bi441 short form 2007 dev.qxd 6/26/07 8:59 AM Page 23 23 Hybrid Microcircuits Standard Hybrid Microcircuits Power Modules Power Factor Correction Power Modules H-Bridge Model 7700B 7700-2A 7720 Output Power, Watts 1,500 to 3,000 2,000 to 4,000 500 to 3,000 FET, Max. or IGBT, Max 0.1W 500 Volts FET 2.8 Volts @ 24 Amps 600 Volts Hyperfast 67 mW 500 Volts, Low Charge FET 2.8 Volts @ 50 Amps 600 Volts Hyperfast 0.1, 0.13, 0.2W 500 Volts FET 2.8 Volts @ 18, 25 Amps 600 Volts Hyperfast Bridge 1.2 Volts @ 25 Amps 600 Volts, w / SCRs 1.2 Volts @ 40 Amp 800 Volts, w / SCRs 1.2 Volts @ 18, 25 Amps 600 Volts Thermistor (NTC) Ohms 25K 25K 25K 25K Operating Temp. Range -40°C to +125°C -40°C to +125°C -40°C to +125°C -40°C to +125°C Output Diodes, Max. 7721-X 2.5 Volts @ 32 Amps - 2A 3.0 Volts @22 Amps - 1A 500 Volts 2.8 Volts @ 50 Amps - 2A 2.8 Volts @ 24 Amps - 1A 600 Volts Ultrafast Designed to optimally facilitate a boost type power factor correction (PFC) system for designs with up to 25Arms input current. Standard applications include switching power supplies from 500 to 4,000 watts with line voltages from 84 to 265Vrms. Ordering Information Schematic Diagram System Diagrams 7721 7700 7700 77 0 0 - 2A Model Series: 4 Power Level: B = 1,500 to 3,000W 2A = 2,000 to 4,000W Package Size 16 CT 3 EMI Filter Circuit Function: 0 = PFC AC Line L1 8 9 BUS G1 E1 OUT1 G3 E3 RTN 15 14 13 11 10 9 7 + Co 2 Q2 Q1 Vo CT 1 12 Load D1 D2 D2 D4 TH1 7720 5 13 12 14 11 10 77 2 0 - 1A Package Size: Circuit Function: 0 = PFC 1 = H-Bridge Power Level: 7720 1A = 1,500 to 3,000W 2A = 1,000 to 2,250W 3A = 500 to 1,500W 1 2 3 BUS G2 4 5 E2 OUT2 6 7 8 G4 E4 RTN PFC PWM 7721 -1A = 22A -2A = 32A 7720 5 In Rush Control Circuit 2 3 25A 420 L40 AC Line EMI Filter Model Series: Thermal Shutdown Circuitry Q4 Q2 6 Gate Driver 390 Vdc 6 4 D 1 10Ω + G S T 13 12 11 10 Gate Driver PWM 9 8 7 +18 Vdc Aux Power with UVLO Thermal Shutdown Circuitry www.bitechnologies.com bi441 short form 2007 dev.qxd 24 6/26/07 8:59 AM Page 24 Hybrid Microcircuits Custom Hybrid Microcircuits Assemblies Hybrid microcircuit assemblies are being used in an increasing number of applications. Our Military “chip & wire” hybrids accommodate a wide variety of analog and digital control circuits. Our Power Modules focus on applications requiring power and thermal management of large semiconductor components. Additionally in small to mid-size assemblies, our Commercial Hybrids offer price competitive solutions along with quality and design advantages. Model Military Hybrids Commercial Hybrids Power Modules Typical Product Specifications Integrated Thick Film Resistors Integrated Thick Film Resistors Power Semiconductors in die form Resistor Tolerance 1% Resistor Tolerance 1% SMD Thermistors Resistor Matching 0.5% Resistor Matching 0.5% SMD Resistors ICs of all types (die form) SMT ICs of all types SMD Capacitors SMD Capacitors & Inductors SMD Capacitors & Inductors 50 Resistors 50 Resistors 5 to 20 Semiconductors 50 Capacitors 50 Capacitors Power to 5000 Watts 20 Active Components 20 Active Components Current to 30 Amps Power to 15 Watts Power to 15 Watts Current to 5 Amps Current to 5 Amps Average Complexity Typical Circuit Applications Typical Customer Applications Analog, Digital, Mixed Analog, Digital, Mixed Power Factor Correction Signal Conditioning Signal Conditioning Power Amplification Motor Driver Motor Driver Bridge Rectifier Active Filters Active Filters Motor Drive Linear Amplifiers Power Amplifiers H-Bridge Sensor Circuits Sensor Circuits Voltage Regulators DC/DC Converters Data Converters Line Protection DC/DC Converters Fuel Cards Avionics Telecommunication Systems Power Supplies Power Supplies Industrial Control Satellite Industrial Control Systems Avionics Inertial Control Computer & Workstation Audio Systems Instrumentation Welding Systems Automotive www.bitechnologies.com Power Supplies bi441 short form 2007 dev.qxd 6/26/07 8:59 AM Page 25 Hybrid Microcircuits 25 Subassemblies Model Military Hybrid 165-X Commercial Hybrid 143-X Power Module 170-X Microelectronics Specialists BI Technologies has extensive circuit knowledge and over 40 years of design experience with military grade hybrid products For upgrading “Throughhole” circuit boards to surface mount technology or developing a new design, BI Technologies provides solutions. BI Technologies has a dedicated production line supporting processes to optimize heat dissipation for our high power modules Features Multi-layer thick film on Alumina Multi-layer construction Direct Bonded Copper on alumina substrate Integral Thick Film Resistors Surface mount components on ceramic substrates Large diameter aluminum wire bonding Custom Thin Film Subassemblies Chip-on-Board capability Versatile molded packaging Chip & Wire construction Integral Thick Film Resistors Directly mountable to heat sink Metal and Ceramic Packages Versatile lead configurations High voltage and high current designs Surface mount or Plug-in packages One and two sided designs Fully isolated heat sink MIL-STD-883 Screening Low cost assemblies Excellent thermal management Listed in QML-38534 US and Offshore assembly in TS16949 facility Reduced stray inductance MIL-PRF-38534 US design and management Standard Power Factor Correction modules to 5000 Watts TS16949 Certified Facility Reduced board size Smallest Size Superior Thermal Performance Highest Reliability A Commitment To Microcircuits BI Technologies is the preferred choice for companies seeking custom, high-reliability hybrid microcircuits which meet exacting performance, cost and schedule requirements. With over 40 years of experience in thick film and thin film design and manufacturing, BI Technologies offers strength of experience, large company resources and small company flexibility. All factors combined give us the ability to rapidly respond to your needs. www.bitechnologies.com