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth.
14: eDP translator option supporting 2048x1536 (HD 6310) or 1920x1200 (HD 6250) at 18 or 24 bpp.
15: Low voltage (1.35V) DDR3 is assumed for the 9W TDP processors. The use of 1.5V DDR3 will incur a power adder.
16: Configuration dependant. See product databook for configurations.
AMD Embedded Solutions, cont.
Socket AM3/AM21
Model
OPN
Number of Cores
Core Frequency
Cache
Thermal Design Power3
Memory Interface
HyperTransport™ Interface
Package
Product Release
AMD Phenom II XLT Q54L
HEQ54LOEK4DGME
4
2.2/0.8GHz2
L2 512K x4; L3
6MB
65/36.5W2
DDR3-1333, 2-ch
Unbuffered ECC
One [email protected]
Full Duplex
AM3
Q2-10
AMD AthlonTM II XL - V66C
AEV66CHDK23GME
2
2.8GHz
1MB x2
45W
DDR3-1333, 2-ch
Unbuffered ECC
One [email protected]
Full Duplex
AM3
Q2-10
AMD AthlonTM II XLT - V64L
AEV64LHFK23GME
2
2.7GHz
1MB x2
45W
DDR3-1066, 2-ch
Unbuffered ECC
One [email protected]
Full Duplex
AM3
Q2-10
AMD AthlonTM II XLT - V50L
AEV50LSCK23GME
2
2.2/0.8GHz2
1MB x2
25/13.8W2
DDR3-1066, 2-ch
Unbuffered ECC
One [email protected]
Full Duplex
AM3
Q2-10
AMD AthlonTM X2 4200+
ADD4200IAA5DOE
2
2.2GHz
512KB x2
35W
DDR2-800, 2-ch
nbuffered ECC
One [email protected] Full
Duplex
AM2
Q2-08
AMD AthlonTM X2 3600+
ADD3600IAA5DOE
2
1.9GHz
512KB x2
35W
DDR2-800, 2-ch
Unbuffered ECC
One [email protected] Full
Duplex
AM2
Q2-08
AMD AthlonTM X2 3400e
ADJ3400IAA5DOE
2
1.8/1.0GHz
512KB x2
22/10.8W
DDR2-800, 2-ch
Unbuffered ECC
One [email protected] Full
Duplex
AM2
Q2-08
AMD Athlon 3100+
ADS3100IAR4DRE
1
2.0GHz
512KB
25W
DDR2-667, 2-ch
Unbuffered ECC
One [email protected] Full
Duplex
AM2
Q4-07
AMD Athlon 2600+
ADG2600IAV4DRE
1
1.6GHz
512KB
15W
DDR2-667, 2-ch
Unbuffered ECC
One [email protected] Full
Duplex
AM2
Q4-07
AMD AthlonTM 2000+
ADF2000IAV4DRE
1
1.0GHz
512KB
8W
DDR2-667, 2-ch
Unbuffered ECC
One [email protected] Full
Duplex
AM2
Q4-07
TM
TM
Note 1. Note 2.
Note 3.
2
2
Socket AM3 processors can operate in Socket AM2 board designs with DDR2 memory. Socket AM2 processors cannot operate in Socket AM3 board designs with DDR3 memory.
While operating at the max/min P-States which can be dynamic or fixed through BIOS.
TDP specified in dual-plane platform.
Socket S1
Model
OPN
Number of
Cores
Core Frequency
L2 Cache/Core
Thermal Design Power
Memory Interface
HyperTransport™ Technology
Tcase
Product Release
AMD TurionTM 64 X2 TL-62
TMDTL62HAX5DME
2
2.1GHz
512KB x2
35W
DDR2-800, 2-ch
Unbuffered
One [email protected] Full
Duplex
95ºC
Q4-07
AMD TurionTM 64 X2 TL-56
TMDTL56HAX5DME
2
1.8/0.8GHz1
512KB x2
31/9.4W1
DDR2-800, 2-ch
Unbuffered
One [email protected] Full
Duplex
95ºC
Q4-07
AMD Sempron 3700+
SMS3700HAX4DQE
1
2.0GHz
512KB
25W
DDR2-800, 2-ch
Unbuffered
One [email protected] Full
Duplex
95ºC
Q4-07
AMD Sempron 2100+
SMF2100HAX3DQE
1
1.0GHz
256KB
8W
DDR2-800, 2-ch
Unbuffered
One [email protected] Full
Duplex
95ºC
Q4-07
Note 1. While operating at the max/min P-States which can be dynamic or fixed through BIOS.
