AMD Family 10h Server and Workstation Processor Power and

AMD Family 10h
Server and Workstation Processor
Power and Thermal Data Sheet
Publication # 43374
Revision: 3.19
Issue Date: June 2010
Advanced Micro Devices
© 2009, 2010 Advanced Micro Devices, Inc. All rights reserved.
The contents of this document are provided in connection with Advanced Micro Devices,
Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the
accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. The information contained herein may be of a preliminary or advance nature and is subject to change
without notice. No license, whether express, implied, arising by estoppel or otherwise, to
any intellectual property rights is granted by this publication. Except as set forth in AMD’s
Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited
to, the implied warranty of merchantability, fitness for a particular purpose, or infringement
of any intellectual property right.
AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications
intended to support or sustain life, or in any other application in which the failure of
AMD’s product could create a situation where personal injury, death, or severe property or
environmental damage may occur. AMD reserves the right to discontinue or make changes
to its products at any time without notice.
Trademarks
AMD, the AMD Arrow logo, AMD Opteron, and combinations thereof are trademarks of Advanced Micro Devices, Inc.
Microsoft and Windows Vista are registered trademarks of the Microsoft Corporation.
HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.
Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table of Contents
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1 Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1.1 Ordering Part Number Description Section Overview . . . . . . . . . . . . . . . . . . 8
1.1.2 Thermal and Power Table Guide Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1.3 Thermal and Power Table Section Overview . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.1.4 Power Supply Specification Chapter Overview . . . . . . . . . . . . . . . . . . . . . . . 9
1.1.5 Power Limit Encoding Chapter Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.2 Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.3 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2
AMD Opteron™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.1 AMD Opteron™ Processor Ordering Part Number Description . . . . . . . . . . . . . . . . 12
2.2 AMD Opteron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . 28
2.3 AMD Opteron Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . . 30
2.3.1 OS mmmm PA pnc GC (79 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.3.2 OS mmmm PA pnc GD (79 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2.3.3 OS mmmm PA pnc GE (79 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
2.3.4 OS mmmm WA pnc GC (115 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2.3.5 OE mmmm FM pnc GD (79 W Embedded Server, Fr2 (1207)) Thermal
and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
2.3.6 OS mmmm WE pnc GD (95 W Server, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
2.3.7 OS mmmm WA pnc GE (115 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
2.3.8 OS mmmm WA pnc GD (115 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
2.3.9 OS mmmm WB pnc GD (115 W Server, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
2.3.10 OS mmmm YA pnc GD (137 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
2.3.11 OS mmmm WA pnc GH (115 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
2.3.12 OS mmmm PA pnc GH (79 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.3.13 OS mmmm YA pnc GH (137 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.3.14 OS mmmm WB pnc GH (115 W Server, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
2.3.15 OE mmmm FM pnc GH (79 W Embedded Server, Fr2 (1207)) Thermal
and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
2.3.16 OS mmmm WA pnc GI (115 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Contents
3
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
2.3.17 OS mmmm PA pnc GI (79 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
2.3.18 OS mmmm YA pnc GI (137 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
2.3.19 OS mmmm WH pnc GI (115 W Server, Fr5 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
2.3.20 OS mmmm PC pnc GI (79 W Server, Fr5 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
2.3.21 OS mmmm YC pnc GI (137 W Server, Fr5 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
2.3.22 OS mmmm WG pnc GI (115 W Server, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
2.3.23 OS mmmm NA pnc GI (60 W Server, Fr5 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
2.3.24 OS mmmm WJ pnc GN (115 W Server, Fr6 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
2.3.25 OS mmmm PD pnc GN (79 W Server, Fr6 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
2.3.26 OS mmmm NB pnc GN (60 W Server, Fr6 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
2.3.27 OS mmmm WK pnc GO (115 W Server, G34r1) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
2.3.28 OS mmmm VA pnc GO (85 W Server, G34r1) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
2.3.29 OS mmmm YE pnc GO (140 W Server, G34r1) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
2.3.30 OS mmmm WL pnc GO (95 W Server, C32) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
2.3.31 OS mmmm WL pnc GN (95 W Server, C32) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
2.3.32 OS mmmm OF pnc GO (65 W Server, C32) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
2.3.33 OS mmmm HJ pnc GO (35 W Server, C32) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
3
Power Supply Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
3.1 bsmmmmrr L ncdd – Fr2 (1207) Power Supply Operating Conditions . . . . . . . . . . 81
3.2 bsmmmmrr P ncdd – Fr5 (1207) Power Supply Operating Conditions . . . . . . . . . . . 84
3.3 bsmmmmrr J ncdd – AM2r2 Power Supply Operating Conditions . . . . . . . . . . . . . . 87
3.4 bsmmmmrr K ncdd – AM3 Power Supply Operating Conditions . . . . . . . . . . . . . . . 90
3.5 bsmmmmrr S ncdd – Fr6 (1207) Power Supply Operating Conditions . . . . . . . . . . 93
4
Power Limit Encoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
5
MTOPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
6
APP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Contents
4
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
List of Figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
AMD Opteron™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . . 12
AMD Opteron Processor Ordering Part Number Example . . . . . . . . . . . . . . . 12
Socket Fr2 (1207) AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . 82
Socket Fr5 (1207) AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . 85
Socket AM2 AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Socket AM3 AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Socket Fr6 (1207) AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . 94
List of Figures
5
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
List of Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
AMD Opteron™ Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . 13
AMD Opteron Processor Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . 13
AMD Opteron Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
AMD Opteron Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
AMD Opteron Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . 14
AMD Opteron Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . . 15
AMD Opteron Processor Segment Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
AMD Opteron Processor Thermal Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
AMD Opteron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . 28
bsmmmmrr L ncdd DC Operating Conditions for VDD Power Supply . . . . . . 81
bsmmmmrr L ncdd AC Operating Conditions for VDD Power Supply . . . . . . 81
bsmmmmrr L ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
bsmmmmrr L ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
bsmmmmrr P ncdd DC Operating Conditions for VDD Power Supply . . . . . 84
bsmmmmrr P ncdd AC Operating Conditions for VDD Power Supply . . . . . 84
bsmmmmrr P ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
bsmmmmrr P ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
bsmmmmrr J ncdd DC Operating Conditions for VDD Power Supply . . . . . 87
bsmmmmrr J ncdd AC Operating Conditions for VDD Power Supply . . . . . 87
bsmmmmrr J ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
bsmmmmrr J ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
bsmmmmrr K ncdd DC Operating Conditions for VDD Power Supply . . . . . 90
bsmmmmrr K ncdd AC Operating Conditions for VDD Power Supply . . . . . 90
bsmmmmrr K ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
bsmmmmrr K ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
bsmmmmrr S ncdd DC Operating Conditions for VDD Power Supply . . . . . 93
bsmmmmrr S ncdd AC Operating Conditions for VDD Power Supply . . . . . 93
bsmmmmrr S ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
bsmmmmrr S ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Composite Theoretical Performance (CTP) Calculation . . . . . . . . . . . . . . . . . 97
Adjusted Peak Performance (APP) Calculation . . . . . . . . . . . . . . . . . . . . . . . 98
List of Tables
6
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Revision History
Date
Revision
Description
June 2010
3.19
Fifth public release.
• Added new OPNs.
• Added new definitions to Section 1.3 on page 10.
• Modified Table 5 on page 14 to differentiate G34 and C32 infrastructures from F and AM infrastructures.
• Added Max DDR Speed and Max HT Link Speed to Table 6 on
page 15.
• Changed IDD Max to TDC and corrected values in the thermal and
power specification tables for all Socket G34 and Socket C32 OPNs
(existing Section 2.3.27 through Section 2.3.29 and new
Section 2.3.30 through Section 2.3.33).
March 2010
3.15
Fourth public release.
• Added new OPNs.
September 2009
3.07
Third public release.
• Added OPN.
• Updated the Thermal and Power Specifications tables for 115-W
and 79-W Fr6 (1207) Server Processors in Section 2.3.24 and
Section 2.3.25.
• Modified ILDT specs in the Power Supply Specifications section.
June 2009
3.04
Second public release.
April 2009
3.00
Initial Public release.
Revision History
7
PID: 43374 Rev 3.19 - June 2010
1
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Overview
This document contains processor thermal specifications and power specifications. The specifications
in this document supersede those found in the power roadmaps. For all other electrical specifications,
refer to the appropriate product data sheet and the AMD Family 10h Processor Electrical Data Sheet,
order# 40014.
1.1 Organization
This document is organized into the following sections:
• Document overview (Section 1)
• One section for each brand represented in the server/workstation segment, containing the following
subsections:
• Ordering Part Number (OPN) description (content overview in Section 1.1.1)
• Thermal and power specification tables (content overview in Section 1.1.3 on page 9)
• Power supply specifications (content overview in Section 1.1.4 on page 9)
• Power Limit Encoding information (content overview in Section 1.1.5)
• MTOPS section in Table 30 on page 97
• APP section in Table 31 on page 98
1.1.1
Ordering Part Number Description Section Overview
The Ordering Part Number (OPN) Description section contains a depiction and description of a valid
OPN for the brand contained in that chapter. Each character or group of characters within an OPN has
a specific meaning (for example, model number, socket compatibility). The meaning of each OPN
character is detailed in the OPN description section. Each OPN identifies a processor with a unique
thermal and power specification table entry.
The OPN description section also contains a full description of the Subsection Ordering Part Number
(SOPN) abstraction characters for the brand contained in that chapter. SOPNs are used to group and
organize OPNs into subsections for the thermal and power tables and power supply specifications. A
definition of SOPNs is contained in Section 1.3 on page 10.
1.1.2
Thermal and Power Table Guide Overview
The thermal and power table guide section contains a table mapping SOPNs and the properties
associated with their defined characters to the proper thermal and power table subsections and page
numbers. This table is designed to be used as a quick reference for finding the appropriate subsection
for the thermal and power tables corresponding to an SOPN.
Overview
8
PID: 43374 Rev 3.19 - June 2010
1.1.3
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Thermal and Power Table Section Overview
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, ambient temperature assumptions) and power delivery (for example, voltage and
current, and power dissipation for each P-state).
The thermal and power specification tables are organized into subsections that correspond to
Subsection Ordering Part Numbers (SOPNs). SOPNs for the thermal and power tables have the
brand, power limit, and part definition characters defined. They are of the form AB mmmmrrpnc GH.
Each chapter provides a guide table that maps the SOPNs in the thermal and power tables within that
chapter to the appropriate subsection number and page number. Within each subsection the OPNs are
sorted by model number, socket compatibility, voltage, temperature, and cache size, respectively.
1.1.4
Power Supply Specification Chapter Overview
The power supply specification chapter contains the operating conditions and requirements for all
voltage planes required by the processor. Power supply requirements are organized into subsections
that correspond to socket infrastructure. The socket infrastructure of a particular OPN can be found in
Table 5 on page 14.
1.1.5
Power Limit Encoding Chapter Overview
The power limit encoding section defines power encodings and their interpretation. Refer to the BIOS
and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for details.
1.2 Conventions
Following are conventions used with numbers.
• Binary numbers. Binary numbers are indicated by appending a “b” at the end, for example: 0110b.
• Decimal numbers. Unless specified otherwise, all numbers are decimal.
• Hexadecimal numbers. Hexadecimal numbers are indicated by appending an “h” to the end, for
example: 45F8h.
• Underscores in numbers. Underscores are used to break up numbers to make them more readable,
for example: 0110_1100b. They do not imply any operation.
Overview
9
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
1.3 Definitions
Following are some key definitions.
• CPU COF. CPU Current Operating Frequency.
• CTP. Composite Theoretical Performance.
• Dual-plane. Platforms in which the VDD and VDDNB (Northbridge) planes are isolated on the
platform and controlled as separate voltages.
• DP. Dual Processor. Each link on DP models supports connections to I/O devices, and any one link
or any sub-link can connect to another MP or DP processor.
• Max Power. The maximum sustained power dissipated by the processor at nominal voltage and
maximum specified case or die temperature.
• MP. Multiprocessor. Each link on MP models supports connections to I/O devices or an MP or DP
processor. Systems are limited to the number of nodes supported by all the processors. Refer to the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for
more details.
• MTOPS. Millions Of Theoretical Operations Per Second.
• NB COF. Northbridge Current Operating Frequency.
• OPN. Ordering Part Number. An OPN uniquely identifies a processor and its associated
specifications in the thermal and power tables and power supply specifications section.
• P-state. Processor Performance State. P-states are valid combinations of CPU voltage, CPU COF,
Northbridge voltage, and NB COF.
• Single-plane. Platforms in which all the VDD and VDDNB power planes are connected together
on the platform and controlled as a single power plane.
• SOPN. Subsection Ordering Part Number. An SOPN is an OPN with a subset of defined characters.
All defined characters in an SOPN are bolded and capitalized. All abstracted characters in an SOPN
are in non-bolded lowercase. Information for any OPN that matches all of the defined characters in
an SOPN is contained in that subsection. For example, OPN AB1234CDE5FGH appears under the
subsection for SOPN AB mmmmrrpnc GH. The abstracted (lowercase) character definitions for
SOPNs are contained in the OPN description section of each chapter.
• State. Indicates the ACPI defined sleep state, power state, and performance state for the related
specifications. 'x' indicates the related specifications are independent of the associated ACPI state.
For example, S0.C0.P0 indicates sleep state 0, power state 0, and performance state 0. S3.Cx.Px
indicates sleep state 3 entered from any power and performance state combination.
• TDC. Thermal Design Current. The maximum sustained current that the voltage regulator must
support. TDC is defined at nominal voltage and maximum specified case or die temperature.
• TDP. Thermal Design Power. The thermal design power is the maximum power a processor can
draw for a thermally significant period while running commercially useful software. The
constraining conditions for TDP are specified in the notes in the thermal and power tables.
• UP. Uniprocessor. Each link on UP models supports connections to I/O devices.
Overview
10
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
• VID_VDD. The VID_VDD voltage is the VID-requested VDD supply level. Refer to the BIOS and
Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for VID to
voltage translation specifications.
• VID_VDDNB. The VID_VDDNB voltage is the VID-requested VDD Northbridge supply level.
Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors,
order# 31116, for VID to voltage translation specifications.
Overview
11
PID: 43374 Rev 3.19 - June 2010
2
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
AMD Opteron™ Processor
The following sections contain the OPN description and thermal and power specifications for the
AMD Opteron™ processor. Each column in the thermal and power tables represents a specific
Ordering Part Number (OPN). Section 2.1 provides an example of the OPN structure for this
processor family.
2.1 AMD Opteron™ Processor Ordering Part Number Description
b s mmmm rr p n c dd
Part Definition
Cache Size
Number of Cores
Package
Roadmap
Model
Segment
Brand
Figure 1.
AMD Opteron™ Processor Ordering Part Number Diagram
O S 8347 PA L 4 BGC
Part Definition: GC (see Table 1)
Cache Size: B (see Table 2)
Number of Cores: 4 (see Table 3)
Package: L (see Table 4)
Roadmap: PA (see Table 5)
Model Number: 8347 (see Table 6)
Segment: S = Server (see Table 7)
Brand: O = AMD Opteron™ Processor
Figure 2.
AMD Opteron™ Processor Ordering Part Number Example
AMD Opteron™ Processor
12
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 1. AMD Opteron™ Processor Part Definition Options
Part
Definition
Revision
CPUID 8000_0001h EAX [31:0]
(CPUID)
GC
Rev B1
00100F21h
GE
Rev BA
00100F2Ah
GD
Rev B2
00100F22h
GH
Rev B3
00100F23h
GI
Rev C2
00100F42h
GN
Rev D0
00100F80h
GO
Rev D1
00100F81h
Table 2. AMD Opteron™ Processor Cache Size Options
OPN
Character
L2 Cache Size
L3 Cache Size
B
512 KB
2048 KB
D
512 KB
6144 KB
E
512 KB
12288 KB
Table 3. AMD Opteron™ Processor Number of Cores
OPN
Character
Number of
Cores
4
4
6
6
8
8
C
12
AMD Opteron™ Processor
13
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 4. AMD Opteron™ Processor Package Options
OPN
Character
Package
L
Fr2 (1207)
J
AM2r2
K
AM3
P
Fr5 (1207)
S
Fr6 (1207)
T
G34r1
U
C32
Table 5. AMD Opteron™ Processor Roadmap Options
OPN
Character
Max TDP
Socket
Infrastructure
IDD Max IDD Max IDD TDC IDD TDC
HS Class
(VDD)
(NB)
(VDD)
(NB)
FM
79 W
Fr2 (1207)
60 A
20 A
-
-
HS57
PA
79 W
Fr2 (1207)
60 A
20 A
-
-
HS54
WA
115 W
Fr2 (1207)
80 A
20 A
-
-
HS65
WB
115 W
AM2r2
80 A
20 A
-
-
HS65
WE
95 W
AM2r2
80 A
20 A
-
-
HS65
YA
137 W
Fr2 (1207)
95 A
20 A
-
-
HS72
WH
115 W
Fr5 (1207)
80 A
20 A
-
-
HS65
WG
115 W
AM3
95 A
20 A
-
-
HS65
PC
79 W
Fr5 (1207)
60 A
20 A
-
-
HS54
YC
137 W
Fr5 (1207)
95 A
20 A
-
-
HS72
NA
60 W
Fr5 (1207)
50 A
20 A
-
-
HS54
WJ
115 W
Fr6 (1207)
80 A
20 A
-
-
HS65
PD
79 W
Fr6 (1207)
60 A
20 A
-
-
HS54
NB
60 W
Fr6 (1207)
50 A
20 A
-
-
HS54
WK
115 W
G34r1
-
-
110 A
25 A
HS70, HS65
VA
85 W
G34r1
-
-
80 A
25 A
HS65,HS63
YE
140 W
G34r1
-
-
115 A
25 A
HS75,HS72
WL
95 W
C32
-
-
95 A
20 A
HS73,HS65
OF
65 W
C32
-
-
70 A
20 A
HS75,HS72
HJ
35 W
C32
-
-
44 A
12 A
HS63,HS55
AMD Opteron™ Processor
14
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 6. AMD Opteron™ Processor Model Number Options
Core
Frequency
Max HT
Single-Plane
Dual-Plane
UniDualMultiMax DDR
Link
NB Frequency NB Frequency Processor Processor Processor Speed
Speed
1700 MHz
1200 MHz
1400 MHz
–
2344
–
800 MT/s
1000 MT/s
1700 MHz
1400 MHz
1600 MHz
–
2344
–
800 MT/s
1000 MT/s
1700 MHz
1400 MHz
1600 MHz
–
23GF
–
800 MT/s
2000 MT/s
1700 MHz
N/A
1800 MHz
–
–
6164
1333 MT/s
6400 MT/s
1700 MHz
N/A
1800 MHz
–
4162
–
1333 MT/s
6400 MT/s
1800 MHz
1400 MHz
1600 MHz
13HF
23HF
83HF
800 MT/s
2000 MT/s
1800 MHz
1400 MHz
1600 MHz
–
2346
8346
800 MT/s
1000 MT/s
1800 MHz
N/A
2000 MHz
–
2419
-
800 MT/s
4800 MT/s
1800 MHz
N/A
1800 MHz
–
–
6124
1333 MT/s
6400 MT/s
1800 MHz
N/A
1800 MHz
–
4164
–
1333 MT/s
6400 MT/s
1900 MHz
1400 MHz
1600 MHz
–
2347
8347
800 MT/s
1000 MT/s
1900 MHz
N/A
1800 MHz
–
–
6168
1333 MT/s
6400 MT/s
2000 MHz
1400 MHz
1800 MHz
–
2350
8350
800 MT/s
1000 MT/s
2000 MHz
1600 MHz
1800 MHz
–
2350
8350
800 MT/s
1000 MT/s
2000 MHz
N/A
2200 MHz
–
2423
–
800 MT/s
4800 MT/s
2000 MHz
N/A
1800 MHz
–
–
1333 MT/s
6400 MT/s
2000 MHz
N/A
1800 MHz
–
–
1333 MT/s
6400 MT/s
2000 MHz
N/A
1800 MHz
–
–
1333 MT/s
6400 MT/s
2100 MHz
1600 MHz
1800 MHz
–
2352
–
800 MT/s
2000 MT/s
2100 MHz
1600 MHz
1800 MHz
1352
–
–
800 MT/s
3600 MT/s
2100 MHz
1600 MHz
2000 MHz
–
2372
800 MT/s
2000 MT/s
2100 MHz
1600 MHz
2000 MHz
–
2373
8373
800 MT/s
4000 MT/s
2100 MHz
N/A
2200 MHz
–
2425
8425
800 MT/s
4800 MT/s
2100 MHz
N/A
1800 MHz
–
–
6172
1333 MT/s
6400 MT/s
2100 MHz
N/A
2200 MHz
–
4170
–
1333 MT/s
6400 MT/s
2200 MHz
1600 MHz
1800 MHz
–
2354
8354
800 MT/s
2000 MT/s
2200 MHz
1600 MHz
1800 MHz
1354
–
–
800 MT/s
3600 MT/s
2200 MHz
1600 MHz
2000 MHz
–
2374
8374
800 MT/s
2000 MT/s
2200 MHz
N/A
2200 MHz
–
2427
–
800 MT/s
4800 MT/s
2200 MHz
N/A
1800 MHz
–
–
6174
1333 MT/s
6400 MT/s
AMD Opteron™ Processor
6128
15
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 6. AMD Opteron™ Processor Model Number Options (Continued)
Core
Frequency
Max HT
Single-Plane
Dual-Plane
UniDualMultiMax DDR
Link
NB Frequency NB Frequency Processor Processor Processor Speed
Speed
2200 MHz
N/A
2200 MHz
–
4122
–
1333 MT/s
6400 MT/s
2300 MHz
1600 MHz
2000 MHz
–
2376
8376
800 MT/s
2000 MT/s
2300 MHz
1600 MHz
2000 MHz
–
2377
–
800 MT/s
4000 MT/s
2300 MHz
1600 MHz
2000 MHz
–
2356
8356
800 MT/s
2000 MT/s
2300 MHz
1600 MHz
2000 MHz
1356
–
–
800 MT/s
4000 MT/s
2300 MHz
N/A
1800 MHz
–
–
6134
1333 MT/s
6400 MT/s
2300 MHz
N/A
1800 MHz
–
–
6176
1333 MT/s
6400 MT/s
2300 MHz
N/A
1800 MHz
–
–
1333 MT/s
6400 MT/s
2300 MHz
N/A
2200 MHz
–
4174
–
1333 MT/s
6400 MT/s
2400 MHz
1600 MHz
2000 MHz
–
2358
8358
800 MT/s
1000 MT/s
2400 MHz
1600 MHz
2000 MHz
–
2378
8378
800 MT/s
2000 MT/s
2400 MHz
1600 MHz
2000 MHz
–
2379
8379
800 MT/s
4000 MT/s
2400 MHz
N/A
2200 MHz
–
2431
8431
800 MT/s
4800 MT/s
2400 MHz
N/A
1800 MHz
–
–
6136
1333 MT/s
6400 MT/s
2400 MHz
N/A
2200 MHz
–
4176
–
1333 MT/s
6400 MT/s
2500 MHz
1600 MHz
2000 MHz
–
2360
8360
800 MT/s
1000 MT/s
2500 MHz
1600 MHz
2000 MHz
–
2380
8380
800 MT/s
2000 MT/s
2500 MHz
1600 MHz
2000 MHz
–
2381
8381
800 MT/s
4000 Mt/s
2500 MHz
1600 MHz
2200 MHz
1381
–
–
1333 MT/s
4400 MT/s
2600 MHz
1600 MHz
2200 MHz
–
2382
8382
800 MT/s
2000 MT/s
2600 MHz
N/A
2200 MHz
–
2435
8435
800 MT/s
4800 MT/s
2600 MHz
N/A
2200 MHz
–
4130
–
1333 MT/s
6400 MT/s
2600 MHz
N/A
2200 MHz
–
4180
–
1333 MT/s
6400 MT/s
2700 MHz
1600 MHz
2200 MHz
–
2384
8384
800 MT/s
2000 MT/s
2700 MHz
1600 MHz
2200 MHz
1385
–
–
1333 MT/s
4400 MT/s
2800 MHz
1600 MHz
2200 MHz
–
2386
8386
800 MT/s
2000 MT/s
2800 MHz
1600 MHz
2200 MHz
–
2387
8387
800 MT/s
4400 MT/s
2800 MHz
1600 MHz
2200 MHz
–
800 MT/s
4400 MT/s
2800 MHz
N/A
2200 MHz
–
4184
–
1333 MT/s
6400 MT/s
2900 MHz
1600 MHz
2200 MHz
–
2389
8389
800 MT/s
4400 MT/s
2900 MHz
1600 MHz
2200 MHz
1389
–
–
1333 MT/s
4400 MT/s
3100 MHz
1600 MHz
2200 MHz
–
2393
8393
800 MT/s
4400 MT/s
AMD Opteron™ Processor
16
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 7. AMD Opteron™ Processor Segment Options
OPN
Character
Segment
E
Embedded Server
S
Server
AMD Opteron™ Processor
17
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 8. AMD Opteron™ Processor Thermal Profiles
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
A
0.29°C/W
42°C
0.232°C/W
48°C
HS65
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
56.1°C
57.3°C
58.4°C
59.6°C
60.8°C
61.9°C
63.1°C
64.2°C
65.4°C
66.6°C
67.7°C
68.9°C
70.0°C
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
68.0 W
B
0.42°C/W
42°C
0.338°C/W
48°C
HS54
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
56.5°C
58.1°C
59.8°C
61.5°C
63.2°C
64.9°C
66.6°C
68.3°C
70.0°C
71.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
AMD Opteron™ Processor
18
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
100.0 W
105.0 W
110.0 W
115.0 W
120.0 W
125.0 W
130.0 W
135.0 W
137.0 W
C
0.24°C/W
38°C
0.197°C/W
44°C
HS72
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.8°C
56.8°C
57.8°C
58.8°C
59.8°C
60.7°C
61.7°C
62.7°C
63.7°C
64.7°C
65.7°C
66.7°C
67.6°C
68.6°C
69.6°C
70.6°C
71.0°C
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
100.0 W
105.0 W
110.0 W
115.0 W
D
0.29°C/W
42°C
0.243°C/W
48°C
HS65
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.3°C
56.5°C
57.7°C
58.9°C
60.2°C
61.4°C
62.6°C
63.8°C
65.0°C
66.2°C
67.4°C
68.7°C
69.9°C
71.1°C
72.3°C
73.5°C
74.7°C
76.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
AMD Opteron™ Processor
19
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
79.0 W
E
0.42°C/W
42°C
0.354°C/W
48°C
HS54
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.1°C
56.9°C
58.6°C
60.4°C
62.2°C
63.9°C
65.7°C
67.5°C
69.2°C
71.0°C
72.8°C
74.6°C
76.0°C
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
79.0 W
F
0.39°C/W
55°C
0.316°C/W
61°C
HS57
Tcase Max
61.0°C
62.6°C
64.2°C
65.7°C
67.3°C
68.9°C
70.5°C
72.1°C
73.6°C
75.2°C
76.8°C
78.4°C
80.0°C
81.5°C
83.1°C
84.7°C
86.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
AMD Opteron™ Processor
20
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
100.0 W
105.0 W
110.0 W
115.0 W
G
0.30°C/W
42°C
0.252°C/W
48°C
HS65
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.6°C
56.8°C
58.1°C
59.3°C
60.6°C
61.9°C
63.1°C
64.4°C
65.6°C
66.9°C
68.2°C
69.4°C
70.7°C
71.9°C
73.2°C
74.5°C
75.7°C
77.0°C
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
79.0 W
H
0.43°C/W
42°C
0.354°C/W
48°C
HS54
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.1°C
56.9°C
58.6°C
60.4°C
62.2°C
63.9°C
65.7°C
67.5°C
69.2°C
71.0°C
72.8°C
74.6°C
76.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
AMD Opteron™ Processor
21
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
100.0 W
105.0 W
110.0 W
115.0 W
120.0 W
125.0 W
130.0 W
135.0 W
137.0 W
I
0.25°C/W
38°C
0.212°C/W
44°C
HS72
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.7°C
56.7°C
57.8°C
58.8°C
59.9°C
61.0°C
62.0°C
63.1°C
64.1°C
65.2°C
66.3°C
67.3°C
68.4°C
69.4°C
70.5°C
71.6°C
72.6°C
73.0°C
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
J
0.43°C/W
42°C
0.333°C/W
48°C
HS54
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
56.3°C
58.0°C
59.7°C
61.3°C
63.0°C
64.7°C
66.3°C
68.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
AMD Opteron™ Processor
22
PID: 43374 Rev 3.19 - June 2010
.
