AP92T03GH,J (MN0308-S03) - Advanced Power Electronics Corp.

AP92T03GH/J
RoHS-compliant Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Simple Drive Requirement
D
▼ Lower On-resistance
▼ Fast Switching Characteristics
BVDSS
30V
RDS(ON)
4mΩ
ID
G
75A
S
Description
Advanced Power MOSFETs from APEC provide the designer with
the best combination of fast switching, ruggedized device design, low
on-resistance and cost-effectiveness.
GD
The TO-252 package is widely preferred for commercial-industrial
surface mount applications and suited for low voltage applications
such as DC/DC converters. The through-hole version (AP92T03GJ)
are available for low-profile applications.
G
D
S
TO-252(H)
S
TO-251(J)
Rating
Units
30
V
+20
V
75
A
50
A
300
A
Absolute Maximum Ratings
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
[email protected]=25℃
Continuous Drain Current
[email protected]=100℃
Continuous Drain Current
3
1
IDM
Pulsed Drain Current
[email protected]=25℃
Total Power Dissipation
89
W
Linear Derating Factor
0.71
W/℃
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Rthj-c
Parameter
Maximum Thermal Resistance, Junction-case
4
Value
Units
1.4
℃/W
Rthj-a
Maximum Thermal Resistance, Junction-ambient (PCB mount)
62.5
℃/W
Rthj-a
Maximum Thermal Resistance, Junction-ambient
110
℃/W
Data and specifications subject to change without notice
1
200901123
AP92T03GH/J
Electrical [email protected]=25oC(unless otherwise specified)
Symbol
Parameter
Test Conditions
VGS=0V, ID=250uA
Min.
Typ.
Max. Units
30
-
-
V
BVDSS
Drain-Source Breakdown Voltage
ΔBVDSS/ΔTj
Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=1mA
-
0.02
-
V/℃
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=40A
-
-
4
mΩ
VGS=4.5V, ID=30A
-
-
5.2
mΩ
0.5
-
2
V
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
gfs
Forward Transconductance
VDS=10V, ID=40A
-
100
-
S
IDSS
Drain-Source Leakage Current
VDS=24V, VGS=0V
-
-
1
uA
Drain-Source Leakage Current (T j=125 C) VDS=24V ,VGS=0V
-
-
250
uA
Gate-Source Leakage
VGS= +20V, VDS=0V
-
-
+100
nA
ID=40A
-
45
72
nC
o
IGSS
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=20V
-
6
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=4.5V
-
26
-
nC
VDS=15V
-
12
-
ns
2
td(on)
Turn-on Delay Time
tr
Rise Time
ID=40A
-
80
-
ns
td(off)
Turn-off Delay Time
RG=1Ω,VGS=10V
-
40
-
ns
tf
Fall Time
RD=0.375Ω
-
7
-
ns
Ciss
Input Capacitance
VGS=0V
-
3500 5600
pF
Coss
Output Capacitance
VDS=25V
-
930
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
770
-
pF
Min.
Typ.
IS=40A, VGS=0V
-
-
1.3
V
IS=20A, VGS=0V,
-
39
-
ns
dI/dt=100A/µs
-
42
-
nC
Source-Drain Diode
Symbol
VSD
Parameter
2
Forward On Voltage
2
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Test Conditions
Max. Units
Notes:
1.Pulse width limited by Max junction temperature.
2.Pulse test
3.Package limitation current is 75A .
4.Surface mounted on 1 in2 copper pad of FR4 board
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP92T03GH/J
240
280
o
10V
7.0V
5.0V
4.5V
200
ID , Drain Current (A)
240
ID , Drain Current (A)
T C =150 o C
10V
7.0V
5.0V
4.5V
T C =25 C
200
160
120
V G =3.0V
80
160
120
V G =3.0V
80
40
40
0
0
0.0
2.0
4.0
6.0
0.0
8.0
2.0
4.0
6.0
8.0
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
10
2
I D =30A
T C =25 ℃
I D =40A
V G =10V
8
Normalized RDS(ON)
RDS(ON) (mΩ)
1.6
6
4
1.2
0.8
2
0.4
0
0
2
4
6
8
25
10
50
100
125
150
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
40
6.0
30
5.0
RDS(ON) (mΩ)
IS(A)
Fig 3. On-Resistance v.s. Gate Voltage
20
T j =150 o C
75
T j , Junction Temperature ( o C)
V GS , Gate-to-Source Voltage (V)
V GS =4.5V
4.0
V GS =10V
T j =25 o C
10
3.0
0
2.0
0
0.5
1
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.5
0
20
40
60
80
100
I D , Drain Current (A)
Fig 6. On-Resistance vs.