ASB2 BGA
Model
OPN
Number of
Cores
Core Frequency
L2 Cache/Core
Thermal Design Power
Memory Interface
HyperTransport™ Technology
Tcase
Product Release
AMD TurionTM II Neo - N54L
TEN54LSDV23GME
2
2.2GHz
1MB x2
25W
DDR3-800, 2-ch
Unbuffered ECC
One [email protected]
Full Duplex
95ºC
Q2-10
AMD TurionTM II Neo - N40L
TEN40LGAV23GME
2
1.5GHz
1MB x2
15W
DDR3-800, 2-ch
Unbuffered ECC
One [email protected]
Full Duplex
95ºC
Q2-10
AMD AthlonTM II Neo - N36L
AEN36LLAV23GME
2
1.3/0.8GHz1
1MB x2
12/8W1
DDR3-800, 2-ch
Unbuffered ECC
One [email protected]
Full Duplex
95ºC
Q2-10
AMD AthlonTM II Neo - R44L
AER44LLAV13GME
1
1.7GHz
1MB
12W
DDR3-800, 2-ch
Unbuffered ECC
One [email protected]
Full Duplex
95ºC
Q2-10
AMD AthlonTM II Neo - R34L
AER34LFCV13GME
1
1.0GHz
1MB
8W
DDR3-800, 2-ch
Unbuffered ECC
One [email protected]
Full Duplex
95ºC
Q2-10
Note 1. While operating at the max/min P-States which can be dynamic or fixed through BIOS.
ASB1 BGA
Model
OPN
Number of
Cores
Core Frequency
L2 Cache/Core
Thermal Design Power
Memory Interface
HyperTransport™ Technology
Tcase
Product Release
AMD TurionTM Neo X2 L625
TMZL625OAX5DYE
2
1.6/0.8GHz1
512KB x2
18/10.1W1
DDR2-667, 2-ch
Unbuffered ECC
One [email protected]
Full Duplex
95ºC
Q3-09
AMD TurionTM Neo X2 L325
AMZL325OAX5DYE
2
1.5GHz1
512KB x2
18W1
DDR2-667, 2-ch
Unbuffered ECC
One [email protected]
Full Duplex
95ºC
Q3-09
AMD SempronTM 210U
SMG210UOAX3DVE
1
1.5GHz
256KB
15W
DDR2-400, Unbuffered
One [email protected]
Full Duplex
95ºC
Q4-08
AMD SempronTM 208U
SML208UOAX3DVE
1
1.4GHz
256KB
12W
DDR2-400, Unbuffered
One [email protected]
Full Duplex
95ºC
Q4-08
AMD SempronTM 200U
SMF200UOAX3DVE
1
1.0GHz
256KB
8W
DDR2-400, Unbuffered
One [email protected]
Full Duplex
95ºC
Q4-08
Note 1. While operating at the max/min P-States which can be dynamic or fixed through BIOS.
AMD Embedded Solutions, cont.