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
65.0 W
70.0 W
75.0 W
80.0 W
85.0 W
90.0 W
95.0 W
100.0 W
105.0 W
110.0 W
115.0 W
K
0.29°C/W
42°C
0.243°C/W
48°C
HS65
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.3°C
56.5°C
57.7°C
59.0°C
60.2°C
61.4°C
62.6°C
63.8°C
65.0°C
66.3°C
67.5°C
68.7°C
69.9°C
71.1°C
72.3°C
73.6°C
74.8°C
76.0°C
Thermal Profile
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
TDP
0.0 W
5.0 W
10.0 W
15.0 W
20.0 W
25.0 W
30.0 W
35.0 W
40.0 W
45.0 W
50.0 W
55.0 W
60.0 W
P
0.43°C/W
42°C
0.333°C/W
48°C
HS54
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
56.3°C
58.0°C
59.7°C
61.3°C
63.0°C
64.7°C
66.3°C
68.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
AMD Opteron™ Processor
23
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Q
Thermal Profile
Profile 1
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
Max Power
0W
10 W
20 W
30 W
40 W
50 W
60 W
70 W
80 W
90 W
100 W
110 W
120 W
130 W
135 W
R
Thermal Profile
Profile 2
0.20°C/W
0.23°C/W
42.0°C
42.0°C
0.156°C/W
48.0°C
HS70
HS65
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.8°C
57.4°C
58.9°C
60.5°C
62.0°C
63.6°C
65.2°C
66.7°C
68.3°C
69.0°C
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
Max Power
0W
10 W
20 W
30 W
40 W
50 W
60 W
70 W
80 W
90 W
100 W
110 W
120 W
130 W
135 W
Profile 1
Profile 2
0.20°C/W
0.24°C/W
42.0°C
42.0°C
0.163°C/W
48.0°C
HS70
HS65
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
56.2°C
57.8°C
59.4°C
61.0°C
62.7°C
64.3°C
65.9°C
67.6°C
69.2°C
70.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
AMD Opteron™ Processor
24
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
S
Thermal Profile
Profile 1
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
Max Power
0W
5W
10 W
15 W
20 W
25 W
30 W
35 W
40 W
45 W
50 W
55 W
60 W
65 W
70 W
75 W
80 W
85 W
90 W
95 W
100 W
T
Thermal Profile
Profile 2
0.23°C/W
0.27°C/W
42.0°C
42.0°C
0.170°C/W
48.0°C
HS65
HS63
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.7°C
56.5°C
57.4°C
58.2°C
59.1°C
59.9°C
60.8°C
61.6°C
62.5°C
63.3°C
64.2°C
65.0°C
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
Max Power
0W
5W
10 W
15 W
20 W
25 W
30 W
35 W
40 W
45 W
50 W
55 W
60 W
65 W
70 W
75 W
80 W
85 W
90 W
95 W
100 W
Profile 1
Profile 2
0.24°C/W
0.28°C/W
42.0°C
42.0°C
0.180°C/W
48.0°C
HS65
HS63
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.2°C
56.1°C
57.0°C
57.9°C
58.8°C
59.7°C
60.6°C
61.5°C
62.4°C
63.3°C
64.2°C
65.1°C
66.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
AMD Opteron™ Processor
25
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
V
Thermal Profile
Profile 1
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
Max Power
0W
10 W
20 W
30 W
40 W
50 W
60 W
70 W
80 W
90 W
100 W
110 W
120 W
130 W
135 W
140 W
145 W
150 W
155 W
160 W
165 W
W
Thermal Profile
Profile 2
0.15°C/W
0.18°C/W
38.0°C
38.0°C
0.121°C/W
44.0°C
HS75
HS72
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
56.1°C
57.3°C
58.5°C
59.7°C
60.3°C
60.9°C
61.5°C
62.2°C
62.8°C
63.4°C
64.0°C
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
Max Power
0W
10 W
20 W
30 W
40 W
50 W
60 W
70 W
80 W
Profile 1
Profile 2
0.34°C/W
0.42°C/W
42.0°C
42.0°C
0.275°C/W
48.0°C
HS63
HS55
Tcase Max
55.0°C
55.0°C
55.0°C
56.3°C
59.0°C
61.8°C
64.5°C
67.3°C
70.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
AMD Opteron™ Processor
26
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Y
Thermal Profile
Profile 1
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
Max Power
0W
10 W
20 W
30 W
40 W
50 W
60 W
70 W
80 W
90 W
95 W
100 W
110 W
115 W
Z
Thermal Profile
Profile 2
0.24°C/W
0.29°C/W
42.0°C
42.0°C
0.232°C/W
48.0°C
HS73
HS65
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
57.3°C
59.6°C
61.9°C
64.2°C
66.6°C
68.9°C
70.0°C
71.2°C
73.5°C
75.0°C
Heat S ink Thermal
Resistance
Heat S ink Local
Ambient
Profile Thermal
Resistance
Profile Ambient
Heatsink Class
Max Power
0W
10 W
20 W
30 W
35 W
40 W
43 W
Profile 1
Profile 2
0.34°C/W
0.42°C/W
50.0°C
50.0°C
0.257°C/W
56.0°C
HS63
HS55
Tcase Max
56.0°C
58.6°C
61.1°C
63.7°C
65.0°C
66.3°C
68.0°C
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
AMD Opteron™ Processor
27
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
2.2 AMD Opteron™ Processor Thermal and Power Table Guide
The thermal and power table guide shown in Table 9 maps SOPNs and the properties associated with
their defined characters to the proper thermal and power table subsections and page numbers. This
table is designed to be used as a quick reference for finding the appropriate subsection for the thermal
and power tables corresponding to an SOPN.
Table 9. AMD Opteron™ Processor Thermal and Power Table Guide
SOPN
Power
Revision
Thermal/Power Tables
OS mmmm PA pnc GC
79 W
Rev B1
Section 2.3.1 on page 31
OS mmmm PA pnc GD
79 W
Rev B2
Section 2.3.2 on page 33
OS mmmm PA pnc GE
79 W
Rev BA
Section 2.3.3 on page 34
OS mmmm WA pnc GC
115 W
Rev B1
Section 2.3.4 on page 36
OE mmmm FM pnc GD
79 W
Rev B2
Section 2.3.5 on page 37
OS mmmm WE pnc GD
95 W
Rev B2
Section 2.3.6 on page 38
OS mmmm WA pnc GE
95 W
Rev BA
Section 2.3.7 on page 39
OS mmmm WA pnc GD
115 W
Rev B2
Section 2.3.8 on page 40
OS mmmm WB pnc GD
115 W
Rev B2
Section 2.3.9 on page 42
OS mmmm YA pnc GD
137 W
Rev B2
Section 2.3.10 on page 43
OS mmmm WA pnc GH
115 W
Rev B3
Section 2.3.11 on page 44
OS mmmm PA pnc GH
79 W
Rev B3
Section 2.3.12 on page 46
OS mmmm YA pnc GH
137 W
Rev B3
Section 2.3.13 on page 48
OS mmmm WB pnc GH
115 W
Rev B3
Section 2.3.14 on page 49
OE mmmm FM pnc GH
79 W
Rev B3
Section 2.3.15 on page 51
OS mmmm WA pnc GI
115 W
Rev C2
Section 2.3.16 on page 52
OS mmmm PA pnc GI
79 W
Rev C2
Section 2.3.17 on page 55
OS mmmm YA pnc GI
137 W
Rev C2
Section 2.3.18 on page 57
OS mmmm WH pnc GI
115 W
Rev C2
Section 2.3.19 on page 58
OS mmmm PC pnc GI
79 W
Rev C2
Section 2.3.20 on page 59
OS mmmm YC pnc GI
137 W
Rev C2
Section 2.3.21 on page 60
OS mmmm WG pnc GI
115 W
Rev C2
Section 2.3.22 on page 61
OS mmmm NA pnc GI
60 W
Rev C2
Section 2.3.23 on page 63
OS mmmm WJ pnc GN
115 W
Rev D0
Section 2.3.24 on page 64
OS mmmm PD pnc GN
79 W
Rev D0
Section 2.3.25 on page 66
OS mmmm NB pnc GN
60 W
Rev D0
Section 2.3.26 on page 67
OS mmmm WK pnc GO
115 W
Rev D1
Section 2.3.27 on page 68
AMD Opteron™ Processor
28
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 9. AMD Opteron™ Processor Thermal and Power Table Guide (Continued)
SOPN
Power
Revision
Thermal/Power Tables
OS mmmm VA pnc GO
85 W
Rev D1
Section 2.3.28 on page 72
OS mmmm YE pnc GO
140 W
Rev D1
Section 2.3.29 on page 74
OS mmmm WL pnc GO
95 W
Rev D1
Section 2.3.30 on page 75
OS mmmm WL pnc GN
95 W
Rev D0
Section 2.3.31 on page 76
OS mmmm OF pnc GO
65 W
Rev D1
Section 2.3.32 on page 77
OS mmmm HJ pnc GO
35 W
Rev D1
Section 2.3.33 on page 79
AMD Opteron™ Processor
29
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
2.3 AMD Opteron™ Processor Thermal and Power Specifications
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, temperature assumptions) and power delivery (for example, voltage, current, and
power dissipation for each P-state). Refer to the AMD Family 10h Processor Electrical Data Sheet,
order# 40014, for all other electrical specifications for the processor. Refer to the BIOS and Kernel
Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for power management
BIOS requirements.
Section 2.1 on page 12 provides an example of the OPN structure for processors documented in this
chapter and Table 9 on page 28 provides a guide to OPN organization in the following subsections.
Refer to Section 1.2 on page 9 and Section 1.3 on page 10 for numbering conventions and
terminology definitions used in these tables.
