Blazing A Trail to High Performance Graphics Hynix Semiconductor, Inc. Agenda • A Constraint to Performance • Future Solutions • Conclusion Performance for Visualization Performance never compromise Perf. Perf. Perf. Time A Constraint to Performance POWER Smart management of System Power is the KEY of Future IT Leadership Power-sensitive Graphic Memory Memory Right time to blaze a trail Power for future Graphic solution System Power Budget GPU Performance Memory Time 3 Options after GDDR5 • GDDR5 Single-ended I/O - Max. 8Gbps with same power • GDDR5 Differential I/O - Max. 14Gbps with much more power • HBM*(Wide I/O with TSV) - Lower speed with many I/Os and low power * High Bandwidth Memory HBM for Best Solution Performance with a restricted power budget HBM GDDR5 Single-end I/O GDDR5 Differential I/O Time HBM to satisfy IT trend ~ 65% System Performance ~ 40% Memory Power Consumption Major Features of HBM Wide I/O Stacked DRAM with TSV GDDR5 HBM DRAM Package DRAM Substrate Architecture DRAM DRAM DRAM FBGA Ball u-Bump x32 IO x 1024 7Gbps Data Rate 1Gbps 1.5V Voltage 1.2V TSV Extendibility of HBM Perf. Density Upgradable DRAM Speed Increasable # of I/O Flexible # of stack App. Graphics Card HPC, Workstation Interim solution for mainstream • HBM migrating to mainstream 2-3 years after High-end segmentation • Interim Solution between DDR3 and HBM GDDR5M Speed : Max. 4.0Gbps @1.35V IO : x16/x8 Conclusion Based on the strong partnership with AMD, Hynix navigates the best Graphics solutions of each system for the future today. Hynix will be ready to support the full Graphics solution portfolio for each Customer tomorrow as like today.