ROHM BD6150MUV

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Structure
Silicon Monolithic Integrated Circuit
Product Name
Step-up DC/DC converter for medium size LCD panel
Type
BD6150MUV
Features
High efficiency PWM step-up DC/DC converter (fsw=1.25MHz)
High accuracy and good matching current driver 6ch (MAX 30mA/ch)
Drive up to 10 in series x 6 strings in parallel =60 white LEDs
●Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Maximum applied voltage 1
VMAX1
7
V
Maximum applied voltage 2
VMAX2
25
V
Maximum applied voltage 3
Maximum applied voltage 4
Power dissipation 1
Power dissipation 2
Power dissipation 3
Operating temperature range
Storage temperature range
VMAX3
VMAX4
Pd1
Pd2
Pd3
Topr
Tstg
30.5
41
500
780
1510
-40 ~ +85
-55 ~ +150
V
V
mW
mW
mW
°C
°C
Condition
VREG, ISET, PWMDRV,
FSEL, OCPSET, VDET, TEST
LED1, LED2, LED3
LED4, LED5, LED6
VBAT, FAILFLAG, PWMPOW
SW
*1
*2
*3
-
*1 Reduced 4.0mW/°C With Ta>25°C when not mounted on a heat radiation Board.
*2 1 layer (ROHM Standard board) has been mounted. Copper foil area 0mm2, When it’s used by more than Ta=25°C, it’s reduced by 6.2mW/°C.
*3 4 layer (JEDEC Compliant board) has been mounted. Copper foil area 1layer 6.28mm2, Copper foil area 2~4layers 5655.04mm2,
When it’s used by more than Ta=25°C, it’s reduced by 12.1mW/°C.
●Operating conditions (Ta=-40 to +85°C)
Parameter
Supply voltage
Symbol
VBAT
Min.
4.2
Rating
Typ
12.0
This product isn’t designed to protect itself against radioactive rays.
REV. A
Max
26.0
Unit
V
Condition
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●Electrical Characteristics
(Unless otherwise noted, VBAT=12V, Ta = +25°C)
Iq
Idd
Min.
-
Limits
Typ.
1.6
3.6
Max.
4.4
5.4
POWL
POWH
POWR
0
2.1
100
300
PDRVL
PDRVH
DRVR
0
2.1
100
FSL
FSH
FSR
Parameter
Symbol
Unit
Condition
Quiescent current
Current consumption
[PWMPOW Terminal]
Low input voltage range1
High input voltage range1
Pull down resistor1
[PWMDRV Terminal]
Low input voltage range2
High input voltage range2
Pull down resistor2
[FSEL Terminal]
Low input voltage range3
High input voltage range3
Pull down resistor3
[FAILFLAG]
Input resistor
Off current
[Regulator]
VREG voltage
Under voltage lock out
[Switching Regulator]
LED control voltage
Switching frequency
Duty cycle limit
SW Nch FET RON
[Protection]
Over current limit
OCPSET open protect
Over voltage limit Input
SBD open protect
VDET leak current
[Current driver]
LED maximum current
LED current accuracy
µA
mA
PWMPOW=PWMDRV=0V
VDET=0V,ISET=22kΩ
0.9
VBAT
500
V
V
kΩ
PWMPOW=2.5V
300
0.9
6.0
500
V
V
kΩ
PWMDRV=2.5V
0
2.1
100
300
0.9
6.0
500
V
V
kΩ
FSEL=2.5V
FFIR
FFIST
1.0
-
2.0
0.1
3.0
2.0
kΩ
µA
FAILFLAG=2.5V
PWMPOW=0V
VREG
UVLO
4.2
3.3
5.0
3.7
6.0
4.1
V
V
No load
VBAT falling edge
VLED
fsw
Duty
RON
0.56
1.00
91.0
-
0.70
1.25
95.0
0.48
0.84
1.50
99.0
0.58
V
MHz
%
Ω
Ocp
OOP
Ovl
Sop
OVIL
1.4
0.96
0.02
-
2.0
0.0
1.00
0.05
0.1
2.6
0.1
1.04
0.08
1.0
A
A
V
V
µA
ILMAX
ILACCU
-
-
30
±3.0
mA
%
LED current matching
ILMAT
-
-
±1.5
%
LED current limiter
ILOCP
-
0
0.1
mA
LEDOVP
10.0
11.5
13.0
V
Iset
0.5
0.6
0.7
V
LED terminal
Over voltage protect
ISET voltage
*1 This parameter is tested with dc measurement.
REV. A
FSEL=L (GND short)
LED1-6=0.3V
ISW=80mA
*1
OCPSET=68kΩ
OCPSET=2MΩ
Detect voltage of VDET pin
Detect voltage of VDET pin
ILED=16~20mA
Each LED current/Average
(LED1-6)
ILED=16~20mA
Current limit value at ISET
resistor 1kΩ setting
PWMDRV=2.5V
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●Package outline drawing
●Terminals
PIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Type
D6150
LOT No.
VQFN024V4040 ( Unit : mm )
PIN Name
SW
SW
N.C.
PGND
FAILFLAG
OCPSET
VDET
TEST
FSEL
ISET
GND
N.C.
LED1
LED2
LED3
LED4
LED5
LED6
N.C.
GND
PWMDRV
VREG
PWMPOW
VBAT
●Block diagram
VBAT VREG
FAILFLAG
SBD OPEN/
Output short PROTECT
REG
UVLO
Internal Reset
VDET
Output Over Voltage PROTECT
TSD
PWMPOW
Clamp
FAULT
DETECTOR
Internal Power
Supply
Internal Power
Control
SW
LED TERMINAL
OPEN/SHORT
DETECTOR
Soft start
ERRAMP
PWM COMP
Control
SW
LED1
SENCE
LED
LED2
RETURN
LED3
+
Current SENCE
LED4
SELECT
+
OSC
LED5
LED6
Over Current Protect
6ch
PGND
+
-
ISET
Resistor driver
N.C.
OCPSET
TEST
FSEL
GND
REV. A
PWMDRV
ISET
Current Driver
GND
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●Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down
devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding
the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses,
etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical
characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the
reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the
digital block power supply and the analog block power supply, even though these power supplies has the same level of potential,
separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital
noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give
consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same
time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no
problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore,
check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down
the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the
power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be
sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the
inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection,
be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a
ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic
element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal.
Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the
GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no
power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage
lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the
small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern
and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to
cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the
nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 175°C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF. The
thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection
or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of
use.
(14) Selection of coil
Select the low DCR inductors to decrease power loss for DC/DC converter.
REV. A
Notice
Notes
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The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
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use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
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While ROHM always makes efforts to enhance the quality and reliability of its Products, a
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Please be sure to implement in your equipment using the Products safety measures to guard
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