AMD Opteron™ Processor
30
PID: 43374 Rev 3.19 - June 2010
2.3.1
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm PA pnc GC (79 W Server, Fr2 (1207)) Thermal and Power Specifications
OPN
State
Specification 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Notes Single Plane
Dual Plane
o
1
o
55 C to 71 C
OS2346PAL4BGC
OS8346PAL4BGC
Single Plane
2
Thermal Profile
Dual Plane
o
55 C to 71 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
B
B
Startup P-state
5
S0.C0.P4
S0.C0.P4
HTC P-state
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1200 MHz
1400 MHz
1400 MHz
1600 MHz
VID_VDDNB
11
N/A
1.150 V
N/A
1.150 V
IDDNB Max
12
N/A
9.4 A
N/A
9.4 A
CPU COF
6
TDP
3,7
66.1 W
68.0 W
66.1 W
68.0 W
VID_VDD Min
9
1.100 V
1.100 V
1.100 V
1.100 V
VID_VDD Max
9
1.150 V
1.150 V
1.150 V
1.150 V
54.2 A
47.1 A
54.3 A
47.1 A
1700 MHz
1800 MHz
IDD Max
3,10
CPU COF
6
TDP
3,7
63.6 W
65.7 W
61.1 W
63.5 W
VID_VDD Min
9
1.100 V
1.100 V
1.100 V
1.100 V
VID_VDD Max
9
1.150 V
1.125 V
1.150 V
1.125 V
IDD Max
3,10
52.1 A
45.0 A
50.2 A
43.0 A
CPU COF
6
TDP
3,7
58.5 W
58.3 W
56.1 W
56.3 W
VID_VDD Min
9
1.100 V
1.075 V
1.100 V
1.075 V
VID_VDD Max
9
1.150 V
1.100 V
1.150 V
1.100 V
IDD Max
3,10
48.0 A
39.2 A
46.0 A
37.3 A
1600 MHz
1400 MHz
1600 MHz
1400 MHz
CPU COF
6
TDP
3,7
53.5 W
54.0 W
51.1 W
52.0 W
VID_VDD Min
9
1.100 V
1.075 V
1.100 V
1.075 V
VID_VDD Max
9
1.150 V
1.075 V
1.150 V
1.075 V
43.9 A
35.2 A
41.9 A
33.3 A
1200 MHz
1200 MHz
IDD Max
3,10
CPU COF
6
TDP
3,7
48.7 W
47.5 W
46.6 W
45.6 W
VID_VDD Min
9
1.100 V
1.050 V
1.100 V
1.050 V
VID_VDD Max
9
1.150 V
1.050 V
1.150 V
1.050 V
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
OS2344PAL4BGC
I/O Power
1000 MHz
1000 MHz
3,10
39.8 A
29.8 A
37.8 A
28.0 A
3,10,14
21.5 A
10.1 A
19.1 A
8.1 A
13
6.5 W
6.5 W
6.5 W
6.5 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
31
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS2347PAL4BGC
OS8347PAL4BGC
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Specification 8
Notes Single Plane
Dual Plane
o
Tcase Max
1
55 C to 71 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
B
Thermal Profile
Startup P-state
5
S0.C0.P4
HTC P-state
4
S0.C0.P4
NB COF
6,15
1400 MHz
1600 MHz
VID_VDDNB
11
N/A
1.150 V
IDDNB Max
12
N/A
8.8 A
CPU COF
6
TDP
3,7
66.2 W
68.0 W
VID_VDD Min
9
1.100 V
1.100 V
VID_VDD Max
9
1.150 V
1.150 V
54.5 A
47.6 A
IDD Max
3,10
CPU COF
6
1900 MHz
1700 MHz
TDP
3,7
61.2 W
63.5 W
VID_VDD Min
9
1.100 V
1.100 V
VID_VDD Max
9
1.150 V
1.125 V
IDD Max
3,10
50.3 A
43.5 A
CPU COF
6
1400 MHz
TDP
3,7
53.7 W
54.2 W
VID_VDD Min
9
1.100 V
1.075 V
VID_VDD Max
9
1.150 V
1.100 V
IDD Max
3,10
44.2 A
35.9 A
CPU COF
6
TDP
3,7
49.1 W
49.9 W
VID_VDD Min
9
1.100 V
1.075 V
VID_VDD Max
9
1.150 V
1.075 V
40.1 A
31.9 A
IDD Max
3,10
CPU COF
6
1200 MHz
1000 MHz
TDP
3,7
44.5 W
43.7 W
VID_VDD Min
9
1.100 V
1.050 V
VID_VDD Max
9
1.150 V
1.050 V
3,10
36.0 A
26.8 A
3,10,14
16.9 A
6.8 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
13
6.5 W
6.5 W
S3
I/O Power
13
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
32
PID: 43374 Rev 3.19 - June 2010
2.3.2
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm PA pnc GD (79 W Server, Fr2 (1207)) Thermal and Power Specifications
OS2346PAL4BGD
OS8346PAL4BGD
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Specification 8
Dual-Plane
Single-Plane
Dual-Plane
Tcase Max
1
55 oC to 76 oC
55 oC to 76 oC
Tctl Max
2
70 oC
70 oC
o
5 C
5 oC
E
E
Tambient Min
Thermal Profile
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1400 MHz
1600 MHz
1400 MHz
1600 MHz
VID_VDDNB
11,15
N/A
1.125 V
N/A
1.125 V
IDDNB Max
12
N/A
9.3 A
N/A
CPU COF
6
1800 MHz
8.9 A
1900 MHz
TDP
3,7
76.9 W
77.6 W
77.1 W
77.8 W
VID_VDD Min
9
1.075 V
1.075 V
1.075 V
1.075 V
VID_VDD Max
9
1.125 V
1.125 V
1.125 V
1.125 V
IDD Max
3,10
63.8 A
56.1 A
64.0 A
56.7 A
CPU COF
6
1600 MHz
1700 MHz
TDP
3,7
71.8 W
72.4 W
72.0 W
72.7 W
VID_VDD Min
9
1.075 V
1.075 V
1.075 V
1.075 V
VID_VDD Max
9
1.125 V
1.125 V
1.125 V
1.125 V
IDD Max
3,10
59.2 A
51.5 A
59.4 A
52.1 A
CPU COF
6
TDP
3,7
66.6 W
63.3 W
64.2 W
61.2 W
VID_VDD Min
9
1.075 V
1.050 V
1.075 V
1.050 V
VID_VDD Max
9
1.125 V
1.075 V
1.125 V
1.075 V
IDD Max
3,10
54.9 A
44.9 A
52.9 A
43.4 A
CPU COF
6
TDP
3,7
61.5 W
55.4 W
59.1 W
53.8 W
VID_VDD Min
9
1.075 V
1.025 V
1.075 V
1.025 V
VID_VDD Max
9
1.125 V
1.050 V
1.125 V
1.050 V
IDD Max
3,10
50.6 A
38.7 A
48.6 A
37.4 A
CPU COF
6
1400 MHz
1200 MHz
1000 MHz
1400 MHz
1200 MHz
1000 MHz
TDP
3,7
56.3 W
48.7 W
53.9 W
46.9 W
VID_VDD Min
9
1.075 V
1.000 V
1.075 V
1.000 V
VID_VDD Max
9
1.125 V
1.000 V
1.125 V
1.000 V
3,10
46.3 A
33.0 A
44.3 A
31.7 A
3,10,14
25.6 A
10.3 A
23.3 A
9.1 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
Notes Single-Plane
OS2347PAL4BGD
OS8347PAL4BGD
I/O Power
13
7.20 W
7.20 W
7.20 W
7.20 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
33
PID: 43374 Rev 3.19 - June 2010
2.3.3
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm PA pnc GE (79 W Server, Fr2 (1207)) Thermal and Power Specifications
OS2344PAL4BGE
OPN
State
Specification 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Dual-Plane
o
o
55 C to 71 C
1
Single-Plane
2
Thermal Profile
Dual-Plane
o
55 C to 71 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
B
B
Startup P-state
5
S0.C0.P4
S0.C0.P4
HTC P-state
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1200 MHz
1400 MHz
1400 MHz
1600 MHz
VID_VDDNB
11
N/A
1.150 V
N/A
1.150 V
IDDNB Max
12
N/A
9.4 A
N/A
9.4 A
CPU COF
6
TDP
3,7
66.1 W
68.0 W
66.1 W
68.0 W
VID_VDD Min
9
1.100 V
1.100 V
1.100 V
1.100 V
VID_VDD Max
9
1.150 V
1.150 V
1.150 V
1.150 V
IDD Max
3,10
54.2 A
47.1 A
54.3 A
47.1 A
CPU COF
6
1700 MHz
1600 MHz
1800 MHz
1600 MHz
TDP
3,7
63.6 W
65.7 W
61.1 W
63.5 W
VID_VDD Min
9
1.100 V
1.100 V
1.100 V
1.100 V
VID_VDD Max
9
1.150 V
1.125 V
1.150 V
1.125 V
IDD Max
3,10
52.1 A
45.0 A
50.2 A
43.0 A
CPU COF
6
1400 MHz
1400 MHz
TDP
3,7
58.5 W
58.3 W
56.1 W
56.3 W
VID_VDD Min
9
1.100 V
1.075 V
1.100 V
1.075 V
VID_VDD Max
9
1.150 V
1.100 V
1.150 V
1.100 V
IDD Max
3,10
48.0 A
39.2 A
46.0 A
37.3 A
CPU COF
6
TDP
3,7
53.5 W
54.0 W
51.1 W
52.0 W
VID_VDD Min
9
1.100 V
1.075 V
1.100 V
1.075 V
VID_VDD Max
9
1.150 V
1.075 V
1.150 V
1.075 V
IDD Max
3,10
43.9 A
35.2 A
41.9 A
33.3 A
CPU COF
6
1200 MHz
1000 MHz
1200 MHz
1000 MHz
TDP
3,7
48.7 W
47.5 W
46.6 W
45.6 W
VID_VDD Min
9
1.100 V
1.050 V
1.100 V
1.050 V
VID_VDD Max
9
1.150 V
1.050 V
1.150 V
1.050 V
3,10
39.8 A
29.8 A
37.8 A
28.0 A
3,10,14
21.5 A
10.1 A
19.1 A
8.1 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
Notes Single-Plane
OS2346PAL4BGE
OS8346PAL4BGE
I/O Power
13
6.5 W
6.5 W
6.5 W
6.5 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
34
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS2347PAL4BGE
OS8347PAL4BGE
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Specification 8
Dual-Plane
Tcase Max
1
55 C to 71 oC
Tctl Max
2
70 oC
o
5 oC
Tambient Min
Thermal Profile
B
Startup P-state
5
S0.C0.P4
HTC P-state
4
S0.C0.P4
NB COF
6,15
1400 MHz
1600 MHz
VID_VDDNB
11
N/A
1.150 V
IDDNB Max
12
N/A
8.8 A
CPU COF
6
TDP
3,7
66.2 W
68.0 W
VID_VDD Min
9
1.100 V
1.100 V
VID_VDD Max
9
1.150 V
1.150 V
54.5 A
47.6 A
1900 MHz
IDD Max
3,10
CPU COF
6
TDP
3,7
61.2 W
63.5 W
VID_VDD Min
9
1.100 V
1.100 V
VID_VDD Max
9
1.150 V
1.125 V
IDD Max
3,10
50.3 A
43.5 A
CPU COF
6
TDP
3,7
53.7 W
54.2 W
VID_VDD Min
9
1.100 V
1.075 V
VID_VDD Max
9
1.150 V
1.100 V
IDD Max
3,10
44.2 A
35.9 A
CPU COF
6
TDP
3,7
49.1 W
49.9 W
VID_VDD Min
9
1.100 V
1.075 V
VID_VDD Max
9
1.150 V
1.075 V
40.1 A
31.9 A
1700 MHz
1400 MHz
1200 MHz
IDD Max
3,10
CPU COF
6
TDP
3,7
44.5 W
43.7 W
VID_VDD Min
9
1.100 V
1.050 V
VID_VDD Max
9
1.150 V
1.050 V
3,10
36.0 A
26.8 A
3,10,14
16.9 A
6.8 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
Notes Single-Plane
I/O Power
1000 MHz
13
6.5 W
6.5 W
13
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
35
PID: 43374 Rev 3.19 - June 2010
2.3.4
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WA pnc GC (115 W Server, Fr2 (1207)) Thermal and Power Specifications
OS2347WAL4BGC
OS8347WAL4BGC
OPN
State
Specification8
Tcase Max
Tctl Max
S0.C0.Px
Notes Single-Plane
Dual-Plane
o
o
55 C to 70 C
1
OS2350WAL4BGC
OS8350WAL4BGC
Single-Plane
55 C to 70 oC
o
2
Tambient Min
Thermal Profile
Dual-Plane
o
70 C
70 oC
5 oC
5 oC
A
A
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
S0.Cx.Px VID_VDDNB
1400 MHz
1600 MHz
1600 MHz
1800 MHz
11
6,15
N/A
1.200 V
N/A
1.200 V
IDDNB Max
12
N/A
15.2 A
N/A
15.2 A
CPU COF
6
TDP
3,7
94.1 W
95.0 W
94.1 W
95.0 W
S0.C0.P0 VID_VDD Min
9
1.100 V
1.100 V
1.100 V
1.100 V
VID_VDD Max
9
1.200 V
1.200 V
1.200 V
1.200 V
IDD Max
3,10
76.7 A
65.3 A
76.9 A
65.3 A
CPU COF
6
1900 MHz
1700 MHz
2000 MHz
1700 MHz
TDP
S0.C0.P1 VID_VDD Min
3,7
88.6 W
90.5 W
85.8 W
88.2 W
9
1.100 V
1.100 V
1.100 V
1.100 V
VID_VDD Max
9
1.200 V
1.175 V
1.200 V
1.175 V
IDD Max
3,10
72.6 A
61.2 A
70.7 A
59.1 A
CPU COF
6
1400 MHz
1400 MHz
TDP
S0.C0.P2 VID_VDD Min
3,7
80.2 W
79.3 W
77.5 W
77.2 W
9
1.100 V
1.075 V
1.100 V
1.075 V
VID_VDD Max
9
1.200 V
1.125 V
1.200 V
1.125 V
IDD Max
3,10
66.5 A
52.2 A
64.5 A
50.3 A
CPU COF
6
TDP
3,7
74.7 W
75.0 W
72.0 W
72.9 W
S0.C0.P3 VID_VDD Min
9
1.100 V
1.075 V
1.100 V
1.075 V
VID_VDD Max
9
1.200 V
1.075 V
1.200 V
1.075 V
IDD Max
3,10
62.4 A
48.2 A
60.4 A
46.3 A
CPU COF
6
1200 MHz
1000 MHz
1200 MHz
1000 MHz
TDP
S0.C0.P4 VID_VDD Min
3,7
69.5 W
67.0 W
67.0 W
65.2 W
9
1.100 V
1.050 V
1.100 V
1.050 V
VID_VDD Max
9
1.200 V
1.050 V
1.200 V
1.050 V
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
I/O Power
3,10
58.2 A
41.7 A
56.3 A
40.0 A
3,10,14
43.4 A
23.4 A
41.0 A
21.5 A
13
6.5 W
6.5 W
6.5 W
6.5 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
36
PID: 43374 Rev 3.19 - June 2010
2.3.5
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OE mmmm FM pnc GD (79 W Embedded Server, Fr2 (1207)) Thermal and Power Specifications
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Specification 8
Notes Single-Plane
Dual-Plane
Tcase Max
1
55 oC to 86 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
F
Thermal Profile
Startup P-State
5
S0.C0.P4
HTC P-State
4
S0.C0.P4
NB COF
6,15
1400 MHz
1600 MHz
VID_VDDNB
11,15
N/A
1.125 V
IDDNB Max
12
N/A
CPU COF
6
9.8 A
1700 MHz
TDP
3,7
76.7 W
77.4 W
VID_VDD Min
9
1.075 V
1.075 V
VID_VDD Max
9
1.125 V
1.125 V
IDD Max
3,10
63.6 A
55.5 A
CPU COF
6
1600 MHz
TDP
3,7
74.1 W
74.8 W
VID_VDD Min
9
1.075 V
1.075 V
VID_VDD Max
9
1.125 V
1.125 V
IDD Max
3,10
61.3 A
53.2 A
CPU COF
6
TDP
3,7
69.0 W
66.1 W
VID_VDD Min
9
1.075 V
1.050 V
VID_VDD Max
9
1.125 V
1.100 V
IDD Max
3,10
56.9 A
46.5 A
CPU COF
6
TDP
3,7
63.8 W
57.6 W
VID_VDD Min
9
1.075 V
1.025 V
VID_VDD Max
9
1.125 V
1.050 V
IDD Max
3,10
52.6 A
40.1 A
CPU COF
6
1400 MHz
1200 MHz
1000 MHz
TDP
3,7
58.7 W
50.4 W
VID_VDD Min
9
1.075 V
1.000 V
VID_VDD Max
9
1.125 V
1.000 V
IDD Max
3,10
48.3 A
34.2 A
S0.C1.Pmin IDD Max
S0
I/O Power
S3
OE23GFFML4BGD
I/O Power
3,10,14
27.8 A
11.4 A
13
7.2 W
7.2 W
13
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
37
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
2.3.6 OS mmmm WE pnc GD (95 W Server, AM2r2) Thermal and Power Specifications
OP N
S ta te
S 0.C0.P x
S 0.Cx .P x
S 0.C0.P 0
S 0.C0.P 1
S 0.C0.P 2
S 0.C0.P 3
S 0.C0.P 4
OS 1354W EJ4BGD
S pe cifica tion 8
Note s S ingle -P la ne
Tcas e M ax
1
55 C to 70 o C
Tctl M ax
2
70 o C
5 oC
Tam bient m in
A
Therm al P rofile
S tartup P -S tate
5
S 0.C0.P 4
HTC P -S tate
4
S 0.C0.P 4
NB COF
6,15
1600 M Hz
1800 M Hz
V ID_V DDNB
11,15
N/A
1.200 V
IDDNB M ax
12
N/A
12.5 A
2200 M Hz
CP U COF
6
TDP
3,7
94.3 W
95.0 W
V ID_V DD M in
9
1.100 V
1.100 V
V ID_V DD M ax
9
1.200 V
1.200 V
IDD M ax
3,10
78.1 A
68.6 A
CP U COF
6
2000 M Hz
TDP
3,7
88.6 W
90.4 W
V ID_V DD M in
9
1.100 V
1.100 V
V ID_V DD M ax
9
1.200 V
1.150 V
IDD M ax
3,10
73.9 A
64.4 A
CP U COF
6
1700 M Hz
TDP
3,7
79.9 W
78.9 W
V ID_V DD M in
9
1.100 V
1.075 V
V ID_V DD M ax
9
1.200 V
1.100 V
IDD M ax
3,10
67.5 A
55.2 A
CP U COF
6
TDP
3,7
72.0 W
68.4 W
V ID_V DD M in
9
1.100 V
1.050 V
V ID_V DD M ax
9
1.200 V
1.050 V
IDD M ax
3,10
61.2 A
46.6 A
CP U COF
6
1400 M Hz
1100 M Hz
TDP
3,7
64.9 W
62.2 W
V ID_V DD M in
9
1.100 V
1.050 V
V ID_V DD M ax
9
1.200 V
1.050 V
IDD M ax
S 0.C1.P m in IDD M ax
S0
I/O P ower
S3
Dua l-P la ne
o
I/O P ower
3,10
54.9 A
40.7 A
3,10,14
36.7 A
19.9 A
13
6.50 W
6.50 W
13
350 m W
350 m W
The notes for this table are on page 80.
AMD Opteron™ Processor
38
PID: 43374 Rev 3.19 - June 2010
2.3.7
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WA pnc GE (115 W Server, Fr2 (1207)) Thermal and Power Specifications
OS2347W AL4BGE
OS8347W AL4BGE
OPN
State
Specification 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Dual-Plane
o
o
55 C to 70 C
1
Single-Plane
2
Thermal Profile
Dual-Plane
o
55 C to 70 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
A
A
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1400 MHz
1600 MHz
1600 MHz
1800 MHz
VID_VDDNB
11
N/A
1.200 V
N/A
1.200 V
IDDNB Max
12
N/A
15.2 A
N/A
15.2 A
CPU COF
6
TDP
3,7
94.1 W
95.0 W
94.1 W
95.0 W
VID_VDD Min
9
1.100 V
1.100 V
1.100 V
1.100 V
VID_VDD Max
9
1.200 V
1.200 V
1.200 V
1.200 V
IDD Max
3,10
76.7 A
65.3 A
76.9 A
65.3 A
CPU COF
6
1900 MHz
1700 MHz
2000 MHz
1700 MHz
TDP
3,7
88.6 W
90.5 W
85.8 W
88.2 W
VID_VDD Min
9
1.100 V
1.100 V
1.100 V
1.100 V
VID_VDD Max
9
1.200 V
1.175 V
1.200 V
1.175 V
IDD Max
3,10
72.6 A
61.2 A
70.7 A
59.1 A
CPU COF
6
1400 MHz
1400 MHz
TDP
3,7
80.2 W
79.3 W
77.5 W
77.2 W
VID_VDD Min
9
1.100 V
1.075 V
1.100 V
1.075 V
VID_VDD Max
9
1.200 V
1.125 V
1.200 V
1.125 V
IDD Max
3,10
66.5 A
52.2 A
64.5 A
50.3 A
CPU COF
6
TDP
3,7
74.7 W
75.0 W
72.0 W
72.9 W
VID_VDD Min
9
1.100 V
1.075 V
1.100 V
1.075 V
VID_VDD Max
9
1.200 V
1.075 V
1.200 V
1.075 V
IDD Max
3,10
62.4 A
48.2 A
60.4 A
46.3 A
CPU COF
6
1200 MHz
1000 MHz
1200 MHz
1000 MHz
TDP
3,7
69.5 W
67.0 W
67.0 W
65.2 W
VID_VDD Min
9
1.100 V
1.050 V
1.100 V
1.050 V
VID_VDD Max
9
1.200 V
1.050 V
1.200 V
1.050 V
3,10
58.2 A
41.7 A
56.3 A
40.0 A
3,10,14
43.4 A
23.4 A
41.0 A
21.5 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
Notes Single-Plane
OS2350W AL4BGE
OS8350W AL4BGE
I/O Power
13
6.5 W
6.5 W
6.5 W
6.5 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
39
PID: 43374 Rev 3.19 - June 2010
2.3.8
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WA pnc GD (115 W Server, Fr2 (1207)) Thermal and Power Specifications
OS2350W AL4BGD
OS8350W AL4BGD
OPN
Sta te
Spe cifica tion 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx .Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Dua l-Pla ne
o
o
55 C to 76 C
1
Single -Pla ne
2
Thermal Profile
Dua l-Pla ne
o
55 C to 76 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
D
D
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1600 MHz
1800 MHz
1600 MHz
1800 MHz
VID_VDDNB
11,15
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
14.4 A
N/A
CPU COF
6
TDP
3,7
114.1 W
115 W
114.1 W
115 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
88.6 A
77.9 A
89.0A
78.7
2000 MHz
IDD Max
3,10
CPU COF
6
1700 MHz
13.9 A
2100 MHz
1800 MHz
TDP
3,7
103.5 W
94.6 W
103.5 W
94.8 W
VID_VDD Min
9
1.150 V
1.100 V
1.150 V
1.100 V
VID_VDD Max
9
1.250 V
1.200 V
1.250 V
1.200 V
IDD Max
3,10
80.5 A
63.2 A
80.9 A
64.1 A
CPU COF
6
TDP
3,7
92.8 W
80.5 W
96.4 W
83.4 W
VID_VDD Min
9
1.150 V
1.075 V
1.150 V
1.075 V
VID_VDD Max
9
1.250 V
1.100 V
1.250 V
1.150 V
IDD Max
3,10
72.9 A
53.3 A
75.8 A
56.6 A
CPU COF
6
1400 MHz
1200 MHz
1600 MHz
1300 MHz
TDP
3,7
85.7 W
71.7 W
86.2 W
72.1 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
IDD Max
3,10
67.8 A
46.2 A
68.2 A
47.2 A
CPU COF
6
TDP
3,7
79.2 W
67.0 W
78.1 W
66.2 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
3,10
62.7 A
41.7 A
61.8 A
41.6 A
3,10,14
43.5 A
18.8 A
40.8 A
17.4 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
Note s Single -Pla ne
OS2352W AL4BGD
I/O Power
1000 MHz
1050 MHz
13
7.2 W
7.2 W
7.2 W
7.2 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
40
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS2354W AL4BGD
OS8354W AL4BGD
OPN
State
Specification 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Dual-Plane
o
o
55 C to 76 C
1
Single-Plane
2
Thermal Profile
Dual-Plane
o
55 C to 76 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
D
D
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1600 MHz