AMD Embedded Discrete Graphics
Model
Process
ATI RadeonTM
E2400 Discreet
GPU
Package
GPU +
memory
TDP
# Shaders
Interface
13W2
Memory
Engine/
Memory
Clock (MHz)
OS
Compute
MXM 2.1a
Type II
module
65 nm
64-bit wide
256 MB
GDDR3
2 active outputs from: 2x VGA,
1x Comp/YC/YPbPr, 2x single-link DVI,
1x dual-link DVI, 1x single / dual-link
LVDS, 1x HDMI™, 1x DVO
73 x 78 mm
40
PCIe® 1.1
(x1, x2, x4,
x8, x16)
Avivo™ Display System
600/700
Windows®
XP/ XPe/
Vista®/7
Linux®
Single Precision
FP Performance:
48 GFLOPS
(x86 32/64)
ATI RadeonTM
E2400 PCIe®
Add-in Board
PCIe® Addin Board
18W4
Shader Model
3.0
64-bit wide
128 MB
GDDR3
16 x 11 cm
Unified Video
Decoder (UVD) for
H.264, VC-1
DirectX® 10
Product
Release
Q1-08
Dual independent display controllers
Open GL® 2.0
18W3
Display
Resolutions
Avivo™ Display System
3D Mark 05
4061 @ 13W
ATI RadeonTM
E2400 MXM-II
Module
Display
Outputs
Video
DirectX® 10
Shader Model
3.0
64-bit wide
128 MB
GDDR3
31 x 31 mm
BGA
Graphics
MPEG 1/2/4
decode & encode
acceleration
Dual independent display controllers
Available on MXM 2.1a connector
2 active outputs from: 2x VGA,
1x Comp/YC/YPbPr, 2x single-link DVI
1x dual-link DVI, 1x single / dual-link
LVDS, 1x HDMI™
1x DVO on header
Avivo™ Display System
Open GL 2.0
®
VGA: 400 MHz pixel clk
Comp/YC: NTSC, PAL
YPbPr: 480i/p, 576i/p,
720p, 1080i
Single-link DVI:
1600x1200 60 Hz 24 bpp
Q2-08
Dual-link DVI:
2048x1536 60 Hz 24 bpp
Single-link LVDS:
1280x1024 60 Hz 24 bpp
Dual-link LVDS:
2048x1536 60 Hz 24 bpp
Dual independent display controllers
HDMI™: 1920x1080i
60 Hz 24 bpp
Available on dual DVI-I connectors
DVO: 220 MHz pixel clk
Q2-10
2 active outputs from: 2x VGA,
2x single-link DVI, 1x dual-link DVI,
1x HDMI™
ATI RadeonTM
E4690 Discreet
GPU
GPU +
memory
25W6
DirectX® 10.1
Shader Model
4.0
35 x 35 mm
BGA
55 nm
ATI RadeonTM
E4690 PCIe®
Add-in Board
MXM 3.0
Type A
module
32W7
320
70 x 82 mm
PCIe® Addin Board
Dual independent display controllers
Open GL 3.0
3D Mark 06
6686 @ 25W
ATI RadeonTM
E4690 MXM
Avivo™ Display System
PCIe® 2.0
(x1, x2, x4,
x8, x16)
128-bit
wide
512 MB
GDDR3
Single Precision
FP Performance:
384 GFLOPS
600/700
Windows®
XP/
XPe/
Vista®/7
DirectX® 10.1
Shader Model
4.0
Open GL 3.0
2nd Generation
Unified Video
Decoder (UVD2)
for H.264, VC-1,
MPEG2 decode
SD & HD HQV™
processing
Blu-Ray
Linux®
32W8
Avivo™ Display System
Dual independent display controllers
Available on MXM
3.0 connector
2 active outputs from: 2x VGA,
4x single-link DVI, 2x dual-link DVI,
1x single / dual-link LVDS, 4x
DisplayPort v1.1a, 1x HDMI™
Avivo™ Display System
(x86 32/64
18 x 11 cm
2 active outputs from: 2x VGA,
1x Comp/YC/YPbPr, 5x single-link DVI
3x dual-link DVI, 1x single / dual-link
LVDS, 5x DisplayPort v1.1a, 1x
HDMI™, 1x DVO
Dual independent display controllers
Available on dual DVI-I connectors
2 active outputs from: 2x single / duallink DVI, 1x HDMI™, 2x VGA
ATI RadeonTM
HD 5770
Graphics Board
40 nm
PC Add-in
Board
23.5 x 11.2
cm
108W10
800
PCIe® 2.1
(x1, x2, x4,
x8, x16)
128-bit
wide
1 GB
GDDR5
850/4.8Gbps
ATI Stream
Technology
OpenCL™ 1.1
DirectCompute 11
Single Precision
FP Performance:
1.36 TFLOPS
DirectX® 11
Shader Model
5.0
Open GL® 3.2
OpenCL™ 1.0
3D Mark
Vantage (P)
10141 @ 108W
2nd Generation
Unified Video
Decoder (UVD2)
for H.264, VC-1,
MPEG4, MPEG2
decode
Dual HD 1080p
decode
VGA: 400 MHz pixel clk
YPbPr: 480i/p, 576i/p, 720p,
1080i/p
Single-link DVI: 1600x1200
60 Hz 24 bpp
Dual-link DVI: 2048x1536
60 Hz 24 bpp
Q1-10
Single-link LVDS: 1280x1024
60 Hz 24 bpp
Dual-link LVDS: 2048x1536
60 Hz 24 bpp
DisplayPort v1.1a:
2560x1600
60 Hz 24 bpp
HDMI™: 1920x1080p
60 Hz 24 bpp
Q1-10
DVO: 220 MHz pixel clk
ATI Eyefinity
VGA: 2048x1536
Avivo™ Display System
Dual-link DVI: 2560x1600
Three independent display controllers
DisplayPort v1.1a:
2560x1600
3 active outputs from: 2x dual-link DVI,
1x DisplayPort v1.1a, 1x HDMI™ 1.3
Q2-09
Comp/YC: NTSC, PAL
Q2-10
HDMI™ 1.3: 1920x1200p
HQV Benchmark 2.0
score 175
1: Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth.
