ADVANCED POWER ELECTRONICS CORP. Recommended Reflow Profile for Lead(Pb) Free Soldering (Pure Matte Tin Plating) Lead(Pb) free solders which require to use higher reflow temperature. Advanced Power Electronics Corp. has studied the reliability of our products at higher reflow temperature. Customer may use below temperature profile for the solders requirement. PTD-02-2012220302 Table 1. Lead-Free Reflow Rrofile Recommendation(IPC/JEDEC J-STD-020C) Reflow Parameter Minimum preheat temperature(Ts MIN Maximum preheat temperature(Ts MAX) Preheat Time Ts MAX TO TL ramp-up rate Time above temperature TL (tL) Lead-Free Assembly 150° C 200° C 60-180 seconds 3° C/second maximum 217° C 60-150 seconds Peak Temperature (Tp) Time 25 C To Tp Time within 5c of Peak Tp Ramp-down rate 260° C 8 minute maximum 20-40 seconds 6° C/second maximum * Could meet three 3 cycles ADVANCED POWER ELECTRONICS CORP. Recommended wave soldering profiles The recommended solder profile for devices with Pb-free terminal plating where a Pb-free solder is used. STD Profile 3 00 Peak Temp 260℃ D e g re e C 2 50 2 00 T2 T1 1 50 STD Profile Preheat Zone 1 00 100°…130C° Cooling Zone 50 0 1 5 9 13 17 21 25 29 33 37 41 45 49 53 57 61 65 69 73 77 81 85 89 93 97 101 105 109 113 117 121 125 Time (Sec) The recommended solder profile for devices with Pb-free terminal plating used with leaded solder,or for devices with leaded terminal plating used with a leaded solder. Reflow soldering profile a.Maximum slope in preheat zone : 3℃/sec b.Minimum slope in cooling zone: 5℃/sec c.Delta T:Maximum delta T1:100℃ ; T2:100℃ d.Peak Temp 260℃. e.Time within to +0,-5℃ of actual Peak: 10 Sec f.The preheat temperature : 100°…130C°