1800 MHz
1600 MHz
2000 MHz
VID_VDDNB
11,15
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
13.3 A
N/A
13.4 A
CPU COF
6
TDP
3,7
114.1 W
115 W
113.3 W
115 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
89.3 A
79.4 A
89.3 A
79.5 A
CPU COF
6
2200 MHz
2000 MHz
2300 MHz
2000 MHz
TDP
3,7
107.0 W
101.1 W
102.6 W
99.5 W
VID_VDD Min
9
1.150 V
1.125 V
1.150 V
1.125 V
VID_VDD Max
9
1.250 V
1.175 V
1.250 V
1.150 V
IDD Max
3,10
83.9 A
70.5 A
81.6 A
68.9 A
CPU COF
6
1700 MHz
1700 MHz
TDP
3,7
96.4 W
83.7 W
92.3 W
82.4 W
VID_VDD Min
9
1.150 V
1.075 V
1.150 V
1.075 V
VID_VDD Max
9
1.250 V
1.100 V
1.250 V
1.100 V
IDD Max
3,10
76.2 A
57.6 A
74.0 A
56.2 A
CPU COF
6
TDP
3,7
86.5 W
72.5 W
82.6 W
71.4 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
IDD Max
3,10
68.6 A
48.2 A
66.4 A
47.0 A
CPU COF
6
1400 MHz
1100 MHz
1400 MHz
1150 MHz
TDP
3,7
76.8 W
65.4 W
74.5 W
65.4 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
3,10
60.9 A
41.5 A
60.0 A
41.4 A
3,10,14
38.0 A
16.0 A
36.0 A
14.6 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
Notes Single-Plane
OS2356W AL4BGD
OS8356W AL4BGD
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
41
PID: 43374 Rev 3.19 - June 2010
2.3.9
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WB pnc GD (115 W Server, AM2r2) Thermal and Power Specifications
OPN
State
Specification 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Notes Single-Plane
Dual-Plane
o
o
55 C to 76 C
1
OS1354W BJ4BGD
Single-Plane
2
Thermal Profile
Dual-Plane
o
55 C to 76 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
D
D
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1600 MHz
1800 MHz
1600 MHz
1800 MHz
VID_VDDNB
11,15
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
14.0 A
N/A
13.4 A
CPU COF
6
TDP
3,7
114.1 W
115.0 W
114.1 W
115.0 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
89.8 A
79.5 A
89.8 A
80.0 A
CPU COF
6
2100 MHz
1800 MHz
2200 MHz
2000 MHz
TDP
3,7
102.8 W
104.8 W
106.6 W
107.9 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
81.4 A
71.0 A
84.5 A
74.3 A
CPU COF
6
1600 MHz
1700 MHz
TDP
3,7
95.3 W
88.4 W
95.3 W
88.3 W
VID_VDD Min
9
1.150 V
1.100 V
1.150 V
1.100 V
VID_VDD Max
9
1.250 V
1.200 V
1.250 V
1.175 V
IDD Max
3,10
76.1 A
59.8 A
76.5 A
60.5 A
CPU COF
6
TDP
3,7
85.0 W
75.2 W
84.9 W
75.5 W
VID_VDD Min
9
1.150 V
1.075 V
1.150 V
1.075 V
VID_VDD Max
9
1.250 V
1.125 V
1.250 V
1.125 V
IDD Max
3,10
68.1 A
49.5 A
68.5 A
50.5 A
CPU COF
6
1300 MHz
1050 MHz
1400 MHz
1100 MHz
TDP
3,7
76.5 W
65.3 W
74.7 W
64.4 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
3,10
61.5 A
41.2 A
60.6 A
41.1 A
3,10,14
39.7 A
17.4 A
37.0 A
19.9 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
OS1352W BJ4BGD
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
42
PID: 43374 Rev 3.19 - June 2010
2.3.10
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm YA pnc GD (137 W Server, Fr2 (1207)) Thermal and Power Specifications
OS2358YAL4BGD
OS8358YAL4BGD
OPN
State
Specification 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Dual-Plane
o
o
55 C to 71 C
1
Single-Plane
2
Thermal Profile
Dual-Plane
o
55 C to 71 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
C
C
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB
11,15
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
14.6 A
N/A
CPU COF
6
TDP
3,7
135.3 W
137 W
135.3 W
137 W
VID_VDD Min
9
1.200 V
1.200 V
1.200 V
1.200 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
105.0 A
93.5 A
105.0 A
94.3 A
CPU COF
6
2400 MHz
2100 MHz
14.1 A
2500 MHz
2200 MHz
TDP
3,7
124.6 W
113.3 W
124.6 W
126.3 W
VID_VDD Min
9
1.200 V
1.150 V
1.200 V
1.200 V
VID_VDD Max
9
1.250 V
1.175 V
1.250 V
1.200 V
IDD Max
3,10
97.2 A
78.1 A
97.6 A
86.2 A
1800 MHz
CPU COF
6
TDP
3,7
VID_VDD Min
1900 MHz
114 W
94.6 W
114 W
94.7 W
9
1.200 V
1.100 V
1.200 V
1.100 V
VID_VDD Max
9
1.250 V
1.100 V
1.250 V
1.100 V
IDD Max
3,10
89.2 A
64.3 A
89.6 A
65.3 A
1500 MHz
1600 MHz
CPU COF
6
TDP
3,7
103.3 W
77.9 W
103.3 W
78.5 W
VID_VDD Min
9
1.200 V
1.050 V
1.200 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
81.1 A
51.8 A
81.5 A
53 A
IDD Max
3,10
CPU COF
6
1200 MHz
1250 MHz
TDP
3,7
92.8 W
70.8 W
91.7 A
70.2 A
VID_VDD Min
9
1.200 V
1.050 V
1.200 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
3,10
73.0 A
45.1 A
72.1 A
45.1 A
3,10,14
44.1 A
17.5 A
41.5 A
16.3 A
IDD Max
S0.C1. Pmin IDD Max
S0
I/O Power
S3
Notes Single-Plane
OS2360YAL4BGD
OS8360YAL4BGD
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
43
PID: 43374 Rev 3.19 - June 2010
2.3.11
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WA pnc GH (115 W Server, Fr2 (1207)) Thermal and Power Specifications
OS2350W AL4BGH
OS8350W AL4BGH
OPN
State
Specification 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Dual-Plane
o
o
55 C to 76 C
1
Single-Plane
2
Thermal Profile
Dual-Plane
o
55 C to 76 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
D
D
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1600 MHz
1800 MHz
1600 MHz
1800 MHz
VID_VDDNB
11,15
N/A
1.250 V
N/A
1.250 V
IDDNB
12
N/A
14.9 A
N/A
14.3 A
CPU COF
6
TDP
3,7
114.1 W
115.0 W
114.1 W
115.0 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
88.8 A
77.5 A
89.2 A
78.5 A
CPU COF
6
2100 MHz
2000 MHz
1700 MHz
1800 MHz
TDP
3,7
102.8 W
104.4 W
102.8 W
104.8 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
80.3 A
69.0 A
80.7 A
70.0 A
CPU COF
6
1600 MHz
1400 MHz
TDP
3,7
91.5 W
85.0 W
95.3 W
88.6 W
VID_VDD Min
9
1.150 V
1.100 V
1.150 V
1.100 V
VID_VDD Max
9
1.250 V
1.175 V
1.250 V
1.200 V
IDD Max
3,10
72.3 A
55.2 A
75.3 A
58.9 A
CPU COF
6
TDP
3,7
84.5 W
74.9 W
85.1 W
75.2 W
VID_VDD Min
9
1.150 V
1.075 V
1.150 V
1.075 V
VID_VDD Max
9
1.250 V
1.125 V
1.250 V
1.125 V
IDD Max
3,10
66.9 A
47.5 A
67.3 A
48.5 A
CPU COF
6
1200 MHz
1300 MHz
1050 MHz
1000 MHz
TDP
3,7
77.7 W
66.4 W
76.6 W
65.5 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
3,10
61.6 A
40.5 A
60.7 A
40.4 A
3,10,14
25.2 A
7.1 A
23.5 A
6.4 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
Notes Single-Plane
OS2352W AL4BGH
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
44
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS2354W AL4BGH
OS8354W AL4BGH
OPN
State
Specification 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Dual-Plane
o
o
55 C to 76 C
1
Single-Plane
2
Thermal Profile
Dual-Plane
o
55 C to 76 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
D
D
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1600 MHz
1800 MHz
1600 MHz
2000 MHz
VID_VDDNB
11,15
N/A
1.250 V
N/A
1.250 V
IDDNB
12
N/A
13.7 A
N/A
13.8 A
2200 MHz
2300 MHz
CPU COF
6
TDP
3,7
114.1 W
115.0 W
113.2 W
115.0 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
89.3 A
79.1 A
89.5 A
79.2 A
CPU COF
6
2000 MHz
2000 MHz
TDP
3,7
106.6 W
108.2 W
101.9 W
104.8 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
83.7 A
73.5 A
81.5 A
71.2 A
CPU COF
6
1700 MHz
1700 MHz
TDP
3,7
95.4 W
88.8 W
91.3 W
86.1 W
VID_VDD Min
9
1.150 V
1.100 V
1.150 V
1.100 V
VID_VDD Max
9
1.250 V
1.175 V
1.250 V
1.175 V
IDD Max
3,10
75.7 A
59.8 A
73.5 A
57.9 A
1400 MHz
1400 MHz
CPU COF
6
TDP
3,7
85.2 W
75.6 W
81.1 W
74.2 W
VID_VDD Min
9
1.150 V
1.075 V
1.150 V
1.075 V
VID_VDD Max
9
1.250 V
1.125 V
1.250 V
1.100 V
IDD Max
3,10
67.8 A
49.5 A
65.5 A
48.1 A
CPU COF
6
1100 MHz
1150 MHz
TDP
3,7
75.0 W
64.6 W
72.9 W
64.6 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
3,10
59.8 A
40.3 A
58.8 A
40.1 A
3,10,14
21.9 A
5.7 A
21.0 A
5.0 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
Notes Single-Plane
OS2356W AL4BGH
OS8356W AL4BGH
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
45
PID: 43374 Rev 3.19 - June 2010
2.3.12
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm PA pnc GH (79 W Server, Fr2 (1207)) Thermal and Power Specifications
OPN
State
Specification 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Notes Single-Plane
Dual-Plane
o
o
55 C to 76 C
1
OS2346PAL4BGH
OS8346PAL4BGH
Single-Plane
2
Thermal Profile
Dual-Plane
o
55 C to 76 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
E
E
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1400 MHz
1600 MHz
1400 MHz
1600 MHz
VID_VDDNB
11,15
N/A
1.125 V
N/A
1.125 V
IDDNB Max
12
N/A
10.4 A
N/A
9.9 A
1700 MHz
CPU COF
6
TDP
3,7
76.8 W
77.5 W
77.0 W
77.7 W
VID_VDD Min
9
1.075 V
1.075 V
1.075 V
1.075 V
VID_VDD Max
9
1.125 V
1.125 V
1.125 V
1.125 V
IDD Max
3,10
63.6 A
55.0 A
63.8 A
55.7 A
CPU COF
6
1800 MHz
1600 MHz
1600 MHz
TDP
3,7
74.1 W
74.8 W
71.6 W
72.3 W
VID_VDD Min
9
1.075 V
1.075 V
1.075 V
1.075 V
VID_VDD Max
9
1.125 V
1.125 V
1.125 V
1.125 V
IDD Max
3,10
61.2 A
52.6 A
59.1 A
50.9 A
CPU COF
6
1400 MHz
1400 MHz
TDP
3,7
68.7 W
65.9 W
66.2 W
63.1 W
VID_VDD Min
9
1.075 V
1.050 V
1.075 V
1.050 V
VID_VDD Max
9
1.125 V
1.100 V
1.125 V
1.075 V
IDD Max
3,10
56.7 A
45.8 A
54.6 A
44.1 A
1200 MHz
CPU COF
6
TDP
3,7
63.3 W
57.4 W
60.9 W
55.1 W
VID_VDD Min
9
1.075 V
1.025 V
1.075 V
1.025 V
VID_VDD Max
9
1.125 V
1.050 V
1.125 V
1.050 V
IDD Max
3,10
52.2 A
39.2 A
50.1 A
37.8 A
CPU COF
6
1200 MHz
1000 MHz
1000 MHz
TDP
3,7
57.9 W
50.1 W
55.5 W
48.3 W
VID_VDD Min
9
1.075 V
1.000 V
1.075 V
1.000 V
VID_VDD Max
9
1.125 V
1.000 V
1.125 V
1.000 V
3,10
47.7 A
33.2 A
45.7 A
32.0 A
3,10,14
17.0 A
5.1 A
15.7 A
4.5 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
OS2344PAL4BGH
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
46
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS2347PAL4BGH
OS8347PAL4BGH
OPN
State
Specification 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Dual-Plane
o
o
55 C to 76 C
1
Single-Plane
2
Thermal Profile
Dual-Plane
o
55 C to 76 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
E
E
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1400 MHz
1600 MHz
1400 MHz
1800 MHz
VID_VDDNB
11,15
N/A
1.125 V
N/A
1.125 V
IDDNB Max
12
N/A
9.4 A
N/A
9.6 A
CPU COF
6
TDP
3,7
77.2 W
78.0 W
77.5 W
78.9 W
VID_VDD Min
9
1.075 V
1.075 V
1.075 V
1.075 V
VID_VDD Max
9
1.125 V
1.125 V
1.125 V
1.125 V
IDD Max
3,10
64.0 A
56.3 A
64.3 A
57.0 A
CPU COF
6
2000 MHz
1900 MHz
1700 MHz
1700 MHz
TDP
3,7
71.9 W
72.6 W
69.4 W
70.8 W
VID_VDD Min
9
1.075 V
1.075 V
1.075 V
1.075 V
VID_VDD Max
9
1.125 V
1.125 V
1.125 V
1.125 V
IDD Max
3,10
59.3 A
51.5 A
57.3 A
49.8 A
CPU COF
6
1400 MHz
1400 MHz
TDP
3,7
63.8 W
60.9 W
61.3 W
59.4 W
VID_VDD Min
9
1.075 V
1.050 V
1.075 V
1.050 V
VID_VDD Max
9
1.125 V
1.075 V
1.125 V
1.075 V
IDD Max
3,10
52.6 A
42.5 A
50.5 A
41.0 A
1200 MHz
CPU COF
6
TDP
3,7
58.4 W
53.4 W
56.0 W
52.1 W
VID_VDD Min
9
1.075 V
1.025 V
1.075 V
1.025 V
VID_VDD Max
9
1.125 V
1.050 V
1.125 V
1.050 V
IDD Max
3,10
48.1 A
36.4 A
46.1 A
35.1 A
CPU COF
6
1200 MHz
1000 MHz
1000 MHz
TDP
3,7
53.0 W
46.5 W
50.6 W
45.5 W
VID_VDD Min
9
1.075 V
1.000 V
1.075 V
1.000 V
VID_VDD Max
9
1.125 V
1.000 V
1.125 V
1.000 V
3,10
43.6 A
30.7 A
41.6 A
29.5 A
3,10,14
14.3 A
3.8 A
13.6 A
3.1 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
Notes Single-Plane
OS2350PAL4BGH
OS8350PAL4BGH
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
47
PID: 43374 Rev 3.19 - June 2010
2.3.13
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm YA pnc GH (137 W Server, Fr2 (1207)) Thermal and Power Specifications
OS2358YAL4BGH
OS8358YAL4BGH
OPN
State
Specification 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Dual-Plane
o
o
55 C to 71 C
1
Single-Plane
2
Thermal Profile
Dual-Plane
o
55 C to 71 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
C
C
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB
11,15
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
15.0 A
N/A
14.5 A
2400 MHz
2500 MHz
CPU COF
6
TDP
3,7
135.2 W
137.0 W
135.2 W
137.0 W
VID_VDD Min
9
1.200 V
1.200 V
1.200 V
1.200 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
105.5 A
93.2 A
106.0 A
94.1 A
CPU COF
6
2100 MHz
2200 MHz
TDP
3,7
123.9 W
125.7 W
123.9 W
126.1 W
VID_VDD Min
9
1.200 V
1.200 V
1.200 V
1.200 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
97.0 A
84.7 A
97.5 A
85.6 A
CPU COF
6
1800 MHz
1900 MHz
TDP
3,7
112.6 W
104.0 W
112.6 W
104.5 W
VID_VDD Min
9
1.200 V
1.150 V
1.200 V
1.150 V
VID_VDD Max
9
1.250 V
1.175 V
1.250 V
1.175 V
IDD Max
3,10
88.5 A
69.6 A
89.0 A
70.6 A
1500 MHz
1600 MHz
CPU COF
6
TDP
3,7
101.3 W
85.6 W
101.7 W
86.1 W
VID_VDD Min
9
1.200 V
1.125 V
1.200 V
1.100 V
VID_VDD Max
9
1.250 V
1.125 V
1.250 V
1.125 V
IDD Max
3,10
80.0 A
54.7 A
80.4 A
57.1 A
CPU COF
6
1200 MHz
1250 MHz
TDP
3,7
91.0 W
70.1 W
89.8 W
69.4 W
VID_VDD Min
9
1.200 V
1.050 V
1.200 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
3,10
71.5 A
43.9 A
70.5 A
43.9 A
3,10,14
26.1 A
6.4 A
24.5 A
5.8 A
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
Notes Single-Plane
OS2360YAL4BGH
OS8360YAL4BGH
I/O Power
13
7.2 W
7.2 W
7.2 W
7.2 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
48
PID: 43374 Rev 3.19 - June 2010
2.3.14
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WB pnc GH (115 W Server, AM2r2) Thermal and Power Specifications
OPN
State
Specification 8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Notes Single-Plane
Dual-Plane
o
o
55 C to 76 C
1
OS1354W BJ4BGH
Single-Plane
2
Thermal Profile
Dual-Plane
o
55 C to 76 oC
o
Tambient Min
70 C
70 oC
5 oC
5 oC
D
D
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
1600 MHz
1800 MHz
1600 MHz
1800 MHz
VID_VDDNB
11,15
N/A
1.250 V
N/A
1.250 V
IDDNB Max
12
N/A
14.0 A
N/A
13.4 A
2100 MHz
2200 MHz
CPU COF
6
TDP
3,7
114.1 W
115.0 W
114.1 W
115.0 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
89.8 A
79.5 A
89.8 A
80.0 A
IDD Max
3,10
CPU COF
6
TDP
3,7
102.8 W
104.8 W
106.6 W
107.9 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
81.4 A
71.0 A
84.5 A
74.3 A
CPU COF
6
TDP
3,7
95.3 W
88.4 W
95.3 W
88.3 W
VID_VDD Min
9
1.150 V
1.100 V
1.150 V
1.100 V
VID_VDD Max
9
1.250 V
1.200 V
1.250 V
1.175 V
IDD Max
3,10
76.1 A
59.8 A
76.5 A
60.5 A
1800 MHz
1600 MHz
1300 MHz
2000 MHz
1700 MHz
CPU COF
6
TDP
3,7
85.0 W
75.2 W
84.9 W
75.5 W
VID_VDD Min
9
1.150 V
1.075 V
1.150 V
1.075 V
VID_VDD Max
9
1.250 V
1.125 V
1.250 V
1.125 V
1400 MHz
68.1 A
49.5 A
68.5 A
50.5 A
IDD Max
3,10
CPU COF
6
TDP
3,7
76.5 W
65.3 W
74.7 W
64.4 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
1.250 V
1.050 V
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
OS1352W BJ4BGH
I/O Power
1050 MHz
1100 MHz
3,10
61.5 A
41.2 A
60.6 A
41.1 A
3,10,14
39.7 A
17.4 A
37.0 A
29.4 A
13
7.2 W
7.2 W
7.2 W
7.2 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
49
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OPN
State
S0.C0.Px
Specification8
OS1356WBJ4BGH
Notes Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 76 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
D
Thermal Profile
Startup P-State
5
S0.C0.P4
HTC P-State
4
S0.C0.P4
NB COF
S0.Cx.Px VID_VDDNB
6,15
1600 MHz
2000 MHz
11,15
N/A
1.250 V
IDDNB Max
12
N/A
13.3 A
CPU COF
6
TDP
3,7
113.2 W
115.0 W
S0.C0.P0 VID_VDD Min
9
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
89.7 A
80.0 A
CPU COF
6
2300 MHz
2000 MHz
TDP
S0.C0.P1 VID_VDD Min
3,7
101.9 W
104.4 W
9
1.150 V
1.150 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
81.7 A
72.0 A
CPU COF
6
1700 MHz
TDP
S0.C0.P2 VID_VDD Min
3,7
90.9 W
85.5 W
9
1.150 V
1.100 V
VID_VDD Max
9
1.250 V
1.175 V
IDD Max
3,10
73.7 A
58.5 A
CPU COF
6
TDP
3,7
80.7 W
73.5 W
S0.C0.P3 VID_VDD Min
9
1.150 V
1.075 V
VID_VDD Max
9
1.250 V
1.100 V
IDD Max
3,10
65.7 A
48.7 A
CPU COF
6
1400 MHz
1150 MHz
TDP
S0.C0.P4 VID_VDD Min
3,7
72.4 W
63.8 W
9
1.150 V
1.050 V
VID_VDD Max
9
1.250 V
1.050 V
IDD Max
S0.C1.Pmin IDD Max
S0
I/O Power
S3
I/O Power
3,10
59.0 A
40.7 A
3,10,14
34.2 A
14.2 A
13
7.2 W
7.2 W
13
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
50
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
2.3.15 OE mmmm FM pnc GH (79 W Embedded Server, Fr2 (1207)) Thermal and Power Specifications
OE23GFFML4BGH16
OPN
Sta te
S0.C0.Px
S0.Cx .Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Spe cifica tion 8
Dua l-Pla ne
Single -Pla ne
Dua l-Pla ne
Tcase Max
1
61 oC to 86 o C
61 oC to 86 o C
Tctl Max
2
70 oC
70 oC
o
5 oC
5 C
Tambient Min
Thermal Profile
F
F
S0.C0.P4
S0.C0.P4
Startup P-State
5
HTC P-State
4
NB COF
6,15
1400 MHz
1600 MHz
1400 MHz
1600 MHz
VID_VDDNB
11,15
N/A
1.125 V
N/A
1.125 V
IDDNB Max
12
N/A
11.9 A
N/A
11.4 A
S0.C0.P4
S0.C0.P4
CPU COF
6
TDP
3,7
78.3 W
79.0 W