2: System configuration: 3DMark05, 1280x1024, ASUS MB - ASUS 790 M3A32 – MVP Deluxe, CPU – Quad-Core AMD Phenom™ processor, 4x 2.3GHz, Memory – 4x 512MB DDR2-800, Windows® XP (8.61).
3: System configuration: 3DMark03, 1600x1200, 32bpp, 60Hz. For additional information see ATI Radeon™ E2400 MXM-II Module Specification.
4: System configuration: Estimate same as MXM 2.1a Type II module.
5: Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth.
6: System configuration: 3DMark06, 1280x1024, ASUS M4A79T DeLuxe Motherboard, CPU - Quad-Core AMD Phenom™ processor , 4x 2.3GHz, Memory – 2x 2GB Corsair DDR310200 , Windows® XP SP3.
7: System configuration: 3DMark01, 1600x1200, 32bpp, 60 Hz. For additional information see ATI Radeon™ E4690 MXM 3.0 Module Specification.
8: Estimate same as MXM 3.0 Type A module.
9: Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth.
10: System configuration: 3DMark Vantage (P), CPU: AMD Phenom™ II 965 (3.4GHz), Motherboard: Asus M3A79-T(790)/ ASUS M3N-HT DLX (780a), Memory: 4GB DDR2-800 5-5-5-18, OS: Windows 7 RTM 64bit, GPU: 1G GDDR5, 850e/1200m,
8.732RC1-100504a-099648E-ATI.
11: See www.KITGURU.net
AMD Embedded Solutions, cont.
AMD Embedded Chipsets
Model
Devices
CPU Interface
Package
AMD
M69OT
M690T/
SB600
1GHz
HyperTransportTM
21mm
FCBGA/
23mm
FCBGA
AMD
M69OE
M690E/
SB600
1GHz
HyperTransportTM
AMD
780E
780E/
SB710
AMD
785E
AMD
SR5690,
SR5670,
SR5650
PCI
®
Express
ATI Hybrid
™
CrossFireX
DVI/
HDMI
Display
Port
DirectX
9.0
WMV9
®
No
1@
1080i2
DirectX
9.0
WMV9
®
No
®
®
LPC
SPI
SMBus
Max
GPIOs
Display:
Max
1
Resol.