Drain Current
3
AP92T03GH/J
I D =40A
9
C iss
V DS =12V
V DS =16V
V DS =20V
C (pF)
VGS , Gate to Source Voltage (V)
f=1.0MHz
10000
12
6
1000
C oss
C rss
3
0
100
0
20
40
60
80
100
120
1
5
9
13
17
21
25
29
V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1000
Normalized Thermal Response (Rthjc)
1
100us
ID (A)
100
1ms
10ms
100ms
1s
DC
10
o
T C =25 C
Single Pulse
1
Duty factor = 0.5
0.2
0.1
0.1
0.05
PDM
t
0.02
T
0.01
Duty Factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
0.1
1
10
100
0.00001
0.0001
V DS , Drain-to-Source Voltage (V)
0.001
0.01
0.1
1
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig10. Effective Transient Thermal Impedance
280
V DS =5V
VG
ID , Drain Current (A)
240
QG
200
T j =25 o C
T j =150 o C
4.5V
160
QGS
QGD
120
80
40
Charge
Q
0
0
1
2
3
4
5
6
V GS , Gate-to-Source Voltage (V)
Fig 11. Transfer Characteristics
Fig 12. Gate Charge Waveform
4
ADVANCED POWER ELECTRONICS CORP.
Package Outline : TO-252
D
D1
E2
E3
B1
F1
e
Millimeters
SYMBOLS
E1
MIN
NOM
MAX
A2
1.80
2.30
2.80
A3
0.40
0.50
0.60
B1
0.40
0.70
1.00
D
6.00
6.50
7.00
D1
4.80
5.35
5.90
E3
3.50
4.00
4.50
F
2.20
2.63
3.05
F1
0.50
0.85
1.20
E1
5.10
5.70
6.30
E2
0.50
1.10
1.80
e
--
2.30
--
C
0.35
0.50
0.65
F
e
1.All Dimensions Are in Millimeters.
2.Dimension Does Not Include Mold Protrusions.
R : 0.127~0.381
A2
A3
(0.1mm
C
Part Marking Information & Packing : TO-252
Laser Marking
Part Number
92T03GH
Package Code
Meet Rohs requirement
for low voltage MOSFET only
LOGO
YWWSSS
Date Code (YWWSSS)
Y:Last Digit Of The Year
WW:Week
SSS:Sequence
5
ADVANCED POWER ELECTRONICS CORP.
Package Outline : TO-251
D
Millimeters
A
SYMBOLS
c1
D1
E2
E1
E
A1
B2
F
B1
c
e
MIN
NOM
MAX
A
2.20
2.30
2.40
A1
0.90
1.20
1.50
B1
0.40
0.60
0.80
B2
0.60
0.85
1.05
c
c1
0.40
0.50
0.60
0.40
0.50
0.60
D
6.40
6.60
6.80
D1
4.80
5.20
5.50
E
6.70
7.00
7.30
E1
5.40
5.60
5.80
E2
1.30
1.50
1.70
e
----
2.30
----
F
7.00
8.30
9.60
1.All Dimensions Are in Millimeters.
2.Dimension Does Not Include Mold Protrusions.
e
Part Marking Information & Packing : TO-251
Part Number
92T03GJ
YWWSSS
meet Rohs requirement
for low voltage MOSFET only
Package Code
LOGO
Date Code (YWWSSS)
Y :Last Digit Of The Year
WW :Week
SSS :Sequence
6