78.3 W
79.0 W
VID_VDD Min
9
1.075 V
1.075 V
1.075 V
1.075 V
VID_VDD Max
9
1.125 V
1.125 V
1.125 V
1.125 V
IDD Max
3,10
66.3 A
56.2 A
66.4 A
56.7 A
CPU COF
6
1700 MHz
1800 MHz
1600 MHz
1600 MHz
TDP
3,7
75.8 W
76.8 W
73.4 W
74.6 W
VID_VDD Min
9
1.075 V
1.075 V
1.075 V
1.075 V
VID_VDD Max
9
1.125 V
1.125 V
1.125 V
1.125 V
IDD Max
3,10
64.3 A
54.2 A
62.4 A
52.6 A
CPU COF
6
TDP
3,7
70.9 W
68.4 W
68.5 W
66.4 W
VID_VDD Min
9
1.075 V
1.050 V
1.075 V
1.050 V
VID_VDD Max
9
1.125 V
1.100 V
1.125 V
1.075 V
IDD Max
3,10
60.2 A
47.5 A
58.3 A
46.1 A
CPU COF
6
1400 MHz
1400 MHz
1200 MHz
1200 MHz
TDP
3,7
66.0 W
60.8 W
63.6 W
59.0 W
VID_VDD Min
9
1.075 V
1.025 V
1.075 V
1.025 V
VID_VDD Max
9
1.125 V
1.050 V
1.125 V
1.050 V
IDD Max
3,10
56.1 A
41.2 A
54.2 A
39.9 A
CPU COF
6
TDP
3,7
61.2 W
53.9 W
59.1 W
52.2 W
VID_VDD Min
9
1.075 V
1.000 V
1.075 V
1.000 V
VID_VDD Max
9
1.125 V
1.000 V
1.125 V
1.000 V
34.1 A
IDD Max
S0.C1.Pm in IDD Max
S0
I/O Power
S3
Note s Single -Pla ne
OE13HFFML4BGH16
OE23HFFML4BGH
OE83HFFML4BGH
I/O Power
1000 MHz
1000 MHz
3,10
52.1 A
35.3 A
50.1 A
3,10,14
21.3 A
7.1 A
20.0 A
6.5 A
13
7.2 W
7.2 W
7.2 W
7.2 W
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
51
PID: 43374 Rev 3.19 - June 2010
2.3.16
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WA pnc GI (115 W Server, Fr2 (1207)) Thermal and Power Specifications
OS2384WAL4DGI
OS8384WAL4DGI
OPN
State
Specification8
Tcase Max
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
1
Single-Plane
Dual-Plane
o
o
55 C to 77 C
Single-Plane
Dual-Plane
o
55 C to 77 oC
70 C
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
G
G
Tctl Max
S0.C0.Px
Notes
OS2382WAL4DGI
OS8382WAL4DGI
o
2
Startup P-State
5
S0.C0.P3
S0.C0.P3
HTC P-State
4
S0.C0.P3
S0.C0.P3
NB COF
6,15
1600 MHz
2200 MHz
1600 MHz
2200 MHz
VID_VDDNB Min
11,15
N/A
1.150 V
N/A
1.150 V
VID_VDDNB Max
11,15
N/A
1.300 V
N/A
1.300 V
IDDNB Max
12
N/A
20.0 A
N/A
20.0 A
CPU COF
6
TDP
3,7
115.0 W
115.0 W
115.0 W
115.0 W
VID_VDD Min
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.325 V
1.325 V
1.325 V
1.325 V
IDD Max
3,10
90.0 A
72.7 A
90.0 A
72.2 A
CPU COF
6
2600 MHz
2700 MHz
1900 MHz
2000 MHz
TDP
3,7
100.4 W
84.8 W
100.4 W
84.7 W
VID_VDD Min
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.225 V
1.225 V
1.225 V
1.225 V
IDD Max
3,10
79.9 A
50.1 A
79.9 A
49.6 A
1400 MHz
CPU COF
6
TDP
3,7
92.1 W
66.1 W
92.1 W
65.8 W
VID_VDD Min
9
1.150 V
0.950 V
1.150 V
0.950 V
VID_VDD Max
9
1.150 V
1.125 V
1.150 V
1.125 V
IDD Max
3,10
72.7 A
35.1 A
72.7 A
34.5 A
CPU COF
6
TDP
3,7
80.5 W
51.1 W
82.2 W
53.1 W
VID_VDD Min
9
1.150 V
0.850 V
1.150 V
0.875 V
VID_VDD Max
9
1.150 V
1.025 V
1.150 V
1.050 V
IDD Max
3,10
62.6 A
21.4 A
64.1 A
23.2 A
IDD Max (Pre-Flush)
3,10,17
33.7 A
6.4 A
34.0 A
7.0 A
IDD Max (Post-Flush) 3,10,17
31.1 A
4.6 A
31.5 A
5.2 A
1500 MHz
800 MHz
800 MHz
S0
I/O Power
13
8.5 W
8.5 W
8.5 W
8.5 W
S3
I/O Power
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80
AMD Opteron™ Processor
52
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS2380WAL4DGI
OS8380WAL4DGI
OPN
State
Specification8
Tcase Max
S0.Cx.Px
1
Dual-Plane
o
o
55 C to 77 C
Single-Plane
Dual-Plane
o
55 C to 77 oC
70 C
70 oC
Tambient Min
5 oC
5 oC
Thermal Profile
G
G
Tctl Max
S0.C0.Px
Notes Single-Plane
OS2378WAL4DGI
OS8378WAL4DGI
o
2
Startup P-State
5
S0.C0.P3
S0.C0.P3
HTC P-State
4
S0.C0.P3
S0.C0.P3
NB COF
6,15
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,15
N/A
1.150 V
N/A
1.150 V
VID_VDDNB Max
11,15
N/A
1.300 V
N/A
1.300 V
IDDNB Max
12
N/A
20.0 A
N/A
20.0 A
CPU COF
6
2500 MHz
2400 MHz
TDP
S0.C0.P0 VID_VDD Min
3,7
115.0 W
115.0 W
115.0 W
115.0 W
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.325 V
1.325 V
1.325 V
1.325 V
IDD Max
3,10
90.0 A
71.8 A
90.0 A
71.4 A
CPU COF
6
1800 MHz
1700 MHz
TDP
S0.C0.P1 VID_VDD Min
3,7
100.4 W
84.4 W
100.4 W
83.8 W
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.225 V
1.225 V
1.225 V
1.225 V
IDD Max
3,10
79.9 A
49.0 A
79.9 A
48.5 A
1300 MHz
1200 MHz
CPU COF
6
TDP
3,7
92.1 W
65.5 W
92.1 W
64.6 W
S0.C0.P2 VID_VDD Min
9
1.150 V
0.950 V
1.150 V
0.950 V
VID_VDD Max
9
1.150 V
1.125 V
1.150 V
1.125 V
IDD Max
3,10
72.7 A
33.9 A
72.7 A
33.3 A
CPU COF
6
TDP
3,7
83.8 W
53.9 W
85.5 W
57.6 W
S0.C0.P3 VID_VDD Min
9
1.150 V
0.875 V
1.150 V
0.900 V
VID_VDD Max
9
1.150 V
1.050 V
1.150 V
1.075 V
IDD Max
3,10
65.5 A
23.7 A
67.0 A
25.6 A
IDD Max (Pre-Flush)
3,10,17
34.4 A
7.2 A
35.2 A
8.2 A
IDD Max (Post-Flush) 3,10,17
31.8 A
5.4 A
32.7 A
6.1 A
S0.C1.Pmin
800 MHz
800 MHz
S0
I/O Power
13
8.5 W
8.5 W
8.5 W
8.5 W
S3
I/O Power
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
53
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OPN
State
S0.C0.Px
S0.Cx.Px
Specification8
OS2376WAL4DGI
Notes Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 77 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
G
Thermal Profile
Startup P-State
5
S0.C0.P3
HTC P-State
4
S0.C0.P3
NB COF
6,15
1600 MHz
2000 MHz
VID_VDDNB Min
11,15
N/A
1.150 V
VID_VDDNB Max
11,15
N/A
1.300 V
IDDNB Max
12
N/A
20.0 A
CPU COF
6
2300 MHz
TDP
S0.C0.P0 VID_VDD Min
3,7
115.0 W
115.0 W
9
1.150 V
1.150 V
VID_VDD Max
9
1.325 V
1.325 V
IDD Max
3,10
90.0 A
71.0 A
CPU COF
6
1600 MHz
TDP
S0.C0.P1 VID_VDD Min
3,7
99.7 W
83.5 W
9
1.150 V
1.075 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
79.3 A
47.9 A
1100 MHz
CPU COF
6
TDP
3,7
91.4 W
64.2 W
S0.C0.P2 VID_VDD Min
9
1.150 V
1.000 V
VID_VDD Max
9
1.175 V
1.175 V
IDD Max
3,10
72.1 A
32.7 A
CPU COF
6
TDP
3,7
86.4 W
58.4 W
S0.C0.P3 VID_VDD Min
9
1.150 V
0.900 V
VID_VDD Max
9
1.150 V
1.075 V
IDD Max
3,10
67.8 A
27.5 A
IDD Max (Pre-Flush)
3,10,17
35.7 A
8.9 A
IDD Max (Post-Flush) 3,10,17
33.1 A
6.8 A
S0.C1.Pmin
800 MHz
S0
I/O Power
13
8.5 W
8.5 W
S3
I/O Power
13
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
54
PID: 43374 Rev 3.19 - June 2010
2.3.17
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm PA pnc GI (79 W Server, Fr2 (1207)) Thermal and Power Specifications
OS2372PAL4DGI
OPN
State
Specification8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
Notes Single-Plane
Dual-Plane
o
o
55 C to 76 C
1
OS2374PAL4DGI
OS8374PAL4DGI
Single-Plane
55 C to 76 oC
o
2
Tambient Min
Thermal Profile
Dual-Plane
o
70 C
70 oC
5 oC
5 oC
H
H
Startup P-State
5
S0.C0.P3
S0.C0.P3
HTC P-State
4
S0.C0.P3
S0.C0.P3
NB COF
6,15
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,15
N/A
1.150 V
N/A
1.150 V
VID_VDDNB Max
11,15
N/A
1.200 V
N/A
1.200 V
IDDNB Max
12
N/A
13.4 A
N/A
12.9 A
CPU COF
6
2100 MHz
2200 MHz
TDP
S0.C0.P0 VID_VDD Min
3,7
79.0 W
79.0 W
79.0 W
79.0 W
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.325 V
1.325 V
1.325 V
1.325 V
IDD Max
3,10
60.3 A
48.8 A
60.0 A
49.1 A
CPU COF
6
1600 MHz
1700 MHz
TDP
S0.C0.P1 VID_VDD Min
3,7
69.6 W
61.8 W
69.2 W
61.9 W
9
1.150 V
1.075 V
1.150 V
1.075 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
53.1 A
35.9 A
52.8 A
36.2 A
1400 MHz
1300 MHz
CPU COF
6
TDP
3,7
64.6 W
51.1 W
64.2 W
51.2 W
S0.C0.P2 VID_VDD Min
9
1.150 V
1.000 V
1.150 V
1.000 V
VID_VDD Max
9
1.175 V
1.175 V
1.175 V
1.175 V
IDD Max
3,10
48.8 A
27.5 A
48.5 A
27.9 A
CPU COF
6
TDP
3,7
56.3 W
40.9 W
54.3 W
39.9 W
S0.C0.P3 VID_VDD Min
9
1.150 V
0.925 V
1.150 V
0.925 V
VID_VDD Max
9
1.150 V
1.100 V
1.150 V
1.100 V
IDD Max
3,10
41.6 A
18.4 A
39.8 A
17.7 A
IDD Max (Pre-Flush)
3,10,17
21.0 A
5.3 A
20.2 A
5.1 A
IDD Max (Post-Flush) 3,10,17
18.4 A
3.3 A
17.6 A
3.0 A
S0.C1.Pmin
800 MHz
800 MHz
S0
I/O Power
13
8.5 W
8.5 W
8.5 W
8.5 W
S3
I/O Power
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
55
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS2376PAL4DGI
OS8376PAL4DGI
OPN
State
S0.C0.Px
S0.Cx.Px
Specification8
Notes Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 76 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
H
Thermal Profile
Startup P-State
5
S0.C0.P3
HTC P-State
4
S0.C0.P3
NB COF
6,15
1600 MHz
2000 MHz
VID_VDDNB Min
11,15
N/A
1.150 V
VID_VDDNB Max
11,15
N/A
1.200 V
IDDNB Max
12
N/A
12.5 A
CPU COF
6
2300 MHz
TDP
S0.C0.P0 VID_VDD Min
3,7
79.0 W
79.0 W
9
1.150 V
1.150 V
VID_VDD Max
9
1.325 V
1.325 V
IDD Max
3,10
60.3 A
49.7 A
CPU COF
6
1800 MHz
TDP
S0.C0.P1 VID_VDD Min
3,7
69.6 W
62.0 W
9
1.150 V
1.075 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
53.1 A
36.9 A
CPU COF
6
TDP
3,7
64.6 W
51.2 W
S0.C0.P2 VID_VDD Min
9
1.150 V
1.000 V
VID_VDD Max
9
1.175 V
1.175 V
IDD Max
3,10
48.8 A
28.6 A
CPU COF
6
TDP
3,7
53.0 W
37.7 W
S0.C0.P3 VID_VDD Min
9
1.150 V
0.900 V
VID_VDD Max
9
1.150 V
1.075 V
IDD Max
3,10
38.7 A
16.4 A
IDD Max (Pre-Flush)
3,10,17
19.4 A
4.6 A
IDD Max (Post-Flush) 3,10,17
16.7 A
2.6 A
S0.C1.Pmin
1500 MHz
800 MHz
S0
I/O Power
13
8.5 W
8.5 W
S3
I/O Power
13
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
56
PID: 43374 Rev 3.19 - June 2010
2.3.18
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm YA pnc GI (137 W Server, Fr2 (1207)) Thermal and Power Specifications
OS2386YAL4DGI
OS8386YAL4DGI
OPN
State
S0.C0.Px
S0.Cx.Px
Specification8
Notes Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 73 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
I
Thermal Profile
Startup P-State
5
S0.C0.P3
HTC P-State
4
S0.C0.P3
NB COF
6,15
1600 MHz
2200 MHz
VID_VDDNB Min
11,15
N/A
1.150 V
VID_VDDNB Max
11,15
N/A
1.300 V
IDDNB Max
12
N/A
20.0 A
CPU COF
6
TDP
S0.C0.P0 VID_VDD Min
VID_VDD Max
2800 MHz
3,7
137 W
137 W
9
1.225 V
1.225 V
9
1.325 V
1.325 V
IDD Max
3,10
102.8 A
82.9 A
CPU COF
6
2100 MHz
TDP
S0.C0.P1 VID_VDD Min
3,7
96.4 W
99.5 W
9
1.150 V
1.125 V
VID_VDD Max
9
1.225 V
1.225 V
IDD Max
3,10
76.4 A
57.4 A
CPU COF
6
TDP
3,7
88.1 W
76.0 W
S0.C0.P2 VID_VDD Min
9
1.150 V
1.025 V
VID_VDD Max
9
1.150 V
1.125 V
IDD Max
3,10
69.2 A
40.4 A
CPU COF
6
TDP
3,7
74.9 W
56.0 W
S0.C0.P3 VID_VDD Min
9
1.150 V
0.925 V
VID_VDD Max
9
1.150 V
1.025 V
IDD Max
3,10
57.7 A
24.0 A
IDD Max (Pre-Flush)
3,10,17
36.2 A
7.5 A
IDD Max (Post-Flush) 3,10,17
33.6 A
5.5 A
S0.C1.Pmin
1600 MHz
800 MHz
S0
I/O Power
13
8.5 W
8.5 W
S3
I/O Power
13
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
57
PID: 43374 Rev 3.19 - June 2010
2.3.19
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WH pnc GI (115 W Server, Fr5 (1207)) Thermal and Power Specifications
OS2387WHP4DGI
OS8387WHP4DGI
OPN
State
Specification8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
Notes Single-Plane
Dual-Plane
o
o
55 C to 77 C
1
OS2389WHP4DGI
OS8389WHP4DGI
Single-Plane
55 C to 77 oC
o
2
Tambient Min
Thermal Profile
Dual-Plane
o
70 C
70 oC
5 oC
5 oC
G
G
Startup P-State
5
S0.C0.P3
S0.C0.P3
HTC P-State
4
S0.C0.P3
S0.C0.P3
NB COF
6,15
1600 MHz
2200 MHz
1600 MHz
2200 MHz
VID_VDDNB Min
11,15
N/A
1.150 V
N/A
1.150 V
VID_VDDNB Max
11,15
N/A
1.200 V
N/A
1.200 V
IDDNB Max
12
N/A
20.0 A
N/A
20.0 A
CPU COF
6
2800 MHz
2900 MHz
TDP
S0.C0.P0 VID_VDD Min
3,7
115.0 W
115.0 W
115.0 W
115.0 W
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.325 V
1.325 V
1.325 V
1.325 V
IDD Max
3,10
90.0 A
73.1 A
90.0 A
73.5 A
CPU COF
6
2100 MHz
2300 MHz
TDP
S0.C0.P1 VID_VDD Min
3,7
100.4 W
84.5 W
102.1 W
86.2 W
9
1.150 V
1.050 V
1.150 V
1.050 V
VID_VDD Max
9
1.225 V
1.225 V
1.225 V
1.225 V
IDD Max
3,10
79.9 A
50.7 A
81.4 A
52.5 A
1600 MHz
1700 MHz
CPU COF
6
TDP
3,7
92.1 W
65.3 W
92.1 W
66.0 W
S0.C0.P2 VID_VDD Min
9
1.150 V
0.950 V
1.150 V
0.950 V
VID_VDD Max
9
1.150 V
1.125 V
1.150 V
1.125 V
IDD Max
3,10
72.7 A
35.7 A
72.7 A
36.3 A
CPU COF
6
TDP
3,7
78.9 W
49.4 W
77.2 W
48.1 W
S0.C0.P3 VID_VDD Min
9
1.150 V
0.850 V
1.150 V
0.825 V
VID_VDD Max
9
1.150 V
1.025 V
1.150 V
1.000 V
IDD Max
3,10
61.2 A
21.0 A
59.8 A
19.6 A
IDD Max (Pre-Flush)
3,10,17
33.2 A
6.2 A
32.4 A
5.6 A
IDD Max (Post-Flush) 3,10,17
30.6 A
4.5 A
29.8 A
3.9 A
S0.C1.Pmin
800 MHz
800 MHz
S0
I/O Power
13
8.5 W
8.5 W
8.5 W
8.5 W
S3
I/O Power
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
58
PID: 43374 Rev 3.19 - June 2010
2.3.20
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm PC pnc GI (79 W Server, Fr5 (1207)) Thermal and Power Specifications
OS2379PCP4DGI
OS8379PCP4DGI
OPN
State
Specification8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
Notes Single-Plane
Dual-Plane
o
o
55 C to 76 C
1
OS2381PCP4DGI
OS8381PCP4DGI
Single-Plane
55 C to 76 oC
o
2
Tambient Min
Thermal Profile
Dual-Plane
o
70 C
70 oC
5 oC
5 oC
H
H
Startup P-State
5
S0.C0.P3
S0.C0.P3
HTC P-State
4
S0.C0.P3
S0.C0.P3
NB COF
6,15
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,15
N/A
1.100 V
N/A
1.100 V
VID_VDDNB Max
11,15
N/A
1.150 V
N/A
1.150 V
IDDNB Max
12
N/A
11.2 A
N/A
10.8 A
CPU COF
6
2500 MHz
2400 MHz
TDP
S0.C0.P0 VID_VDD Min
3,7
79.0 W
79.0 W
79.0 W
79.0 W
9
1.150 V
1.150 V
1.150 V
1.150 V
VID_VDD Max
9
1.325 V
1.325 V
1.325 V
1.325 V
IDD Max
3,10
61.3 A
50.8 A
61.3 A
51.2 A
CPU COF
6
2100 MHz
1900 MHz
TDP
S0.C0.P1 VID_VDD Min
3,7
70.7 W
61.6 W
72.4 W
63.1 W
9
1.150 V
1.075 V
1.150 V
1.075 V
VID_VDD Max
9
1.250 V
1.250 V
1.250 V
1.250 V
IDD Max
3,10
54.1 A
37.9 A
55.5 A
39.8 A
1700 MHz
1500 MHz
CPU COF
6
TDP
3,7
64.1 W
49.4 W
65.7 W
50.6 W
S0.C0.P2 VID_VDD Min
9
1.150 V
1.000 V
1.150 V
1.000 V
VID_VDD Max
9
1.175 V
1.175 V
1.175 V
1.175 V
IDD Max
3,10
48.3 A
28.4 A
49.8 A
30.2 A
CPU COF
6
TDP
3,7
52.5 W
34.6 W
50.8 W
32.7 W
S0.C0.P3 VID_VDD Min
9
1.150 V
0.875 V
1.150 V
0.850 V
VID_VDD Max
9
1.150 V
1.050 V
1.150 V
1.025 V
IDD Max
3,10
38.3 A
20.4 A
36.8 A
18.8 A
IDD Max (Pre-Flush)
3,10,17
18.4 A
4.2 A
17.6 A
3.8 A
IDD Max (Post-Flush) 3,10,17
15.8 A
2.3 A
15.0 A
2.0 A
S0.C1.Pmin
800 MHz
800 MHz
S0
I/O Power
13
8.5 W
8.5 W
8.5 W
8.5 W
S3
I/O Power
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
59
PID: 43374 Rev 3.19 - June 2010
2.3.21
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm YC pnc GI (137 W Server, Fr5 (1207)) Thermal and Power Specifications
OS2393YCP4DGI
OS8393YCP4DGI
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
Specification8
Notes Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 73 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
Thermal Profile
I
Startup P-State
5
S0.C0.P3
HTC P-State
4
S0.C0.P3
NB COF
6,15
1600 MHz
2200 MHz
VID_VDDNB Min
11,15
N/A
1.150 V
VID_VDDNB Max
11,15
N/A
1.200 V
IDDNB Max
12
N/A
19.6 A
CPU COF
6
TDP
3,7
137.0 W
137.0 W
VID_VDD Min
9
1.225 V
1.225 V
VID_VDD Max
9
1.325 V
1.325 V
IDD Max
3,10
104.9 A
85.5 A
CPU COF
6
TDP
3,7
99.4 W
99.7 W
VID_VDD Min
9
1.150 V
1.125 V
VID_VDD Max
9
1.225 V
1.225 V
IDD Max
3,10
79.0 A
60.2 A
CPU COF
6
TDP
3,7
91.1 W
76.2 W
VID_VDD Min
9
1.150 V
1.025 V
VID_VDD Max
9
1.150 V
1.125 V
IDD Max
3,10
71.8 A
43.1 A
CPU COF
6
TDP
3,7
72.9 W
48.6 W
VID_VDD Min
9
1.150 V
0.850 V
VID_VDD Max
9
1.150 V
0.950 V
IDD Max
3,10
56.0 A
19.6 A
IDD Max (Pre-Flush)
3,10,17
36.2 A
7.5 A
IDD Max (Post-Flush) 3,10,17
33.6 A
5.5 A
3100 MHz
2400 MHz
1900 MHz
800 MHz
S0
I/O Power
13
8.5 W
8.5 W
S3
I/O Power
13
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
60
PID: 43374 Rev 3.19 - June 2010
2.3.22
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WG pnc GI (115 W Server, AM3) Thermal and Power Specifications
OPN
State
Specification8
Tcase Max
Tctl Max
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
OS1381WGK4DGI
Notes Single-Plane
1
Dual-Plane
o
o
55 C to 77 C
OS1385WGK4DGI
Single-Plane
55 C to 77 oC
o
2
Tambient Min
Thermal Profile
Dual-Plane
o
70 C
70 oC
5 oC
5 oC
G
G
Startup P-State
5
S0.C0.P3
S0.C0.P3
HTC P-State
4
S0.C0.P3
S0.C0.P3
NB COF
6,15
1600 MHz
2200 MHz
1600 MHz
2200 MHz
VID_VDDNB Min
11,15
N/A
1.150 V
N/A
1.150 V
VID_VDDNB Max
11,15
N/A
1.200 V
N/A
1.200 V
IDDNB Max
12
N/A
20.0 A
N/A
20.0 A
CPU COF
6
TDP
3,7
VID_VDD Min
VID_VDD Max
IDD Max
3,10
CPU COF
6
2500 MHz
2700 MHz
115 W
115 W
115 W
115 W
9
1.150 V
1.150 V
1.150V
1.150V
9
1.325 V
1.325 V
1.325V
1.325V
92.2 A
73.4 A
92.7 A
74.4 A
2000 MHz
1800 MHz
TDP
3,7
76.0 W
83.1 W
76.8 W
83.8 W
VID_VDD Min
9
1.050 V
1.050 V
1.050V
1.050V
VID_VDD Max
9
1.225 V
1.225 V
1.225V
1.225V
IDD Max
3,10
64.2 A
50.1 A
65.2 A
51.4 A
CPU COF
6
TDP
3,7
66.4 W
63.4 W
68.5 W
64.4 W
VID_VDD Min
9
1.050V
0.950V
1.050V
0.950V
VID_VDD Max
9
1.125V
1.125V
1.125V
1.125V
IDD Max
3,10
56.8 A
34.7 A
58.8 A
36.1 A
CPU COF
6
TDP
3,7
59.7 W
51.4 W
59.1 W
48.9 W
VID_VDD Min
9
1.050V
0.875V
1.050V
0.850V
VID_VDD Max
9
1.050V
1.050V
1.050V
1.025V
IDD Max
3,10
50.4 A
24.1 A
49.9 A
22.2 A
IDD Max (Pre-Flush)
3,10,17
29.9 A
7.4 A
29.6 A
6.6 A
IDD Max (Post-Flush) 3,10,17