HD
Audio,
AC97
v2.3
Yes
73
2048 x 1536
10
v2.0
HD
Audio,
AC97
v2.3
Yes
73
2048 x 1536
No
12
v2.0,
2
v1.1
HD
Audio,
AC97
v2.3
Yes
73
2560 x 1600
6.4 13W
Yes5
14
v2.0,
2
v1.1
HD
Audio,
AC97
v2.3
Yes
73
2560 x 1600
SR5690:
18W
SR5670:
17W
SR5650:
13W
SP5100:
4W
No
12
v2.0,
2
v1.1
HD
Audio,
AC97
v2.3
Yes
73
N/A
LVDS
TV
DVO
SATA II
IDE
Power
Ethernet
MAC
No
24-bit
DualChannel
Yes
DVI &
LVDS
Transmitter
3
Support
4, RAID 0,
1, 10 meets
1.0a spec
ATA
133
8W
2@
1080i4
No
24-bit
DualChannel
No
DVI &
LVDS
Transmitter
3
Support
4, RAID 0,
1, 10 meets
1.0a spec
ATA
133
Yes
2@
1080P4
Yes
24-bit
DualChannel
No
No
6, RAID 0,
1, 10 meets
2.5 spec
DirectX
10.1
OpenGL
2.0, UVD
2.0
Yes
2@
1080P4
Yes
24-bit
DualChannel
No
No
N/A
N/A
N/A
N/A
N/A
N/A
N/A
PCI
Graphics
1x8, 4x1
Gen 1
v2.3
21mm
FCBGA/
23mm
FCBGA
1x8, 4x1
Gen 1
v2.3
2.6GHz
HyperTransportTM 3.0
21mm
FCBGA/
23mm
FCBGA
2x8 or
1x16, 6x1
Gen 2
v2.3
DirectX
10.0
OpenGL
2.0, UVD
2.0
785E/
SB8XX
2.6GHz
HyperTransportTM 3.0
21mm
FCBGA/
23mm
FCBGA
2x8 or
1x16,
6x1 Gen
2, 2x1
Gen 1
v2.3
SR56x0/
SP5100
HyperTransportTM 3.0
(5.2GT/s)
Backward
Compatible with
HT 1.0
29x29mm
FCBGA/
SP5100:
21x21mm
FCBGA
Gen 2
v1.0;
SR5690:
42 lanes/
11 engines
SR5670:
30 lanes/
9 engines
SR5650:
22 lanes/
8 engines
v2.3
USB
Audio
No
10
v2.0
8W
No
ATA
133
13W
6, RAID 0,
1, 55, 105,
6GBPS
No
6, RAID 0,
1, 10 meets
2.5 spec
ATA
133
Note 1. Capable display resolutions are influenced by the operating system driver, processor and memory selection.
Note 2. The PCI Express® x8 interface is multiplexed with a TMDS interface, enabling DVI or HDMI 1.2 with HDCP 1.1 support.
Note 3. The sideport memory interface of the M690T and M690E can be configured as a DVO to attach to an additional DVI, LVDS, or CRT transmitter.
Note 4. The LVDS interface of the M690E and 780E is multiplexed with a TMDS interface, enabling DVI or HDMI 1.2 (for the M690E) or HDMI 1.3b (for the 780E) with HDCP 1.1 support. This enables support for native dual DVI; however, only one HDMI interface may be enabled at a time.
Note 5.
Avalable on the SB850.
AMD Development Boards
1
ATX
•
1
RJ45
ATX
4,
3Gbps
ports
1
1
ATX
4
•
1
1
1
ATX
6
•
1
CD-ROM/Std. Documentation
1x16,
1x4
1
DVI/HDMI Adapter Board
12
IrDA
7.1
Parallel Port
•
PS/2 Keyboard/Mouse
1x164
1x1
Serial Ports
9
IDE UDMA
7.1
1
1
Serial ATA
•
1
Power
1 x1
1
Ethernet on Board
8
3
Super I/O on Board
2
•
LPC Slots or Headers
•
Mini-PCI
4
PCI Slots
2
PCI Express Mini Card
•
PCI Express® Slots
USB
•
Audio Out Channels
•
Linux
Display
Output
Windows® CE 6.0
Form
Factor
Windows® CE 5.0
Chipset
Typical Kit
Contents
I/O Connectors
Windows® XP/XPe
Processor
(* Denotes Processor
shipped in Kit)
Windows® Embedded Standard 2009
Name
Windows® 7 / Windows® Embedded
Standard 7
OS1
AMD GEODE™ SOLUTIONS BASED DEVELOPMENT BOARDS
LX DB800
AMD GeodeTM LX [email protected]
AMD
CS5536
Mini-ITX/ETX
CRT, TFT
•
A55E
Mini-ITX
VGA,
single-link
DVI-D
support
•
13
•
AMD64 BASED DEVELOPMENT BOARDS
AMD DB-FT1
Development
Board
G-Series T56N
(DBFT1-00-E1-EVAL-KT)
Or
•
•
1
4
•
G-Series T40N
(DBFT1-01-EVAL-KT
S1 DBM690T/E
Mobile AMD SempronTM 3500+*
and 2100+, AMD TurionTM 64
X2 TL-52,
AMD SempronTM 2100+
AMD M690T
or M690E,
SB600
ATX
CRT,
DVI/HDMI,
LVDS
•
•
AM2+ DB780E
AMD PhenomTM 9350e,
AMD AthlonTM X2 4200+ and 3400e,
AMD AthlonTM 3100+ and 2000+,
AMD AthlonTM II XLT,
AMD PhenomTM II XLT
AMD 780E,
SB710
ATX
CRT, DVI
•
•
•
•
3
1
•
1
Note 1. OS support typically includes BIOS and drivers for audio, display, and bootloader if required.
