ROHM BD6422EFV

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STRUCTURE
Silicon monolithic integrated circuits
PRODUCT SERIES
Bipolar stepping motor driver
TYPE
BD6422EFV
FUNCTION
・PWM constant current controllable two H bridge driver
・Parallel-IN control
・Full, Half, and Quarter step modes
・Mix decay control
○Absolute maximum ratings(Ta=25℃)
Item
Supply voltage
Symbol
VCC1,2
Limit
Unit
-0.2~+45.0
V
※1
W
1.1
Power dissipation
Pd
4.0※2
W
Input voltage for control pin
VIN
-0.2~+5.5
V
RNF maximum voltage
VRNF
0.7
V
Maximum output current
IOUT
1.0※3
A/phase
Operating temperature range
Topr
-25~+85
℃
Storage temperature range
Tstg
-55~+150
℃
Junction temperature
Tjmax
+150
℃
※1
70mm×70mm×1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃.
※2
4-layer recommended board. Derating in done at 32.0mW/℃ for operating above Ta=25℃.
※3
Do not, however exceed Pd, ASO and Tjmax=150℃.
○Operating conditions (Ta=-25~+85℃)
Item
Symbol
Supply voltage
VCC1,2
Output current
IOUT
※4
Do not, however exceed Pd, ASO.
Min.
19
-
Typ.
37
0.5
This product isn’t designed for protection against radioactive rays.
REV. A
Max.
42
0.7※4
Unit
V
A/phase
2/4
○Electrical characteristics (Unless otherwise specified Ta=25℃, VCC1,2=37V)
Item
Symbol
Min.
Limit
Typ.
Whole
Circuit current at standby
ICCST
1.0
Circuit current
ICC
2.0
Control input (PHASE1, I01, I11, PHASE2, I02, I12, DEC1, DEC2, PS)
H level input voltage
VINH
2.0
L level input voltage
VINL
H level input current
IINH
35
50
L level input current
IINL
-10
0
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Output ON resistance
Output leak current
Current control
RNFX input current
VREF input current
VREF input voltage range
Comparator threshold
100%
Comparator threshold
67%
Comparator threshold
33%
Minimum on time (Blank time)
Unit
Conditions
2.5
5.0
mA
mA
PS=L
PS=H, VREF=3V
0.8
100
-
V
V
μA
μA
VIN=5V
VIN=0V
Max.
RON
-
2.0
2.6
Ω
ILEAK
-
-
10
μA
IRNF
IVREF
VREF
-40
-2.0
0
-20
-0.1
-
3.0
μA
μA
V
VCTH100
0.57
0.60
0.63
V
VCTH67
0.38
0.40
0.42
V
VCTH33
0.18
0.20
0.22
V
tONMIN
0.5
1.5
3.0
μs
REV. A
IOUT=0.5A,
Sum of upper and lower
RNFX=0V
VREF=0V
VREF=3V,
(I0X,I1X)=(L,L)
VREF=3V,
(I0X,I1X)=(H,L)
VREF=3V,
(I0X,I1X)=(L,H)
C=470pF, R=82kΩ
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○Package outline
Product No.
BD6422
Lot No.
HTSSOP-B24 (Unit:mm)
○Block diagram
○Pin No. / Pin name
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
Regulator
PHASE1 13
PHASE2 16
7 GND
I01 14
I11 15
I02 17
I12 18
12 PS
UVLO
TSD
OCP
VREF 11
+
-
2bit DAC
5 VCC1
+
-
Blank time
PWM control
CR 8
OSC
3 RNF1
Predriver
RNF2
2 OUT1B
Control Logic
RNF1
4 OUT1A
+
-
20 VCC2
NC : Non Connection
21 OUT2A
23 OUT2B
DEC1 9
DEC2 10
Mix decay
control
Pin name
GND
OUT1B
RNF1
OUT1A
VCC1
NC
GND
CR
DEC1
DEC2
VREF
PS
22 RNF2
1 GND
REV. A
Pin No.
13
14
15
16
17
18
19
20
21
22
23
24
Pin name
PHASE1
I01
I11
PHASE2
I02
I12
NC
VCC2
OUT2A
RNF2
OUT2B
NC
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○Operation Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating
conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a
short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings,
consider adding circuit protection devices, such as fuses.
(2) Power supply lines
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no
problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor
to decide capacity value. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the
product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to
implement a physical safety measure such as the insertion of a voltage clamp diode between the power
supply and GND pins.
(3) GND potential
The potential of GND pin must be minimum potential in all operating conditions.
(4) Metal on the backside (Define the side where product markings are printed as front)
The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND.
Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than
GND.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed
to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as
wide as possible with heat dissipation pattern not only on the board surface but also the backside.
(6) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the
IC to malfunction.
(7) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(8) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃,
and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not
use the TSD function to protect peripheral equipment.
(9) Ground Wiring Pattern
When using both large current and small signal GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the ground potential of application so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal
ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
(10) Mounting errors
When attaching to a printed circuit board, pay attention to the direction of the IC and displacement.
Improper attachment may lead to destruction of the IC.
REV. A
Notice
Notes
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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
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R1120A