27.6 A
5.5 A
27.3 A
4.9 A
1300 MHz
1500 MHz
800 MHz
800 MHz
S0
I/O Power
13
8.5 W
8.5 W
8.5 W
8.5 W
S3
I/O Power
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
61
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
OS1389WGK4DGI
Specification8
Notes Single-Plane
Dual-Plane
o
Tcase Max
1
55 C to 77 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
G
Thermal Profile
Startup P-State
5
S0.C0.P3
HTC P-State
4
S0.C0.P3
NB COF
6,15
1600 MHz
2200 MHz
VID_VDDNB Min
11,15
N/A
1.150 V
VID_VDDNB Max
11,15
N/A
1.200 V
IDDNB Max
12
N/A
20.0 A
CPU COF
6
TDP
3,7
VID_VDD Min
VID_VDD Max
IDD Max
3,10
CPU COF
6
TDP
3,7
80.0 W
85.5 W
VID_VDD Min
9
1.050 V
1.050 V
VID_VDD Max
9
1.225 V
1.225 V
IDD Max
3,10
67.0 A
53.8 A
CPU COF
6
TDP
3,7
69.0 W
64.7 W
VID_VDD Min
9
1.050V
0.950V
VID_VDD Max
9
1.125V
1.125V
IDD Max
3,10
59.3 A
37.2 A
CPU COF
6
TDP
3,7
57.0 W
46.3 W
VID_VDD Min
9
1.050V
0.825V
VID_VDD Max
9
1.050V
1.000V
IDD Max
3,10
47.9 A
20.3 A
IDD Max (Pre-Flush)
3,10,17
28.6 A
5.8 A
IDD Max (Post-Flush) 3,10,17
26.3 A
4.2 A
2900 MHz
115 W
115 W
9
1.150 V
1.150 V
9
1.325 V
1.325 V
92.7 A
75.2 A
2300 MHz
1700 MHz
800 MHz
S0
I/O Power
13
8.5 W
8.5 W
S3
I/O Power
13
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
62
PID: 43374 Rev 3.19 - June 2010
2.3.23
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm NA pnc GI (60 W Server, Fr5 (1207)) Thermal and Power Specifications
OS2373NAP4DGI
OS8373NAP4DGI
OPN
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
S0.C1.Pmin
Specification8
Notes Single-Plane
Dual-Plane
OS2377NAP4DGI
Single-Plane
Dual-Plane
Tcase Max
1
55 oC to 68 oC
55 oC to 68 oC
Tctl Max
2
70 oC
70 oC
5 oC
5 oC
Tambient Min
Thermal Profile
J
J
S0.C0.P4
S0.C0.P4
Startup P-State
5
HTC P-State
4
NB COF
6,15
1600 MHz
2000 MHz
1600 MHz
2000 MHz
VID_VDDNB Min
11,15
N/A
1.075 V
N/A
1.075 V
VID_VDDNB Max
11,15
N/A
1.075 V
N/A
1.075 V
IDDNB Max
12
N/A
7.7 A
N/A
7.7 A
CPU COF
6
TDP
3,7
57.2 W
60.0 W
59.6 W
60.0 W
VID_VDD Min
9
1.075 V
1.050 V
1.075 V
1.050 V
VID_VDD Max
9
1.100 V
1.100 V
1.100 V
1.100 V
IDD Max
3,10
44.3 A
37.1 A
46.4 A
39.4 A
CPU COF
6
TDP
3,7
51.4 W
52.3 W
54.2 W
54.6 W
VID_VDD Min
9
1.075 V
1.025 V
1.075 V
1.025 V
VID_VDD Max
9
1.075 V
1.075 V
1.075 V
1.075 V
IDD Max
3,10
39.9 A
33.0 A
42.5 A
35.3 A
CPU COF
6
S0.C0.P4
S0.C0.P4
2300 MHz
2100 MHz
1900 MHz
2100 MHz
1700 MHz
1900 MHz
TDP
3,7
48.5 W
47.4 W
51.4 W
49.6 W
VID_VDD Min
9
1.075 V
1.000 V
1.075 V
1.000 V
VID_VDD Max
9
1.075 V
1.050 V
1.075 V
1.050 V
IDD Max
3,10
37.2 A
29.2 A
39.9 A
31.4 A
CPU COF
6
1500 MHz
1700 MHz
TDP
3,7
45.7 W
43.0 W
48.5 W
45.0 W
VID_VDD Min
9
1.075 V
0.975 V
1.075 V
0.975 V
VID_VDD Max
9
1.075 V
1.025 V
1.075 V
1.025 V
IDD Max
3,10
34.6 A
25.6 A
37.2 A
27.7 A
CPU COF
6
800 MHz
800 MHz
TDP
3,7
35.8 W
28.9 W
35.8 W
28.5 W
VID_VDD Min
9
1.075 V
0.850 V
1.075 V
0.850 V
VID_VDD Max
9
1.075 V
0.900 V
1.075 V
0.900 V
IDD Max
3,10
25.4 A
13.4 A
25.4 A
13.2 A
IDD Max (Pre-Flush)
3,10,17
11.9 A
3.5 A
11.9 A
3.4 A
9.4 A
1.5 A
9.4 A
1.4 A
IDD Max (Post-Flush) 3,10,17
S0
I/O Power
13
8.5 W
8.5 W
8.5 W
8.5 W
S3
I/O Power
13
350 mW
350 mW
350 mW
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
63
PID: 43374 Rev 3.19 - June 2010
2.3.24
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WJ pnc GN (115 W Server, Fr6 (1207)) Thermal and Power Specifications
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Specification8
Notes
OS2427WJS6DGN
OS2431WJS6DGN
OS8431WJS6DGN
Tcase Max
1
55 oC to 76 oC
55 oC to 76 oC
Tctl Max
2
70 oC
70 oC
o
5 oC
Tambient Min
5 C
Thermal Profile
K
K
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
2200 MHz
2200 MHz
VID_VDDNB Min
15
1.175 V
1.175 V
VID_VDDNB Max
15
1.200 V
1.200 V
IDDNB Max
12
20.0 A
20.0 A
CPU COF
6
2200 MHz
2400 MHz
TDP
3,7
115.0 W
115.0 W
VID_VDD Min
9
1.025 V
1.025 V
VID_VDD Max
9
1.300 V
1.300 V
IDD Max
3,10
78.3 A
79.7 A
CPU COF
6
1700 MHz
1900 MHz
TDP
3,7
93.0 W
93.8 W
VID_VDD Min
9
0.975 V
0.975 V
VID_VDD Max
9
1.250 V
1.250 V
IDD Max
3,10
CPU COF
6
TDP
60.5 A
62.2 A
1300 MHz
1500 MHz
3,7
80.5 W
81.8 W
VID_VDD Min
9
0.950 V
0.950 V
VID_VDD Max
9
1.225 V
1.225 V
IDD Max
3,10
CPU COF
6
49.4 A
51.4 A
1000 MHz
1200 MHz
TDP
3,7
71.1 W
69.4 W
VID_VDD Min
9
0.925 V
0.900 V
VID_VDD Max
9
1.200 V
1.175 V
IDD Max
3,10
CPU COF
6
41.1 A
40.6 A
800 MHz
800 MHz
TDP
3,7
59.2 W
57.8 W
VID_VDD Min
9
0.850 V
0.850 V
VID_VDD Max
9
1.125 V
1.125 V
IDD Max
3,10
30.9 A
29.5 A
IDD Max (Pre-Flush)
3,10,17
10.5 A
10.0 A
IDD Max (Post-Flush) 3,10,17
8.2 A
7.7 A
S0
I/O Power
13
9.8 W
9.8 W
S3
I/O Power
13
350 mW
350 mW
S0.C1.Pmin
The notes for this table are on page 80.
AMD Opteron™ Processor
64
PID: 43374 Rev 3.19 - June 2010
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
S0.C1.Pmin
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Specification8
Notes
OS2435WJS6DGN
OS8435WJS6DGN
Tcase Max
1
55 oC to 76 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
Thermal Profile
K
Startup P-State
5
S0.C0.P4
HTC P-State
4
S0.C0.P4
NB COF
6,15
2200 MHz
VID_VDDNB Min
15
1.175 V
VID_VDDNB Max
15
1.200 V
IDDNB Max
12
17.4 A
CPU COF
6
2600 MHz
TDP
3,7
115.0 W
VID_VDD Min
9
1.075 V
VID_VDD Max
9
1.300 V
IDD Max
3,10
CPU COF
6
TDP
3,7
93.2 W
VID_VDD Min
9
1.025 V
VID_VDD Max
9
1.250 V
IDD Max
3,10
CPU COF
6
80.0 A
2100 MHz
62.8 A
1700 MHz
TDP
3,7
80.8 W
VID_VDD Min
9
1.000 V
VID_VDD Max
9
1.225 V
IDD Max
3,10
CPU COF
6
TDP
3,7
71.5 W
VID_VDD Min
9
0.975 V
VID_VDD Max
9
1.200 V
IDD Max
3,10
CPU COF
6
TDP
3,7
53.2 W
VID_VDD Min
9
0.900 V
VID_VDD Max
9
1.125 V
IDD Max
3,10
27.1 A
IDD Max (Pre-Flush)
3,10,17
8.6 A
IDD Max (Post-Flush) 3,10,17
6.4 A
52.0 A
1400 MHz
43.8 A
800 MHz
S0
I/O Power
13
9.8 W
S3
I/O Power
13
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
65
PID: 43374 Rev 3.19 - June 2010
2.3.25
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm PD pnc GN (79 W Server, Fr6 (1207)) Thermal and Power Specifications
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
Specification8
Notes
OS2423PDS6DGN
OS2425PDS6DGN
OS8425PDS6DGN
Tcase Max
1
55 oC to 76 oC
55 oC to 76 oC
Tctl Max
2
70 oC
70 oC
o
5 oC
Tambient Min
5 C
Thermal Profile
E
E
Startup P-State
5
S0.C0.P4
S0.C0.P4
HTC P-State
4
S0.C0.P4
S0.C0.P4
NB COF
6,15
2200 MHz
2200 MHz
VID_VDDNB Min
15
1.175 V
1.175 V
VID_VDDNB Max
15
1.200 V
1.200 V
IDDNB Max
12
17.5 A
16.7 A
CPU COF
6
2000 MHz
2100 MHz
TDP
3,7
79.0 W
79.0 W
VID_VDD Min
9
0.950 V
0.950 V
VID_VDD Max
9
1.150 V
1.150 V
IDD Max
3,10
54.6 A
55.3 A
CPU COF
6
1500 MHz
1600 MHz
TDP
3,7
67.1 W
67.1 W
VID_VDD Min
9
0.925 V
0.925 V
VID_VDD Max
9
1.125 V
1.125 V
IDD Max
3,10
CPU COF
6
TDP
42.4 A
43.3 A
1300 MHz
1400 MHz
3,7
61.1 W
61.1 W
VID_VDD Min
9
0.900 V
0.900 V
VID_VDD Max
9
1.100 V
1.100 V
IDD Max
3,10
CPU COF
6
36.7 A
37.6 A
1000 MHz
1100 MHz
TDP
3,7
54.2 W
54.1 W
VID_VDD Min
9
0.875 V
0.875 V
VID_VDD Max
9
1.075 V
1.075 V
IDD Max
3,10
CPU COF
6
29.7 A
30.6 A
800 MHz
800 MHz
TDP
3,7
49.4 W
48.0 W
VID_VDD Min
9
0.850 V
0.850 V
VID_VDD Max
9
1.050 V
1.050 V
IDD Max
3,10
24.8 A
24.1 A
IDD Max (Pre-Flush)
3,10,17
7.8 A
7.5 A
IDD Max (Post-Flush) 3,10,17
5.7 A
5.4 A
S0
I/O Power
13
9.8 W
9.8 W
S3
I/O Power
13
350 mW
350 mW
S0.C1.Pmin
The notes for this table are on page 80.
AMD Opteron™ Processor
66
PID: 43374 Rev 3.19 - June 2010
2.3.26
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm NB pnc GN (60 W Server, Fr6 (1207)) Thermal and Power Specifications
State
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
S0.C1.Pmin
Specification 8
Notes
OS2419NBS6DGN
Tcase Max
1
55 oC to 68 oC
Tctl Max
2
70 oC
5 oC
Tambient Min
Thermal Profile
P
Startup P-State
5
S0.C0.P4
HTC P-State
4
S0.C0.P4
NB COF
6,15
2000 MHz
VID_VDDNB
15
1.125 V
IDDNB Max
12
11.2 A
CPU COF
6
1800 MHz
TDP
3,7
60.0 W
VID_VDD Min
9
0.900 V
VID_VDD Max
9
1.125 V
IDD Max
3,10
42.7 A
CPU COF
6
TDP
3,7
51.0 W
VID_VDD Min
9
0.875 V
VID_VDD Max
9
1.100 V
IDD Max
3,10
CPU COF
6
TDP
3,7
47.9 W
VID_VDD Min
9
0.875 V
VID_VDD Max
9
1.100 V
IDD Max
3,10
30.3 A
1400 MHz
33.7 A
1200 MHz
CPU COF
6
TDP
3,7
1000 MHz
42.9 W
VID_VDD Min
9
0.850 V
VID_VDD Max
9
1.075 V
IDD Max
3,10
25.4 A
CPU COF
6
TDP
3,7
800 MHz
40.0 W
VID_VDD Min
9
0.850 V
VID_VDD Max
9
1.075 V
IDD Max
3,10
22.1 A
IDD Max (Pre-Flush)
3,10,17
6.6 A
IDD Max (Post-Flush) 3,10,17
4.5 A
S0
I/O Power
13
9.8 W
S3
I/O Power
13
350 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
67
PID: 43374 Rev 3.19 - June 2010
2.3.27
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WK pnc GO (115 W Server, G34r1) Thermal and Power Specifications
Specification 8
Tcase Max
Tctl Max
Tambient Min
S0.C0.Px
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
TDP
Max Power
S0.C0.P0
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P1
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P2
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P3
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P4
VID_VDD Min
VID_VDD Max
IDD TDC
IDD Max (Pre-Flush)
S0.C1.Pmin
IDD Max (Post-Flush)
TDP
S0.C1e.Pmin
I/O Power
I/O Power
S0
I/O Power
S3
State
Notes
1
2
5
4
6,15
15
15
12
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
3,10,17
3,10,17
19
21
20
OS6168WKTCEGO
55 oC to 69 oC
70 oC
5 oC
Q
S0.C0.P4
S0.C0.P4
1800 MHz
1.0250 V
1.1000 V
19.6 A
1900 MHz
115.0 W
135.0 W
1.0000 V
1.1875 V
93.4 A
1500 MHz
99.4 W
113.7 W
0.9500 V
1.1375 V
75.2 A
1300 MHz
93.7 W
102.6 W
0.9250 V
1.1125 V
66.5 A
1000 MHz
83.5 W
90.7 W
0.9000 V
1.0875 V
55.0 A
800 MHz
78.0 W
83.8 W
0.8750 V
1.0625 V
46.8 A
22.0 A
16.1 A
15.2 W
8.7 W
23.8 W
600 mW
OS6172W KTCEGO
55 oC to 69 oC
70 oC
5 oC
Q
S0.C0.P4
S0.C0.P4
1800 MHz
1.0250 V
1.1000 V
18.4 A
2100 MHz
115.0 W
135.0 W
1.0000 V
1.1875 V
96.6 A
1700 MHz
101.2 W
114.9 W
0.9500 V
1.1375 V
78.5 A
1400 MHz
90.4 W
100.4 W
0.9125 V
1.1125 V
66.9 A
1100 MHz
81.8 W
89.6 W
0.9000 V
1.0875 V
55.4 A
800 MHz
73.7 W
79.7 W
0.8750 V
1.0625 V
44.3 A
18.4 A
12.5 A
12.0 W
8.7 W
23.3 W
600 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
68
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Specification 8
Tcase Max
Tctl Max
Tambient Min
S0.C0.Px
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
TDP
Max Power
S0.C0.P0
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P1
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P2
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P3
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P4
VID_VDD Min
VID_VDD Max
IDD TDC
IDD Max (Pre-Flush)
S0.C1.Pmin
IDD Max (Post-Flush)
TDP
S0.C1e.Pmin
I/O Power
I/O Power
S0
I/O Power
S3
State
Notes
1
2
5
4
6,15
15
15
12
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
3,10,17
3,10,17
19
21
20
OS6174W KTCEGO
55 oC to 69 oC
70 oC
5 oC
Q
S0.C0.P4
S0.C0.P4
1800 MHz
1.0250 V
1.1000 V
17.2 A
2200 MHz
115.0 W
135.0 W
1.0000 V
1.1875 V
98.3 A
1800 MHz
99.2 W
113.5 W
0.9500 V
1.1375 V
80.1 A
1400 MHz
88.1 W
98.6 W
0.9250 V
1.1125 V
65.6 A
1100 MHz
79.4 W
87.8 W
0.9000 V
1.0875 V
54.2 A
800 MHz
71.1 W
77.5 W
0.8750 V
1.0625 V
43.1 A
17.5 A
11.6 A
11.2 W
8.7 W
23.2 W
600 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
69
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Specification 8
Tcase Max
Tctl Max
Tambient Min
S0.C0.Px
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
TDP
Max Power
S0.C0.P0
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P1
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P2
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P3
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P4
VID_VDD Min
VID_VDD Max
IDD TDC
IDD Max (Pre-Flush)
S0.C1.Pmin
IDD Max (Post-Flush)
TDP
S0.C1e.Pmin
I/O Power
I/O Power
S0
I/O Power
S3
State
Notes
1
2
5
4
6,15
15
15
12
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
3,10,17
3,10,17
19
21
20
OS6128W KT8EGO
55 oC to 70 oC
70 oC
5 oC
R
S0.C0.P4
S0.C0.P4
1800 MHz
1.0250 V
1.1000 V
21.1 A
2000 MHz
115.0 W
135.0 W
1.0000 V
1.3000 V
84.8 A
1500 MHz
99.7 W
109.1 W
0.9500 V
1.2375 V
66.5 A
1200 MHz
90.3 W
96.2 W
0.9125 V
1.2000 V
56.2 A
1000 MHz
83.2 W
88.4 W
0.8750 V
1.1625 V
48.5 A
800 MHz
77.0 W
81.1 W
0.8375 V
1.1250 V
41.0 A
21.3 A
17.7 A
17.0 W
8.7 W
24.4 W
600 mW
OS6134WKT8EGO
55 oC to 70 oC
70 oC
5 oC
R
S0.C0.P4
S0.C0.P4
1800 MHz
1.0250 V
1.1000 V
19.4 A
2300 MHz
115.0 W
135.0 W
1.0375 V
1.3000 V
87.9 A
1800 MHz
97.9 W
111.3 W
0.9750 V
1.2375 V
69.8 A
1400 MHz
87.2 W
94.8 W
0.9375 V
1.2000 V
57.6 A
1100 MHz
78.8 W
84.9 W
0.9000 V
1.1625 V
47.9 A
800 MHz
71.2 W
75.7 W
0.8625 V
1.1250 V
38.6 A
18.7 A
15.1 A
14.5 W
8.7 W
23.9 W
600 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
70
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Specification 8
Tcase Max
Tctl Max
Tambient Min
S0.C0.Px
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
TDP
Max Power
S0.C0.P0
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P1
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P2
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P3
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P4
VID_VDD Min
VID_VDD Max
IDD TDC
IDD Max (Pre-Flush)
S0.C1.Pmin
IDD Max (Post-Flush)
TDP
S0.C1e.Pmin
I/O Power
I/O Power
S0
I/O Power
S3
State
Notes
1
2
5
4
6,15
15
15
12
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
3,10,17
3,10,17
19
21
20
OS6136WKT8EGO
55 oC to 70 oC
70 oC
5 oC
R
S0.C0.P4
S0.C0.P4
1800 MHz
1.0250 V
1.1000 V
19.0 A
2400 MHz
115.0 W
135.0 W
1.0375 V
1.3000 V
89.0 A
1900 MHz
98.0 W
111.4 W
0.9750 V
1.2375 V
70.9 A
1500 MHz
87.4 W
95.3 W
0.9375 V
1.2000 V
58.7 A
1100 MHz
77.6 W
83.7 W
0.9000 V
1.1625 V
47.1 A
800 MHz
70.0 W
74.5 W
0.8625 V
1.1250 V
37.8 A
18.2 A
14.5 A
14.0 W
8.7 W
23.8 W
600 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
71
PID: 43374 Rev 3.19 - June 2010
2.3.28
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm VA pnc GO (85 W Server, G34r1) Thermal and Power Specifications
Specification8
Tcase Max
Tctl Max
Tambient Min
S0.C0.Px
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
TDP
Max Power
S0.C0.P0
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P1
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P2
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P3
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P4
VID_VDD Min
VID_VDD Max
IDD TDC
IDD Max (Pre-Flush)
S0.C1.Pmin
IDD Max (Post-Flush)
TDP
S0.C1e.Pmin
I/O Power
I/O Power
S0
I/O Power
S3
State
Notes
1
2
5
4
6,15
15
15
12
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
3,10,17
3,10,17
19
21
20
OS6164VATCEGO
55 oC to 65 oC
70 oC
5 oC
S
S0.C0.P4
S0.C0.P4
1800 MHz
1.0250 V
1.1000 V
16.9 A
1700 MHz
85.0 W
100.0 W
0.8500 V
1.0750 V
68.8 A
1500 MHz
79.1 W
91.1 W
0.8250 V
1.0625 V
60.2 A
1200 MHz
71.8 W
79.5 W
0.8000 V
1.0250 V
49.3 A
1000 MHz
66.4 W
72.8 W
0.7750 V
1.0000 V
42.0 A
800 MHz
61.5 W
66.8 W
0.7500 V
0.9750 V
35.0 A
13.5 A
8.4 A
8.6 W
8.7 W
23.1 W
600 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
72
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Specification 8
Tcase Max
Tctl Max
Tambient Min
S0.C0.Px
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
TDP
Max Power
S0.C0.P0
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P1
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P2
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P3
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P4
VID_VDD Min
VID_VDD Max
IDD TDC
IDD Max (Pre-Flush)
S0.C1.Pmin
IDD Max (Post-Flush)
TDP
S0.C1e.Pmin
I/O Power
I/O Power
S0
I/O Power
S3
State
Notes
1
2
5
4
6,15
15
15
12
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
3,10,17
3,10,17
19
21
20
OS6124VAT8EGO
55 oC to 66 oC
70 oC
5 oC
T
S0.C0.P4
S0.C0.P4
1800 MHz
1.0250 V
1.1000 V
17.9 A
1800 MHz
85.0 W
100.0 W
0.9000 V
1.2000 V
61.0 A
1600 MHz
79.6 W
91.3 W
0.8750 V
1.1750 V
54.4 A
1300 MHz
72.4 W
79.0 W
0.8375 V
1.1375 V
46.1 A
1100 MHz
69.0 W
74.3 W
0.8250 V
1.1125 V
40.3 A
800 MHz
63.7 W
67.7 W
0.8000 V
1.0875 V
32.9 A
14.9 A
11.5 A
11.2 W
8.7 W
23.6 W
600 mW
OS6128VAT8EGO
55 oC to 66 oC
70 oC
5 oC
T
S0.C0.P4
S0.C0.P4
1800 MHz
1.0250 V
1.1000 V
17.1 A
2000 MHz
85.0 W
100.0 W
0.8875 V
1.2000 V
63.2 A
1700 MHz
78.5 W
89.2 W
0.8625 V
1.1750 V
54.5 A
1400 MHz
71.3 W
77.8 W
0.8250 V
1.1375 V
46.4 A
1100 MHz
66.5 W
71.8 W
0.8125 V
1.1125 V
38.8 A
800 MHz
61.5 W
65.6 W
0.7875 V
1.0875 V
31.4 A
13.9 A
10.4 A
10.3 W
8.7 W
23.3 W