Note 2. The Geode LX [email protected] processor operates at 500MHz. Model numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodelxbenchmark. DDR2 versions available - please talk with your AMD representative
Note 3.The Geode LX DB800 has one 32-bit, 66/33MHz, 3.3V (non-5V tolerant) PCI slot. Additionally, a bridge card that offers two 32-bit, 66/33MHz, 3.3V (5V tolerant) slots is shipped with the development board. The bridge card occupies the one slot on the main board.
Note 4. The S1 DBM690T/E has one x16 PCI Express® slot that is supported by a 1x8 PCI Express interface.
1
1
•
•
AMD Embedded Solutions, cont.
AMD Geode™ Processors
Processor
Family
Device
Number
Chipset
Package/
Operating
Case Temp.
Core Freq.
(Perform.
Rating)
Core
Volt
Thermal
Design
Power
Power
Mgmt./
Rating
AMD
Geode™ LX
Processors
(Integrated
North Bridge/
Graphics)
LX900@
1.5W
AMD
CS5536
BGU481
0˚C to 80˚C
600MHz
(900)
1.4V
5.1W
ACPI v2.0
LX800@
0.9W
BGU481
0˚C to 85˚C
and -40˚C
to 85˚C2
500MHz
(800)
1.25V
3.6W
LX700@
0.8W
BGU481
0˚C to 85˚C
433MHz
(700)
1.2V
3.1W
DDR-333
LX600@
0.7W
BGU481
0˚C to 85˚C
366MHz
(600)
1.2V
2.8W
DDR-266
FPU
MMX ,
AMD
3DNow!™
Technology
™
Memory
Support
PCI
Ethernet
IDE
USB
LPC
Audio
DDR-400
v2.2
No
1 Ch.,
UDMA100
4
Ports,
v2.0
1
LDRQ
AC97
v2.3
UART/
IR
2/1
Serial/
Parallel
Interfaces
ACCESS.bus
w/2 Ports
RTC
Max.
GPI0s
1
32
DDR-400
Display:
Max Res.
Security
28-Bit AES
w/Optional
In-package
EEPROM
CRT:
1920x1440
TFT:
1600x1200
VIP/VOP =
1.1, 2.0
28-Bit AES
AMD Geode™ Solutions Based Reference Design Kits
5.0
•
LX Ultra Value Client
AMD GeodeTM LX [email protected]
AMD CS5536
5.5x5
CRT
•
•
•
1
4
LX EPIC Single Board
Computer
AMD GeodeTM LX [email protected] or
LX [email protected]
AMD CS5536
4.5x6.5
CRT/TFT/LVDS
•
5.0
•
2
4
LX Network Attached Storage
Processor
AMD GeodeTM LX [email protected] or
LX [email protected]
AMD CS5536
Mini-ITX
CRT for debug
only
•
4
•
1
Mini
PCI
1
SVDC thru
ETX conn.
1
12VDC
•
•
1
Mini-ITX
•
2
•
•
3
1
ATX
•
2
1
IrDA
•
Parallel Port
CRT/TFT
PS/2 Keyboard/Mouse
3.7x4.5
Serial Ports
Linux®
AMD CS5536
IDE UDMA
Windows CE
AMD GeodeTM LX [email protected]
Serial ATA
Windows® XP/XPe
LX ETX
Power Input
Video
Output
Ethernet on Board
Form
Factor
(Inches)
Super I/O on Board
Companion
Device
PCI Slots
Processor
USB
Name
LPC Slots or Headers
I/O Connectors
Audio Out Channels
OS1
Note 1. OS support typically includes BIOS and drivers for audio, display, and bootloader if required.