600 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
73
PID: 43374 Rev 3.19 - June 2010
2.3.29
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm YE pnc GO (140 W Server, G34r1) Thermal and Power Specifications
Specification8
Tcase Max
Tctl Max
Tambient Min
S0.C0.Px
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
TDP
Max Power
S0.C0.P0
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P1
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P2
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P3
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P4
VID_VDD Min
VID_VDD Max
IDD TDC
IDD Max (Pre-Flush)
S0.C1.Pmin
IDD Max (Post-Flush)
TDP
S0.C1e.Pmin
I/O Power
I/O Power
S0
I/O Power
S3
State
Notes
1
2
5
4
6,15
15
15
12
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
3,10,17
3,10,17
19
21
20
OS6176YETCEGO
55 oC to 64 oC
70 oC
5 oC
V
S0.C0.P4
S0.C0.P4
1800 MHz
1.0250 V
1.1000 V
22.5 A
2300 MHz
140.0 W
165.0 W
1.0375 V
1.2500 V
113.5 A
2000 MHz
126.6 W
145.0 W
1.0000 V
1.2125 V
99.1 A
1600 MHz
110.3 W
121.5 W
0.9500 V
1.1625 V
80.8 A
1200 MHz
93.9 W
102.2 W
0.8875 V
1.1000 V
62.1 A
800 MHz
77.6 W
82.9 W
0.8000 V
0.8375 V
42.9 A
20.2 A
15.1 A
14.5 W
8.7 W
24.2 W
600 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
74
PID: 43374 Rev 3.19 - June 2010
2.3.30
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WL pnc GO (95 W Server, C32) Thermal and Power Specifications
Specification 8
Tcase Max
Tctl Max
Tambient Min
S0.C0.Px
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
TDP
Max Power
S0.C0.P0
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P1
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P2
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P3
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P4
VID_VDD Min
VID_VDD Max
IDD TDC
IDD Max (Pre-Flush)
S0.C1.Pmin
IDD Max (Post-Flush)
TDP
S0.C1e.Pmin
I/O Power
I/O Power
S0
I/O Power
S3
State
Notes
1
2
5
4
6,15
15
15
12
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
3,10,17
3,10,17
19
21
20
OS4184WLU6DGO
55 oC to 70 oC
70 oC
5 oC
Y
S0.C0.P4
S0.C0.P4
2200 MHz
1.0750 V
1.2000 V
14.0 A
2800 MHz
95.0 W
115.0 W
1.1250 V
1.3500 V
79.0 A
2500 MHz
85.1 W
100.9 W
1.0875 V
1.3125 V
69.6 A
1900 MHz
69.0 W
77.8 W
1.0250 V
1.2500 V
53.3 A
1400 MHz
57.6 W
64.4 W
0.9750 V
1.1875 V
40.9 A
800 MHz
40.9 W
45.0 W
0.8250 V
0.8500 V
22.9 A
9.6 A
7.0 A
7.9 W
4.2 W
10.9 W
200 mW
OS4180WLU6DGO
55 oC to 70 oC
70 oC
5 oC
Y
S0.C0.P4
S0.C0.P4
2200 MHz
1.0750 V
1.2000 V
14.8 A
2600 MHz
95.0 W
113.9 W
1.1250 V
1.3500 V
77.4 A
2300 MHz
85.0 W
99.8 W
1.0875 V
1.3125 V
67.9 A
1800 MHz
70.2 W
78.6 W
1.0250 V
1.2500 V
53.3 A
1300 MHz
58.7 W
65.1 W
0.9750 V
1.1875 V
40.8 A
800 MHz
42.8 W
46.9 W
0.8250 V
0.8500 V
24.0 A
10.4 A
7.7 A
8.8 W
4.2 W
11.1 W
200 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
75
PID: 43374 Rev 3.19 - June 2010
2.3.31
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm WL pnc GN (95 W Server, C32) Thermal and Power Specifications
Specification 8
Tcase Max
Tctl Max
Tambient Min
S0.C0.Px
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
TDP
Max Power
S0.C0.P0
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P1
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P2
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P3
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P4
VID_VDD Min
VID_VDD Max
IDD TDC
IDD Max (Pre-Flush)
S0.C1.Pmin
IDD Max (Post-Flush)
TDP
S0.C1e.Pmin
I/O Power
I/O Power
S0
I/O Power
S3
State
Notes
1
2
5
4
6,15
15
15
12
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
3,10,17
3,10,17
19
21
20
OS4130W LU4DGN
55 oC to 70 oC
70 oC
5 oC
Y
S0.C0.P4
S0.C0.P4
2200 MHz
1.1000 V
1.2500 V
17.2 A
2600 MHz
95.0 W
107.9 W
1.1625 V
1.3125 V
70.3 A
2300 MHz
86.0 W
96.4 W
1.1250 V
1.2750 V
62.3 A
1800 MHz
74.2 W
81.0 W
1.0750 V
1.2250 V
50.9 A
1300 MHz
63.9 W
69.2 W
1.0250 V
1.1750 V
40.4 A
800 MHz
49.7 W
53.3 W
0.8875 V
0.9000 V
26.1 A
13.3 A
11.4 A
12.9 W
4.2 W
11.3 W
200 mW
OS4122WLU4DGN
55 oC to 70 oC
70 oC
5 oC
Y
S0.C0.P4
S0.C0.P4
2200 MHz
1.1000 V
1.2500 V
18.3 A
2200 MHz
95.0 W
106.7 W
1.1625 V
1.3125 V
68.1 A
1900 MHz
85.9 W
94.7 W
1.1250 V
1.2750 V
59.9 A
1600 MHz
76.0 W
82.6 W
1.0750 V
1.2250 V
50.9 A
1200 MHz
66.4 W
71.5 W
1.0250 V
1.1750 V
41.4 A
800 MHz
52.5 W
56.1 W
0.8875 V
0.9000 V
27.7 A
14.5 A
12.6 A
14.2 W
4.2 W
11.5 W
200 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
76
PID: 43374 Rev 3.19 - June 2010
2.3.32
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm OF pnc GO (65 W Server, C32) Thermal and Power Specifications
Specification 8
Tcase Max
Tctl Max
Tambient Min
S0.C0.Px
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
TDP
Max Power
S0.C0.P0
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P1
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P2
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P3
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P4
VID_VDD Min
VID_VDD Max
IDD TDC
IDD Max (Pre-Flush)
S0.C1.Pmin
IDD Max (Post-Flush)
TDP
S0.C1e.Pmin
I/O Power
I/O Power
S0
I/O Power
S3
State
Notes
1
2
5
4
6,15
15
15
12
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
3,10,17
3,10,17
19
21
20
OS4170OFU6DGO
55 oC to 70 oC
70 oC
5 oC
W
S0.C0.P4
S0.C0.P4
2200 MHz
1.0750 V
1.2000 V
16.0 A
2100 MHz
65.0 W
78.0 W
0.9125 V
1.1875 V
52.8 A
1800 MHz
59.6 W
68.4 W
0.8875 V
1.1625 V
45.7 A
1400 MHz
51.8 W
57.3 W
0.8375 V
1.1000 V
36.0 A
1100 MHz
46.8 W
51.3 W
0.8000 V
1.0625 V
29.5 A
800 MHz
43.5 W
47.4 W
0.7875 V
0.8250 V
24.7 A
11.1 A
8.6 A
9.3 W
4.2 W
11.4 W
200 mW
OS4174OFU6DGO
55 oC to 70 oC
70 oC
5 oC
W
S0.C0.P4
S0.C0.P4
2200 MHz
1.0750 V
1.2000 V
15.2 A
2300 MHz
65.0 W
79.0 W
0.9125 V
1.1875 V
54.4 A
2000 MHz
59.6 W
69.5 W
0.8875 V
1.1625 V
47.4 A
1600 MHz
51.8 W
57.7 W
0.8375 V
1.1000 V
37.7 A
1200 MHz
45.8 W
50.6 W
0.8000 V
1.0625 V
29.8 A
800 MHz
41.7 W
45.6 W
0.7875 V
0.8250 V
23.6 A
10.4 A
7.9 A
8.5 W
4.2 W
11.3 W
200 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
77
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Specification 8
Tcase Max
Tctl Max
Tambient Min
S0.C0.Px
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
TDP
Max Power
S0.C0.P0
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P1
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P2
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P3
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P4
VID_VDD Min
VID_VDD Max
IDD TDC
IDD Max (Pre-Flush)
S0.C1.Pmin
IDD Max (Post-Flush)
TDP
S0.C1e.Pmin
I/O Power
I/O Power
S0
I/O Power
S3
State
Notes
1
2
5
4
6,15
15
15
12
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
3,10,17
3,10,17
19
21
20
OS4176OFU6DGO
55 oC to 70 oC
70 oC
5 oC
W
S0.C0.P4
S0.C0.P4
2200 MHz
1.0750 V
1.2000 V
14.8 A
2400 MHz
65.0 W
79.6 W
0.9125 V
1.1875 V
55.3 A
2100 MHz
59.6 W
70.1 W
0.8875 V
1.1625 V
48.3 A
1600 MHz
50.9 W
56.8 W
0.8375 V
1.1000 V
37.1 A
1200 MHz
44.9 W
49.7 W
0.8000 V
1.0625 V
29.3 A
800 MHz
40.8 W
44.7 W
0.7875 V
0.8250 V
23.1 A
10.1 A
7.5 A
8.1 W
4.2 W
11.2 W
200 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
78
PID: 43374 Rev 3.19 - June 2010
2.3.33
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
OS mmmm HJ pnc GO (35 W Server, C32) Thermal and Power Specifications
Specification 8
Tcase Max
Tctl Max
Tambient Min
S0.C0.Px
Thermal Profile
Startup P-State
HTC P-State
NB COF
VID_VDDNB Min
S0.Cx.Px
VID_VDDNB Max
IDDNB Max
CPU COF
TDP
Max Power
S0.C0.P0
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P1
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P2
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P3
VID_VDD Min
VID_VDD Max
IDD TDC
CPU COF
TDP
Max Power
S0.C0.P4
VID_VDD Min
VID_VDD Max
IDD TDC
IDD Max (Pre-Flush)
S0.C1.Pmin
IDD Max (Post-Flush)
TDP
S0.C1e.Pmin
I/O Power
I/O Power
S0
I/O Power
S3
State
Notes
1
2
5
4
6,15
15
15
12
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
6
3,7
18
9
9
3,10,17
3,10,17
19
21
20
OS4164HJU6DGO
55 oC to 65 oC
70 oC
5 oC
Z
S0.C0.P4
S0.C0.P4
1800 MHz
0.9750 V
1.1250 V
10.2 A
1800 MHz
35.0 W
43.0 W
0.7625 V
0.9625 V
34.8 A
1600 MHz
33.0 W
39.6 W
0.7500 V
0.9500 V
31.0 A
1400 MHz
31.4 W
37.2 W
0.7375 V
0.9250 V
27.9 A
1100 MHz
29.0 W
33.4 W
0.7375 V
0.9125 V
23.1 A
800 MHz
26.5 W
30.1 W
0.7250 V
0.8250 V
18.7 A
7.7 A
5.4 A
4.9 W
4.2 W
7.9 W
200 mW
OS4162HJU6DGO
55 oC to 65 oC
70 oC
5 oC
Z
S0.C0.P4
S0.C0.P4
1800 MHz
0.9750 V
1.1250 V
10.5 A
1700 MHz
35.0 W
43.0 W
0.7625 V
0.9625 V
33.8 A
1500 MHz
33.0 W
39.5 W
0.7500 V
0.9500 V
30.0 A
1300 MHz
31.3 W
36.8 W
0.7375 V
0.9250 V
26.8 A
1100 MHz
29.6 W
34.1 W
0.7375 V
0.9125 V
23.4 A
800 MHz
27.1 W
30.7 W
0.7250 V
0.8250 V
18.9 A
8.1 A
5.7 A
5.2 W
4.2 W
7.9 W
200 mW
The notes for this table are on page 80.
AMD Opteron™ Processor
79
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
AMD Opteron™ Processor Thermal and Power Specification Table Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
Tc as e Max is the m axim um c as e tem perature spec ification, whic h is a physical value in degrees
Celsius. Tc as e Max can b e any valid Tcase Max value in the range s pecified for the corres ponding
OP N.
Tc tl Max (m axim um c ontrol tem perature) is a non-phys ic al tem perature on an arb itrary sc ale that
c an b e us ed for s ystem therm al m anagem ent polic ies. Refer to the B IOS and K ernel Developer’s
Guide (BK DG) For AM D Fam ily 10h P roc es sors, order #31116.
TDP is m eas ured under the c onditions of all cores operating at CP U COF, Tcase Max, and VDD at
the voltage reques ted b y the process or. TDP inc ludes all power dis sipated on-die from V DD,
V DDNB, V DDIO, VLDT, V TT and V DDA.
P -State lim it when HTC is active. Refer to the B IOS and Kernel Developer’s Guide (B KDG) for
A MD Fam ily 10h P roc es sors, order# 31116 for m ore inform ation.
Hardware trans itions the part to Startup P-S tate at c old b oot. During initializ ation, the startup NB
COF and VID_V DDNB values m ay differ from those of the s tartup P -State. P leas e s ee the BIOS
and Kernel Developer's Guide (BK DG) for AMD Fam ily 10h P roc es sors, order# 31116 for detailed
power sequenc ing inform ation.
Frequenc y reported to the OS is rounded to the nearest 100-MHz b oundary.
The process or therm al solution s hould b e designed to acc om m odate therm al design power (TDP) at
Tc as e,m ax.TDP is not the m axim um power of the process or.
S pecifications for m ulti-c ore process ors as sum e equivalent P-S tates (voltage and frequency) and
equivalent Tcase conditions for all c ores. Refer to the B IOS and Kernel Developer’s Guide (B KDG)
for AMD Fam ily 10h Process ors , order# 31116, for details on P-S tate operation for m ulti-core
proc ess ors .
V ariab le voltage, any valid voltage b etween VDD m in and V DD m ax is allowed.
TDP IDD conditions: s ingle plane platform s supply IDD and IDDNB tied together and use the IDD
Max specific ation.
S ingle-plane platform s have VID_V DD and V ID_VDDNB tied together, and us e the V ID_VDD
s pecification.
TDP IDDNB conditions: s ingle-plane platform s supply IDD and IDDNB tied together and use the
IDD Max s pecific ation.
Therm al Des ign P ower diss ipated b y the proc es sor VDDIO and VTT power planes only. A ss um es
V DDIO = 1.8 V and V TT = VDDIO / 2.
Refer to erratum 308 in the Revis ion Guide for A M D Fam ily 10h Process ors , Order# 41322 for the
appropriate cloc k divis or s etting.
During initialization, the s tartup NB COF and V ID_VDDNB values m ay differ from thos e of the
s tartup P-S tate. See the B IOS and Kernel Developer’s Guide (B KDG) for A MD Fam ily 10h
P roc ess ors , order# 31116, for spec ific power sequencing inform ation.
This produc t is intended for dual-plane platform s only.
IDDMax (P re-Flus h) and (Post-Flus h) refer to the Cache Flus h On Halt feature des crib ed in the
B IOS and Kernel Developer’s Guide (B KDG) for AM D Fam ily 10h P roc es sors, order# 31116.
IDDMax pre-flus h and post-flus h values are b as ed on the rec om m ended BK DG s ettings. A ctual C1
idle c urrent varies with sys tem us age acc ording to the following equation:
C1 idle current = F3xDC[Cas hFlus hOnHaltTm r]/OS tim er tic k interval * Idd Max (P re-Flus h) +
(1 - F3xDC[CachFlushOnHaltTm r]/OS tim er tick interval * Idd Max (Post-Flus h))
The default Microsoft ® W indows V is ta ® tim er tick interval is 15.6 m s. This interval varies b etween
operating s ystem s and within an operating sys tem depending on usage.
Maxim um S us tained P ower diss ipated b y the proc es sor at nom inal voltage and m axim um spec ified
c as e or die tem perature.
A ss um es 35 o C, m in P-S tate VID_V DD, core c lock divider set to S tpClk and NB cloc k divider s et
to 16.Power saving c om es from as serting LDTS TOP to plac e HyperTransport TM phys into LS 2.
Rec om m ended s ettings are in the B IOS and Kernel Developer’s Guide (B KDG) for A MD Fam ily 10h
P roc ess ors , order# 31116.
Therm al Des ign P ower diss ipated b y the proc es sor (VDDIO power plane only). As sum e VDDIO =
1.5 V
Therm al Des ign P ower diss ipated b y the proc es sor VDDIO, V DDR, V LDT and V DDA power planes .
AMD Opteron™ Processor
80
PID: 43374 Rev 3.19 - June 2010
3
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Power Supply Specifications
For socket infrastructures not covered by this document refer to the AMD Infrastructure Roadmap,
order# 41842.
3.1 bsmmmmrr L ncdd – Fr2 (1207) Power Supply Operating Conditions
Table 10. bsmmmmrr L ncdd DC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VID_VDD
VID-Requested VDD
Supply Level
V
VDD_dc
DC Tolerance - VDD
Supply Voltage
V
VDD_PON
Metal Mask VID_VDD
V
VDDNB_dc
VDDNB Supply voltage
V
VID_VDDNB
VDDNB Supply voltage
V
Min
Typ
Max
Notes
Refer to the thermal/power tables under the
appropriate SOPN section for this OPNspecific parameter.
VID_VDD
VID_VDD
VID_VDD
–50 mV
+ 50 mV
0.95
1.00
MaxVID_VDD 1,2
VID_VDDNB VID_VDDNB VID_VDDNB
–50 mV
+ 50 mV
Refer to the thermal/power tables under the
appropriate SOPN section for this OPNspecific parameter.
0.95
1.00
1.30 2
VDDNB_PON
Metal Mask VDDNB
V
Notes:
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during
device manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Table 11. bsmmmmrr L ncdd AC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VDD_ac
VDD Supply Voltage
V
VDDNB_ac
VDDNB Supply Voltage
V
Min
Typ
VID_VDD
VID_VDD
–100 mV
VID_VDDNB
VID_VDDNB
–100 mV
Max
Notes
VID_VDD +
1
100 mV
VID_VDDNB
1
+ 100 mV
Notes:
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all
times. Transients above dc max must return to within the DC specification within 15 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 3 on page 82.
Power Supply Specifications
81
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 12. bsmmmmrr L ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Symbol
VDDIO
VDDIO
VLDT
VDDA
VDD, VDDNB
Parameter
VDDIO Supply Voltage
for DDR2 electricals
VDDIO Supply Voltage
for DDR3 electricals
VLDT Supply Voltage
VDDA Supply Voltage
VDD, VDDNB Supply
Voltage
Units
Max
V
2.05
V
1.65
V
V
1.32
2.70
Max AC
Voltage
V
VID + 1 00 mV
VID + 50 mV
VID
VID – 50 mV
VID – 100 mV
15 μS
Figure 3.
Socket Fr2 (1207) AC and DC Transient Limits
Power Supply Specifications
82
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 13. bsmmmmrr L ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol
VDDIO_dc
Parameter
VDDIO Supply Voltage
for DDR2 electricals
Units
Min
Typ
Max
Notes
V
1.70
1.80
1.90
1
VDDIO_ac
VDDIO Supply voltage
V
VLDT
VLDT Supply Voltage
VTT Supply Voltage for
DDR2 electricals
V
VDDIO_dc
–150 mV
1.14
V
0.85
VTT_dc
VTT_ac
VTT Supply Voltage
V
VDDA
VDDA Supply Voltage
VDDIO Power Supply
Current
VTT Power Supply
Current
VLDT Power Supply
Current
VDDA Power Supply
Current
V
IDDIO1
ITT1
ILDT
IDDA
VTT_dc
–75mV
2.40
1.20
VDDIO_dc
+150 mV
1.26
0.90
0.95
VDDIO_dc
VTT_dc
2.50
VTT_dc +
75mV
2.60
2, 3
10
4
2, 3
A
3.60
7, 9
A
1.75
6, 8, 9
mA
600/ link
5, 9
mA
250
9
Notes:
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop
must be carefully considered and compensated for. For example, if the inaccuracy and IR drop
amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid
violating the VDDIO_dc minimum spec of 1.70 V.
2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all data bus bits
switching.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level
measured at the processor VTT_SENSE pin track s 0.5*VDDIO_DC and stays within the specified maximum
and minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully
considered and compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage
regulator setting must be set 20 mV higher so that VTT still track s 0.5*VDDIO_dc and stays within the range
of 0.85 V and 0.95 V.
5) ILDT is specified for each unconnected HyperTransport™ link or for each 16x16 bit Gen1 HyperTransport link
operating at max 2.0 GT/s or less. Please refer to erratum 396.
6) VTT must both sink and source current.
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
9) This specification reflects the values published in the appropriate power roadmap document.
10) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
Power Supply Specifications
83
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
3.2 bsmmmmrr P ncdd – Fr5 (1207) Power Supply Operating Conditions
Table 14. bsmmmmrr P ncdd DC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VID_VDD
VID-Requested VDD
Supply Level
V
VDD_dc
DC Tolerance - VDD
Supply Voltage
V
VDD_PON
Metal Mask VID_VDD
V
VDDNB_dc
VDDNB Supply voltage
V
VID_VDDNB
VDDNB Supply voltage
V
Min
Typ
Max
Notes
Refer to the thermal/power tables under the
appropriate SOPN section for this OPNspecific parameter.
VID_VDD
VID_VDD
VID_VDD
–50 mV
+ 50 mV
0.95
1.00
MaxVID_VDD 1,2
VID_VDDNB VID_VDDNB VID_VDDNB
–50 mV
+ 50 mV
Refer to the thermal/power tables under the
appropriate SOPN section for this OPNspecific parameter.
0.95
1.00
1.30
2
VDDNB_PON
Metal Mask VDDNB
V
Notes:
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during
device manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Table 15. bsmmmmrr P ncdd AC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VDD_ac
VDD Supply Voltage
V
VDDNB_ac
VDDNB Supply Voltage
V
Min
Typ
VID_VDD
VID_VDD
–100 mV
VID_VDDNB
VID_VDDNB
–100 mV
Max
Notes
VID_VDD +
1
100 mV
VID_VDDNB
1
+ 100 mV
Notes:
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all
times. Transients above dc max must return to within the DC specification within 15 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 4 on page 85.
Power Supply Specifications
84
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 16. bsmmmmrr P ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Symbol
VDDIO
VDDIO
VLDT
VDDA
VDD, VDDNB
Parameter
VDDIO Supply Voltage
for DDR2 electricals
VDDIO Supply Voltage
for DDR3 electricals
VLDT Supply Voltage
VDDA Supply Voltage
VDD, VDDNB Supply
Voltage
Units
Max
V
2.05
V
1.65
V
V
1.32
2.70
Max AC
Voltage
V
VID + 1 00 mV
VID + 50 mV
VID
VID – 50 mV
VID – 100 mV
15 μS
Figure 4.
Socket Fr5 (1207) AC and DC Transient Limits
Power Supply Specifications
85
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 17. bsmmmmrr P ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol
VDDIO_dc
Parameter
VDDIO Supply Voltage
for DDR2 electricals
Units
Min
Typ
Max
Notes
V
1.70
1.80
1.90
1
VDDIO_ac
VDDIO Supply voltage
V
VLDT
VLDT Supply Voltage
VTT Supply Voltage for
DDR2 electricals
V
VDDIO_dc
–150 mV
1.14
V
0.85
VTT_dc
VTT_ac
VTT Supply Voltage
V
VDDA
VDDA Supply Voltage
VDDIO Power Supply
Current
VTT Power Supply
Current
VLDT Power Supply
Current
VDDA Power Supply
Current
V
IDDIO1
ITT1
ILDT
IDDA
VTT_dc
–75mV
2.40
1.20
VDDIO_dc
+150 mV
1.26
0.90
0.95
VDDIO_dc
VTT_dc
2.50
VTT_dc +
75mV
2.60
2, 3
12
4
2, 3
A
3.60
7, 9
A
1.75
6, 8, 9
A
1.40/ link
0.60/ link
5, 9
9,10,11
mA
250
9
Notes:
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop
must be carefully considered and compensated for. For example, if the inaccuracy and IR drop
amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid
violating the VDDIO_dc minimum spec of 1.70 V.
2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all data bus bits
switching.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level
measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_DC and stays within the specified maximum
and minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully
considered and compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage
regulator setting must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range
of 0.85 V and 0.95 V.
5) ILDT is specified for each Gen3 16x16-bit HyperTransport™ link operating between 2.4GT/s and 4.8 GT/s.
6) VTT must both sink and source current.
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
9) This specification reflects the values published in the appropriate power roadmap document.
10) ILDT is specified for each unconnected HyperTransport link or for each 16x16 bit Gen1 HyperTransport link
operating at max 2.0 GT/s or less.
11) The maximum value is listed as a per link value to allow for a mix of Gen1 and Gen3 links. All links must be
powered on a processor. Please refer to erratum 396.
12) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
Power Supply Specifications
86
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
3.3 bsmmmmrr J ncdd – AM2r2 Power Supply Operating Conditions
Table 18. bsmmmmrr J ncdd DC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VID_VDD
VID-Requested VDD
Supply Level
V
VDD_PON
DC Tolerance - VDD
Supply Voltage
Metal Mask VID
V
VDDNB_dc
VDDNB Supply voltage
V
VID_VDDNB
VDDNB Supply voltage
V
VDD_dc
V
Min
Typ
Max
Notes
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-specific
parameter.
VID_VDD
VID_VDD
VID_VDD
– 50 mV
+ 50 mV
0.95
1.00
MaxVID_VDD
1,2
VID_VDDNB VID_VDDNB VID_VDDNB
– 50 mV
+ 50 mV
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-specific
parameter.
0.95
1.00
MaxVID_VDDNB 1,2
VDDNB_PON
Metal Mask VDDNB
V
Notes:
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during device
manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Table 19. bsmmmmrr J ncdd AC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VDD_ac
VDD Supply Voltage
V
VDDNB_ac
VDDNB Supply Voltage
V
Min
Typ
VID_VDD –
VID_VDD
140 mV
VID_VDDNB
VID_VDDNB
– 140 mV
Max
VID_VDD + 150
mV
VID_VDDNB
+ 150 mV
Notes
1
1
Notes:
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all
times. Transients above dc max must return to within the DC specification within 30 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 5 on page 88.
Power Supply Specifications
87
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 20. bsmmmmrr J ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Symbol
VDDIO
VDDIO
VLDT
VDDA
VDD, VDDNB
Parameter
VDDIO Supply Voltage for
DDR2 electricals
VDDIO Supply Voltage for
DDR3 electricals
VLDT Supply Voltage
VDDA Supply Voltage
VDD, VDDNB Supply
Voltage
Units
Max
V
2.05
V
1.65
V
V
1.32
2.70
Max AC
Voltage
V
VID + 1 50 mV
VID + 50 mV
VID
VID – 50 mV
VID – 140 mV
30 μs
Figure 5.
Socket AM2 AC and DC Transient Limits
Power Supply Specifications
88
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 21. bsmmmmrr J ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol
VDDIO_dc
Parameter
Units
VDDIO Supply Voltage for
V
DDR2 electricals
Min
Typ
Max
Notes
1.70
1.80
1.90
1
VDDIO_ac
VDDIO Supply voltage
V
VLDT
VLDT Supply Voltage
VTT Supply Voltage for
DDR2 electricals
V
VDDIO_dc –
150 mV
1.14
V
0.85
VTT_dc
VTT_ac
VTT Supply Voltage
V
VDDA
VDDA Supply Voltage
VDDIO Power Supply
Current
V
IDDIO1
ITT1
ILDT
IDDA
VTT_dc –
75mV
2.40
1.20
VDDIO_dc + 150
2, 3
mV
1.26
10
0.90
0.95
VTT_dc
VTT_dc + 75mV 2, 3
2.50
2.60
VDDIO_dc
4
A
3.60
7, 9
VTT Power Supply Current A
1.75
6, 8, 9
mA
500/ link
5, 9
mA
250
9
VLDT Power Supply
Current
VDDA Power Supply
Current
Notes:
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must
be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then
the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid violating the VDDIO_dc
minimum spec of 1.70 V.
2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all
data bus bits switching.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level
measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_dc and stays within the specified maximum and
minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and
compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage regulator setting
must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range
of 0.85 V and 0.95 V.
5) ILDT is specified for each 16x16-bit HyperTransport™ link operating at 2.0 GT/s.
6) VTT must both sink and source current.
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
9) This specification reflects the values published in the appropriate power roadmap document.
10) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
Power Supply Specifications
89
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
3.4 bsmmmmrr K ncdd – AM3 Power Supply Operating Conditions
Table 22. bsmmmmrr K ncdd DC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VID_VDD
VID-Requested VDD
Supply Level
V
VDD_dc
DC Tolerance - VDD
Supply Voltage
V
VDD_PON
Metal Mask VID
V
VDDNB_dc
VDDNB Supply voltage
V
VID_VDDNB
VDDNB Supply voltage
V
Min
Typ
Max
Refer to the thermal/power tables under the
appropriate SOPN section for this OPNspecific parameter.
VID_VDD
VID_VDD
VID_VDD
–50 mV
+ 50 mV
0.95
1.00
Notes
MaxVID_VDD 1,2
VID_VDDNB VID_VDDNB VID_VDDNB
–50 mV
+ 50 mV
Refer to the thermal/power tables under the
appropriate SOPN section for this OPNspecific parameter.
0.95
1.00
MaxVID_VDD 1,2
VDDNB_PON
Metal Mask VDDNB
V
Notes:
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during
device manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Table 23. bsmmmmrr K ncdd AC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VDD_ac
VDD Supply Voltage
V
VDDNB_ac
VDDNB Supply Voltage
V
Min
Typ
VID_VDD
VID_VDD
–140 mV
VID_VDDNB
VID_VDDNB
–140 mV
Max
VID_VDD +
150 mV
VID_VDDNB
+ 150 mV
Notes
1
1
Notes:
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all.
times. Transients above dc max must return to within the DC specification within 30 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 6 on page 91.
Power Supply Specifications
90
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 24. bsmmmmrr K ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Symbol
VDDIO
VDDIO
VLDT
VDDA
VDD, VDDNB
Parameter
VDDIO Supply Voltage for
DDR2 electricals
VDDIO Supply Voltage for
DDR3 electricals
VLDT Supply Voltage
VDDA Supply Voltage
VDD, VDDNB Supply
Voltage
Units
Max
V
2.05
V
1.65
V
V
1.32
2.70
Max AC
Voltage
V
VID + 1 50 mV
VID + 50 mV
VID
VID – 50 mV
VID – 140 mV
30 μs
Figure 6.
Socket AM3 AC and DC Transient Limits
Power Supply Specifications
91
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 25. bsmmmmrr K ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol
VDDIO_dc
Parameter
Units
VDDIO Supply Voltage for
V
DDR3 electricals
VDDIO_ac
VDDIO Supply voltage
VLDT
VLDT Supply Voltage
V
VDDR Supply Voltage for
V
DDR3 electricals
VDDR_dc
V
VDDR_ac
VDDR Supply Voltage
V
VDDA
VDDA Supply Voltage
VDDIO Power Supply
Current
VDDR Power Supply
Current
VLDT Power Supply
Current
VDDA Power Supply
Current
V
IDDIO1
IDDR
ILDT
IDDA
Min
Typ
Max
Notes
1.375
1.500
1.625
1
VDDIO_dc –
VDDIO_dc
125 mV
1.14
1.20
VDDIO_dc +
125 mV
1.26
1.14
1.26
VDDR_dc
–60mV
2.40
1.20
VDDR_dc
2.50
VDDR_dc +
60mV
2.60
2, 3
12
4
2, 3
A
3.60
7, 9
A
1.75
6, 8, 9
A
1.40/ link
0.60/ link
5, 9
9,10,11
mA
9
Notes:
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must
be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then
the voltage regulator setting for VDDIO should not be lower than 1.475 V to avoid violating the VDDIO_dc
minimum spec of 1.375 V.
2) VDDIO_ac and VDDR_ac parameters are measured over 60 seconds time frame with all data bus bits switching.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
4) All voltages are referenced to VSS. Voltage regulator for VDDR must be set accordingly so that VDDR_dc level
measured at the processor with VDDR_SENSE pin stay within the specified maximum and minimum DC tolerance
limits. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated
for to ensure the VDDR stays within the specified DC tolerance limits.
5) ILDT is specified for one 16x16-bit Gen3 link.
6) VDDR must both sink and source current.
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
8) VDDR current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
9) This specification reflects the values published in the appropriate power roadmap document.
10) ILDT is specified for one 16x16-bit HyperTransport™ link operating at 2.0 GT/s.
11) Please refer to erratum 396.
12) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
Power Supply Specifications
92
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
3.5 bsmmmmrr S ncdd – Fr6 (1207) Power Supply Operating Conditions
Table 26. bsmmmmrr S ncdd DC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VID_VDD
VID-Requested VDD
Supply Level
V
VDD_dc
DC Tolerance - VDD
Supply Voltage
V
VDD_PON
Metal Mask VID_VDD
V
VDDNB_dc
VDDNB Supply voltage
V
VID_VDDNB
VDDNB Supply voltage
V
Min
Typ
Max
Notes
Refer to the thermal/power tables under the
appropriate SOPN section for this OPNspecific parameter.
VID_VDD
VID_VDD
VID_VDD
–50 mV
+ 50 mV
0.95
1.00
MaxVID_VDD 1,2
VID_VDDNB VID_VDDNB VID_VDDNB
–50 mV
+ 50 mV
Refer to the thermal/power tables under the
appropriate SOPN section for this OPNspecific parameter.
0.95
1.00
1.30 2
VDDNB_PON
Metal Mask VDDNB
V
Notes:
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during
device manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Table 27. bsmmmmrr S ncdd AC Operating Conditions for VDD Power Supply
Symbol
Parameter
Units
VDD_ac
VDD Supply Voltage
V
VDDNB_ac
VDDNB Supply Voltage
V
Min
Typ
VID_VDD
VID_VDD
–100 mV
VID_VDDNB
VID_VDDNB
–100 mV
Max
Notes
VID_VDD +
1
100 mV
VID_VDDNB
1
+ 100 mV
Notes:
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all
times. Transients above dc max must return to within the DC specification within 15 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 7 on page 94.
Power Supply Specifications
93
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 28. bsmmmmrr S ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Symbol
VDDIO
VDDIO
VLDT
VDDA
VDD, VDDNB
Parameter
VDDIO Supply Voltage
for DDR2 electricals
VDDIO Supply Voltage
for DDR3 electricals
VLDT Supply Voltage
VDDA Supply Voltage
VDD, VDDNB Supply
Voltage
Units
Max
V
2.05
V
1.65
V
V
1.32
2.70
Max AC
Voltage
V
VID + 100 mV
VID + 50 mV
VID
VID – 50 mV
VID – 1 00 mV
15 μS
Figure 7.
Socket Fr6 (1207) AC and DC Transient Limits
Power Supply Specifications
94
PID: 43374 Rev 3.19 - June 2010
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Table 29. bsmmmmrr S ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol
VDDIO_dc
Parameter
VDDIO Supply Voltage
for DDR2 electricals
Units
Min
Typ
Max
Notes
V
1.70
1.80
1.90
1
VDDIO_ac
VDDIO Supply voltage
V
VLDT
VLDT Supply Voltage
VTT Supply Voltage for
DDR2 electricals
V
VDDIO_dc
–150 mV
1.14
V
0.85
VTT_dc
VTT_ac
VTT Supply Voltage
V
VDDA
VDDA Supply Voltage
VDDIO Power Supply
Current
VTT Power Supply
Current
VLDT Power Supply
Current
VDDA Power Supply
Current
V
IDDIO1
ITT1
ILDT
IDDA
VTT_dc
–75mV
2.40
1.20
VDDIO_dc
+150 mV
1.26
0.90
0.95
VDDIO_dc
VTT_dc
2.50
VTT_dc +
75mV
2.60
2, 3
12
4
2, 3
A
3.60
7, 9
A
1.75
6, 8, 9
A
1.50/ link
0.60/ link
5, 9,11
9,10,11
mA
250
9
Notes:
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop
must be carefully considered and compensated for. For example, if the inaccuracy and IR drop
amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid
violating the VDDIO_dc minimum spec of 1.70 V.
2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all data bus bits
switching.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level
measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_DC and stays within the specified maximum
and minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully
considered and compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage
regulator setting must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range
of 0.85 V and 0.95 V.
5) ILDT is specified for each Gen3 16x16-bit HyperTransport™ link operating between 2.4 GT/s and 4.8 GT/s.
6) VTT must both sink and source current.
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
9) This specification reflects the values published in the appropriate power roadmap document.
10) ILDT is specified for each unconnected HyperTransport link or for each 16x16-bit Gen1 HyperTransport link
operating at max 2.0 GT/s or less.
11) The maximum value is listed as a per link value to allow for a mix of Gen1 and Gen3 links. All links must be
powered on a processor. Please refer to errata 396-397.
12) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
Power Supply Specifications
95
PID: 43374 Rev 3.19 - June 2010
4
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
Power Limit Encoding
IddValue and IddDiv are available for each P-state in P-state registers MSRC001_00[68:64]. For
more details, refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h
Processors, order# 31116.
Power Limit Encoding
96
PID: 43374 Rev 3.19 - June 2010
5
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
MTOPS
Table 30 shows Composite Theoretical Performance (CTP) calculations. The calculations are stated
in Millions of Theoretical Operations per Second (MTOPS) and are based upon a formula in the
United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory
Note 4 for Category 4).
All calculations contained herein are subject to change without notice. AMD makes no representation
or warranty as to the accuracy or reliability of such calculations.
THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES
WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY
WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY
PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD
PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS.
Furthermore, AMD shall have no liability for any losses or damages including direct, indirect,
special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or
other economic loss occurring in connection with use of the calculations, even if AMD has been
advised in advance of the possibility of such damages. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted herein.
Table 30. Composite Theoretical Performance (CTP) Calculation
Frequency
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
2800
2900
3000
3100
3200
3300
3400
MTOPS
MTOPS
MTOPS
MTOPS
S ingle-Core Dual-Core Triple-Core Quad-Core
8,667
16,267
23,867
31,467
9,209
17,284
25,359
33,434
9,750
18,300
26,850
35,400
10,292
19,317
28,342
37,367
10,834
20,334
29,834
39,334
11,375
21,350
31,325
41,300
11,917
22,367
32,817
43,267
12,459
23,384
34,309
45,234
13,000
24,400
35,800
47,200
13,542
25,417
37,292
49,167
14,084
26,434
38,784
51,134
14,625
27,450
40,275
53,100
15,167
28,467
41,767
55,067
15,709
29,484
43,259
57,034
16,250
30,500
44,750
59,000
16,792
31,517
46,242
60,967
17,334
32,534
47,734
62,934
17,875
33,550
49,225
64,900
18,417
34,567
50,717
66,867
MTOPS
S ix-Core
46,667
49,584
52,500
55,417
58,334
61,250
64,167
67,084
70,000
72,917
75,834
78,750
81,667
84,584
87,500
90,417
93,334
96,250
99,167
MTOPS
MTOPS
MTOPS
Eight-Core Twelve-Core
61,867
92,267
65,734
98,034
69,600
103,800
73,467
109,567
77,334
115,334
81,200
121,100
85,067
126,867
88,934
132,634
92,800
138,400
96,667
144,167
100,534
149,934
104,400
155,700
108,267
161,467
112,134
167,234
116,000
173,000
119,867
178,767
123,734
184,534
127,600
190,300
131,467
196,067
97
PID: 43374 Rev 3.19 - June 2010
6
AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
APP
Table 31 shows the Adjusted Peak Performance (APP) calculations for the
AMD Opteron™ processor. The calculations are stated in millions of Weighted Teraflops (WT) and
are based upon a formula in the United States Department of Commerce Export Administration
Regulations 15 CFR 774 (Advisory Note 4 for Category 4).
All calculations contained herein are subject to change without notice. AMD makes no representation
or warranty as to the accuracy or reliability of such calculations.
THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES
WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY
WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY
PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD
PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS.
Furthermore, AMD shall have no liability for any losses or damages including direct, indirect,
special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or
other economic loss occurring in connection with use of the Calculations, even if AMD has been
advised in advance of the possibility of such damages. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted herein.
Table 31. Adjusted Peak Performance (APP) Calculation
Frequency
APP
S ingle-Core
APP
Dual-Core
APP
Triple-Core
APP
Quad-Core
APP
S ix-Core
APP
Eight-Core
APP
Twelve-Core
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
2800
2900
3000
3100
3200
3300
3400
0.0019
0.0020
0.0022
0.0023
0.0024
0.0025
0.0026
0.0028
0.0029
0.0030
0.0031
0.0032
0.0034
0.0035
0.0036
0.0037
0.0038
0.0040
0.0041
0.0038
0.0041
0.0043
0.0046
0.0048
0.0050
0.0053
0.0055
0.0058
0.0060
0.0062
0.0065
0.0067
0.0070
0.0072
0.0074
0.0077
0.0079
0.0082
0.0058
0.0061
0.0065
0.0068
0.0072
0.0076
0.0079
0.0083
0.0086
0.0090
0.0094
0.0097
0.0101
0.0104
0.0108
0.0112
0.0115
0.0119
0.0122
0.0077
0.0082
0.0086
0.0091
0.0096
0.0101
0.0106
0.0110
0.0115
0.0120
0.0125
0.0130
0.0134
0.0139
0.0144
0.0149
0.0154
0.0158
0.0163
0.0115
0.0122
0.0130
0.0137
0.0144
0.0151
0.0158
0.0166
0.0173
0.0180
0.0187
0.0194
0.0202
0.0209
0.0216
0.0223
0.0230
0.0238
0.0245
0.0154
0.0163
0.0173
0.0182
0.0192
0.0202
0.0211
0.0221
0.0230
0.0240
0.0250
0.0259
0.0269
0.0278
0.0288
0.0298
0.0307
0.0317
0.0326
0.0230
0.0245
0.0259
0.0274
0.0288
0.0302
0.0317
0.0331
0.0346
0.0360
0.0374
0.0389
0.0403
0.0418
0.0432
0.0446
0.0461
0.0475
0.0490
APP
98