Note 2. The Geode LX [email protected] processor operates at 500MHz and the Geode LX [email protected] processor operates at 433MHz. Model numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodelxbenchmark
AMD64 Reference Design Kits
Second-Generation AMD OpteronTM
Processor-based
AdvancedTCA® Blade
AMD OpteronTM
Model 2210 EE
Processor
Broadcom
HT-2100,
HT-1000
ATCA®
Blade
Dual Star
Backplane
or 5 slot
Full Mesh
AMD Socket S1 Processor
COM Express
AMD TurionTM
64 X2, Mobile
AMD SempronTM
Processors
AMD M690T/E
with
ATI RadeonTM
X1250
Graphics
COM
Express
Type 2
N/A
AMD Socket AM2 Processor
Storage Bridge Bay
AMD AthlonTM
and
AMD AthlonTM
X2 Processors
Broadcom
HT-2100,
HT-1000
SBB 2.0
N/A
AMD SempronTM 210U/200U
Processor Mini-DTX
ABS1 BGA
Processors
AMD M690E
with
ATI RadeonTM
X1250
Graphics
Mini-DTX
N/A
4 HDMI connectors,
Supports CES-861B
video modes, including 4800, 720p,
1980i and 1080p
1Gb
None
No
2 internal
SATA II,
3Gbps ports
1 External
eSATA 3
Gbps
2 channel
HDaudio:
1 analog
line in,
1 analog
line out
2
2
•
•
•
Dual 1G to
Fabric,
Dual 1G
to Base
AMC® x2
Half
Height
•
•
DVI, LVDS, Analog
VGA, TV
1Gb
3x1
PCIe,®
1x8 PCIe,
PCI
2Ch
•
Analog VGA
GbE to
back plate,
GbE to
mid-plane
1x8 PCIe
•
•
DVI VGA
1Gb
2x1 PCIe
•
HD
•
Custom form
factor
N/A
RoHS
Compliant
2
1
Core
Specification
PICMG 3.0
NEBS
Level-3
and ETSI
Installations
RoHS
Compliant
8
1
HD
www.amd.com/embedded
One AMD Place
P.O. Box 3453
Sunnyvale, CA 94088-3453, USA
Tel: 408-749-4000 or 800-538-8450
TWX: 910-339-9280
TELEX: 34-6306
©2011 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, ATI, the ATI logo, AMD Athlon, AMD Opteron, AMD Turion, AMD Sempron, AMD Phenom, AMD Digital Media
Xpress, AMD Virtualization, AMD-V, AMD PowerNow!, 3DNow!, Geode, PowerPlay, Radeon, and Avivo and combinations thereof are trademarks of Advanced Micro Devices. AdvancedTCA,
ATCA, and AMC are registered trademarks of PCI Industrial Computers Manufacturers Group. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Microsoft,
Windows and DirectX are registered trademarks of Microsoft Corporation in the U.S. and/or other jurisdictions. Linux is a registered trademark of Linus Torvalds. MMX is a trademark of Intel
Corporation. PCIe and PCI Express are registered trademarks of PCI-SIG. Other names are for informational purposes only and may be trademarks of their respective owners.
January 2011 - 43838I
Compliance
•
NEBS
•
Standard
Serial
N/A
USB
203mm x
122mm
custom
form
factor
Audio
AMD 780E ,
AMD SB710,
and
ATI RadeonTM
E4690 GPU
SAS
AMD AthlonTM
II XL/XLT
Processors
AMD PhenomTM
II XLT
Processors
IDE
Topology
High Performance Embedded
Graphics RDK
Aux Slots
Form
Factor
Ethernet
Chipset
Display
Processor
Support
Electrical/Mechanical
Linux®
Name
I/O Connectors
Windows XP/
XPe/ 7/ WES 7
OS
6
1
COM.0
RoHS
Compliant
SBB 2.0
RoHS
Compliant
Mini-DTX
RoHS
Compliant